Today at Mobile World Congress, Intel released the MeeGo tablet user experience (UX). It features an intuitive object-oriented interface with panels displaying content and contacts – all geared to give consumers fingertip access to their digital lives with easy access to social networks, people, videos and photos. A video demonstration of the new MeeGo tablet UX is available, as is a video interview with some of its designers.

At Mobile World Congress, Intel made several announcements regarding the MeeGo™ open source platform and the industry momentum backing both MeeGo and Intel® Atom™ processors. Leading network operators, device manufacturers, operating system vendors and system integrators have endorsed MeeGo and Atom for multiple devices, including netbooks, smart TVs, tablets, in-vehicle infotainment systems and more. Additional information on the breadth of ecosystem support can be found here.

KT, Intel and Samsung Electronics Co. Ltd., will demonstrate the world’s first live-air LTE solutions based on Cloud Communication Center (CCC) network technology at Mobile World Congress 2011 in Barcelona, Spain and plan an LTE trial test in the third quarter of this year in South Korea. The demonstration of a Full-HD 3D video streaming using LTE solutions based on CCC prototype systems will be supported by Intel architecture-based servers and Samsung’s commercial-ready LTE end-to-end solution. LTE CCC is an innovative network technology converging cloud computing and telecommunications, it enables enhancement of data traffic capacity and network flexibility while reducing an operator’s total costs for network deployment and operation. For more information click here.

Intel launched several new Xeon® 5600 processors today, including the six-core Intel® Xeon® processor X5690, which captured 8 new world records for two-socket server performance. Based on the groundbreaking 32 nanometer (nm) process technology, Intel has increased the number of six-core processor offerings with the Xeon® E5649 and E5645 processors, helping more customers achieve a faster return on their investment after refreshing their older servers. These new chips also complete the transition to Xeon® 5600 across the entire server and workstation product line, and strengthen the line of defense for data centers by featuring advanced security features, Intel Trusted Execution Technology (Intel TXT) and Intel Advanced Encryption Standard New Instructions (Intel AES-NI). Find out more about how Xeon® processors help solve IT’s biggest challenges.

The Intel AppUpSM developer program is expanding to accept apps for MeeGo™-based tablets and netbooks. The program now offers technical resources, tools and incentives for developers to create, distribute and sell MeeGo-based apps. Building upon Intel’s support for Java, Microsoft.NET and Adobe AIR, this expansion strengthens Intel’s vision to provide developers a choice of languages and runtimes. In addition, developers can distribute their apps through multiple applications stores including Best Buy, Walmart.com, HSN, Newegg, Dixons, Croma and ASUS.

Intel today announces availability of the Core i7-990X processor Extreme Edition for the ultimate desktop PC enthusiasts.  Clocked at 3.46 GHz for the mature LGA1366 platform, this processor has robust overclocking features for hardcore gamers, 3D artists and media enthusiasts. Read more here.

Adobe* recently announced the arrival of Flash* 10.2, which enhances HD video playback acceleration support. Intel® Core™ Processors and Intel® 2nd Generation Core™ Processors provide optimized Flash* playback, including H.264 decode acceleration. Just update your Flash* Player and Flash* web browser plugin to enjoy these features.

Neubiberg, Germany and Barcelona, Spain – Feb. 14, 2011 – Addressing the emerging Dual-SIM market, Intel Mobile Communications, a leading vendor of advanced mobile semiconductors solutions for handheld devices, introduced the XMM™ 2138 platform supporting Dual-SIM Dual-Standby (DSDS) operation.

 

The XMM 2138 Dual-SIM platform is based on the popular and very successful X-GOLD™ 213 EDGE baseband chip, the lowest-cost EDGE single-chip solution for mobile Internet (browsing & messaging). Highest integration of GSM baseband, RF transceiver, mixed signal, power management, SRAM and FM radio in 65nm CMOS technology and the innovative 8x8 mm eWLB-217 lead-free package of the X-GOLD 213 enable very small and slim, but feature rich designs. The XMM 2138 EDGE platform paves the way for mobile phone manufacturers to provide optimized and cost-effective solutions with short time-to-market for the increasing demand of the emerging Dual-SIM market.

