When Natalie Portman accepted her Oscar this week, many people likely did not know that in the 1990s she was recognized on a much different national stage for her outstanding research as a semifinalist in the Intel Science Talent Search, a program of Society for Science & the Public. As the New York Times describes today, past Science Talent Search finalists have gone on to win some of the most prestigious honors in math and science, but Natalie is our first Academy Award winner! Please join us in congratulating Natalie for both her Oscar win and her excellence in math and science.

SANTA CLARA, Calif., February 28, 2011 - Intel Corporation today announced the acquisition of McAfee, Inc. is complete.

 

McAfee will continue developing and selling security products and services under its own brand. Intel and McAfee plan to bring the first fruits of their strategic partnership to market later this year, with the intent of tackling security and the pervasive nature of computing threats in an entirely new way.

 

Intel and McAfee believe today's approach to security does not adequately address the billions of new Internet-ready devices, including PCs, mobile and wireless devices, TVs, cars, medical devices and ATM machines. With the surge in cyber threats, providing protection to a diverse online world requires a fundamentally new approach involving software, hardware and services. Together the two companies will work to help people more securely take full advantage of the potential of computing and connectivity.

 

As a wholly-owned subsidiary of Intel, McAfee reports into Intel's Software and Services Group. The group is managed by Renée James, Intel senior vice president, and general manager. McAfee's president, Dave DeWalt, will report to James.

 

"In the past, energy-efficient performance and Internet connectivity have defined computing requirements," said James. "Intel has added security as a third pillar of what people demand from their experiences with personal computers and other connected devices. Security challenges put the future potential of computing at risk. The acquisition of McAfee adds not only world-leading security products and technologies to Intel's computing portfolio, but also brings incredibly talented people focused on delivering products and services that help make connecting to the mobile Internet safer and more secure."

 

Intel's updated Business Outlook for Q1 2011 and full year 2011, published on January 31, 2011, reflected the impact of the closing of the McAfee transaction. The press release, including the Outlook and related risk factors, can be found at http://sec.gov/Archives/edgar/data/50863/000005086311000020/exh991.htm.

 

 

Risk Factors

This press release contains forward-looking statements, including statements concerning McAfee's development and sale of products and services under its brand and the timing of products to market under the strategic partnership, that involve a number of risks and uncertainties. Many factors could affect Intel's actual results, and variances from Intel's current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements.

 

  • Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will," "should," and their variations identify forward-looking statements.
  • Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. These statements are not guarantees of results and are subject to risks and uncertainties that could cause actual results to differ materially from those anticipated in the forward-looking statements.
  • These risks and uncertainties include, but are not limited to, the risk that Intel may not realize the anticipated benefits of the McAfee acquisition, the risk that Intel may not retain the customer relationships of McAfee, and other risks associated with the acquisition, including the ability to successfully integrate the acquired technologies or operations, the potential for unexpected liabilities, our ability to retain key employees of the acquired business, and our compliance with commitments made to the European Commission (EC) in connection with the EC's approval of the McAfee transaction.

 

A detailed discussion of these and other factors that could affect Intel's results is included in Intel's SEC filings, including the report on Form 10-K for the fiscal year ended Dec. 25, 2010.

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

About McAfee
McAfee, McAfee Labs and Global Threat Intelligence are registered trademarks or trademarks of McAfee, Inc. or its subsidiaries in the United States and other countries. Other marks and brands may be claimed as the property of others. © 2011 McAfee, Inc. All rights reserved.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

 

Intel AppUpSM center’s CameraBag brings you back to the days of film and dark rooms by transforming your snapshots into vintage masterpieces with the touch of button.  Want portraits? Sparkbooth Home simulates a classic photo booth effect, producing four-photo layouts.  Then use Shutterfly Express to touch up imperfections using its photo editing software. After you’ve taken all of your great shots, use Snapact Photo Manager to simplify digital photo organization and the online photo sharing experience.

Today, Intel released version 4.0 of Intel® Graphics Performance Analyzers (GPA), the latest game developer toolset used to optimize the playability of PC games. New features include over 20 new hardware metrics to analyze applications running on 2nd Generation Intel® Core™ processors. In GPA 4.0, the enhanced System Analyzer Head-Up Display enables developers to profile game code on a single PC. Additionally, GPA 4.0 fully supports workloads from the newest Windows graphics API, Microsoft DirectX® 11. GPA 4.0 will let developers easily identify bottlenecks in graphics and CPU processing with system-level performance context in Platform Analyzer. Download a free copy of GPA 4.0 and enter to win a laptop.

Intel has announced the latest in its solid-state drive (SSD) line up: The Intel® SSD 510 Series, featuring 6Gbps SATA performance for faster data transfers. Aimed at gamers, media creators and other performance-intensive users, it takes full advantage of Intel’s transition to higher speed SATA bus interfaces on the recently introduced 2nd Generation Intel® Core™ processor-based platforms. Go to www.intel.com/pressroom/kits/ssd.

 

Ideal for Gamers, Media Creators and Workstation Users, Intel's Newest SSD Takes Full Advantage of 2nd Generation Intel® Core™ Processors

 

NEWS HIGHLIGHTS

  • Intel SSD 510, next in series of Intel SSD introductions for 2011, transfers more data in less time.
  • Ideal for gamers, media creators, performance-intensive workstations, Intel SSD 510 offers fastest available sequential performance.
  • Intel SSD 510 with 6Gbps SATA interface outperforms 10,000 RPM HDDs by 50 percent for fast performance and high visual fidelity game play.1

 

 

SANTA CLARA, Calif., Feb. 28, 2011 – Intel Corporation announced today the next in a line of new solid-state drives (SSD), the Intel® Solid-State Drive 510 Series. The new Intel SSD 510 features fast SATA 6 Gigabits per second (Gbps) performance to take full advantage of Intel's transition to higher speed SATA bus interfaces on the recently introduced 2nd Generation Intel® Core™ processor-based platforms. Supporting data transfers of up to 500 megabytes per second (MB/s), the Intel SSD 510 doubles the sequential read speeds, and at up to 315MB/s more than triples the sequential write speeds of Intel's current 3Gbps SSDs, to transfer more data in less time. This makes it ideal for demanding gamers, media creators, performance-intensive workstation users and any technology enthusiast.

 

The Intel SSD 510 offers the fastest sequential read and write speeds of any consumer SATA SSD available today, providing industry leading performance that beats a traditional hard disk drive (HDD) by more than 50 percent.1 In addition to better overall system responsiveness when compared to a mechanical hard drive, SSDs have no moving parts so are more rugged, consume less power and run quieter and cooler than HDDs. SSDs reduce boot times, launch applications and files faster and recover from sleep mode quicker, resulting in noticeable improvement. Conventional HDDs are also unable to effectively take advantage of 6Gbps platform technology, since HDDs fail to maximize even the current 3Gbps SATA interface.

 

"The Intel SSD 510 Series helps round out our SSD product line and was specifically designed for applications that require high sequential media transfers," said Pete Hazen, director of marketing for Intel's NAND Solutions Group. "Whether it's a gamer wanting impeccable visual performance and faster game loading, or a performance-intensive workstation user, the new 6Gbps SATA SSD from Intel is not only significantly faster than the top 10,000 RPM gaming HDD, it's also faster than two RAIDed gaming HDDs."2

 

"As a game developer the number one thing we try to optimize during development isn't our game's memory usage or frames per second, but our content creator's iteration time," said Dave Lang, CEO of Iron Galaxy, a Chicago-based game development studio. "By transitioning our team to Intel's 6Gbps SSDs, we've seen a dramatic 15 to 20 percent improvement in the time it takes one of our developers to make a change in the editor, then get to try it out in-game. Faster iterations mean more iterations, which means a better game for the consumer."

 

The Intel SSD 510 Series uses proven Intel 34-nanometer NAND flash memory to deliver best-in-class sequential performance of up to 500MB/s sequential read speeds and up to 315 MB/s writes for its high-capacity model. The product is available now and comes in a 250GB capacity priced at $584 and a 120GB at $284, for 1,000-unit quantities. Both products include a limited 3-year warranty. The 120GB version is an excellent choice for dual-drive desktops, a hybrid configuration gaining in popularity. In this type of set up, the operating system, favorite applications and games are accessed from the SSD for faster boot up and accelerated application performance, while the HDD is used to store data.

 

In addition to solid reliability, Intel SSD purchasers have the benefit of the Intel® SSD Toolbox with Intel SSD Optimizer, a free utility which provides Microsoft Windows* users with a powerful set of management, information and diagnostic tools to help maintain the health and out-of-box performance of the drive. To help ease the installation process, all Intel SSD users can download the free Intel® Data Migration Software to help clone the entire content of a previous storage drive (SSD or HDD) to any Intel SSD.

 

Intel SSDs can be purchased from a variety of resellers, retailers or Internet e-tailers such as Newegg.com or Amazon.com worldwide. More information on Intel SSDs can be found at www.intel.com/go/ssd or by accessing the multimedia press kit at www.intel.com/pressroom/kits/ssd. Follow Intel SSDs on Twitter: @intelssd, Facebook: Intel Solid State Drive (Official) or communities.intel.com.

 

Additional Information

 

 

Video

 

Photography

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Intel SSD 510 Series - Intel has introduced its latest solid-state drive (SSD), the Intel® SSD 510 Series with 6Gbps SATA interface. The Intel SSD 510 is ideal for gamers, media creators or performance-intensive workstations.

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Fastest Sequentials - The Intel SSD 510 with a 6Gbps SATA interface offers the fastest available sequential read and write speeds to transfer more data in less time.

