IntelPR

Chip Shot: Rain, Rain Go Away

Posted by IntelPR Apr 29, 2011

As April comes to a close, it’s time to stow away your rain boots and worn-out umbrella. Use these weather apps from the Intel AppUpSM center to plan for those sunny days. Simply enter the zip code and get temperature, forecast and humidity levels quickly on iWeather. Weather Station displays the latest weather stats quickly from this easy-to-use app. Eager to step onto the golf course? Foretee Golf Weather Desktop provides real-time golf course information on weather and availability of tee times. Users can configure preferences by weather, price range and location of golf courses. Fore!

Intel is at the heart of everyday life -- making experiences people love even better, solving some of the world’s toughest challenges and making things that were once unimaginable common place. Today in NYC, Intel researchers and technologists give media a little taste of tech heaven with a look at future of technology innovation - today.

Celebrate Earth Day with these "green" games in the Intel AppUpSM center. In Build It Green by National Geographic, players build environmentally friendly housing, investigate alternative fuels and upgrade facilities with the latest green technology. In Plan it Green, the player has been elected mayor with the promise of bringing about a new green future. Get your "green" on today.

Intel Capital portfolio company OpenFeint announced today that it is being acquired by Gree. Intel Capital invested in OpenFeint in 2010, providing strategic and operational planning guidance, industry introductions and financial support that enabled the company to focus on growing the business. Commenting on the acquisition, outgoing Co-Founder and Chairman of OpenFeint Peter Relan said "From day one, working with Intel Capital has been excellent for OpenFeint. Not only did the Intel Capital brand validate OpenFeint's vision for mobile social gaming, but it also attracted a lot of other strategic partners to do business with OpenFeint." The OpenFeint investment is another success for Intel Capital's Consumer Internet investment team, which maintains a portfolio of 30 companies in the social media, online commerce, mobile web and monetization platform infrastructure space. Intel Capital has a decidedly international and stage agnostic Consumer Internet approach, with investments in iFeng (Phoenix New Media) and Okaybuy in China, Vostu and boo-box in Latin America, Yatra.com and July Systems in India and Nokta and iMall in Eastern Europe, as well as US-based companies including Betaworks, Yume, Kabam and Kno.

With Royal Wedding mania hitting fever pitch, the Intel AppUpSM center today launched A Royal Wedding Celebration – a new app for supported PCs with everything royal fans need to know about the wedding of the decade. Containing nine info-packed sections exploring William and Kate’s early lives, their love story and all the behind-the-scenes gossip, including the route Kate will take on her wedding day, the app will be updated with photos from the wedding day itself, bringing one of the most anticipated events of the year to life on your PC.

The Texas Advanced Computing Center (TACC) at the University of Texas at Austin today became the first National Science Foundation TeraGrid institution to work with Intel to support the national open science community in building applications that take full advantage of the Intel many integrated core (MIC) architecture. TACC now joins more than 100 other Intel partners porting software to the Intel MIC processor-based software development platform. Intel’s forthcoming MIC processors are designed to achieve tremendous performance for applications that possess a high degree of data parallelism, including molecular dynamics and quantum chemistry, as well as such emerging data-intensive applications as seismic imaging, sensor network analysis and real-time analytics. For more information on Intel and TACC’s collaboration, check out The Server Room blog post.

Intel Corporation and Micron Technology, Inc., today expanded their NAND flash memory joint venture operations with the official opening of the IM Flash Singapore fabrication facility. The $US 3 billion state-of-the-art 300 millimeter facility is currently ramping production of the companies’ industry-leading 25 nanometer NAND flash memory and is anticipated to employ more than 1,200 employees.

Money may not grow on trees, but algae grows on our roof! As part of a research project, Intel employees in Arizona determined a way to harness the carbon dioxide emitted by an Intel chip factory in order to grow algae, which can be used to create clean-burning biofuel. Learn more.

The First Semiconductor Company to Obtain LEED Silver Certification for a Manufacturing Campus

 

NEWS HIGHLIGHTS

  • Intel's Ocotillo manufacturing campus in Arizona received LEED silver certification for Existing Buildings: Operations & Maintenance.
  • Intel is the first semiconductor or industrial technology company to obtain LEED certification for an entire manufacturing campus.
  • A team of Intel employees determined a way to harness the carbon dioxide emitted by the Ocotillo manufacturing facility in order to grow algae for biofuel.

 

 

SANTA CLARA, Calif., April 21, 2011 –Intel® Corporation became the first semiconductor or industrial technology company to obtain LEED certification by the U.S. Green Building Council (USGBC) for a manufacturing campus. A certificate from LEED, which stands for Leadership in Energy and Environmental Design, is an internationally recognized stamp of approval. The LEED silver certification for "Existing Buildings: Operations & Maintenance" went to Intel's entire Ocotillo campus in Arizona, a site that includes three generations of wafer fabrication plants, support and office buildings.

 

As a result of Intel's longstanding environmental conservation efforts, no capital improvements were required to achieve the certification. Notable features of the campus include:

 

  • Semiconductor Industry Association benchmark data shows that Intel's Ocotillo campus utilized 26 percent less energy than the average semiconductor campus.
  • Two-hundred and 300 kW solar electricity support structures were erected in the Ocotillo campus parking lot in 2010. Currently ranking amongst the 10 largest solar installations in its utility territory, the Renewable Energy Certificates (RECs) generated by these installations are transferred to the local utility to support their regulatory obligations and programs.
  • In 2010, the Ocotillo campus recycled 90 percent of its solid waste (more than 10,000 tons) and achieved 66 percent site wide water conservation, saving approximately 5 million gallons of fresh water per day.
  • The Ocotillo campus utilizes a pipe that feeds water not suitable for drinking from the City of Chandler's waste water treatment plant directly back to Intel. As a result, 100 percent of the irrigation water and 95 percent of the cooling tower water is non-potable.
  • One-hundred percent of captured storm water is retained onsite.

 

"Given the complexity and size of the Ocotillo campus, it was an immense undertaking to seek certification of this manufacturing campus," said Brian Krzanich, senior vice president and general manager of Manufacturing and Supply Chain for Intel. "We take these steps not just in Arizona, but at our other facilities around the world, because we see a combination of economic advantages and opportunities to reduce our environmental impact, which in turn betters our business."

 

Intel has a policy of designing all new buildings to a minimum of LEED Silver and is also committed to making strategic improvements to its existing locations. In fact, in April 2010, Intel announced that it had received LEED Gold certification for Intel Design Center 9 in Haifa, Israel. That same month, KM 1, an Intel factory and office building in Kulim, Malaysia, achieved basic LEED certification for strategic improvements made to the 14-year-old facility.

 

Growing Algae on the Roof

 

Apart from striving to meet the green building requirements laid out in the LEED rating system, Intel engineers are constantly innovating with sustainability in mind. A team of such innovators at the Ocotillo campus determined that the carbon dioxide emissions produced by the fabrication facility ("the fab") were well-suited to grow algae, which can be used to create clean-burning biofuel.

 

Working with Arizona State University (ASU), the team erected a small proof-of-concept model on the roof of the Ocotillo fab, which demonstrates the capture of boiler emissions, the use of the emissions to grow algae, and the conversion of those algae into biofuel. This sort of carbon recycling could reduce the overall carbon emissions of the fab and, by creating a sustainable alternative fuel, displace the carbon emissions of burning fossil fuels from the Intel boilers.