 

Dual-SIM phones can natively work with two SIM cards, both of which may be active at the same time. While most of these active Dual-SIM phones have two transceivers, the new DSDS generation provides the ability to have two active SIM simultaneously using only one transceiver, with related cost savings. A DSDS mobile enables the functionality of two mobiles in one device whether for separating business and private operation or when roaming. Just one convenient and compact handset offers the advantage of different calling plans from service providers to save costs, while frequent travelers benefit from the greater coverage.

 

Today, a high growth rate for Dual-SIM phones exists in the BRICA (Brazil, Russia, India, China, and Africa) region and most significantly in the Asian-Pacific countries. The market research group Strategy Analytics forecasts that 206 million DSDS handsets will be sold worldwide in 2014, compared with 41 million in 2010. In some regions, India for instance, the Dual-SIM phone segment is estimated to be the fastest-growing market segment for mobile phones.

 

"With this dedicated, cost-effective design platform we again underline our commitment to provide complete and scalable solutions for all market segments, from ultra low-cost devices to high-end smart phones," said Prof. Dr. Hermann Eul, president of Intel Mobile Communications. "The XMM2138 is available in two flavors; the UTA-based XMM 2138 platform offering Tier 1 customers maximum re-use and design flexibility while the turnkey platform enables mobile phone manufacturers to produce optimized and cost-effective products with short time-to-market for the increasing demand for Dual-SIM handsets."

 

The XMM 2138 platform supports touch screen, WQVGA display for improved mobile browsing capabilities, Bluetooth for file sharing and WLAN for Internet access. In addition it provides high audio and video performance with its on-chip integrated FM radio and the computing power of the ARM11 core in the X-GOLD 213. The software re-usability and the hardware scalability based on the common ARM11 architecture make the XMM 2138 an ideal and flexible design platform. It offers handset manufacturers a scalable path from 2G to low-cost 3G due to reuse of a common hardware backbone across the entire IMC portfolio. In addition, mobile phone vendors benefit from the optimization of the XMM 2138 for the lowest system cost with 6-layer PCB for low-cost PCB manufacturing.

 

Availability
Platform samples are commercially available. Intel Mobile Communications presents its leading-edge platform solutions (Hall 1, Booth B22) at the Mobile World Congress in Barcelona (Feb. 14-17).

 

About Intel Mobile Communications
Intel Mobile Communications develops and markets innovative semiconductor products and solutions for wireless communications leveraging its unique advantages in the areas of RF, Mixed Signal/power management, monolithic integration and comprehensive know-how in cellular software and systems. Intel Mobile Communications targets the fast growing market segments of smart phones, connected devices (e.g., tablets, USB dongles, mobile PCs, M2M), and ultra-low-cost/entry phones. Its roadmap is focused to provide the most cost-effective 2G/3G single-chip platforms for ULC phones up to entry-level smart phones and to offer best-in-class 3G/4G slim modem and RF solutions for mid-to high-end smart phones and connected devices. Intel Mobile Communication has formerly been a division of Infineon Technologies AG, called Wireless Solutions (WLS). Early in 2011, Intel completed the acquisition of Infineon's wireless business that has more than 3,500 employees worldwide.

 

Intel, and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Industry`s first HSPA+ solution offering true 21Mbps downlink performance based on a leading-edge 40nm baseband processor

 

Neubiberg, Germany and Barcelona, Spain – Feb. 14, 2011 – Intel Mobile Communications, a leading vendor of advanced mobile semiconductors solutions for handheld devices, today announced shipment of its XMM™ 6260 platform to key customers. Optimized for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data cards, the advanced HSPA+ platform is based on the X-GOLD™ 626 baseband processor and the SMARTi™ UE2 RF transceiver. Combined with the 3GPP Release 7 protocol stack, the XMM 6260 platform comprises a fully integrated HSPA+ system solution supporting HSPA category 14 (21Mbps) in the downlink and category 7 (11.5Mbps) in the uplink.