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Intel SSDs No. 1 in the Channel - The Intel SSD 510 is the next in a series of SSDs to be introduced in 2011. Intel SSDs are No. 1 in the channel and can be purchased from a variety of resellers, retailers or Internet e-tailers such as Newegg.com or Amazon.com. For more information go to www.intel.com/go/ssd.

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Inside the Intel SSD 510 Series - This photo shows the flash memory inside the Intel SSD 510. Based on 34-nm NAND flash memory, the Intel SSD 510 Series delivers best-in-class sequential performance of up to 500MB/s sequential read speeds and 315 MB/s writes for its high-capacity model. The product is available now and comes in a 250GB capacity priced at $584 and a 120GB at $284, for 1,000 unit quantities.

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

1 Based on Intel research and benchmarking utilizing PCMark Vantage comparing one Intel® SSD 510 with one 10,000 RPM HDD. Intel test platform configuration included Intel® CoreTM i7-2600 2600 3.4Ghz 8MB L3 cache; Intel® DH67BL Express Chipset; 4GB DDR3 1333 DRAM; Windows* 7 Ultimate 64-bit;  Single Intel® SSD 510 Series SSDSC2MH250A2C 250GB SATA3 6.0Gbps with FW PWX6; Single Western Digital* VelociRaptor* 600GB WD6000HLHX 10,000 RPM HDD and 32MB cache.

2 Based on Intel research and benchmarking utilizing PCMark Vantage comparing one Intel SSD 510 with two Western Digital VelociRaptor 10,000 RPM HDDs in a RAID 0 configuration using same test platform as footnote 1. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as PCMark Vantage, are measured using specific computer systems, components, software, operations and functions.  Any change to any of those factors may cause the results to vary.

Many in Washington DC and throughout the U.S. look forward to the White House's regular "West Wing Week" video which includes video from President Obama's events from the preceding week. Today, the West Wing Week humorously subtitled "Don't Bump My Atoms" (a quip from President Obama while Intel's Barbara Miner explained the workings of an electron microscope) includes must see footage from the President tour of one of Intel's most advanced manufacturing facilities and his experience meeting the seventh grade girls who make up the BindleBot Intel FIRST LEGO Robotics Team.

Majority of U.S. Adults Wish People Practiced Better Etiquette When Using Mobile Devices

 

NEWS HIGHLIGHTS

  • Ninety-one percent of U.S. adults say that they have seen people misuse mobile technology.
  • Seventy-five percent of U.S. adults say mobile manners are worse now than in 2009.
  • Growing number of innovative mobile devices contributes to more "public displays of technology," highlighting the need for increased awareness of "mobile etiquette" and the impact of mobile technology on societal norms.

 

SANTA CLARA, Calif., Feb. 25, 2011 - Texting or typing while driving. Sending emails while walking. Using mobile devices while on a honeymoon. These are among the top pet peeves cited by U.S. adults in a recent survey conducted by Ipsos* and sponsored by Intel Corporation to uncover the current state of mobile etiquette in the United States.

 

Nine out of ten American adults claim they have seen people misuse mobile technology, and 75 percent say mobile manners are becoming worse compared to just 1 year ago, according to the survey.

 

As the number of Internet-connected mobile devices continues to grow, awareness of how people use mobile devices around others is on the rise. A 2011 report from the Pew Internet & American Life Project1 states that 85 percent of U.S. adults own a cell phone, 52 percent own a laptop computer, 4 percent own a tablet, and only 9 percent do not own any of these or other devices covered in the study. As the innovator behind the processors, or "brains," and complementary technologies that power many of today's mobile devices, Intel taps its team of social scientists, anthropologists, psychologists and industrial designers to provide a glimpse into how people use, will use or would like to use technology, including mobile devices, well into the future, across different cultures.

 

Said Genevieve Bell, Intel Fellow and head of interaction and experience research, Intel Labs: "At Intel, we try to start with people first - we ask questions about who they are and what they care about, we also ask questions about technology: What do you love about it, how does it frustrate you, what do you hate about it, what can't you live without? We use this research and our understandings about what people care about to help make technology even better - to drive innovation and revolution in technology development. It is important to remember that most digital technology is still quite new to consumers.

 

"For instance," Bell continued, "the mobile technology is still relatively novel. After all, it was just 8 years ago that Intel integrated WiFi into the computer with its Intel® Centrino® processor technology, thus enabling the unwired laptop. Smart phones, tablets and other mobile devices are really still in their infancy, so it's no surprise that people still struggle with how to best integrate these devices into their lives."

 

"New digital technologies are becoming a mainstay in consumers' lives, but we haven't yet worked out for ourselves, our families, communities and societies what all the right kinds of behaviors and expectations will be," Bell said. "Our appropriate digital technology behaviors are still embryonic, and it's important for Intel and the entire industry to maintain a dialogue about the way people use technology and our personal relationships with technology as they continue to help shape societal and cultural norms."

 

Key Survey Findings

While connectivity at one's fingertips has enabled people be more productive, how people use technology in the presence of others can lead to frustration. The majority of U.S. adults surveyed (92 percent) agree that they wish people practiced better etiquette when it comes to using their mobile devices in public areas. Roughly one in five adults (19 percent) admits to poor mobile behavior but continues the behavior because everyone else is doing it.

 

The desire to be more connected to family, friends and co-workers, combined with devices that are "always on," contributes to an innate need to have mobile devices available all day, every day, from early morning to late night. In fact, one in five adults admits to checking their mobile device before they get out of bed in the morning.

 

With a choice of sleek, small and powerful mobile devices on the market, people can easily take mobile devices with them wherever they go, making it easy to commit "public displays of technology." The survey revealed that U.S. adults see an average of five mobile offenses every day and top mobile pet peeves remain unchanged from Intel's first examination of the state of mobile etiquette in 2009. The top mobile etiquette gripes continue to be the use of mobile devices while driving (73 percent), talking on a device loudly in public places (65 percent), and using a mobile device while walking on the street (28 percent).

 

"The premise of etiquette and how we socialize with one another is not a new concept. Whenever we interact with another person directly or through the use of mobile technology, etiquette is a factor," explained author and etiquette expert Anna Post of The Emily Post Institute. "We can all be more cognizant of how we use our mobile technology and how our usage may impact others around us - at home, in the office and whenever we are in public."

 

As mobile etiquette guidelines continue to evolve, Post offers these tips to those who use a variety of mobile devices on a daily basis:

 

  • Practice what you preach: If you don't like others' bad behavior, don't engage in it.
  • Be present: Give your full attention to those you are with, such as when in a meeting or on a date. No matter how well you think you multi-task, you'll make a better impression.
  • The small moments matter. Before making a call, texting or emailing in public, consider if your actions will impact others. If they will, reconsider, wait or move away first.
  • Talk with your family, friends and colleagues about ground rules for mobile device usage during personal time.
  • Some places should stay private: Don't use a mobile device while using a restroom.

 

For additional materials and results of Intel's Mobile Etiquette survey, visit www.intel.com/newsroom/mobileetiquette.

The survey was conducted online within the United States by Ipsos on behalf of Intel from Dec. 10, 2010 to Jan. 5, 2011 among a nationally representative sample of 2,000 U.S. adults ages 18 and older with a margin of error of plus or minus 2.2 percentage points.

 

 

 

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 Zickuhr, Kathryn. Generations and their gadgets. Pew Internet & American Life Project, Feb. 3, 2011, www.pewinternet.org/Infographics/2011/Generations-and-gadgets.aspx, accessed on Feb. 11, 2011.

 

 

Following its debut in the Intel Connected Store at  NRF 2011, the Intel® Digital Signage Endcap, based on 2nd generation Intel® Core™ processor technology, has won Digital Signage Expo’s Apex Gold Award in the new concept category. The Intel® Digital Signage Endcap proof-of-concept was recognized for its advanced anonymous video analytics capabilities, mobile integration and RFID technology. The endcap redefines the consumer’s shopping experience with price comparisons, promotional coupons and samples of the hottest items. In addition, the adidas virtual footwear wall, adiVERSE, won the Silver Award for its state of the art touch-screen and 3-D rendered images. The awards were announced at the annual awards dinner at the Digital Signage Expo, in Las Vegas, NV. To learn more about the endcap and footwear wall, visit the Embedded Press Kit.

Blazingly Fast Data Transfer Combines with HD Display Connectivity to Enable New Usages and Peripheral Devices

 

NEWS HIGHLIGHTS

  • Thunderbolt™ technology is a new high-speed PC connection technology that runs at 10Gbps.
  • Thunderbolt technology supports both data and display on a single cable, enabling greater simplicity, flexibility and new and exciting ways to use a PC.
  • Apple* is the first customer to offer Thunderbolt technology, coming first on its new line of MacBook* Pro laptops.

 

 

SANTA CLARA, Calif., Feb. 24, 2011 – Intel Corporation today announced the availability of Thunderbolt™ technology, a new high-speed PC connection technology that brings together high-speed data transfer and high-definition (HD) display on to a single cable. Running at 10Gbps, Thunderbolt technology can transfer a full-length HD movie in less than 30 seconds. This Intel-developed technology is coming to market through a technical collaboration with Apple, and is available first on Apple's new line of MacBook Pro laptop computers.

 

Wait Less. Do More.