 

The next phase of the project will focus on measuring the amounts of carbon captured, identifying options for implementing the concept on a larger scale, and assessing how algae-based carbon recycling should be recognized under various regulatory regimes. The Intel and ASU participants plan to continue to make their research results publicly available under the open, collaborative research model the team has established.

 

This project is part of Intel's Sustainability in Action program, through which employees can secure funding to share Intel's expertise in environmental sustainability with communities around the world. This program is a key element in Intel's efforts to engage all employees and drive corporate responsibility and sustainability deeper into the corporate culture.

 

 

 

 

Fab32.jpg

The exterior of Fab 32 on the Intel Ocotillo campus. Fab 32, a chip factory, is one of 12 buildings on the campus that has achieved LEED Silver certification.

OC2.jpg

The exterior of OC 2 on the Intel Ocotillo campus. OC 2 is one of 12 buildings on the campus that has achieved LEED Silver certification.

Algae1.jpg

The proof-of-concept model on the roof of the Ocotillo chip factory, which demonstrates the capture of emissions, the use of the emissions to grow algae, and the conversion of that algae into biofuel.

Algae2.jpg

The proof-of-concept model on the roof of the Ocotillo chip factory, which demonstrates the capture of carbon emissions, the use of the emissions to grow algae, and the conversion of that algae into biofuel.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

More than 72,000 laptops were lost by 275 organizations in Europe in the last year, costing the organizations €1.29 billion, or $1.79 billion, according to a new study from Intel and the Ponemon Institute. Nearly half of the laptops disappeared while being used away from the office and were most commonly lost while in-transit. Perhaps most frightening was the finding that 31 percent of lost laptops contained non-encrypted confidential data. The results are similar to a 2010 study commissioned by Intel and the Ponemon Institute to determine the financial implications of laptop loss in the U.S.

Non GAAP Results

  • Revenue $12.9 billion, up $2.6 billion, 25 percent year-over-year
  • Gross margin of 62 percent, down 1 percentage point year-over-year
  • Operating income $4.3 billion, up $862 million, 25 percent year-over-year
  • Net income $3.3 billion, up $830 million, 34 percent year-over-year
  • EPS 59 cents, up 16 cents, 37 percent year-over-year

 

GAAP Results

  • Revenue $12.8 billion, up $2.5 billion, 25 percent year-over-year
  • Gross margin of 61 percent, down 2 percentage points year-over-year
  • Operating income $4.2 billion, up $710 million, 21 percent year-over-year
  • Net income $3.2 billion, up $718 million, 29 percent year-over-year    
  • EPS 56 cents, up 13 cents, 30 percent year-over-year

 

 

SANTA CLARA, Calif., April 19, 2011 – Intel Corporation today reported record EPS and revenue on both a GAAP and non-GAAP basis.

 

On a non-GAAP basis, revenue was $12.9 billion, operating income was $4.3 billion, net income was $3.3 billion, and EPS was 59 cents. On a GAAP basis, the company reported first-quarter revenue of $12.8 billion, operating income of $4.2 billion, net income of $3.2 billion, and EPS of 56 cents.

 

The company generated approximately $4.0 billion in cash from operations, paid cash dividends of $994 million, and used $4.0 billion to repurchase 189 million shares of common stock.

 

“The first-quarter revenue was an all-time record for Intel fueled by double digit annual revenue growth in every major product segment and across all geographies,” said Paul Otellini, Intel president and CEO. “These outstanding results, combined with our guidance for the second quarter, position us to achieve greater than 20 percent annual revenue growth.”

 

Non-GAAP Financial Comparison

Quarterly Results

Q1 2011

vs. Q4 2010

vs. Q1 2010

Revenue

$12.9 billion

up 12%

up 25%

Operating Income

$4.3 billion

up 7%

up 25%

Net Income

$3.3 billion

up 3%

up 34%

Earnings Per Share

59 cents

up 5%

up 37%

Non-GAAP results exclude certain acquisition accounting impacts and expenses related to acquisitions and the related income tax effects of these charges.

 

GAAP Financial Comparison

Quarterly Results

Q1 2011

vs. Q4 2010

vs. Q1 2010

Revenue

$12.8 billion

up 12%

up 25%

Operating Income

$4.2 billion

up 3%

up 21%

Net Income

$3.2 billion

flat

up 29%

Earnings Per Share

56 cents

flat

up 30%

 

Q1 2011 Key Financial Information (GAAP)

  • PC Client Group revenue up 17 percent, Data Center Group revenue up 32 percent, other Intel architecture group revenue up 70 percent, and Intel® Atom™ microprocessor and chipset revenue of $370 million up 4 percent, all year-over-year.
  • The average selling price (ASP) for microprocessors was up sequentially.
  • Gross margin was 61 percent.
  • R&D plus MG&A spending of $3.7 billion, slightly higher than the company’s expectation.
  • The net gain of $213 million from equity investments and interest and other, consistent with the company’s expectation.
  • The effective tax rate was 28 percent, in-line with the company’s outlook of 29 percent.
  • The company used $4.0 billion to repurchase 189 million shares of common stock.
  • During the quarter, the company closed the acquisitions of Infineon Wireless Solutions and McAfee, Inc.  The combination of both acquisitions contributed revenue of $496 million.
  • The first quarter of 2011 had 14 weeks of business versus the typical 13 weeks, as the company realigned its fiscal year with the calendar year.

 

Business Outlook

Intel’s Business Outlook does not include the potential impact of any mergers, acquisitions, divestitures or other business combinations that may be completed after April 19.

 

Q2 2011 (GAAP, unless otherwise stated)

  • Revenue: $12.8 billion, plus or minus $500 million.
  • Non-GAAP revenue: Excluding certain acquisition related accounting impacts, the revenue forecast is $12.85 billion, plus or minus $500 million.
  • Gross margin percentage: 61 percent, plus or minus a couple percentage points.
  • Non-GAAP gross margin: Excluding certain accounting impacts and expenses related to acquisitions, the gross margin forecast is 62 percent plus or minus a couple percentage points.
  • R&D plus MG&A spending: approximately $3.9 billion.
  • Amortization of acquisition related intangibles: approximately $75 million.
  • Impact of equity investments and interest and other: gain of approximately $50 million.
  • Depreciation: approximately $1.2 billion.

 

Full-Year 2011 (GAAP, unless otherwise stated)

  • Gross margin percentage: 63 percent, plus or minus a few percentage points.
  • Non-GAAP gross margin: excluding certain accounting impacts and expenses related to acquisitions, the gross margin forecast is 64% plus or minus a few points.
  • Spending (R&D plus MG&A): $15.7 billion, plus or minus $200 million.
  • Amortization of acquisition related intangibles:  approximately $260 million.
  • Tax rate: approximately 29 percent for the second, third and fourth quarters.
  • Depreciation: $5 billion, plus or minus $100 million.
  • Capital spending: $10.2 billion, plus or minus $400 million.
  • 2011 will have 53 weeks of business versus the typical 52 weeks, as the company realigns its fiscal year with the calendar year.

 

For additional information regarding Intel’s results and Business Outlook, please see the CFO commentary at: www.intc.com/results.cfm.

 

Status of Business Outlook
During the quarter, Intel’s corporate representatives may reiterate the Business Outlook during private meetings with investors, investment analysts, the media and others. From the close of business on June 3 until publication of the company’s second-quarter earnings release, Intel will observe a “Quiet Period” during which the Business Outlook disclosed in the company’s news releases and filings with the SEC should be considered as historical, speaking as of prior to the Quiet Period only and not subject to an update by the company.