 

"With shipping of the XMM 6260 platform ahead of schedule we continue the fast evolution of our leading baseband and transceiver technology by adding advanced HSPA+ features," said Prof. Dr. Hermann Eul, president of Intel Mobile Communications. "The fourth generation of successful 3G platforms underlines our technology leadership and our customers benefit from lower cost and space savings, which significantly increase design flexibility to create unique and feature-rich handsets and mobile Internet cards with innovative form factors."

 

The XMM 6260 platform is based on the X-GOLD 626 baseband processor, manufactured by TSMC in leading-edge 40nm process technology. The X-GOLD 626 integrates a power management unit, enabling world-class power consumption in both active and idle mode. The processor is combined with the SMARTi UE2 RF transceiver. Leveraging from a power-saving 65nm CMOS technology the transceiver uses a unique digital architecture that significantly reduces the number of power amplifiers and RF components, resulting in reduced board space and power consumption. The XMM 6260 smart phone modem platform enables HSPA+ designs in less than 600mm2 PCB (Printed Circuit Board) area, making them among the smallest comparable solutions worldwide.

 

The common and scalable ARM11™-based processor architecture used across all 2G and 3G platforms ensures Intel Mobile Communications customers a high degree of reuse of their hardware and software investment when developing handsets across the entire cellular portfolio. In addition, the platform includes numerous advanced 3GPP Release 7 features such as receive diversity, interference cancellation and CPC (Continuous Packet Connectivity) that significantly improve power consumption and system performance.

 

Availability
The XMM 6260 is available in volume and will be presented at the Intel Mobile Communications booth (Hall 1, Booth B22) during the Mobile World Congress in Barcelona from Feb. 14-17. Worldwide shipment to key customers has already started and design-in of the XMM 6260 is supported by a complete reference design.

 

About Intel Mobile Communications
Intel Mobile Communications develops and markets innovative semiconductor products and solutions for wireless communications leveraging its unique advantages in the areas of RF, Mixed Signal/power management, monolithic integration and comprehensive know-how in cellular software and systems. Intel Mobile Communications targets the fast growing market segments of smart phones, connected devices (e.g., tablets, USB dongles, mobile PCs, M2M), and ultra-low-cost/entry phones. Its roadmap is focused to provide the most cost-effective 2G/3G single-chip platforms for ULC phones up to entry-level smart phones and to offer best-in-class 3G/4G slim modem and RF solutions for mid-to high-end smart phones and connected devices. Intel Mobile Communication has formerly been a division of Infineon Technologies AG, called Wireless Solutions (WLS). Early in 2011, Intel completed the acquisition of Infineon's wireless business that has more than 3,500 employees worldwide.

 

Intel, and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Compact, Low-Power Solution for Slim Modem Designs Supporting LTE, 3G and 2G

 

Neubiberg, Germany and Barcelona, Spain, Feb. 14, 2011 - Intel Mobile Communications, a leading vendor of advanced mobile semiconductors solutions for handheld devices, today announced the compact multimode (LTE/3G/2G) platform XMM™ 7060.

 

The latest enhancement of the company`s comprehensive slim modem portfolio consists of the highly integrated multimode baseband processor X-GOLDTM 706 and the associated multimode RF transceiver SMARTiTM 4G. The chipset is complemented by a robust, full-featured and comprehensively validated 3GPP Release 8 triple mode protocol stack with Inter-Rat features. The new space saving platform is suitable for integration in LTE-enabled portable devices such as mobile handsets, data cards/dongles and other embedded solutions.

