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September 14, 2011 Previous day Next day

SANTA CLARA, Calif., Sept. 14, 2011 – Intel Corporation today announced the pricing of its public offering of $5 billion aggregate principal amount of its notes pursuant to an effective shelf registration statement previously filed with the Securities and Exchange Commission (SEC). The public offering consists of $1.5 billion of 1.950 percent notes due October 1, 2016, $2 billion of 3.300 percent notes due October 1, 2021 and $1.5 billion of 4.800 percent notes due October 1, 2041. The notes were offered to the public at a price of 99.847% of par in the case of the 2016 notes, 99.762% of par in the case of the 2021 notes and 99.258% of par in the case of the 2041 notes. The offering is expected to close on Sept. 19, 2011, subject to customary closing conditions.

 

Intel expects to receive net proceeds from this offering of approximately $4.959 billion, after deducting underwriting discounts. Intel intends to use the net proceeds from this offering primarily to repurchase shares of its common stock; and for general corporate purposes.

 

Citigroup Global Markets Inc., Goldman, Sachs & Co. and Merrill Lynch, Pierce, Fenner & Smith Inc. are acting as joint book-running managers for the offering of the notes. Credit Suisse Securities (USA) LLC, Needham & Company, LLC and RBS Securities Inc. are acting as co-managers for the offering.

 

This offering is being made only by means of a prospectus and related prospectus supplement, which may be obtained for free by visiting www.sec.gov.

 

Alternatively, copies may be obtained by contacting the following firms:

  • Citigroup Global Markets Inc., Brooklyn Army Terminal, 140 58th Street, 8th Floor, Brooklyn, N.Y. 11220, Attention: Prospectus Department (telephone: 877-858-5407, or e-mail: batprospectusdept@citi.com).  
  • Goldman, Sachs & Co., Prospectus Department, 200 West Street, New York, N.Y. 10282 (telephone: 866-471-2526, facsimile: 212-902-9316, or e-mail prospectus-ny@ny.email.gs.com)
  • Merrill Lynch, Pierce, Fenner & Smith Inc., 4 World Financial Center, New York, N.Y. 10080, Attention: Prospectus Department (e-mail: dg.prospectus_requests@baml.com)

 

This news release shall not constitute an offer to sell or a solicitation of an offer to buy any securities, nor shall there be any sale of these securities in any state or jurisdiction in which such an offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state or jurisdiction.

 

This press release contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. Such risks and uncertainties include, but are not limited to, the anticipated use of the proceeds of the offering. Intel does not undertake any obligation to update any forward-looking statements to reflect events or circumstances occurring after the date of this press release.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

The Intel Learning Series continues to change the way students learn with the Intel-powered classmate PC and its developing ecosystem. At the Intel Developer Forum today, new versions of the classmate PC will be displayed and demonstrated in a classroom setting with young students to give attendees the flavor of a classroom sporting the high-tech classmate PCs. The updated versions, coming soon, feature Cedar Trail Atom chips that offer longer battery life, increased ruggedness and an enhanced user experience. Additionally, we are proud to announce the growth of the Intel Learning Series Alliance has reached 500 members in 70 countries who are developing applications, peripherals and services optimized for the Learning Series. Since Intel announced the classmate PC reference design in 2007, more than 5 million classmate PCs have shipped around the world. For more information, visit the Intel-powered classmate PC press kit.

Intel® Solid-State Drive 710 Series with High Endurance Technology Offers Extreme Endurance and Performance for Greater Reliability, Efficiency and Value

 

 

NEWS HIGHLIGHTS

  • Intel debuts enterprise-grade Multi-Level Cell (MLC) SATA SSD Intel SSD 710 Series featuring high endurance, performance and reliability.
  • Intel SSD 710 Series uses compute-quality 25nm MLC NAND flash memory in 100GB, 200GB and 300GB capacities.
  • Intel SSD 710 with High Endurance Technology offers Single-Level Cell (SLC) SSD endurance with MLC value for optimal data center storage.

 

 

SANTA CLARA, Calif., Sept. 14, 2011 – Intel Corporation announced today its latest solid-state drive (SSD), the Intel® Solid-State Drive 710 Series, a purpose-built Multi-Level Cell (MLC) data center SSD and replacement for the Intel® X25-E Extreme SSD. While the Intel X25-E was based on more expensive but highly reliable Single-Level Cell (SLC) NAND flash memory, the Intel SSD 710 uses compute-quality Intel 25-nanomenter (nm) MLC NAND flash memory with Intel High Endurance Technology (HET) to deliver the endurance and performance necessary for data center, financial services, embedded, Internet portal, search engine and other demanding storage and server applications, but at a greater value.