 

Risk Factors
The above statements and any others in this document that refer to plans and expectations for the second quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “plans,” “believes,” “seeks,” “estimates,” “may,” “will,” “should,” and their variations identify forward-looking statements.  Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements.   Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the company’s expectations.

  • Demand could be different from Intel's expectations due to factors including changes in business and economic conditions, including supply constraints and other disruptions affecting customers; customer acceptance of Intel’s and competitors’ products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Potential disruptions in the high technology supply chain resulting from the recent disaster in Japan could cause customer demand to be different from Intel’s expectations.
  • Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and Intel’s ability to respond quickly to technological developments and to incorporate new features into its products.
  • The gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; product mix and pricing; the timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; product manufacturing quality/yields; and impairments of long-lived assets, including manufacturing, assembly/test and intangible assets.
  • Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits.
  • The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets.
  • Gains or losses from equity securities and interest and other could vary from expectations depending on gains or losses on the sale, exchange, change in the fair value or impairments of debt and equity investments; interest rates; cash balances; and changes in fair value of derivative instruments.
  • The majority of Intel’s non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management’s plans with respect to Intel’s investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains/losses on equity investments and interest and other.
  • Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates.
  • Intel’s results could be affected by the timing of closing of acquisitions and divestitures.
  • Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. An unfavorable ruling could include monetary damages or an injunction prohibiting us from manufacturing or selling one or more products, precluding particular business practices, impacting Intel’s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property.

 

A detailed discussion of these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the report on Form 10-K for the fiscal year ended Dec. 25, 2010.

 

Earnings Webcast
Intel will hold a public webcast at 2:30 p.m. PDT today on its Investor Relations web site at www.intc.com. A webcast replay and MP3 download will also be made available on the site.

 

Intel plans to report its earnings for the second quarter of 2011 on Wednesday, July 20, 2011.  Immediately following the earnings report, the company plans to publish a commentary by Stacy J. Smith, vice president and chief financial officer at www.intc.com/results.cfm.  A public webcast of Intel’s earnings conference call will follow at 2:30 p.m. PDT at www.intc.com.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Whether taking part in the Campaign for Commercial-Free Childhood’s “Screen-Free Week” this week , or engaging in “screen-time” together with your “digital native”,  parents and children alike can enhance their lives with mobile technology by discussing family usage and guidelines together according to Anna Post of The Emily Post Institute. At the Mom 2.0 Summit this past weekend, Intel shared additional findings from its recent “Mobile Etiquette” survey that revealed how parents and children use mobile technology around each other and its impact on family relationships. According to the survey, nearly 40 percent of parents admit they sometimes spend too much time using a mobile device in front of their children, while 42 percent of children think their parents need to disconnect more when they are at home. Find additional survey findings from Intel and tips from etiquette expert Anna Post here.

NEWS HIGHLIGHTS:

  • Intel® announces eight Supplier Continuous Quality Improvement Award (SCQI) winners.
  • Intel management shares company direction for 2011

 

 

SANTA CLARA, Calif., April 19, 2011 -- Eight companies were honored today with Intel® Corporation's prestigious Supplier Continuous Quality Improvement (SCQI) award for 2010. The award, handed out at Intel's Supplier Day, recognizes the organization's most accomplished suppliers, distinguishing world-class, outstanding quality performance of companies that provide products and services imperative to Intel's business success.

 

Supplier Day serves as a critical venue for suppliers and Intel's management to collaborate, learn and interact to build the world's best supply chain. Sharing the company direction reinforces the technology and manufacturing organization's focus on cost effective innovation, technology leadership and agile, sustainable execution.

 

"Our industry is experiencing significant changes that make it even more important to partner with outstanding suppliers to deliver leading-edge technology to our customers," said William Holt, senior vice president and general manager of Intel's Technology and Manufacturing Group. "We are delighted to recognize the level of excellence demonstrated by the SCQI winners."

 

"In this industry companies can't rest on last year's quality performance; continuous improvement is what differentiates good companies from great companies," said Brian Krzanich, senior vice president and general manager of Intel's Manufacturing and Supply Chain. "The eight companies honored with this award demonstrated improvement in the important areas of innovation, agility, customer responsiveness and environmental sustainability."

 

The SCQI award is part of Intel's SCQI program, which encourages Intel's key suppliers to strive for excellence and continuous improvement. To qualify for SCQI status, suppliers must score at least 95 percent on a report card that assesses performance and ability to meet cost, quality, availability, delivery, technology and environmental, social and governance goals. Suppliers must also achieve 90 percent or greater on a challenging improvement plan and demonstrate solid quality and business systems. Additional information about the SCQI program is available at www.intel.com/go/quality.

 

The SCQI winners provide Intel with the following products or services:

 

  • DISCO Corporation supplies blade dicing and laser saws, wafer thinning and polishing systems.
  • Hitachi High-Technologies Corporation supplies etching systems, field emission and critical dimension scanning electron microscopes, and defect inspection systems.
  • Hitachi Kokusai Electric Inc. supplies diffusion furnaces.
  • JSR Corporation supplies advanced photoresists, packaging materials and CMP consumables.
  • Senju Metal Industry Co., Ltd. supplies electronic interconnect materials.
  • SHINKO ELECTRIC INDUSTRIES CO., LTD. supplies plastic laminated packages and heat spreaders.
  • SUMCO Corporation supplies 200mm and 300mm polished and epitaxial silicon wafers.
  • Tokyo Electron Limited supplies semiconductor production equipment.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

SANTA CLARA, Calif., April 19, 2011 – Intel® Corporation announced 16 recipients of the Preferred Quality Supplier (PQS) award. These companies are distinguished from thousands of suppliers that work with Intel and have exceeded high expectations and tough performance goals while demonstrating an industry-leading commitment to quality.

 

In addition to the PQS award, Intel celebrates extraordinary supplier accomplishments with the new Achievement Award. This award recognizes supplier achievements across the areas of cost, quality, availability, technology, sustainability and customer satisfaction. Four suppliers are the recipients of this award for performance in 2010.

 

"The recipients of the 2010 Intel Preferred Quality Supplier award have clearly demonstrated their excellence," said Jacklyn Sturm, vice president of Intel's Technology and Manufacturing Group and general manager of Worldwide Materials. "This high level of performance is displayed not only in the world-class quality and superb technology of their products and services, but also in the new bar they have helped Intel achieve in customer responsiveness and total supply chain sustainable business practices."

 

"Intel is delighted to recognize our Preferred Quality Suppliers and their exceptional performance over the past year," said Robert Bruck, vice president of Intel's Technology and Manufacturing Group and general manager of Technology Manufacturing Engineering. "These suppliers have distinguished themselves as market leaders and have made a substantial contribution to Intel's technology, affordability and sustainability leadership."

 

The PQS award is part of Intel's Supplier Continuous Quality Improvement (SCQI) program that encourages suppliers to innovate and continually improve. To qualify for PQS status, suppliers must score 80 percent on a report card that assesses performance and ability to meet cost, quality, availability, delivery, technology and environmental, social and governance goals. Suppliers must also achieve 80 percent or greater on a challenging improvement plan and demonstrate solid quality and business systems. Additional information about the SCQI program is available at www.intel.com/go/quality.