 

LTE is a fast growing market driven by the increasing demand for such mobile broadband services as multimedia broadcasting, music and video streaming and high-speed mobile Internet. It is expected to become the worldwide mobile standard for high-speed Internet due to its high data throughput and high spectral efficiency. However, LTE is faced with the challenge of a strongly fragmented regional frequency landscape. This calls for major RF innovation to create a low-power modem platform that can cover all the diverse frequency plans fitting to portable devices. Intel Mobile Communications is leveraging its proven leadership in RF and meets this challenge by offering the XMM 7060 platform.

 

“It is our intention to serve this growing market with a compact multimode solution equal to today’s 3G PCB footprint”, says Prof. Dr. Hermann Eul, president of Intel Mobile Communications. “The slim modem is optimized for low-power operation and has the flexibility to serve up to five LTE bands concurrently with five 3G and four 2G bands, making the dream of a real world-phone come true.”

 

The X-GOLD 706 baseband processor, manufactured in 40nm process technology, is based on the proven 2G/3G X-GOLD™ 626 with an integrated low power LTE L1 subsystem. Therefore smart phones and tablets based on the XMM™ 6260 2G/3G platform using the X-GOLD 626 can be easily migrated to LTE ensuring the customers a high degree of reuse of their hardware and software investment. The new baseband processor is accompanied with the SMARTi™4G, incorporating optimized building blocks of the leading-edge 2G/3G SMARTi™ UE2 and SMARTi™ LU RF transceiver -- the world’s first commercially available LTE transceiver. The 65nm CMOS RF transceiver employs a proven digital architecture that significantly reduces the number of external RF components such as power amplifiers and filters, and, hence, reduces board space, BOM and power consumption.

 

The XMM 7060 slim modem platform fits in less than 700mm² PCB (Printed Circuit Board) area including all necessary system components for quad band LTE, penta band 3G and quad band EDGE applications. It supports LTE category 3 (CAT-3) throughputs (100Mbps/50Mbps download/upload respectively) and is compliant to LTE Release 8 standard supporting FDD and TDD mode for all bandwidth up to 20MHz. In addition Inter-RAT handover features with 3G and 2G systems are naturally included.

 

Availability
First samples of the platform will be available by the third quarter of 2011, with volume shipment scheduled for the second half of 2012. Intel Mobile Communications will present the new XMM 7060 platform on its booth (Hall 1, Booth B22) at the Mobile World Congress in Barcelona (Feb. 14-17).

 

About Intel Mobile Communications
Intel Mobile Communications develops and markets innovative semiconductor products and solutions for wireless communications leveraging its unique advantages in the areas of RF, Mixed Signal/power management, monolithic integration and comprehensive know-how in cellular software and systems. Intel Mobile Communications targets the fast growing market segments of smart phones, connected devices (e.g., tablets, USB dongles, mobile PCs, M2M), and ultra-low-cost/entry phones. Its roadmap is focused to provide the most cost-effective 2G/3G single-chip platforms for ULC phones up to entry-level smart phones and to offer best-in-class 3G/4G slim modem and RF solutions for mid-to high-end smart phones and connected devices. Intel Mobile Communication has formerly been a division of Infineon Technologies AG, called Wireless Solutions (WLS). Early in 2011, Intel completed the acquisition of Infineon’s wireless business that has more than 3,500 employees worldwide.

 

Intel, and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

NEWS HIGHLIGHTS

  • Intel Capital to invest $26 million in six mobility companies around the globe.
  • New investments will help drive continued innovation in mobile hardware, software and applications ecosystems.
  • Technologies bring new user experiences across a continuum of devices.

 

 

MOBILE WORLD CONGRESS, Barcelona, Feb. 14, 2011 – Intel Capital, Intel Corporation's global investment organization, today announced six new investments to drive continued innovation across the mobile hardware, software and applications ecosystems. The new deals total approximately $26 million and include open source mobile software solutions company Borqs; location-based mapping platform and tools provider CloudMade; QuantumFilm™-based image sensor vendor InVisage; open source online video platform Kaltura; online authentication provider SecureKey Technologies; and unified communications and collaboration service software provider VisionOSS Solutions.