The vision for Thunderbolt technology (formerly codenamed "Light Peak") is to move media faster, simplify connections between devices, and foster new and exciting ways to build and use PCs. Combining high-speed data and HD video connections together onto a single cable is instrumental to achieving that vision. Thunderbolt technology delivers this via two communications methods, or protocols -- PCI Express* for data transfer and DisplayPort* for displays. PCI Express has the flexibility to connect to almost any type of device, and DisplayPort can drive greater than 1080p resolution displays and up to eight channels of audio simultaneously. Thunderbolt technology is compatible with existing DisplayPort displays and adapters. All Thunderbolt technology devices share a common connector, and let individuals simply daisy-chain their devices one after another, connected by electrical or optical cables.

 

Thunderbolt technology is designed to meet the demands of serious HD media creators. For example, videographers can unleash their creativity using high-bandwidth audio and video capture/mixing devices, and get both low latency and highly-accurate time synchronization for real-time processing. At 10Gbps, larger media files are transferred faster so there's less time spent waiting to watch and edit videos. Data can be backed up and restored quicker, so there's less waiting for archived content. For mobile PC users, it means having a single connector on their ultra-thin laptop that extends their high-speed media and HD display capabilities at home or in the office. Thunderbolt technology is complementary to other I/O technologies that Intel continues to support.

 

"Working with HD media is one of the most demanding things people do with their PCs," said Mooly Eden, general manager, PC Client Group, Intel. "With Thunderbolt technology, Intel has delivered innovative technology to help professionals and consumers work faster and more easily with their growing collection of media content, from music to HD movies. We've taken the vision of simple, fast transfer of content between PCs and devices, and made it a reality."

 

"We're thrilled to collaborate with Intel to bring the groundbreaking Thunderbolt technology to Mac users," said Bob Mansfield, Apple's senior vice president of Mac Hardware Engineering. "With ultra-fast transfer speeds, support for high-resolution displays and compatibility with existing I/O technologies, Thunderbolt is a breakthrough for the entire industry and we think developers are going to have a blast with it."

 

Thunderbolt technology is powered by an Intel controller chip, and uses a small connector suitable for mobile devices that will be included in products supporting the technology. Several innovative companies have announced Thunderbolt technology-based products, or currently plan to support Thunderbolt technology in upcoming products, including Aja*, Apogee*, Avid*, Blackmagic*, LaCie*, Promise*, and Western Digital*. Intel is working with the industry on a range of Thunderbolt technology-enabled products including computers, displays, storage devices, audio/video devices, cameras, docking stations and more.

Video

Intel's Thunderbolt Technology in Action

http://www.youtube.com/watch?v=gk69pCcVSSQ

Photography

Click on the images below to view larger versions.

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Intel's Thunderbolt™ controller brings Thunderbolt goodness to your computer.

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Thunderbolt™ technology logo that will signal a product's support of Thunderbolt.

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Block diagram that shows how the Thunderbolt™ controller gets integrated into a system.

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Thunderbolt™ technology connector, which will connect both display and storage devices in a daisy-chain configuration.

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Smaller Thunderbolt™ technology logo.

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Thunderbolt™ technology carries two protocols, DisplayPort* and PCI Express*, to connect displays and data devices, respectively.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, the Intel logo, Thunderbolt and the Thunderbolt logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

VICE and Intel’s Culture and Technology Initiative Kicks Off 2011 by Partnering with UVA, Interpol, Jonathan Glazer and Spiritualized, Emicida and More

 

International Events to Include Coachella Festival, New York, Paris, Lyon, Seoul, Beijing and Sao Paulo

 

NEWS HIGHLIGHTS

  • Intel and VICE launch The Creators Project’s second year with significant updates.
  • 2011 brings the launch of The Studio that will provide leading and emerging artists with the resources, new tech and ability to collaborate with other artists, The Creators Project TV series featuring in-depth documentaries on leading innovators and multi-day events and new destinations.

 

 

NEW YORK, Feb. 23, 2011 – The Creators Project, a global cultural initiative by VICE and Intel Corporation, is evolving significantly in 2011 with the launch of a major studio that will produce multimedia works with leading and emerging artists, musicians, filmmakers and designers from across the world. Continuing after its smash debut in 2010, The Creators Project will empower the next generation of innovators through technology.

 

Launching today, The Studio will transform The Creators Project in 2011 from a celebration of creativity into a true patron of the arts. The Studio is a multi-million-dollar global studio that produces and distributes works from artists representing a cross-section of creative disciplines. It will release albums, artwork and films while providing artists with resources and new technology. The works will then be distributed by The Studio through a variety of channels including traveling international exhibits, museums, concerts and such digital platforms as TheCreatorsProject.com. Participants will retain intellectual property rights.

 

Throughout 2011, The Studio, operating out of VICE’s international offices, will amass a diverse network of creators and works that will be accessible to millions.

 

"We created The Studio because the status quo in media right now is a tragedy,” said Vice Founder Shane Smith. “Whether it's in film, music or the fine arts, a lack of access to production and distribution has left some young artists disenfranchised and frustrated.  The Creators Project created The Studio to show the world that there is another model for supporting creativity, a model where the artist and the artwork come first. To show our commitment we will produce and distribute artworks globally while allowing The Studio artists to own, forever, any of the work that they create for us."

 

"We're thrilled to return as part of The Creators Project in 2011 and to have the opportunity to work with The Studio in recreating the main stage of Coachella as an evolving sculpture,” said United Visual Artists (UVA). “The Studio promises to be a fresh and open way of enabling young artists to break through to large international audiences through new commissions and touring projects, and we look forward to seeing it grow."

 

At Coachella, The Studio will partner with major acts like Interpol (U.S.) to transform their sets into technologically advanced and dramatic multimedia visual experiences. The Studio will also work with returning Creators United Visual Artists (UK) to redesign Coachella’s main stage. Using a combination of integrated lighting technologies, UVA's iconic sculpture will unfold, reveal and evolve over the three days, creating a dynamic canvas for live performances.

 

The Studio will partner with esteemed UK film director Jonathan Glazer and UK band Spiritualized to produce an experimental light and sound installation. The piece, titled "Meet Me in the Chorus," is part of The Studio's collection of highly advanced art installations on Coachella’s grounds. It will then travel the world as part of The Creators Project international event series.

 

The Studio’s body of works will continue to expand throughout the year. Renowned fashion designer Hussein Chalayan (UK) and The Studio will partner for his upcoming Spring/Summer 2012 fashion show to be held during Paris Fashion week this October. The partnership will showcase Hussein's latest collection and will be documented on TheCreatorsProject.com.

 

The Brazilian rap sensation and returning Creator Emicida (Brazil) will work with The Studio to produce, release and distribute his new album. And, filmmaker Barnaby Clay (US) will collaborate with legendary rock photographer Mick Rock (US) on a traveling video installation.

 

Deborah Conrad, Intel vice president and chief marketing officer, said, “We knew we had a great idea last year when we worked with Vice to kick off The Creators Project, but we didn’t really quite wrap our heads around the magnitude of the global appetite for innovation. This comes from the collision of art and technology. Last year, we celebrated a new generation of creative and artistic geniuses. And in our second year, we’ll continue the celebration, but evolve the program to become a patron for the creative process, such as adding The Studio and a partnership with Coachella. We’re going bigger, better, richer and deeper in 2011 to empower even more creators in unimaginable ways.  Prepare to be wowed.”

 

 

The Creators Project TV Series
New this year is the premiere of The Creators Project TV series that will feature 30-minute in-depth documentaries on select creators. The series debuts Feb. 23 with an episode on Interpol (US). The 12-part series will air first on TheCreatorsProject.com and will then be syndicated to major cable networks across the world. Additional short-form pieces will cover Academy Award winning film collective H5 (FR), and artists Quayola (UK), Feng Mengbo (PRC), and Taeyoon Choi (KR)

 

International Event Series
The Creators Project’s international event series in 2011 is expanding its event line-up, with Paris and Lyon joining, as well as return hosts New York, Sao Paulo, Seoul and Beijing. Due to popular demand, the events, which last year brought thousands of people together for live concerts, art exhibits, film screenings and panel discussions, will be extended to multi-day creative summits versus the one-day events held in 2010.

 

About The Creators Project
Launched in 2010, The Creators Project is an ongoing multi-year program that is dedicated to identifying leading artists and enabling them to showcase their works and artistic visions through technology and interactive media. The program includes The Studio, an international event series, a documentary TV series, multi-disciplinary collaborative projects and the video website, TheCreatorsProject.com.

 

In just 1 year, The Creators Project has become a cultural phenomenon. Tens of thousands of guests have attended the events, and the content was viewed over 55 million times online.

 

The project unites a vast collection of artists, designers, musicians and filmmakers who are using technology to push the bounds of creative expression. To date, there are more than 100 Creators involved, hailing mostly from seven countries (United States, United Kingdom, Germany, France, Brazil, South Korea and China) along with other artists from around the world.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

About VICE
VICE was launched in 1994 as a small print zine in Montreal and has since grown into a global media company. Since day one, technology has driven VICE forward, turning ideas into reality. Innovations in desktop publishing made VICE Magazine possible and, more recently, low cost digital filmmaking and distribution democratized the worlds of TV and film bringing about VBS.TV. As technology continues to improve, it remains VICE’s goal to give artists a platform to be presented and discussed.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

IntelPR

Chip Shot: Paint by Netbooks

Posted by IntelPR Feb 22, 2011

Cultivate your child’s inner artist by using these Intel AppUpSM center apps. My Little Artist combines an easy-to-use interface and various brush strokes and styles. KidsPainter for Moblin is another drawing application with fun sound effects and cartoon icons designed for children ages three to 12. Crayola® Art Start simulates the appearance and application of the real Crayola crayons, markers and paints, while Glow is a simple application that helps you or your child create beautiful glowing art right on your netbook.