 

"The Intel SSD 710 Series gives enterprise data center and embedded users extreme endurance and performance, enabled by Intel's High Endurance Technology based on Intel 25nm MLC NAND technology," said Rob Crooke, Intel vice president and general manager of the Intel Non-Volatile Memory Solutions Group. "Intel SSDs are widely deployed in the data center due to their performance, reliability and value. Our latest SSD product family offers more than 30 times the write endurance of our current MLC SSDs, plus improved performance and new features, such as power-loss data protection and surplus arrays of NAND for enhanced reliability."

 

The Intel SSD 710 delivers nearly the same endurance as SLC-based NAND SSDs, yet utilizes the higher capacity and more cost-effective MLC NAND. It achieves write endurance out-of-the-box of up to 1.1 Petabytes (PB) and comes in 100-Gigabyte (GB), 200GB and 300GB capacities. Targeted for I/O-starved applications, the Intel SSD 710 achieves a 4K random write performance of up to 2,700 input/output operations per second (IOPS) and 4K random read performance of up to 38,500 IOPS across the full span of the drive, making this a suitable replacement to an SLC SSD or multiple enterprise-grade hard disk drives (HDD). In addition to performance, the Intel SSD 710 can replace many power-consuming HDDs with a single SSD to help reduce data center energy costs.

 

"Cisco and Intel teams have worked closely, looking at the requirements for servers in the data center – IT organizations today more often run out of memory, and need memory density as well as capacity and performance," said David Lawler, vice president of product management for Cisco. "The Cisco UCS B230 M2 server offers the highest density memory capacity, and is one of the highest-density two-socket, half-width form factors powered by the Intel® Xeon® E7-2800. Cisco will offer the Intel SSD 710 Series to further increase the performance and storage capacity in the UCS B230 with two local drives offering 100GB each in September and up to 300GB each in the fall."

 

The Intel SSD 710 also includes increased reliability and security features. These include enhanced power-loss data protection to reduce potential data loss during a power failure; added data security with surplus NAND flash memory to provide system protection should a NAND die fail; Advanced Encryption Standard (AES) with 128-bit pre-configured encryption technology to protect the data from an external threat or internal system issues and Temperature Monitoring and Logging containing an internal temperature sensor that can be monitored using two self-monitoring analysis and report technology (SMART) attributes to prevent downtime.

 

Positioned for high write usage models, the drive can also be over-provisioned by the user to achieve up to 80 percent greater write endurance, creating an outstanding storage value. Intel HET combines NAND silicon enhancements and unique SSD NAND management techniques to extend the write endurance of MLC-based SSDs. Intel HET comprises Intel-developed firmware, controller and high-cycling NAND for optimized endurance and performance for the heavy loads of data crunching and writing experienced in 24/7 data centers or scientific, financial or other high-intensity usage models. Firmware enhancements from Intel include optimized error avoidance techniques, write amplification reduction algorithms and system-level error management beyond the normal industry Error Correction Code (ECC) standards.

 

Providing a better dollar-per-GB value than its previous-generation Intel X25-E SSD, the Intel SSD 710 Series is priced at $649 for the 100GB version, $1,289 for the 200GB, and $1,929 for 300GB, all based on 1,000-unit quantities. It is backed by a 3-year limited warranty. To download the multimedia press kit go to www.intel.com/newsroom/ssd. For more information on Intel SSDs go to www.intel.com/go/ssd or follow Intel SSDs on Twitter (@intelssd), Facebook (www.intel.com/go/ssdfacebook or communities.intel.com).

 

 

Intel SSD 710 Series and the Data Center

 

 

 

SSD 710 straight3Kpx200dpi.jpg

Intel® SSD 710 Series - The Intel SSD 710 Series uses compute-quality Intel 25-nanomenter (nm) multi-level-cell (MLC) NAND flash memory with Intel High Endurance Technology (HET) to deliver the endurance and performance necessary for data center, financial services, embedded, Internet portal, search engine and other demanding storage and server applications.

2 Intel SSD 710 drives server app.jpg

Intel® SSD 710 Series Ideal for Data Center Storage - Intel SSDs are widely deployed in data centers due to their performance, reliability and value. Intel's latest SSD product family, the Intel SSD 710 Series, achieves more than 30 times the write endurance of Intel's current MLC-based SSDs. It also offers improved performance and new features, such as power-loss data protection and surplus arrays of NAND, for enhanced reliability.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Intel Labs unveiled the Hybrid Memory Cube with 7-times better energy efficiency than today’s DDR3 memory along with the highest data rates ever seen in a single DRAM device.