 

The six companies each have developed innovative technologies to enhance the user experience across a continuum of devices, including handhelds, tablets and laptops, that run a variety of operating systems including MeeGo and Android*.

 

"As more devices compute and connect to the Internet, it creates an opportunity to deliver new end-user capabilities by supporting the development of mobile infrastructure, applications, services and components for Intel® architecture-based platforms," said Arvind Sodhani, president, Intel Capital and executive vice president, Intel. "These six investments represent key growth areas of the mobile ecosystem and will contribute to bringing important features to the next generation of mobile devices."

 

"These Intel Capital investments represent innovative companies that Intel is working with to help advance our mobile platform initiatives across smart device segments including handheld, tablet and notebook businesses," said Anand Chandrasekher, Intel senior vice president and general manager of the company's Ultra Mobile Group. "The investments, coupled with Intel's expanding set of capabilities in silicon, software and communications, will help the company accelerate plans across a variety of smart devices and market segments."

 

Details on the new investments follow:
Borqs Ltd. (Borqs) (Beijing) is an Android software integrator for mobile devices. The company works with name-brand smart phone OEMs, semi-conductor companies, and mobile operators to enhance the Android system to meet their requirements. With expertise ranging from kernel, device-level drivers to top-level user interfaces, Borqs Android solution has been deployed in more than 30 Android mobile devices for W-CDMA networks and TD-SCDMA networks. Borqs Android solution is Google CTS compliant. The investment from Intel Capital, subject to the satisfaction of closing conditions, aligns with Intel's port of choice strategy to support multiple operating systems across a variety of devices and will be used by the company for business development.

 

CloudMade (Menlo Park, Calif.) was founded in 2007 to enable developers to build location-enabled applications and services. The company provides application developers with a range of innovative tools and application programming interfaces to enable the creation of unique location-based applications across all major web and mobile platforms. Today there are more than 16,000 developers using CloudMade's tools to create applications for mobile and Web consumers. The investment from Intel Capital will be used to further strengthen the platform and to work with developers to provide them with an unparalleled suite of tools designed for their specific needs. CloudMade will be certified under the Intel's AppUp™ application store.

 

Kaltura (New York) provides a widely adopted open source online video platform. More than 100,000 media and entertainment companies, enterprises, small- and medium-size businesses, educational institutions, service providers, platform vendors and system integrators use Kaltura's flexible platform to enhance their websites, Web services and Web platforms with advanced customized rich-media functionalities that are delivered through any connected device. Kaltura's features and products enable the easy deployment of custom workflows involving video, photo and audio creation, ingestion, publishing, management, distribution, engagement, monetization and analysis. The investment will be used to enhance rich-media functionalities on tablets, mobile phones and other connected devices, with a special emphasis on supporting the MeeGo™ mobile operating system and Intel's AppUp application store.

 

InVisage Technologies, Inc. (Menlo Park, Calif.)is harnessing the power of custom-designed semiconductor materials to develop QuantumFilm, the world's first commercial quantum dot-based material for image sensors. QuantumFilm replaces silicon as the light capture material to enable high-fidelity, high-resolution images from such handheld devices as camera phones and digital cameras. Imaging is becoming an increasingly important capability across notebooks, handhelds and tablets. InVisage will use this funding round -- led by Intel Capital -- to bring its products and technology into mass production.

 

SecureKey Technologies, Inc. (Toronto) designs hardware and software solutions to enable the strong cryptographic capabilities of debit, credit and identity smartcards -- including those within Near Field Communication-based phones -- for online authentication and online purchases. SecureKey's solutions provide a powerful user experience that can be delivered across platforms improving both the security and convenience of online transactions. The company's focus on secure transactions aligns with Intel's vision of security as a key pillar of computing across all platforms, as more peoples' lives are conducted online. The investment will be used to drive growth and expansion.