NEWS HIGHLIGHTS

  • Intel is building a new $5 billion-plus factory in Arizona.
  • Fab 42 will be the most advanced, high-volume semiconductor manufacturing facility in the world.
  • New fab will create thousands of construction and permanent manufacturing jobs at Intel’s Arizona site.

 

 

CHANDLER, Ariz., Feb. 18, 2011 – Intel Corporation today announced plans to invest more than $5 billion to build a new chip manufacturing facility at its site in Chandler, Ariz. The announcement was made by Intel President and CEO Paul Otellini during a visit by President Barack Obama at an Intel facility in Hillsboro, Ore.

 

The new Arizona factory, designated Fab 42, will be the most advanced, high-volume semiconductor manufacturing facility in the world. Construction of the new fab is expected to begin in the middle of this year and is expected to be completed in 2013.

 

“The investment positions our manufacturing network for future growth,” said Brian Krzanich, senior vice president and general manager, Manufacturing and Supply Chain. “This fab will begin operations on a process that will allow us to create transistors with a minimum feature size of 14 nanometers. For Intel, manufacturing serves as the underpinning for our business and allows us to provide customers and consumers with leading-edge products in high volume. The unmatched scope and scale of our investments in manufacturing help Intel maintain industry leadership and drives innovation.”

 

While more than three-fourths of Intel’s sales come from outside of the United States, Intel manufactures three-fourths of its microprocessors in the United States. The addition of this new fab will increase the company’s American manufacturing capability significantly.

 

Building the new fab on the leading-edge 14-nanometer process enables Intel to manufacture more powerful and efficient computer chips. The nanometer specification refers to the minimum dimensions of transistor technology. A nanometer is one-billionth of a meter or the size one ninety-thousandth the width of an average human hair.

 

“The products based on these leading-edge chips will give consumers unprecedented levels of performance and power efficiency across a range of computing devices from high-end servers to ultra-sleek portable devices,” said Krzanich.

 

Fab 42 will be built as a 300mm factory, which refers to the size of the wafers that contain the computer chips. The project will create thousands of construction and permanent manufacturing jobs at Intel’s Arizona site.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Intel CEO Otellini Announces U.S. Hiring Plans, Investment of More than $5 Billion to Build New Facility in Arizona

 

NEWS HIGHLIGHTS

 

  • Intel hosts President Obama at its world-class semiconductor research and manufacturing site in Hillsboro, Ore.
  • President discusses jobs and competitiveness in the global economy.
  • Intel CEO Paul Otellini announces plans to build a new $5 billion-plus factory in Arizona.
  • Otellini also reveals plans to hire 4,000 new U.S. employees this year.
  • Education showcased as the President meets with science and math students.

 

 

HILLSBORO, Ore., Feb. 18, 2011 - President Barack Obama toured a modern microprocessor factory today and spoke to local students and high-tech factory workers at Intel Corporation's Oregon site, one of the largest and most advanced semiconductor research and manufacturing sites in the world. The theme of the President's visit was innovation in America, and the crucial role of education in maintaining U.S. competitiveness.

 

Intel President and CEO Paul Otellini said, "It is a great honor to host President Obama. Our country and this company have been built on innovation, and manufacturing has been at the heart of America's economy for over a century. We share the President's belief that with a culture of innovation we can and will retain a vibrant economy based on industries of the future."

 

With more than 15,000 workers in Oregon, Intel is the state's largest private employer. Intel's growth helped lead Oregon's transition from a natural resource economy based on timber and agriculture to a high-tech center of manufacturing and R&D, and helped spur a generation of spin-offs and new investments there.

 

During his visit, Obama toured Intel's Fab D1D at the company's Ronler Acres campus, a wafer fabrication facility that is an example of the leading-edge semiconductor manufacturing at Intel sites in Oregon, Arizona, New Mexico and other states. Such world-class manufacturing capability delivers a competitive advantage in the form of the most advanced transistors, helping fuel U.S. exports into global markets. The U.S. semiconductor industry is the country's leading exporter when averaged over the past 5 years.

 

In comments before the President spoke, Otellini disclosed Intel's plans to add 4,000 U.S. jobs in 2011, primarily in product development and R&D. Otellini also announced an investment of more than $5 billion to build a new U.S. fab at its Chandler, Ariz. site to produce future microprocessors. Designated Fab 42, it will be the most advanced high-volume semiconductor manufacturing facility in the world, and will result in thousands of construction and permanent manufacturing jobs in Arizona.

 

"This new factory will play a central role in extending Intel's unquestioned leadership in semiconductor manufacturing," Otellini said. "The transistors and chips it will produce will be the most dynamic platform for innovation that our company has ever created. Together they will enable more capable computers, the most advanced consumer electronics and mobile devices, the brains inside the next generation of robotics, and thousands of other applications that have yet to be invented."

 

Previously, Intel announced plans to spend $6-8 billion over several years to upgrade several existing U.S. factories and build a new development fab in Oregon. These activities, announced in October, would  support approximately 6,000-8,000 additional U.S. construction jobs during the building phase and eventually add up to 1,000 high-skilled, high-wage manufacturing jobs.

 

 

Shared Commitment to Education

Intel's focus on education is based on the belief that young people are the key to solving the world's challenges, and that a solid math and science foundation coupled with key skills such as problem-solving are the foundation for innovation. To that end, in the past 10 years alone, Intel and the Intel Foundation have invested more than $1 billion toward improving education. In 2010, in conjunction with Obama's "Educate to Innovate" campaign, Intel announced a 10-year, $200 million commitment to advance education in math and science in the United States. Intel is also one of four founding companies of Change the Equation, a CEO-led initiative designed to answer the President's call to move the U.S. to the top in science and math education over the next decade.

 

During his visit, Obama met outstanding science and math students from Oregon, including two finalists of the Intel Science Talent Search, a high school team from the School of Science and Technology in Beaverton, Ore., and an all-girls middle school robotics team that competed in the Intel Oregon FIRST LEGO League State Championship the past 3 years.

 

 

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About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Rosalind Hudnell, Intel's Chief Diversity Officer, is participating today in the Women's Bureau of the U. S. Department of Labor's National Dialogue on Workplace Flexibility in Pasadena, CA. The dialogue, which will be opened by Secretary of Labor Hilda Solis, will highlight best practices on workplace flexibility and discuss how to better meet the needs of a changing 21st century workforce. Intel is a leader in workplace flexibility: employees receive time for community service and education, as well as opportunities to telecommute, share and exchange jobs and adopt a flexible schedule. Learn more.

Intel gave its employees the unique opportunity to enhance their health by participating in a 14-week wellness pilot program using the latest high-tech fitness equipment from Core Performance powered by Intel® Core™ Duo processors. In conjunction with personal trainers, study participants exercised on CPro strength and cardio equipment that prescribed the perfect workout for their goal and fitness level. The technology delivered individualized workouts and each training session ensured that employees were working in the correct heart rate zones to meet their individual training goals. Intel found participants lost an average of 14 pounds of fat, six percent body fat and reduced their cholesterol by an average of more than 5 percent. Learn more about the program via Intel Blog and Fact Sheet.

Today at Mobile World Congress, Intel released the MeeGo tablet user experience (UX). It features an intuitive object-oriented interface with panels displaying content and contacts – all geared to give consumers fingertip access to their digital lives with easy access to social networks, people, videos and photos. A video demonstration of the new MeeGo tablet UX is available, as is a video interview with some of its designers.

At Mobile World Congress, Intel made several announcements regarding the MeeGo™ open source platform and the industry momentum backing both MeeGo and Intel® Atom™ processors. Leading network operators, device manufacturers, operating system vendors and system integrators have endorsed MeeGo and Atom for multiple devices, including netbooks, smart TVs, tablets, in-vehicle infotainment systems and more. Additional information on the breadth of ecosystem support can be found here.

KT, Intel and Samsung Electronics Co. Ltd., will demonstrate the world’s first live-air LTE solutions based on Cloud Communication Center (CCC) network technology at Mobile World Congress 2011 in Barcelona, Spain and plan an LTE trial test in the third quarter of this year in South Korea. The demonstration of a Full-HD 3D video streaming using LTE solutions based on CCC prototype systems will be supported by Intel architecture-based servers and Samsung’s commercial-ready LTE end-to-end solution. LTE CCC is an innovative network technology converging cloud computing and telecommunications, it enables enhancement of data traffic capacity and network flexibility while reducing an operator’s total costs for network deployment and operation. For more information click here.

Intel launched several new Xeon® 5600 processors today, including the six-core Intel® Xeon® processor X5690, which captured 8 new world records for two-socket server performance. Based on the groundbreaking 32 nanometer (nm) process technology, Intel has increased the number of six-core processor offerings with the Xeon® E5649 and E5645 processors, helping more customers achieve a faster return on their investment after refreshing their older servers. These new chips also complete the transition to Xeon® 5600 across the entire server and workstation product line, and strengthen the line of defense for data centers by featuring advanced security features, Intel Trusted Execution Technology (Intel TXT) and Intel Advanced Encryption Standard New Instructions (Intel AES-NI). Find out more about how Xeon® processors help solve IT’s biggest challenges.

The Intel AppUpSM developer program is expanding to accept apps for MeeGo™-based tablets and netbooks. The program now offers technical resources, tools and incentives for developers to create, distribute and sell MeeGo-based apps. Building upon Intel’s support for Java, Microsoft.NET and Adobe AIR, this expansion strengthens Intel’s vision to provide developers a choice of languages and runtimes. In addition, developers can distribute their apps through multiple applications stores including Best Buy, Walmart.com, HSN, Newegg, Dixons, Croma and ASUS.