Intel Labs released a “Parallel JS” engine to the open source community, adding data-parallel capabilities to JavaScript™ to speed up browser-based services such as computer vision, cryptography, and 3-D games by up to 8-fold.

New “Near Threshold Voltage Processor” from Intel Labs announced this week in Paul Otellini, Intel CEO and Justin Rattner, Intel CTO’s keynote speeches at IDF, challenges the computing system status quo with an experimental Pentium®-class Intel® architecture CPU delivering five times the energy efficiency and the ability to run off a solar cell the size of a postage stamp.

NEWS HIGHLIGHTS

  • Intel is leading the industry to re-invent personal computing once again with the introduction of Ultrabook™ devices that will deliver the most complete and satisfying computing experiences.
  • Offering more than 20x reduction in connected standby power, Intel's "Haswell" processor is running in-house and on track to power devices in 2013.
  • The 2nd generation Intel® Core™ processor is the fastest-shipping processor in Intel's history with over 75 million units shipped to date.
  • The 22nm 3rd generation Intel Core processors will deliver significant performance, power savings, graphics and media enhancements for Ultrabook devices and PCs in 2012.
  • Built-in security features will help offer peace of mind for users and Intel and McAfee* are collaborating to deliver an anti-theft solution for Ultrabook devices in 2012.

 

 

INTEL DEVELOPER FORUM, San Francisco, Sept. 14, 2011 – Speaking today at the Intel Developer Forum (IDF), Mooly Eden, vice president and general manager of the PC Client Group, said the personal computing experience is undergoing another fundamental transformation as the company leads the creation of Ultrabook™, a new category of mobile devices.

 

To define the Ultrabook category, Intel began with what people want most out of their personal computing devices, both from an emotional and a rational perspective. Ultrabooks are designed to give people the power to create and consume in a sleek, light, secure and elegant device that offers an immersive and responsive experience without compromising performance, all at mainstream price points.

 

"Not since the introduction of Intel® Centrino® technology more than 8 years ago have we witnessed such a fundamental transformation of personal computing," said Eden. "Today's devices powered by our 2nd generation Intel® Core™ processors are giving people a personal computing experience that they've never had before and we won't stop there. We know people desire and demand more from their computers -- to create, consume and share -- which is why we have challenged ourselves and the industry to make Ultrabook the most adaptable, complete and satisfying device."

 

PC Transformation Underway

The first Ultrabook devices, scheduled to be available during this year's holiday shopping season, are based on 2nd generation Intel Core processors. They will come in range of sleek form factors and will wake up almost instantly from even the deepest sleep using Intel® Rapid Start technology.

 

The 2nd generation Intel Core processor family introduced earlier this year delivers an entirely new visual computing experience as a result of improved performance and processor graphics. Eden said that to-date, Intel has shipped 75 million 2nd generation Intel Core processors, making it the fastest-shipping processor in the company's history. It also underscores the continued strong demand for personal computing worldwide, as approximately 1 million computers are sold each day, led by growth in emerging markets.

 

Eden shared the stage with Microsoft* to show off the Windows 8* operating system working and running several applications on Intel-based Ultrabook devices. They highlighted the broad collaboration between the two companies and pointed to the future opportunities that Windows 8* will present across multiple compute devices such as tablets, hybrids and new form factors like Ultrabook.

 

Eden also turned the spotlight on Thunderbolt technology, a new, high-speed, dual-protocol I/O technology designed for performance, simplicity and flexibility. Thunderbolt enables high-speed storage, media capture devices and displays to all connect via a single, thin cable. He gave attendees an early look at a prototype with Thunderbolt technology running the Microsoft Windows 7* operating system.

 

Powering the Next Wave of Ultrabook Devices in 2012

Eden gave the IDF audience a preview of the processor that will power 2012 Ultrabook devices -- the 3rd generation Intel Core processor (codenamed "Ivy Bridge"). Expected to be available in systems in the first half of 2012, it will deliver greater performance and energy efficiency. Intel also redesigned the processor graphics to provide better video and gaming experiences.

 

Eden previewed six pre-production Ultrabook designs that are based on 3rd generation Intel Core processors and said he expects a large selection of devices for people worldwide in 2012.