 

The PQS winners provide Intel with the following products and services:

 

  • Applied Materials Inc. supplies semiconductor manufacturing equipment and support services.
  • ASML supplies semiconductor lithography equipment.
  • Cabot Microelectronics Corporation supplies CMP slurries.
  • Daewon Semiconductor Packaging Industrial Company Ltd. supplies handling media.
  • DAIFUKU supplies Fab automated material handling systems.
  • Dai Nippon Printing Co., Ltd. supplies advanced photomasks.
  • FUJIFILM Electronic Materials supplies advanced chemistry and equipment for semiconductor device manufacturing.
  • Mitsubishi Gas Chemical Company Inc. supplies chemicals for semiconductor device manufacturing.
  • Moses Lake Industries (Tama Chemicals) supplies specialized ultra-high purity chemicals.
  • Murata Manufacturing Co., Ltd. supplies multilayer ceramic capacitors, inductors and electromagnetic interference components.
  • Nikon Corporation supplies lithography scanners and steppers.
  • Rofin-Baasel supplies laser mark equipment.
  • Siltronic supplies polished and epitaxial silicon wafers.
  • STATS ChipPAC Ltd. supplies full turnkey packaging and test services.
  • Taiyo Yuden Co., Ltd. supplies multilayer ceramic capacitors, inductors and electromagnetic interference components.
  • Taiwan Semiconductor Manufacturing Company, Ltd. supplies foundry services.

 

The Achievement Award winners are the following:

 

  • Advantest Corporation, test equipment, awarded for velocity and availability.
  • Gemtek Technology Co., Ltd., wireless products, awarded for customer satisfaction.
  • Grohmann Engineering, assembly equipment, awarded for affordability.
  • Hirata Corporation, automation equipment, awarded for breakthrough technology.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

HDXPRT 2011, the first community-designed version of this consumer-oriented PC benchmark, is now in beta for HDXPRT Development Community members. Started by Principled Technologies last fall, this growing community is open to anyone, and currently includes major PC OEMS, US and International technical press. More information can be found at www.hdxprt.com.

The Creators Project, a global cultural initiative by Vice and Intel Corporation, has radically reinvented this year's Coachella Valley Music and Arts Festival. The Creators Project is Coachella's first-ever creative partner and has brought together leading artists, filmmakers, musicians and designers from across the world to construct dramatic multimedia, art installations on the grounds, including redesigning the festival’s Main Stage and Sahara Dance Tent. The series of artworks at Coachella represent the premiere of The Studio, a global arts initiative under The Creators Project that produces and distributes works from artists representing a cross-section of creative disciplines. Read more here.

Intel Corporation and Micron Technology Inc. today introduced the most advanced, 20-nanometer (nm) process technology for manufacturing NAND flash memory. Manufactured by IM Flash Technologies (IMFT), the companies' NAND flash joint venture, the new 20nm 8GB multi-level cell (MLC) NAND flash device provides a high-capacity, small form factor storage option for saving music, video, books and other data on smartphones, tablets and computing solutions such as solid-state drives (SSDs).

Now that you finally filed your taxes, manage your money for next year with You Need A Budget (YNAB) 3 on the Intel AppUpSM center. YNAB 3 gives users total control of their money with this simple, intuitive, full-featured application. The app is designed for those trying to pay off debt by giving every dollar a job. Even if the user overspends, the app will help users make small adjustments to balance out those mistakes before the next month. Stop living paycheck to paycheck with YNAB 3.

New 20nm, 8-gigabyte Device Delivers Highest Capacity in Smallest Form Factor for Tablets, Smartphones, SSDs and Other Consumer and Compute Devices

 

NEWS HIGHLIGHTS

  • Intel and Micron deliver industry's smallest, most advanced NAND flash process technology at 20nm.
  • IM Flash Technologies leads the industry with 20nm process and quick transitions of the entire fab network.
  • Measuring just 118mm2, the 8GB MLC NAND device provides high capacity for smartphones, tablets, SSDs and more.

 

 

SANTA CLARA, Calif. and BOISE, Idaho, April 14, 2011 – Intel Corporation and Micron Technology Inc. today introduced a new, finer 20-nanometer (nm) process technology for manufacturing NAND flash memory. The new 20nm process produces an 8-gigabyte (GB) multi-level cell (MLC) NAND flash device, providing a high-capacity, small form factor storage option for saving music, video, books and other data on smartphones, tablets and computing solutions such as solid-state drives (SSDs).

 

The growth in data storage combined with feature enhancements for tablets and smartphones is creating new demands for NAND flash technology, especially greater capacity in smaller designs. The new 20nm 8GB device measures just 118mm2 and enables a 30 to 40 percent reduction in board space (depending on package type) compared to the companies' existing 25nm 8GB NAND device. A reduction in the flash storage layout provides greater system level efficiency as it enables tablet and smartphone manufacturers to use the extra space for end-product improvements such as a bigger battery, larger screen or adding another chip to handle new features.

 

Manufactured by IM Flash Technologies (IMFT), Intel and Micron's NAND flash joint venture, the new 20nm 8GB device is a breakthrough in NAND process and technology design, further extending the companies' lithography leadership. Shrinking NAND lithography to this technology node is the most cost-effective method for increasing fab output, as it provides approximately 50 percent more gigabyte capacity from these factories when compared to current technology. The new 20nm process maintains similar performance and endurance as the previous generation 25nm NAND technology.

 

"Close customer collaboration is one of Micron's core values and through these efforts we are constantly uncovering compelling end-product design opportunities for NAND flash storage," said Glen Hawk, vice president of Micron's NAND Solutions Group. "Our innovation and growth opportunities continue with the 20nm NAND process, enabling Micron to deliver cost-effective, value-added solid-state storage solutions for our customers."

 

"Our goal is to enable instant, affordable access to the world's information," said Tom Rampone, vice president and general manager, Intel Non-Volatile Memory Solutions Group. "Industry-leading NAND gives Intel the ability to provide the highest quality and most cost-effective solutions to our customers, generation after generation. The Intel-Micron joint venture is a model for the manufacturing industry as we continue to lead the industry in process technology and make quick transitions of our entire fab network to smaller and smaller lithographies."

 

The 20nm, 8GB device is sampling now and expected to enter mass production in the second half of 2011. At that time, Intel and Micron also expect to unveil samples of a 16GB device, creating up to 128GBs of capacity in a single solid-state storage solution that is smaller than a U.S. postage stamp.

 

 

IMFT 20nm NAND die.jpg

New 64 Gigabit (Gb) NAND flash die from Intel Micron Flash Technologies - Intel and Micron deliver the industry’s smallest, most advanced NAND flash process technology at 20nm. Shown is a 64Gb, or 8 Gigabyte (GB), die measuring just 118mm2. The 64Gb Multi-Level Cell (MLC) NAND device provides high capacity for smartphones, tablets, SSDs and more.

IMFT 34nm-25nm-20nm comparison.jpg

Comparison of two 32Gb 34nm die versus one 64Gb on 25nm and 20nm process from IMFT - This photo shows a comparison of  two 32 Gigabit (Gb) Intel Micron Flash Technologies (IMFT) 34nm die versus one 64Gb, or 8 Gigabyte (GB), die on 25nm and new 20nm processes. Shrinking NAND lithography is the most cost-effective method for increasing fab output and reducing die cost. Shrinking from 25nm to 20nm process will provide an approximately 50 percent more gigabyte capacity from IMFT factories when compared to current technology. The new 20nm process maintains similar performance and endurance as the previous generation 25nm NAND technology.