Intel today announces availability of the Core i7-990X processor Extreme Edition for the ultimate desktop PC enthusiasts.  Clocked at 3.46 GHz for the mature LGA1366 platform, this processor has robust overclocking features for hardcore gamers, 3D artists and media enthusiasts. Read more here.

Adobe* recently announced the arrival of Flash* 10.2, which enhances HD video playback acceleration support. Intel® Core™ Processors and Intel® 2nd Generation Core™ Processors provide optimized Flash* playback, including H.264 decode acceleration. Just update your Flash* Player and Flash* web browser plugin to enjoy these features.

Neubiberg, Germany and Barcelona, Spain – Feb. 14, 2011 – Addressing the emerging Dual-SIM market, Intel Mobile Communications, a leading vendor of advanced mobile semiconductors solutions for handheld devices, introduced the XMM™ 2138 platform supporting Dual-SIM Dual-Standby (DSDS) operation.

 

The XMM 2138 Dual-SIM platform is based on the popular and very successful X-GOLD™ 213 EDGE baseband chip, the lowest-cost EDGE single-chip solution for mobile Internet (browsing & messaging). Highest integration of GSM baseband, RF transceiver, mixed signal, power management, SRAM and FM radio in 65nm CMOS technology and the innovative 8x8 mm eWLB-217 lead-free package of the X-GOLD 213 enable very small and slim, but feature rich designs. The XMM 2138 EDGE platform paves the way for mobile phone manufacturers to provide optimized and cost-effective solutions with short time-to-market for the increasing demand of the emerging Dual-SIM market.

 

Dual-SIM phones can natively work with two SIM cards, both of which may be active at the same time. While most of these active Dual-SIM phones have two transceivers, the new DSDS generation provides the ability to have two active SIM simultaneously using only one transceiver, with related cost savings. A DSDS mobile enables the functionality of two mobiles in one device whether for separating business and private operation or when roaming. Just one convenient and compact handset offers the advantage of different calling plans from service providers to save costs, while frequent travelers benefit from the greater coverage.

 

Today, a high growth rate for Dual-SIM phones exists in the BRICA (Brazil, Russia, India, China, and Africa) region and most significantly in the Asian-Pacific countries. The market research group Strategy Analytics forecasts that 206 million DSDS handsets will be sold worldwide in 2014, compared with 41 million in 2010. In some regions, India for instance, the Dual-SIM phone segment is estimated to be the fastest-growing market segment for mobile phones.

 

"With this dedicated, cost-effective design platform we again underline our commitment to provide complete and scalable solutions for all market segments, from ultra low-cost devices to high-end smart phones," said Prof. Dr. Hermann Eul, president of Intel Mobile Communications. "The XMM2138 is available in two flavors; the UTA-based XMM 2138 platform offering Tier 1 customers maximum re-use and design flexibility while the turnkey platform enables mobile phone manufacturers to produce optimized and cost-effective products with short time-to-market for the increasing demand for Dual-SIM handsets."

 

The XMM 2138 platform supports touch screen, WQVGA display for improved mobile browsing capabilities, Bluetooth for file sharing and WLAN for Internet access. In addition it provides high audio and video performance with its on-chip integrated FM radio and the computing power of the ARM11 core in the X-GOLD 213. The software re-usability and the hardware scalability based on the common ARM11 architecture make the XMM 2138 an ideal and flexible design platform. It offers handset manufacturers a scalable path from 2G to low-cost 3G due to reuse of a common hardware backbone across the entire IMC portfolio. In addition, mobile phone vendors benefit from the optimization of the XMM 2138 for the lowest system cost with 6-layer PCB for low-cost PCB manufacturing.

 

Availability
Platform samples are commercially available. Intel Mobile Communications presents its leading-edge platform solutions (Hall 1, Booth B22) at the Mobile World Congress in Barcelona (Feb. 14-17).

 

About Intel Mobile Communications
Intel Mobile Communications develops and markets innovative semiconductor products and solutions for wireless communications leveraging its unique advantages in the areas of RF, Mixed Signal/power management, monolithic integration and comprehensive know-how in cellular software and systems. Intel Mobile Communications targets the fast growing market segments of smart phones, connected devices (e.g., tablets, USB dongles, mobile PCs, M2M), and ultra-low-cost/entry phones. Its roadmap is focused to provide the most cost-effective 2G/3G single-chip platforms for ULC phones up to entry-level smart phones and to offer best-in-class 3G/4G slim modem and RF solutions for mid-to high-end smart phones and connected devices. Intel Mobile Communication has formerly been a division of Infineon Technologies AG, called Wireless Solutions (WLS). Early in 2011, Intel completed the acquisition of Infineon's wireless business that has more than 3,500 employees worldwide.

 

Intel, and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Industry`s first HSPA+ solution offering true 21Mbps downlink performance based on a leading-edge 40nm baseband processor

 

Neubiberg, Germany and Barcelona, Spain – Feb. 14, 2011 – Intel Mobile Communications, a leading vendor of advanced mobile semiconductors solutions for handheld devices, today announced shipment of its XMM™ 6260 platform to key customers. Optimized for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data cards, the advanced HSPA+ platform is based on the X-GOLD™ 626 baseband processor and the SMARTi™ UE2 RF transceiver. Combined with the 3GPP Release 7 protocol stack, the XMM 6260 platform comprises a fully integrated HSPA+ system solution supporting HSPA category 14 (21Mbps) in the downlink and category 7 (11.5Mbps) in the uplink.

 

"With shipping of the XMM 6260 platform ahead of schedule we continue the fast evolution of our leading baseband and transceiver technology by adding advanced HSPA+ features," said Prof. Dr. Hermann Eul, president of Intel Mobile Communications. "The fourth generation of successful 3G platforms underlines our technology leadership and our customers benefit from lower cost and space savings, which significantly increase design flexibility to create unique and feature-rich handsets and mobile Internet cards with innovative form factors."

 

The XMM 6260 platform is based on the X-GOLD 626 baseband processor, manufactured by TSMC in leading-edge 40nm process technology. The X-GOLD 626 integrates a power management unit, enabling world-class power consumption in both active and idle mode. The processor is combined with the SMARTi UE2 RF transceiver. Leveraging from a power-saving 65nm CMOS technology the transceiver uses a unique digital architecture that significantly reduces the number of power amplifiers and RF components, resulting in reduced board space and power consumption. The XMM 6260 smart phone modem platform enables HSPA+ designs in less than 600mm2 PCB (Printed Circuit Board) area, making them among the smallest comparable solutions worldwide.

 

The common and scalable ARM11™-based processor architecture used across all 2G and 3G platforms ensures Intel Mobile Communications customers a high degree of reuse of their hardware and software investment when developing handsets across the entire cellular portfolio. In addition, the platform includes numerous advanced 3GPP Release 7 features such as receive diversity, interference cancellation and CPC (Continuous Packet Connectivity) that significantly improve power consumption and system performance.

 

Availability
The XMM 6260 is available in volume and will be presented at the Intel Mobile Communications booth (Hall 1, Booth B22) during the Mobile World Congress in Barcelona from Feb. 14-17. Worldwide shipment to key customers has already started and design-in of the XMM 6260 is supported by a complete reference design.

 

About Intel Mobile Communications
Intel Mobile Communications develops and markets innovative semiconductor products and solutions for wireless communications leveraging its unique advantages in the areas of RF, Mixed Signal/power management, monolithic integration and comprehensive know-how in cellular software and systems. Intel Mobile Communications targets the fast growing market segments of smart phones, connected devices (e.g., tablets, USB dongles, mobile PCs, M2M), and ultra-low-cost/entry phones. Its roadmap is focused to provide the most cost-effective 2G/3G single-chip platforms for ULC phones up to entry-level smart phones and to offer best-in-class 3G/4G slim modem and RF solutions for mid-to high-end smart phones and connected devices. Intel Mobile Communication has formerly been a division of Infineon Technologies AG, called Wireless Solutions (WLS). Early in 2011, Intel completed the acquisition of Infineon's wireless business that has more than 3,500 employees worldwide.

 

Intel, and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Compact, Low-Power Solution for Slim Modem Designs Supporting LTE, 3G and 2G

 

Neubiberg, Germany and Barcelona, Spain, Feb. 14, 2011 - Intel Mobile Communications, a leading vendor of advanced mobile semiconductors solutions for handheld devices, today announced the compact multimode (LTE/3G/2G) platform XMM™ 7060.

 

The latest enhancement of the company`s comprehensive slim modem portfolio consists of the highly integrated multimode baseband processor X-GOLDTM 706 and the associated multimode RF transceiver SMARTiTM 4G. The chipset is complemented by a robust, full-featured and comprehensively validated 3GPP Release 8 triple mode protocol stack with Inter-Rat features. The new space saving platform is suitable for integration in LTE-enabled portable devices such as mobile handsets, data cards/dongles and other embedded solutions.

 

LTE is a fast growing market driven by the increasing demand for such mobile broadband services as multimedia broadcasting, music and video streaming and high-speed mobile Internet. It is expected to become the worldwide mobile standard for high-speed Internet due to its high data throughput and high spectral efficiency. However, LTE is faced with the challenge of a strongly fragmented regional frequency landscape. This calls for major RF innovation to create a low-power modem platform that can cover all the diverse frequency plans fitting to portable devices. Intel Mobile Communications is leveraging its proven leadership in RF and meets this challenge by offering the XMM 7060 platform.