 

To provide the peace of mind that people desire, security features will be built into Ultrabook devices with processor-based Intel® Identity Protection technology and Intel Anti-Theft. Building on the capabilities offered today, next-generation Ultrabooks, notebooks and desktop computers can benefit from the collaborative effort between Intel and McAfee* to jointly develop a McAfee anti-theft service for Ultrabooks. Available in 2012, the McAfee solution will be the first to take advantage of unique, Intel chip-level technologies and will provide device and data protection for consumers such as device lock, data wipe and location tracking.

 

Challenging the entire personal computing industry to work together to deliver the thin, light and most complete computing devices, Eden touched on the component technologies including panels, keyboards, battery technology and chassis that require further innovation to meet the Ultrabook vision. Leading the innovation charge, Intel demonstrated a new laptop power savings technology that limits screen refreshes when the Ultrabook screen is static, thereby saving energy. LG Display, a leading panel vendor, will be one of the first to bring a power-optimized panel self refresh display to market for Ultrabooks using its Shuriken Technology* that features edge to edge design, smaller footprint and low power.

 

The Vision of Ultrabook Realized

The Ultrabook vision is a multi-year, industry-wide effort that will roll out in three phases. Eden said phase one is in process and will be realized this holiday season with the introduction of the first Ultrabook devices, while phase two will begin with the launch of Intel's 3rd generation Core processors in the first half of 2012. In 2013, Intel will introduce its next-generation, 22nm "Haswell" processor, signaling phase three of the transition to Ultrabook devices. Eden demonstrated "Haswell" running multiple applications at one time on stage at IDF. Devices powered by the future chip will ultimately transform the personal computing experience as a result of the new levels of power savings in the processor that will help provide more than 10 days of connected standby battery life, as well as give people the most complete and satisfying computing experience.

 

More information about the products and technologies demonstrated in the keynote is available at www.intel.com/newsroom/idf.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Wind River’s latest release of its JTAG Workbench On-Chip Debugging solution bolsters its value for designing with Intel embedded platforms. Notably, this release adds Intel-developed technology which provides visibility to Intel processor, core, and chipset information, such as memory and registers, during code execution. The new version empowers embedded developers to quickly assess the state of, stabilize, and optimize system software including operating systems, device drivers, applications, and UEFI (Unified Extensible Firmware Interface)-compliant BIOS (basic input/output system). The solution supports the latest platforms based on Intel® Atom™, Intel® Core™, and Intel® Xeon® processors.

SANTA CLARA, Calif., Sept. 14, 2011 – Intel Corporation today announced its intention to commence a public offering of senior unsecured notes consisting of 5, 10 and 30-year notes pursuant to an effective shelf registration statement previously filed with the Securities and Exchange Commission. Each tranche will be at, or greater than, the benchmark size of at least $500 million. The offering and the actual terms of the notes, including principal amount, interest rate and maturity, will depend on market and other conditions.

 

Intel intends to use the net proceeds from the offering primarily to repurchase shares of common stock; and for general corporate purposes.

 

Citigroup Global Markets Inc., Goldman, Sachs & Co. and Merrill Lynch, Pierce, Fenner & Smith Inc. are acting as joint book-running managers for the offering of the notes.

 

This offering will be made only by means of a prospectus and related prospectus supplement, which may be obtained for free by visiting the SEC’s website at www.sec.gov.  Alternatively, copies may be obtained by contacting Citigroup Global Markets Inc., Brooklyn Army Terminal, 140 58th Street, 8th Floor, Brooklyn, NY 11220, Attention: Prospectus Department (telephone: 1-877-858-5407 or email: batprospectusdept@citi.com) Goldman, Sachs & Co., Prospectus Department, 200 West Street, New York, NY 10282 (telephone: 1-866-471-2526, facsimile: 212-902-9316, or email prospectus-ny@ny.email.gs.com) or Merrill Lynch, Pierce, Fenner & Smith Incorporated, 100 West 33rd Street, 3rd Floor, New York, NY 10001, Attention: Prospectus Department (telephone: 1-800-294-1322).

 

This news release shall not constitute an offer to sell or a solicitation of an offer to buy any securities, nor shall there be any sale of these securities in any state or jurisdiction in which such an offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state or jurisdiction.

 

This news release contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. Such risks and uncertainties include, but are not limited to, whether or not Intel will offer the notes or consummate the offering, the anticipated terms of the notes and the offering, and the anticipated use of the proceeds of the offering. Intel does not undertake any obligation to update any forward-looking statements to reflect events or circumstances occurring after the date of this press release.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

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