 

About Micron
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron's common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology Inc., visit www.micron.com.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

©2011 Micron Technology, Inc. and Intel Corporation. All rights reserved. Information is subject to change without notice.

 

Micron and the Micron logo are trademarks of Micron Technology, Inc. This news release contains forward-looking statements regarding the production of the 20nm, 8GB and 16GB NAND device. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents Micron files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically Micron's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for Micron on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.

 

 

SANTA CLARA, Calif., April 13, 2011 – Beginning with the publication of Intel’s first-quarter earnings report on Tuesday, April 19, the company will revise the presentation of its financial results to reflect the recently closed acquisitions of Infineon Wireless Solutions and McAfee, Inc. Infineon Wireless Solutions will now operate as Intel Mobile Communications. The company is providing this detail now in order to give visibility into the new reporting model.

 

Operating groups shown below are comprised of the following:

 

  • PC Client Group: Delivering microprocessors and related chipsets and motherboards designed for the notebook and desktop (including high-end enthusiast PCs) market segments; and wireless connectivity products.
  • Data Center Group: Delivering microprocessors and related chipsets and motherboards designed for the server, workstation, and storage computing market segments; and wired network connectivity products.
  • Other Intel Architecture Group consists of the following:
    • Intel Mobile Communications: Delivering mobile phone components such as baseband processors, radio frequency transceivers, and power management chips.
    • Embedded and Communications Group: Delivering microprocessors and related chipsets for embedded applications.
    • Netbook and Tablet Group: Delivering microprocessors and related chipsets for the netbook and tablet market segments.
    • Digital Home Group: Delivering Intel architecture-based products for next-generation consumer electronics devices.
    • Ultra-Mobility Group: Delivering low-power Intel architecture-based products in the next-generation handheld market segment.
  • Software and Services Group consists of the following:
    • McAfee: A wholly owned subsidiary delivering software products for endpoint security, system security, consumer security, network security, and risk and compliance.
    • Wind River Software Group: A wholly owned subsidiary delivering device software optimization products to the embedded and handheld market segments, serving a variety of hardware architectures.
    • Software and Services Group: Delivering software products and services that promote Intel Architecture as the platform of choice for software development.
  • All Other consists of the following:
    • Non-Volatile Memory Solutions Group: Delivering advanced NAND flash memory products for use in a variety of devices.
    • Corporate: Revenue, expenses and charges such as:
      • A portion of profit-dependent compensation and other expenses not allocated to the operating groups.
      • Divested businesses and the results of seed businesses that support our initiatives.
      • Acquisition-related costs, including amortization and any impairment of acquisition-related intangibles and goodwill.

 

supp_oper.jpg

 

The company will also provide non-GAAP financial measures that exclude certain accounting impacts primarily associated with the acquisition of McAfee, Inc and Infineon Wireless Solutions, as follows:

 

supp_roconc.jpg

 

Earnings Webcast
Intel plans to report its earnings for the first quarter of 2011 on Tuesday, April 19, 2011. Immediately following the earnings report, the company plans to publish a commentary by Stacy J. Smith, vice president and chief financial officer at www.intc.com/results.cfm. A public webcast of Intel’s earnings conference call will follow at 2:30 p.m. PST at www.intc.com.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Tune in to MashUp Radio this Fri. April 15 from 12:00 – 12:30 pm PT to catch Intel’s Peter Biddle and Boxee’s Andrew Kippen chat about changes to come on the small screen. Kippen is the VP of Marketing at Boxee, and when a Boxee-powered device is connected to your TV, it allows you to stream content from the Web directly to the tube. Peter and Andrew will discuss how smart TV will change the consumer lifestyle, the future of content and what audiences can expect.

At IDF Beijing,  Kirk Skaugen, vice president and GM of Intel’s Data Center Group, previewed new Itanium-based servers from China’s Huawei and Inspur. Huawei is the newest Itanium OEM and the second in China.  Skaugen said Poulson, the next Itanium processor, will ship in 2012 and provide twice the performance of the current Itanium 9300 processor.

Intel is powering Lenovo’s Cloud-Ready Clients that can take advantage of the hardware capabilities of the PC to give end users a better cloud computing experience. For users operating Lenovo’s Cloud Ready Clients (all ThinkPad and ThinkCentre PCs powered by 2nd Generation Intel® Core™ or Core™ vPro™ processors), Lenovo’s Secure Cloud Access (SCA), detects the device’s capabilities, including processor performance, graphics, and available bandwidth, and uses them to optimize application delivery.

Company Highlights Embedded Growth and Innovation in China; New ‘Oak Trail’ Platform for Tablets and Availability of Intel AppUpSM Center

 

NEWS HIGHLIGHTS

  • Intel introduced its next-generation Intel® Atom™ processor-based tablet platform, “Oak Trail,” powering a variety of tablets and portable embedded devices.
  • Intel disclosed plans for its next-generation 32nm netbook platform, “Cedar Trail.”
  • Intel announced a joint innovation center with Tencent* to focus on mobile computing platforms and new collaborations for the Intel AppUpSM center and developer program in China.
  • Intel disclosed “Crystal Forest,” a next-gen communications infrastructure platform to address application, control and data plane processing on Intel® architecture.
  • Intel highlights embedded innovation with nearly a quarter of embedded business deriving from China in communications, digital signage, security and transportation market segments.
  • Underscoring support for Itanium, Intel will unveil next-gen Itanium processor, codenamed “Poulson;” shipping in 2012.

 

 

INTEL DEVELOPER FORUM, Beijing, April 12, 2011 – Intel Corporation executives today discussed the evolution of personal computing as demand for connectivity in all aspects of people’s daily lives continues to increase.

 

Outlining several hardware, software and ecosystem advancements designed to bring richer and more connected user experiences across a range of products and devices were Doug Davis, vice president and general manager of Intel’s Netbook and Tablet Group; Renée James, senior vice president and general manager, Intel Software and Services Group; and Ton Steenman, vice president and general manager of the Intel Embedded and Communications Group. The announcements included the unveiling of a range of tablet devices based on the newly announced Intel® Atom™ processor Z670; the new collaborations for the Intel AppUpSM center and Intel AppUp Developer Program in China; and the disclosure of Intel’s next-generation communications infrastructure platform “Crystal Forest.”

 

Doug Davis: Reinventing Personal Computing for Devices
During his keynote presentation, Davis discussed how companion computing devices, including netbooks, tablets and other devices are tranforming the world we live in through personal, mobile and connected experiences. He described how Intel, over the next 3 years, is accelerating the Intel Atom product line on a pace faster than Moore’s Law to deliver increased battery life, enhanced performance and new features for amazing user experiences.

 

Davis also unveiled the highly anticipated Intel® AtomTM Z670 processor and Intel® SM35 Express Chipset platform, formerly codenamed “Oak Trail,” with a range of innovative tablets and form factors. These devices are available from leading customers with operating system of choice including Android*, Windows 7* and MeeGo* starting in May.

 

Highlighting the evolution of netbooks, Davis also disclosed “Cedar Trail,” Intel’s next-generation netbook and entry-level desktop platform. Based on Intel’s leading-edge 32nm process technology, “Cedar Trail” will include more than 10 new features that will improve media, graphics and power consumption in upcoming netbooks. The chip’s design, efficiencies and latest manufacturing process technology will enable fan-less, fully enclosed and thus ultra-sleek devices. Davis said other new features will be disclosed in the coming months, with the processor due in the second half of the year.