 

“It is our intention to serve this growing market with a compact multimode solution equal to today’s 3G PCB footprint”, says Prof. Dr. Hermann Eul, president of Intel Mobile Communications. “The slim modem is optimized for low-power operation and has the flexibility to serve up to five LTE bands concurrently with five 3G and four 2G bands, making the dream of a real world-phone come true.”

 

The X-GOLD 706 baseband processor, manufactured in 40nm process technology, is based on the proven 2G/3G X-GOLD™ 626 with an integrated low power LTE L1 subsystem. Therefore smart phones and tablets based on the XMM™ 6260 2G/3G platform using the X-GOLD 626 can be easily migrated to LTE ensuring the customers a high degree of reuse of their hardware and software investment. The new baseband processor is accompanied with the SMARTi™4G, incorporating optimized building blocks of the leading-edge 2G/3G SMARTi™ UE2 and SMARTi™ LU RF transceiver -- the world’s first commercially available LTE transceiver. The 65nm CMOS RF transceiver employs a proven digital architecture that significantly reduces the number of external RF components such as power amplifiers and filters, and, hence, reduces board space, BOM and power consumption.

 

The XMM 7060 slim modem platform fits in less than 700mm² PCB (Printed Circuit Board) area including all necessary system components for quad band LTE, penta band 3G and quad band EDGE applications. It supports LTE category 3 (CAT-3) throughputs (100Mbps/50Mbps download/upload respectively) and is compliant to LTE Release 8 standard supporting FDD and TDD mode for all bandwidth up to 20MHz. In addition Inter-RAT handover features with 3G and 2G systems are naturally included.

 

Availability
First samples of the platform will be available by the third quarter of 2011, with volume shipment scheduled for the second half of 2012. Intel Mobile Communications will present the new XMM 7060 platform on its booth (Hall 1, Booth B22) at the Mobile World Congress in Barcelona (Feb. 14-17).

 

About Intel Mobile Communications
Intel Mobile Communications develops and markets innovative semiconductor products and solutions for wireless communications leveraging its unique advantages in the areas of RF, Mixed Signal/power management, monolithic integration and comprehensive know-how in cellular software and systems. Intel Mobile Communications targets the fast growing market segments of smart phones, connected devices (e.g., tablets, USB dongles, mobile PCs, M2M), and ultra-low-cost/entry phones. Its roadmap is focused to provide the most cost-effective 2G/3G single-chip platforms for ULC phones up to entry-level smart phones and to offer best-in-class 3G/4G slim modem and RF solutions for mid-to high-end smart phones and connected devices. Intel Mobile Communication has formerly been a division of Infineon Technologies AG, called Wireless Solutions (WLS). Early in 2011, Intel completed the acquisition of Infineon’s wireless business that has more than 3,500 employees worldwide.

 

Intel, and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

NEWS HIGHLIGHTS

  • Intel Capital to invest $26 million in six mobility companies around the globe.
  • New investments will help drive continued innovation in mobile hardware, software and applications ecosystems.
  • Technologies bring new user experiences across a continuum of devices.

 

 

MOBILE WORLD CONGRESS, Barcelona, Feb. 14, 2011 – Intel Capital, Intel Corporation's global investment organization, today announced six new investments to drive continued innovation across the mobile hardware, software and applications ecosystems. The new deals total approximately $26 million and include open source mobile software solutions company Borqs; location-based mapping platform and tools provider CloudMade; QuantumFilm™-based image sensor vendor InVisage; open source online video platform Kaltura; online authentication provider SecureKey Technologies; and unified communications and collaboration service software provider VisionOSS Solutions.

 

The six companies each have developed innovative technologies to enhance the user experience across a continuum of devices, including handhelds, tablets and laptops, that run a variety of operating systems including MeeGo and Android*.

 

"As more devices compute and connect to the Internet, it creates an opportunity to deliver new end-user capabilities by supporting the development of mobile infrastructure, applications, services and components for Intel® architecture-based platforms," said Arvind Sodhani, president, Intel Capital and executive vice president, Intel. "These six investments represent key growth areas of the mobile ecosystem and will contribute to bringing important features to the next generation of mobile devices."

 

"These Intel Capital investments represent innovative companies that Intel is working with to help advance our mobile platform initiatives across smart device segments including handheld, tablet and notebook businesses," said Anand Chandrasekher, Intel senior vice president and general manager of the company's Ultra Mobile Group. "The investments, coupled with Intel's expanding set of capabilities in silicon, software and communications, will help the company accelerate plans across a variety of smart devices and market segments."

 

Details on the new investments follow:
Borqs Ltd. (Borqs) (Beijing) is an Android software integrator for mobile devices. The company works with name-brand smart phone OEMs, semi-conductor companies, and mobile operators to enhance the Android system to meet their requirements. With expertise ranging from kernel, device-level drivers to top-level user interfaces, Borqs Android solution has been deployed in more than 30 Android mobile devices for W-CDMA networks and TD-SCDMA networks. Borqs Android solution is Google CTS compliant. The investment from Intel Capital, subject to the satisfaction of closing conditions, aligns with Intel's port of choice strategy to support multiple operating systems across a variety of devices and will be used by the company for business development.

 

CloudMade (Menlo Park, Calif.) was founded in 2007 to enable developers to build location-enabled applications and services. The company provides application developers with a range of innovative tools and application programming interfaces to enable the creation of unique location-based applications across all major web and mobile platforms. Today there are more than 16,000 developers using CloudMade's tools to create applications for mobile and Web consumers. The investment from Intel Capital will be used to further strengthen the platform and to work with developers to provide them with an unparalleled suite of tools designed for their specific needs. CloudMade will be certified under the Intel's AppUp™ application store.

 

Kaltura (New York) provides a widely adopted open source online video platform. More than 100,000 media and entertainment companies, enterprises, small- and medium-size businesses, educational institutions, service providers, platform vendors and system integrators use Kaltura's flexible platform to enhance their websites, Web services and Web platforms with advanced customized rich-media functionalities that are delivered through any connected device. Kaltura's features and products enable the easy deployment of custom workflows involving video, photo and audio creation, ingestion, publishing, management, distribution, engagement, monetization and analysis. The investment will be used to enhance rich-media functionalities on tablets, mobile phones and other connected devices, with a special emphasis on supporting the MeeGo™ mobile operating system and Intel's AppUp application store.

 

InVisage Technologies, Inc. (Menlo Park, Calif.)is harnessing the power of custom-designed semiconductor materials to develop QuantumFilm, the world's first commercial quantum dot-based material for image sensors. QuantumFilm replaces silicon as the light capture material to enable high-fidelity, high-resolution images from such handheld devices as camera phones and digital cameras. Imaging is becoming an increasingly important capability across notebooks, handhelds and tablets. InVisage will use this funding round -- led by Intel Capital -- to bring its products and technology into mass production.

 

SecureKey Technologies, Inc. (Toronto) designs hardware and software solutions to enable the strong cryptographic capabilities of debit, credit and identity smartcards -- including those within Near Field Communication-based phones -- for online authentication and online purchases. SecureKey's solutions provide a powerful user experience that can be delivered across platforms improving both the security and convenience of online transactions. The company's focus on secure transactions aligns with Intel's vision of security as a key pillar of computing across all platforms, as more peoples' lives are conducted online. The investment will be used to drive growth and expansion.

 

VisionOSS Solutions (Reading, UK) provides a unified communications and collaboration (UC&C) service delivery and management platform to service providers and large enterprise customers that are planning to, or have already launched, complex, multi-cluster IP-PBX and UC&C architectures. The VOSS technology is a real-time, fully automated, scalable and centralized UC&C service delivery and management platform, which reduces complexity, speeds implementation, and cuts costs for the fulfilment of UC&C services. VOSS will use the new funds to fuel its growth, and to support the evolution of its technology which has already been deployed in a significant number of tier-one service providers.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Medfield Sampling, LTE Platforms, MeeGo Momentum and Silicon Hive Acquisition Accelerate Mobile Portfolio

 

NEWS HIGHLIGHTS

  • Sampling “Medfield,” Intel’s new phone chip manufactured on the company’s leading-edge 32nm process technology.
  • Accelerating LTE with sampling of first multimode solutions this year with broad designs in the second half of 2012 from Intel Mobile Communications, formerly Infineon Technologies AG Wireless Solutions Business.
  • New MeeGo tablet user experience capitalizes on the flexibility and innovation provided by the MeeGo software platform, MeeGo endorsements from companies including Orange* and Tencent*, and expansion of the Intel AppUp developer program to include new MeeGo-based development tools and ecosystem programs.
  • Acquisition of Silicon Hive advances Intel’s video and imaging SoC capabilities.
  • RF Radio SoC research puts three chips of a typical RF chipset on a single chip.
  • Mobile ecosystem momentum through a series of new Intel Capital investments.
  • Leading-edge, low-power Intel® Atom™ processor-based devices on Android Gingerbread, Honeycomb coming this year.
  • Korea Telecom and Samsung move forward with Intel architecure to deliver services faster and cost effectively expand network capacity with demand.

 

 

MOBILE WORLD CONGRESS, Barcelona, Feb. 14, 2011 – Intel Corporation today announced a number of advancements to its mobile portfolio across a broad spectrum of silicon, software and connectivity, including the sampling of “Medfield,” the company’s 32nm phone chip.

 

The company also announced accelerated LTE platforms, a new MeeGo tablet user experience, the acquisition of Silicon Hive, and several new mobile investments and software development tools to aid in the delivery of premium Intel® architecture-based device experiences across multiple operating systems.