 

VisionOSS Solutions (Reading, UK) provides a unified communications and collaboration (UC&C) service delivery and management platform to service providers and large enterprise customers that are planning to, or have already launched, complex, multi-cluster IP-PBX and UC&C architectures. The VOSS technology is a real-time, fully automated, scalable and centralized UC&C service delivery and management platform, which reduces complexity, speeds implementation, and cuts costs for the fulfilment of UC&C services. VOSS will use the new funds to fuel its growth, and to support the evolution of its technology which has already been deployed in a significant number of tier-one service providers.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Medfield Sampling, LTE Platforms, MeeGo Momentum and Silicon Hive Acquisition Accelerate Mobile Portfolio

 

NEWS HIGHLIGHTS

  • Sampling “Medfield,” Intel’s new phone chip manufactured on the company’s leading-edge 32nm process technology.
  • Accelerating LTE with sampling of first multimode solutions this year with broad designs in the second half of 2012 from Intel Mobile Communications, formerly Infineon Technologies AG Wireless Solutions Business.
  • New MeeGo tablet user experience capitalizes on the flexibility and innovation provided by the MeeGo software platform, MeeGo endorsements from companies including Orange* and Tencent*, and expansion of the Intel AppUp developer program to include new MeeGo-based development tools and ecosystem programs.
  • Acquisition of Silicon Hive advances Intel’s video and imaging SoC capabilities.
  • RF Radio SoC research puts three chips of a typical RF chipset on a single chip.
  • Mobile ecosystem momentum through a series of new Intel Capital investments.
  • Leading-edge, low-power Intel® Atom™ processor-based devices on Android Gingerbread, Honeycomb coming this year.
  • Korea Telecom and Samsung move forward with Intel architecure to deliver services faster and cost effectively expand network capacity with demand.

 

 

MOBILE WORLD CONGRESS, Barcelona, Feb. 14, 2011 – Intel Corporation today announced a number of advancements to its mobile portfolio across a broad spectrum of silicon, software and connectivity, including the sampling of “Medfield,” the company’s 32nm phone chip.

 

The company also announced accelerated LTE platforms, a new MeeGo tablet user experience, the acquisition of Silicon Hive, and several new mobile investments and software development tools to aid in the delivery of premium Intel® architecture-based device experiences across multiple operating systems.

 

As the lines between computing and communications continue to blur, this mobile momentum builds on and complements Intel’s growing capabilities in mobility. Intel is accelerating plans to become the processor architecture of choice across a variety of smart device and market segments -- netbooks and laptops, cars, smart phones, tablets and smart TVs -- while addressing the evolving needs of device manufacturers, service providers, software developers and consumers around the world.

 

“The mobile Internet, with all of its complexity, presents tremendous opportunity and growth prospects for the industry at large,” said Anand Chandrasekher, Intel senior vice president and general manager of the company’s Ultra Mobility Group. “Through these efforts and others still to come, Intel is bringing the full weight of its resources, technology investment and the economics of Moore’s Law to drive down costs and power requirements for new markets, while delivering the leading-edge performance that the industry has come to expect from us.”

 

Multi-Comms and Silicon
With the recent acquisition of Infineon AG’s Wireless Solution Business now closed, Intel outlined its strategy to deliver a smart, multi-communication architecture to address varying customer and service provider needs around the world, such as network capacity, application, device, cost and end-user experience with solutions from WiFi to LTE.

 

Intel announced that Intel Mobile Communications (IMC) will sample its first compact, low-power multi-mode (LTE/3G/2G), truly global LTE solution in the second half of the year with broad market availability for devices in the second half of 2012. IMC is also now shipping the world’s smallest, fully integrated HSPA+ solution with true 21 Mbps downlink and 11.5 Mbps in uplink for small form factor devices, and announced a new platform supporting Dual-SIM Dual-Standby (DSDS) operation for the emerging Dual SIM market. These new mobile solutions underline IMCs’ product and technology leadership and help to position the business for continued growth in an era of multi-communication solutions.