 

Renée James: Creating the Ultimate User Experience
During her keynote, James discussed Intel’s transition from a semiconductor company to a personal computing company, and emphasized the importance of delivering compelling user experiences across a range of personal computing devices. To develop and enable the best experiences, James announced a strategic relationship with Tencent*, China’s largest Internet company, to create a joint innovation center dedicated to delivering best-in-class mobile Internet experiences. Engineers from both companies will work together to further the mobile computing platforms and other technologies.

 

James also announced new collaborations for the Intel AppUpSM center and the Intel AppUp Developer Program in China to help assist in the creation of innovative applications for Intel Atom processor-based devices. Chinese partners supporting this effort include Neusoft*, Haier* and Hasee* and Shenzhen Software Park*.

 

Ton Steenman: One World, Embedded with Innovation
As one of the fastest-growing countries in the world, China has become the center of embedded innovation with nearly a quarter of Intel’s embedded business deriving from China. Worldwide, nearly 30 percent of new Intel embedded design wins were converted from a different architecture, of which nearly 50 percent were in China. The company has also seen increasing momentum for Intel Atom processor-based devices with 4,800 embedded design engagements, including two of the first Atom-based in-vehicle infotainment-equipped cars which hit the road in China last year.

 

During his keynote presentation, Steenman highlighted Intel’s embedded success in China while addressing the need for seamlessly connected, secure and engaging user experiences in embedded devices by illustrating Intel’s vision of the connected city. Steenman described this vision with connected devices such as transportation ticketing kiosks, digital signage and security systems. Steenman also discussed Intel’s involvement in several efforts in China in embedded market segments such as communications, digital signage and transportation, including the “Safe City” campaign and a high-definition intelligent traffic monitoring solution developed by Shanghai Bocom Intelligent Network Technologies Co Ltd*.

 

Steenman also revealed details for the next-generation communications infrastructure platform codenamed “Crystal Forest,” which enables customers to process data, control and applications workloads on Intel® architecture. Steenman closed his remarks by outlining the benefits of the new Intel® Atom™ processor Z670, which enables portable embedded devices in enterprise settings with applications such as mobile clinical assistants, ruggedized industrial tablets and portable point-of-sale devices.

 

Day Two Preview
Day two of the Intel Developer Forum in Beijing will feature a keynote from Kirk Skaugen, vice president and general manager of Intel’s Data Center Group. Skaugen will disclose that Intel’s next-generation Itanium processor, codenamed “Poulson,” will ship in 2012 and is expected to offer twice the performance of the current Intel® Itanium 9300 processor, as well as improved performance per watt, and enhanced reliability, availability and serviceability.

 

Intel Developer Forum
IDF spans the worlds of mobility, digital enterprise, digital home, and technology and research. Held at the China National Convention Center on April 12-13, 2011, the event is geared toward the Chinese market in support of local innovation and Intel’s industry leadership in the region. Next up on the IDF schedule is a 3-day event in San Francisco, which will be held Sept. 13-15 at Moscone Center West. Further information is available at developer.intel.com/idf.

 

View the Multimedia Press Kit
(populated during the event with high resolution photos, videos, fact sheets, and more)

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Intel Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Intel announced that its Intel® Atom™ processor Z670 based platform, formerly codenamed “Oak Trail,” is now available and will be in end user devices beginning next month. Over 35 innovative designs from companies including Evolve III*, Fujitsu Limited*, Lenovo*, Motion Computing*, Razer*, and Viliv* are based on the new technology and running a variety of operating systems.  Purpose built for tablets, the platform offers increased battery life, enhanced performance especially around video, and several other new features. The series is also suited for a range of portable embedded designs such as mobile clinical assistants, ruggedized industrial tablets and portable point-of-sale systems.

Going to NAB in Las Vegas? Stop by Intel's booth (#SU823) to see Thunderbolt™ Technology in action. Intel’s new lightning fast PC connection technology is available today on the new Apple* MacBook* Pros, and will enable products from companies including AJA*, BlackMagic*, Matrox*, Sonnet*, G-Tech*, Promise*, and La Cie*.

 

Company Outlines Plans to Accelerate Intel Manufacturing Lead
with Intel® Atom™ Processor Family and Move Faster than Moore's Law

 

NEWS HIGHLIGHTS

  • Over 35 innovative "Oak Trail" design wins from customers including Evolve III*, Fujitsu Limited*, Lenovo*, Motion Computing*, Razer*, and Viliv* available starting in May and throughout 2011.
  • "Cedar Trail," Intel's upcoming netbook and entry-level desktop platform, will deliver features including Intel® Wireless Music, Intel® Wireless Display, PC Synch and Fast Boot, as well as improvements in media, graphics and power consumption.
  • Innovation beyond the PC: Embedded Intel® Atom™ Z670 creates smaller, thinner, fanless devices for mobile clinical assistants, industrial tablets and portable point-of-sales devices.
  • Intel is accelerating its Atom product line to move faster than Moore's law, bringing new products to market on three process technologies in the next 3 years.
  • Atom platforms harness Intel's unique "operating system of choice" strategy for Google* Chrome* and Android*, MeeGo* and Windows*, delivering personalized experiences.

 

 

SANTA CLARA, Calif., April 11, 2011 - Intel Corporation today announced that the Intel® Atom™ platform, formerly codenamed "Oak Trail," is now available and will be in devices starting in May and throughout 2011. Over 35 innovative tablet and hybrid designs from companies including Evolve III*, Fujitsu Limited*, Lenovo*, Motion Computing*, Razer*, and Viliv* are based on "Oak Trail" and running a variety of operating systems.

 

In addition, at the Intel Developer Forum in Beijing, the company will give a sneak peak of its next-generation, 32nm Intel Atom platform, currently codenamed "Cedar Trail." This solution will help to enable a new wave of fanless, cool and quiet, sleek and innovative netbooks, entry-level desktops and all-in-one designs.

 

"The new Intel Atom 'Oak Trail' platform, with 'Cedar Trail' to follow, are examples of our continued commitment to bring amazing personal and mobile experiences to netbook and tablet devices, delivering architectural enhancements for longer battery life and greater performance," said Doug Davis, vice president and general manager of the Netbook and Tablet Group at Intel. "We are accelerating the Intel Atom product line to now move faster than Moore's law, bringing new products to market on three process technologies in the next 3 years."

 

The new Intel® Atom™ processor Z670, part of the "Oak Trail" platform, delivers improved video playback, fast Internet browsing and longer battery life, without sacrificing performance. The rich media experience available with "Oak Trail" includes support for 1080p video decode, as well as HDMI. The platform also supports Adobe* Flash, enabling rich content and Flash-based gaming.

 

With these significant improvements in power-efficient performance, the Intel Atom processor Z670 allows applications to run on various operating systems, including Google* Android*, MeeGo* and Windows*. This unique flexibility delivers both new experiences and more choice when it comes to tablets and hybrid designs that combine the best features of the netbook and tablet together.

 

The platform also helps deliver smaller, thinner and more efficient devices by packing integrated graphics and the memory controller directly onto the processor die. The processor is 60 percent smaller than previous generations with a lower-power design for fanless devices as well as up to all-day battery life1. Additional features include Intel® Enhanced Deeper Sleep that saves more power during periods of inactivity as well as optimized Intel SpeedStep® technology. An integrated HD decode engine enables smooth 1080p HD video playback at a fraction of the power consumption.