 

As the lines between computing and communications continue to blur, this mobile momentum builds on and complements Intel’s growing capabilities in mobility. Intel is accelerating plans to become the processor architecture of choice across a variety of smart device and market segments -- netbooks and laptops, cars, smart phones, tablets and smart TVs -- while addressing the evolving needs of device manufacturers, service providers, software developers and consumers around the world.

 

“The mobile Internet, with all of its complexity, presents tremendous opportunity and growth prospects for the industry at large,” said Anand Chandrasekher, Intel senior vice president and general manager of the company’s Ultra Mobility Group. “Through these efforts and others still to come, Intel is bringing the full weight of its resources, technology investment and the economics of Moore’s Law to drive down costs and power requirements for new markets, while delivering the leading-edge performance that the industry has come to expect from us.”

 

Multi-Comms and Silicon
With the recent acquisition of Infineon AG’s Wireless Solution Business now closed, Intel outlined its strategy to deliver a smart, multi-communication architecture to address varying customer and service provider needs around the world, such as network capacity, application, device, cost and end-user experience with solutions from WiFi to LTE.

 

Intel announced that Intel Mobile Communications (IMC) will sample its first compact, low-power multi-mode (LTE/3G/2G), truly global LTE solution in the second half of the year with broad market availability for devices in the second half of 2012. IMC is also now shipping the world’s smallest, fully integrated HSPA+ solution with true 21 Mbps downlink and 11.5 Mbps in uplink for small form factor devices, and announced a new platform supporting Dual-SIM Dual-Standby (DSDS) operation for the emerging Dual SIM market. These new mobile solutions underline IMCs’ product and technology leadership and help to position the business for continued growth in an era of multi-communication solutions.

 

Expanding upon Intel’s silicon capabilities, the company announced that it is sampling its 32nm “Medfield” smart phone chip with customers. “Medfield” is scheduled for introduction this year and will extend the performance benefits of Intel architecture into a low-power solution specifically designed for the smart phone market segment.

 

Further building on these silicon capabilities, the company announced the acquisition of Silicon Hive, an Intel Capital portfolio company, which brings better still imaging and multimedia video processor technology, compilers and software tools to its growing Atom processor portfolio. The Silicon Hive capabilities will aid in the delivery of more differentiated Atom-processor based SoCs as multimedia and imaging grow in importance across the mobile smart device segments.

 

Intel also announced a new development by its researchers in radio frequency (RF) integration with new process technology that will make it possible to put three chips of a typical RF chipset on a single chip. Using the most efficient transistors in the world, Intel researchers are able to achieve lower power and faster radio components compared to what is possible today. By taking advantage of Moore’s Law, the research could mean better power, performance and reduced costs for future SoC designs.

 

Finally, an efficient and flexible access network is essential to continue the evolution of the mobile Internet and enable network operators to deliver services faster and cost effectively expand network capacity with demand.  Building on this, Intel, KT and Samsung announced collaborative plans to demonstrate live-air LTE solutions using the Intel architecture-based Cloud Communications Center (CCC). The effort is designed to expand data traffic capacity and network flexibility while reducing an operator’s total cost for network deployment and operation.

 

Software Advancements
Further scaling the development of flexible, open software platforms and applications for all mobile devices, Intel demonstrated a compelling new MeeGo tablet user experience to be made available through the Intel AppUp Developer Program. The MeeGo tablet user experience features an intuitive object-oriented interface with panels to display content and contacts - all geared to give consumers fingertip access to their digital life: social networks, people, videos and photos. The MeeGo tablet user experience is on display at the MeeGo Pavilion at Mobile World Congress.

 

Since MeeGo was introduced one year ago, the open source operating system platform has made great strides with multiple code releases ranging from netbooks to handsets. MeeGo has also gained strong industry momentum with software vendors, system integrators and operators, as well as OEMs and products shipping today in multiple form factors including netbooks, tablet, set-top-boxes and in-vehicle infotainment systems in cars.

 

In addition, Intel announced new MeeGo and AppUp software development tools and other programs to help developers port, write new applications, and tune and publish to the Intel AppUp center more quickly. The programs include developer access to software development platforms, new tools and other expansions such as a worldwide university program, an Application labs program and porting resources.

 

“Intel supports all major operating system environments, working closely with developers, service providers and manufacturers around the world to deliver premium, cross platfrom experiences,” said Renée James, senior vice president and general manager of Intel’s  Software and Services Group. “Our MeeGo tablet user experience shows the power and flexibility of MeeGo, and by adding new developer tools and programs we will accelerate our tablet strategy and MeeGo ecosystem momentum to enable faster time-to-market with innovative products for OEMs and service providers alike.”

 

Building on Intel’s support of multiple operating systems, the company announced its intent to deliver the industry’s fastest performance on open source Android* with Intel® Atom™ processor-based devices running Gingerbread and Honeycomb, slated to come to market this year. The company also announced a series of Intel Capital investments to drive continued innovation across the mobile hardware, software and applications ecosystems, and to enhance the user experience across a continuum of devices, including handhelds, tablets and laptops. The investments include Borqs, CloudMade, InVisage, Kaltura, SecureKey Technologies and VisionOSS Solutions.

 

“By applying Intel’s world-class manufacturing and the most advanced silicon transistor technology to these new segments, we plan to deliver the best transistors and the highest performing, lowest power products that will enable continued innovation and new user experiences,” Chandrasekher said. “When these chips are combined with our support for leading mobile operating systems from Android to MeeGo, our proven ability to create broad ecosystem support, and our growing software and connectivity capabilities, I’m confident we will create exciting opportunities for our partners.”

 

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Industry leaders collaborate to develop the next generation of mobile network architecture, planning an LTE trial test in Q3 2011

 

SEOUL, Korea – February 13, 2011 – KT, a representative service provider in South Korea, Intel Corporation, the world leader in silicon innovation and processor technologies, and Samsung Electronics Co. Ltd., an advanced network solution provider, jointly announced today that they will demonstrate the world’s first live-air LTE solutions based on Cloud Communication Center (CCC) network technology at Mobile World Congress (MWC) 2011 in Barcelona, Spain. They also plan an LTE trial test in the third quarter of this year in South Korea. Working together, KT, Intel and Samsung are shaping the future of next generation network architecture.

 

At MWC, KT, Intel, and Samsung will demonstrate a Full-HD 3D video streaming using LTE solutions based on CCC prototype systems. For this demonstration, Samsung will utilize its commercial-ready LTE end-to-end solution and commercial servers powered by Intel architecture, a general purpose processor platform.

 

LTE CCC is an innovative network technology converging cloud computing and telecommunications. It enables enhancement of data traffic capacity and network flexibility while reducing an operator’s total costs for network deployment and operation. As mobile data traffic continues to increase sharply, CCC architecture is expected to be a key solution of next generation network for mobile network operators.

 

With CCC architecture, Radio Unit (RU), which is placed in its own local site, only performs radio transmissions and Digital Unit (DU) connected to RU via a wired network such as optical fiber carries out all communication signals processing with Intel architecture based servers and Samsung modems in a centralized communication center. This minimizes the real estate costs and operations personnel required to manage equipment at the local site, and allows for more cost-effective centralized operations management.

 

CCC architecture applies virtualization technologies which enable the management of overall network conditions at the communication center, so that operators not only can effectively allocate radio resources by time and place according to the volume of data traffic, but also benefit from improving the scalability of network capacity.

 

In addition, CCC architecture allows operators to reduce the number of base stations required and support a smooth network migration to next generation mobile services. This is made possible by software-oriented development while avoiding the conventional approach of hardware-oriented system development. As a result, CCC architecture is also expected to contribute to Green IT by reducing power consumption for each coverage area.

 

The three-way collaboration among KT, Intel and Samsung is intended to deliver the highest quality of experience to users on KT’s network, and to securely manage their voice and data communications in a cost-effective way. KT, Intel and Samsung plan to begin their LTE trial test in the third quarter of this year in Seoul, South Korea, and will strengthen their partnership in CCC architecture to support multiple radio standards and expand the market around the globe in the future.

 

Dr. Hyunmyung Pyo, President of Mobile Business Group of KT, said “KT is looking for integrated wired and wireless solutions for our customer to enjoy IT services securely as they wish. As one of these solutions, KT is trying to deploy a CCC network and expects that the LTE CCC system developed by the three way collaborations among KT, Intel and Samsung will enable a green mobile network as well as reduce total cost of ownership via the flexible software on an open hardware platform, and therefore show an innovative way to mobile wonderland”

 

“Network operators need to deliver a smart, secure experience to billions of new devices.” stated David Perlmutter, Intel Executive Vice President and Co-general Manager of the Intel Architecture Group. “By utilizing cloud communications center technology based on Intel architecture, KT will be able to drive a faster rate of innovation and quickly expand network capacity as demand for services rises, all while maximizing revenue.”

 

Mr. Youngky Kim, Executive Vice President and Head of the Telecommunication Systems Business of Samsung Electronics, said “We’re very excited to introduce one of the most competitive 4G solutions which increase network throughput and drastically decrease operator’s CAPEX and OPEX as well.” “By leveraging LTE solutions based on CCC and our accumulated experiences in the 4G OFDMA market, Samsung will provide the most optimized mobile broadband solutions to service providers and strengthen our technology and market leadership.” he added.

 

About KT
KT, the largest telephony carrier in South Korea, holds around 87% of the fixed-line telephone service, 32% of the mobile phone service, and 43% of the broadband internet service of the nation. The company is providing individuals, families and companies with advanced IT services, including voice & text data, wired & wireless networks, and broadcasting & telecommunications services. Now KT is moving toward the vision of becoming a Global ICT leader with its convergence technology.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

About Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2009 consolidated sales of US$116.8 billion. Employing approximately 174,000 people in 193 offices across 66 countries, the company consists of eight independently operated business units: Visual Display, Mobile Communications, Telecommunication Systems, Digital Appliances, IT Solutions, Digital Imaging, Semiconductor and LCD. Recognized as one of the fastest growing global brands, Samsung Electronics is a leading producer of digital TVs, memory chips, mobile phones and TFT-LCDs. For more information, please visit www.samsung.com.