 

Expanding upon Intel’s silicon capabilities, the company announced that it is sampling its 32nm “Medfield” smart phone chip with customers. “Medfield” is scheduled for introduction this year and will extend the performance benefits of Intel architecture into a low-power solution specifically designed for the smart phone market segment.

 

Further building on these silicon capabilities, the company announced the acquisition of Silicon Hive, an Intel Capital portfolio company, which brings better still imaging and multimedia video processor technology, compilers and software tools to its growing Atom processor portfolio. The Silicon Hive capabilities will aid in the delivery of more differentiated Atom-processor based SoCs as multimedia and imaging grow in importance across the mobile smart device segments.

 

Intel also announced a new development by its researchers in radio frequency (RF) integration with new process technology that will make it possible to put three chips of a typical RF chipset on a single chip. Using the most efficient transistors in the world, Intel researchers are able to achieve lower power and faster radio components compared to what is possible today. By taking advantage of Moore’s Law, the research could mean better power, performance and reduced costs for future SoC designs.

 

Finally, an efficient and flexible access network is essential to continue the evolution of the mobile Internet and enable network operators to deliver services faster and cost effectively expand network capacity with demand.  Building on this, Intel, KT and Samsung announced collaborative plans to demonstrate live-air LTE solutions using the Intel architecture-based Cloud Communications Center (CCC). The effort is designed to expand data traffic capacity and network flexibility while reducing an operator’s total cost for network deployment and operation.

 

Software Advancements
Further scaling the development of flexible, open software platforms and applications for all mobile devices, Intel demonstrated a compelling new MeeGo tablet user experience to be made available through the Intel AppUp Developer Program. The MeeGo tablet user experience features an intuitive object-oriented interface with panels to display content and contacts - all geared to give consumers fingertip access to their digital life: social networks, people, videos and photos. The MeeGo tablet user experience is on display at the MeeGo Pavilion at Mobile World Congress.

 

Since MeeGo was introduced one year ago, the open source operating system platform has made great strides with multiple code releases ranging from netbooks to handsets. MeeGo has also gained strong industry momentum with software vendors, system integrators and operators, as well as OEMs and products shipping today in multiple form factors including netbooks, tablet, set-top-boxes and in-vehicle infotainment systems in cars.

 

In addition, Intel announced new MeeGo and AppUp software development tools and other programs to help developers port, write new applications, and tune and publish to the Intel AppUp center more quickly. The programs include developer access to software development platforms, new tools and other expansions such as a worldwide university program, an Application labs program and porting resources.

 

“Intel supports all major operating system environments, working closely with developers, service providers and manufacturers around the world to deliver premium, cross platfrom experiences,” said Renée James, senior vice president and general manager of Intel’s  Software and Services Group. “Our MeeGo tablet user experience shows the power and flexibility of MeeGo, and by adding new developer tools and programs we will accelerate our tablet strategy and MeeGo ecosystem momentum to enable faster time-to-market with innovative products for OEMs and service providers alike.”

 

Building on Intel’s support of multiple operating systems, the company announced its intent to deliver the industry’s fastest performance on open source Android* with Intel® Atom™ processor-based devices running Gingerbread and Honeycomb, slated to come to market this year. The company also announced a series of Intel Capital investments to drive continued innovation across the mobile hardware, software and applications ecosystems, and to enhance the user experience across a continuum of devices, including handhelds, tablets and laptops. The investments include Borqs, CloudMade, InVisage, Kaltura, SecureKey Technologies and VisionOSS Solutions.

 

“By applying Intel’s world-class manufacturing and the most advanced silicon transistor technology to these new segments, we plan to deliver the best transistors and the highest performing, lowest power products that will enable continued innovation and new user experiences,” Chandrasekher said. “When these chips are combined with our support for leading mobile operating systems from Android to MeeGo, our proven ability to create broad ecosystem support, and our growing software and connectivity capabilities, I’m confident we will create exciting opportunities for our partners.”

 

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

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