 

In addition, Intel Atom Z670 processors come with the Intel® SM35 Express Chipset, delivering a lead-free2, halogen-free3 design with high-speed USB 2.0 for greater performance and Intel® High-Definition Audio to enable premium home theater sound.

 

Also ideal for small form-factor and portable embedded designs, the platform provides an excellent solution for a range of tablets in retail, medical and industrial applications. Solutions such as mobile clinical assistants allow medical staff to directly input data into patients' electronic files and avoid paper charting. This can result in a reduction in errors, better workflow, higher productivity and reduced paper handling and overhead costs. In addition to the Intel Atom Z670, Intel is offering the Intel® Atom™ processor Z650 for embedded devices with 7-year lifecycle support on Windows and MeeGo operating systems.

 

Based on Intel's leading-edge 32nm process technology, the next-generation "Cedar Trail" platform will feature improvements in graphics capabilities including Blu-ray 2.0 support, a dedicated media engine for full 1080p playback and additional digital display options including HDMI output and DisplayPort. New features will include Intel® Wireless Music, Intel® Wireless Display, PC Synch and Fast Boot. In addition, the enhancements made in power consumption and TDP will enable fanless designs with longer battery life. This means great acoustics without the hum of a fan and improved ruggedness and aesthetics of the design. Intel is currently sampling "Cedar Trail" to all major OEMs and ODMs. Users can look forward to a new generation of innovative mobile and desktop designs based on the "Cedar Trail" platform in the second half of 2011.

 

For more information, video, photos and benchmarks visit www.intel.com/newsroom/atom.

 

 

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Intel Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

1 Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.  Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary.  You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance.

 

2 Intel 45nm product is manufactured on a lead-free process. Lead-free per EU RoHS Directive (2002/95/EC, Annex A). Some RoHS exemptions may apply to other components used in the product package.

 

3 Applies to components containing flame retardants and PVC only. Halogens are below 900 PPM bromine, 900 PPM chlorine, and 1500 PPM combined bromine and chlorine.

Intel and Kno to Further Innovation in Education Tablet Market

 

NEWS HIGHLIGHTS

  • Intel Capital invests $20 million in Kno.
  • Intel and Kno to work together to optimize Kno's touch-based applications for Intel's educational platforms.
  • Intel continues strong support of 1:1 eLearning environments.

 

 

SANTA CLARA, Calif., April 8, 2011 – Intel Capital, Intel Corporation's global investment organization, today announced a $20 million investment in Kno Inc., an education software company. The investment is part of a $30 million Series-C round led by Intel Capital, which includes participation from Andreessen Horowitz, Advance Publications, First Round Capital, FLOODGATE and SV Angels. Kno will use the funding to develop its innovative educational software solutions for multiple platforms, including Intel® architecture.

 

Kno, short for knowledge, is an education software company on a mission to make learning engaging, effective and social for students. The companies will work together to address the growing interactive and 1:1 student learning environments by exploring opportunities to make Kno's touch-based applications available for Intel's educational platforms.

 

"The increasing consumption of digital content has primed the textbook market for disruption, creating an exciting opportunity for technology innovation to fundamentally change the way 1.4 billion students globally learn," said Arvind Sodhani, president of Intel Capital and Intel executive vice president. "Kno's purpose-built education tablet, along with its unique software solution, delivers a learning experience that directly supports Intel's 1:1 eLearning vision."

 

"Intel and Kno have a shared goal of accelerating the global education technology market so we are very pleased to have Intel Capital's support," said Osman Rashid, CEO and co-founder, Kno Inc. "Kno's software makes learning more engaging, effective and social for students, which we believe has the power to transform how students learn."

 

"Intel technology is increasingly becoming a favorite in devices for consumers as well as vertical industries like education," said Bill Kircos, marketing general manager, Intel Netbook and Tablet Group. "Intel® Atom™ processors and the underlying technologies are well-suited for Kno's touch-based applications, and provide the power-efficient performance and responsiveness today's students have come to expect from tablets."

 

About Intel Capital
Intel Capital, Intel's global investment organization, makes equity investments in innovative technology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software, and services targeting enterprise, home, mobility, health, consumer Internet, semiconductor manufacturing and cleantech. Since 1991, Intel Capital has invested more than US$9.8 billion in over 1,100 companies in 48 countries. In that timeframe, 189 portfolio companies have gone public on various exchanges around the world and 258 were acquired or participated in a merger. In 2010, Intel Capital invested US$327 million in 119 investments with approximately 44 percent of funds invested outside the United States and Canada. For more information on Intel Capital and its differentiated advantages, visit www.intelcapital.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

That shoebox full of receipts isn’t going to cut it for the IRS. Get your personal finances organized by using these free apps from the Intel AppUpSM center. Expenses at a Glance lets users create their own set of expenses arranged in a tree structure and perform detailed analysis of any category. Cash Track System is designed to keep track of income and expenses. Income Tax Calculator calculates users’ tax payable based on the assessment year. Use these apps to get your personal finances in order before April 15.

What happens when Facebook and Intel engineers spend more than 18 months together to define a world-class, open approach to data center efficiency? The result is a 60 percent reduction in power consumption per user based on the leading energy-efficient performance of Intel® Xeon® processor-based platforms, jointly developed system optimization, and Facebook’s aggressive power optimization. We are big fans of what Facebook achieved! Learn more about Intel’s collaboration with Facebook in blogs posted here and here.

In Intel’s continued support of the Linux Foundation’s Yocto Project, the company has officially joined the Yocto Project Steering Group to provide leadership and direction. The Yocto Project helps companies develop Linux operating systems for embedded devices by offering high-quality open source technology to customize Linux-based systems. Get more information about the Steering Group and the recently launched Yocto Project Release 1.0.

Congratulations to David Tang-Quan, Prithwis Mukhopadhyay and Xiaoyu “Carrie” Cao, the favorites in the Intel Science Talent Search 2011 People’s Choice Awards! In March, these remarkable young scientists competed against other brilliant high school seniors for the top prize of $100,000. After the judges picked the top winners, we gave YOU the opportunity to vote for your favorites. View the full results.

Intel Corporation announced today the availability of its Intel® Xeon® Processor E3-1200 series-based platforms for embedded devices. Based on Intel’s first "visibly smart" micro-architecture, the new quad-core Xeon CPUs, paired with the Intel® C206 Chipset, offer added security capabilities provided by Error Correcting Code, which corrects memory errors without requiring a system reset, thereby enhancing performance and autonomous operation – all essential for remotely-managed, compute-intensive applications in embedded market segments such as retail, digital signage and banking.

Today’s Intel® Xeon processor server and workstation announcements mark the debut of a new numbering system for the processors. The current system was running out of numbers and needed to evolve to communicate key processor features. Intel’s new numbering system continues to emphasize the “Intel® Xeon® processor” brand and helps customers choose the right product for their needs by providing information on processor scaling and general capability. The first implementation of this system was rolled out today with the Intel® Xeon® processor E7-8800/4800/2800 and E3-1200 product families, and Intel® C200 series chipset. All future Intel® Xeon® processors will adopt this new numbering.  Get more information.