For the 53rd Grammy Awards this Sunday, do you want to relive your "teenage dream" on your netbook or laptop? Consult about a "bad romance?" Maybe tell that special someone you like them "just the way you are?" You can do so with MusicMapper, the 53rd Grammy's official Adobe® AIR® application now available on the Intel AppUpSM center, Intel's app store for netbooks and consumer laptops. With MusicMapper, you can tag any songs and stories to physical locations, describe what the moment reminds you of and share your musical journey with others. To download, visit MusicMapper on the Intel AppUp center.

Friday the White House announced that President Obama will visit Intel Corporation in Hillsboro, Oregon. While there, he will tour one of the world's largest and most advanced semiconductor manufacturing facilities with Intel CEO Paul Otellini. The President will also learn more about Intel's STEM (Science, Technology, Engineering and Math) education programs and Intel's efforts to better prepare the next generation to compete for high-tech jobs and be the minds behind the next great inventions.

Woo your Valentine with poetic words of love. You don’t need to be Shakespeare to write your love poem. With Intel AppUpSM center’s iPoet Limerical and iPoet Sentimental, you just need to enter information about you and your Valentine and it will automatically generate a personalized poem. Then put your poem in an e-Valentine using BlueMountain. Now, where art thou Romeo?

VASCO said today that its DIGIPASS authentication technology will work with Intel Identity Protection Technology to help prevent online fraud. With Intel’s IPT, VASCO’s DIGIPASS generates new passwords every 30 seconds, going beyond the security offered by traditional, stagnant passwords [as additional protection to traditional passwords]. The 2nd Generation Intel Core and Core vPro processor platforms will support a VASCO applet.

Intel disclosed details of plans for its upcoming Intel Identity Protection Technology to work with Symantec’s VeriSign Identity Protection (VIP) Authentication Service to help reduce Internet fraud. Intel IPT integrated into Intel Core and Core vPro processor-based PCs generates one-time passwords that change at regular intervals to help prevent identity theft from phishing attacks. Symantec’s VIP enables banks, online retailers and others [enterprises] to deliver a trusted and safe online experience to consumers, employees and partners. See it at the Symantec and Intel Booth #1426 at the RSA 2011 conference.

SANTA CLARA, Calif., Feb. 7, 2011 – On January 31, 2011, Intel disclosed a design issue with a support chip, the Intel® 6 Series Chipset that has the potential to impact certain PC system configurations. Intel subsequently initiated extensive discussions with computer makers about this topic. Both Intel and its customers are focused on delivering the highest quality PC systems based on Intel® 2nd Generation Core® Processors. As a result of these discussions and specific requests from computer makers, Intel is resuming shipments of the Intel® 6 Series Chipset for use only in PC system configurations that are not impacted by the design issue.

 

Only computer makers who have committed to shipping the Intel® 6 Series Chipset in PC system configurations that are not impacted by the design issue will be receiving these shipments.

 

This resumption of shipments of the Intel® 6 Series Chipset is not changing the company’s updated first quarter 2011 and full-year financial Outlook published on January 31st.

 

In parallel, Intel has started manufacturing on a new version of this support chip.  Intel now expects to begin shipping the new parts in mid February.

 

Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Tune in this Friday, Feb. 4 from 3:00 – 3:30 pm PT to catch Intel’s Peter Biddle and ZDNet/CBS Interactive reporter Chris Dawson discuss technology in education on MashUp Radio. Peter and Chris will explore what’s working and what’s not in educational technology for students, teachers and parents, whether one device can make all the difference, and the role open source should play in education.

Today Intel announced it will purchase 2.5 billion kilowatt hours of renewable energy credits (RECs) in 2011, a 75 percent increase over its 2010 commitment, which equates to more than 85 percent of Intel’s estimated purchased electricity needs in the U.S. this year. In addition, Intel announced it has completed nine solar installations in the U.S. and Israel, and has been recognized by the Environmental Protection Agency as the top green power purchaser in 2011. Learn more here.

Capgemini announced today that it will offer a home energy dashboard for its utility customers based on Intel’s Home Energy Management Proof of Concept Reference Design, which is powered by the Intel® Atom™ processor . The system will allow customers in the home to better understand and manage their energy usage, in turn saving on costs. For more information, please see the Capgemini press release and the Intel Embedded press kit.

NEWS HIGHLIGHTS

  • Intel increased its renewable energy credit purchase to 2.5 billion kilowatt hours, a 75 percent increase over its 2010 commitment.
  • Intel has completed nine solar electric installations at Intel locations in four U.S. states and Israel, collectively generating approximately 3.8 million kilowatt hours per year of clean solar energy.
  • Intel, whose renewable energy credit purchase will exceed 85 percent of its estimated U.S. electricity use, was again named the largest voluntary purchaser of green power by the EPA.

 

 

SANTA CLARA, Calif., Feb. 1, 2011 – Building on years of support for renewable energy generation, Intel Corporation today announced that it will purchase 2.5 billion kilowatt hours of renewable energy credits (RECs) in 2011. This commitment is a 75 percent increase over its 2010 commitment of 1.43 billion kilowatt hours and equates to more than 85 percent of Intel’s estimated purchased electricity needs in the United States for 2011. In addition, Intel has completed nine solar electric installations at Intel locations in Arizona, California, New Mexico, Oregon and Israel, collectively generating more than 3.8 million kilowatt hours per year of clean solar energy.

DSC_4855.jpg

Intel has completed nine solar electric installations at Intel campuses in four states collectively generating 3.8 million Kwh per year of clean solar energy.  Installation shown on Intel’s Chandler, Arizona campus.

“Intel’s renewable energy efforts are meant to spur the market and make renewables cheaper and more accessible, in turn helping to reduce the overall carbon emissions from electric generation,” said Brian Krzanich, senior vice president and general manager of Manufacturing and Supply Chain for Intel. “Intel’s REC purchases, support for solar installations and other clean energy investments will continue to be priorities for us as we search for effective sustainability opportunities around the globe.”

 

Intel first purchased RECs, the “currency” of renewable energy markets, and became the largest purchaser of green power in the United States1 with a 1.3 billion kilowatt hour commitment in 2008. Its 2011 purchase corresponds to the carbon dioxide emissions from the electricity use of nearly 218,000 average American homes or nearly 202 million gallons of gasoline consumed.2 As a result of Intel’s continued commitment to purchase RECs, the Environmental Protection Agency (EPA) again placed Intel at the top of its Green Power Partner List for 2011 as the largest voluntary, single purchaser of green power in the country. Intel was previously honored with the EPA’s Green Power Leadership Award.

 

In January 2010, Intel first announced its plans to construct eight solar projects across four states. Along with Intel’s first international solar electric project – a 50 kilowatt roof installation in Jerusalem – these projects are now complete and generating clean power for use at Intel facilities. The projects are a variety of types, including a massive 1-megawatt solar field that spans nearly six acres of land on Intel’s Folsom, Calif. campus, four rooftop installations and four solar support structures in Intel parking lots. Each of the U.S. installations, which were completed and are operated by Foster City, Calif.-based SolarCity, currently ranks among the 10 largest solar installations in its respective utility territory. The RECs generated by these installations are typically transferred to the local utility to support their regulatory obligations and programs.

 

Intel’s reaffirmed commitment to purchasing RECs and facilitating the nine solar electric installations is just the latest in Intel’s energy portfolio, which includes wind, solar, geo-thermal, small hydro-electric and biomass sources. Since 2001, Intel has invested over $45 million and completed approximately 1,500 projects to improve energy efficiency and resource conservation, saving roughly 790 million kilowatt hours of energy -- enough to power nearly 69,000 average American homes for a year.3 Other highlights include:

 

Investments: Intel is dedicated to clean technology innovation and development.

  • As part of Intel’s broader objective to spur market demand for renewable energy, smart grid, home energy management and energy efficiency in enterprise, commercial, industrial and residential applications, Intel Capital, Intel’s global investment arm, has invested more than $150 million in approximately 20 clean technology businesses.

 

Operations: Intel continues to look for renewable energy and energy efficiency opportunities across its many locations.

 

Employee Engagement: Intel believes that employee engagement and empowerment are critical to its objective of embedding sustainability more deeply into the business.

  • Since 2008, Intel has linked a portion of every employee’s variable compensation — from front-line employees to the CEO — to the achievement of environmental sustainability metrics in three areas: energy efficiency of products, reductions in carbon footprint and energy use and improvements in environmental leadership reputation metrics.
  • As a key element of the solar installations at Intel’s facilities, awareness kiosks are set up in each site lobby to educate and engage employees in the company’s energy efforts.

 

Intel's REC purchase will be handled by Sterling Planet, a national supplier of renewable energy, energy efficiency and low-carbon solutions. All purchases will be certified by the non-profit Center for Resource Solutions' Green-e® program, which certifies and verifies green power products, and meet the requirements of the EPA Green Power Purchasing Program.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 According to the U.S. EPA

 

2 Source: EPA Green Power Equivalency Calculator. For more information, visit www.epa.gov/greenpower/pubs/calculator.htm

 

3 Source: EPA Green Power Equivalency Calculator. For more information, visit www.epa.gov/greenpower/pubs/calculator.htm

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