Intel® Xeon® Processor E7 Family Delivers Record-Breaking Performance, New Security, Reliability and Energy Efficiency Features

 

NEWS HIGHLIGHTS

  • Intel® Xeon® processor E7 family sets a new standard in reliability, availability, security and performance to help IT managers address data-intensive workloads.
  • Two new security features help ensure the highest levels of data integrity and system uptime.
  • Supports up to 10 cores, delivers up to 40 percent greater performance1 than the previous- generation processor, and improved energy efficiency with a new feature that dynamically adjusts power consumption based on workload.
  • Builds on Intel's commitment to democratize mission-critical computing by accelerating the migration away from proprietary computing environments.

 

 

SANTA CLARA, Calif., April 5, 2011 – Enabling IT departments to better manage data-intensive environments through new security and reliability features and record-breaking performance, a new family of server processors that accelerate mission-critical computing have been announced by Intel Corporation.

 

The record-setting Intel® Xeon® processor E7-8800/4800/2800 product families build on Intel's previous generation of server processors to set a new standard for high-end computing applications, including business intelligence, real-time data analytics and virtualization. Strengthening the line of defense for data centers, the new processors also provide advanced security features that ensure greater data integrity.

 

Based on Intel's leading 32-nanometer (nm) process technology, the new Intel Xeon processors have up to 10 cores with Intel® Hyper-Threading Technology, and deliver up to 40 percent greater performance than the Intel® Xeon® 7500 series processor. Concurrently, a new energy-saving feature reduces the power draw of idle portions of the chip. Beginning today, more than 35 systems based on the Intel Xeon processor E7 family are expected to ship from manufacturers around the world.

 

"Intel has been changing the economics for mission-critical computing server deployments for more than a decade, and today we are raising the bar yet again," said Kirk Skaugen, vice president and general manager of Intel's Data Center Group. "The new Intel Xeon processor E7 family delivers record breaking performance with powerful new security, reliability and energy efficiency enhancements. The industry momentum we're seeing for this new server processor architecture is unparalleled in Intel's history. The days of IT organizations being forced to deploy expensive, closed RISC architectures for mission-critical applications are nearing an end."

 

Record-Breaking, Energy-Efficient Performance
The new processor family contains 18 new processors for two-, four- and eight-socket servers, and is expandable to servers with 256 sockets. It also sets more than a dozen world records in performance. A 40 percent improvement in generational compute-intensive performance can enhance the pace and accuracy of applications in such fields as scientific research and financial services where speed is essential. With up to 25 percent better performance with virtual machine3 applications than the current generation, the new chips also hold the industry's highest virtualization performance.

 

IT managers seeking to achieve greater economic efficiencies can replace 18 dual-core servers2 with a single Xeon processor E7-based server. To help address rising energy costs, the new Xeon chips include Intel® Intelligent Power technology that dynamically reduces idle power consumption of the chip based on the workload while also delivering advanced processor power-management capabilities.

 

Recognizing the range of compute-intensive applications from climate modeling to real-time business analytics, and the need for uncompromised performance to run them, Intel is offering 10 advanced 10-core versions of the chip, led by the E7-8870, E7-4870 and E7-2870, all of which reach 2.4 GHz with a TDP (Thermal Design Point) of 130 watts.

 

The company also announced a version of the chip that combines the benefits of high performance with low voltage, as well as a frequency-optimized version. The 10-core low-voltage E7-8867L reaches 2.13 GHz with a TDP of 105 watts, while the eight-core frequency-optimized E7-8837 tops out at 2.67 GHz with a TDP of 130 watts.

 

Intel Xeon processor E7 family based-platforms add a massive 2 Terabyte of memory in a four-socket system supported by the new processors. Most of these chips also contain Intel® Turbo Boost Technology, Intel Hyper-Threading Technology and Intel® Virtualization Technology (VT), which can increase performance as required, ease multitasking and enhance reliability and manageability, respectively.

 

New Security, Reliability Features
Intel is bringing its leading security technologies available today in its mainstream Intel® Xeon® processor 5600 series, to the mission-critical server segment with the introduction of platforms based on the Xeon processor E7 family. Intel® Advanced Encryption Standard New Instruction (AES-NI) allows systems to quickly encrypt and decrypt data running over a range of applications and transactions, while Intel® Trusted Execution Technology (Intel TXT) creates a secure platform at boot-up by protecting applications from malicious threats.

 

Together, these security features can ensure that virtualized environments are more reliably secure when they are launched, migrated or at rest, as well as experience better performance and functionality.

 

Extensive Industry Support
Starting today, system manufacturers from around the world are expected to announce more than 35 Xeon processor E7 family-based platforms. These manufacturers include Bull*, Cisco*, Cray*, Dawning*, Dell*, Fujitsu*, Hitachi*, HP*, Huawei*, IBM*, Inspur*, Lenovo*, NEC*, Oracle*, PowerLeader*, Quanta*, SGI*, Supermicro* and Unisys*.

 

Numerous enterprise software vendors also support Xeon processor E7 family-based platforms, including IBM*, Microsoft*, Oracle*, Red Hat*, SAP AG* and VMware*.

 

Ideal Servers for Small Business
Intel also announced today the Intel® Xeon® processor E3-1200 family, an entry-level server processor built to meet the unique demands of small business applications, ranging from collaboration tools to storage and back-up applications. With up to 30 percent greater performance over the previous generation, the Xeon processor E3-1200 product family is faster and provides higher reliability than a desktop computer running similar applications. Support for Error Correcting Code (ECC) memory ensures system reliability by preventing glitches that cause data breaches and downtime, and with small businesses facing a harsher climate of security threats the Xeon processor E3-1200 product family helps ensure the integrity of valuable data with Intel AES-NI and Intel TXT.

 

Today's news follows the recent disclosures about the low-power, single-socket Intel Xeon processors E3-1260L and E3-1220L targeted for micro servers, and the announcement of the Intel® Xeon® processor E3-1200 product family for workstations.

 

Product, Pricing Details
The Xeon processor E7-8800/4800/2800 families range in price from $774 to $4,616 in quantities of 1,000. The Xeon processor E3-1200 family ranges in price from $189 to $612 in quantities of 1,000. Complete pricing details can be found in the multimedia press kit.

 

For more details on these new Intel Xeon processors, visit www.intel.com/xeon. For more details on world records and other claims, visit www.intel.com/performance/server/.

 

 

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Intel Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 SPECint*_rate_base2006 benchmark comparing next-generation Intel® Xeon® processor E7-4870 (30M cache, 2.40GHz, 6.40GT/s Intel® QPI) scoring 1,010 (includes Intel Compiler XE2011 improvements accounting for about 11 percent of the performance boost) to X7560 (24M cache, 2.26GHz, 6.40GT/s Intel QPI) scoring 723 (Intel Compiler 11.1).  Source: Intel SSG TR#1131.

 

2 Intel measurements as of March 2011 of Xeon  E7-4800 and dual 4-socket systems. Performance comparison using SPECint_rate_base2006. Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.

 

3 Up to 2.8x scaling transaction improvement claim based on internal OLTP benchmark comparing next-generation Intel® Xeon® processor E7-4870 (30M cache, 2.40GHz, 6.40GT/s Intel® QPI, codenamed “Westmere-EX”) scoring 2.73M transactions (leading database vendor) to X5680 (12M cache, 3.33GHz, 6.40GT/s Intel QPI, formerly codenamed “Westmere-EP”) scoring 970K transactions. Source: Intel SSG TR#1120.

 

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

 

Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit www.intel.com/performance/resources or call (U.S.) 800-628-8686 or 916-356-3104.

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