Intel announced several initiatives and investments to spur product development and research for new connected car experiences. The investments include the new global Automotive Innovation and Product Development Center, the expansion of Intel Labs Interaction and Experience Research (IXR), an academic outreach program for automotive projects, and the newly-established $100 million Intel Capital Connected Car Investment Fund. Located in Karlsruhe, Germany, the Automotive Innovation and Product Development Center aims to accelerate innovations for in-vehicle infotainment and telematics solutions based on Intel technology. And with the expansion of Intel Labs IXR, Intel will gain valuable insights into the relationships between humans, cars and technology.

NEWS HIGHLIGHTS

  • Intel Capital creates a $100 million Intel Capital Connected Car Fund to accelerate technology innovation in the automotive industry.
  • Intel Capital Connected Car Fund targeted at technologies that will deliver new in-vehicle infotainment solutions, seamless mobile connectivity, compelling applications and advanced driver assistance systems.
  • By 2014, automobiles will be among the top three fastest-growing market segments for connected devices and Internet content.

 

 

SANTA CLARA, Calif. and KARLSRUHE/FELDKIRCHEN, Germany, Feb. 29, 2012 – Intel Capital today announced a $100 million investment fund to help accelerate innovation and the adoption of new technology and services in the automotive industry. Intel Capital is the first global technology investment organization headquartered in Silicon Valley to announce a dedicated focus on automotive technology innovation.

 

The Intel Capital Connected Car Fund will be invested globally over the next 4 to 5 years in hardware, software and services companies developing technologies to promote new, compelling in-vehicle applications and enable the seamless connection between vehicles and any connected device, including mobile devices and sensors.

 

"Technology has become an integral component of everyday life, with consumers demanding uninterrupted access to the Internet and the constant flow of information, news, entertainment, and social media," said Arvind Sodhani, president of Intel Capital and Intel executive vice president. "Automobiles must be able to provide these same consistent and engaging computing experiences, but in a safe manner. The Intel Capital Connected Car Fund will drive the development of technologies to enhance the in-vehicle experience of the future."

 

The announcement is part of Intel's ongoing work with automakers and in-vehicle infotainment suppliers to help integrate advanced technologies into cars. Ultimately, the connected car will have the intelligence and context awareness to offer the right information, at the right time and in the right way to keep drivers and passengers informed, entertained and productive while maintaining optimal safety. Once the car becomes connected, it can also communicate with the cloud, the transportation infrastructure and even other vehicles to provide additional services such as advanced driver assistance and real-time traffic information to optimize the flow of traffic.

 

"The car is the ultimate mobile device," said Staci Palmer, general manager of Intel's Automotive Solutions Division. "By 2014, automobiles will be among the top three fastest-growing areas for connected devices and Internet content.¹ Intel's experience in developing personal computing, software, security and cloud computing technologies will bring a new level of innovation to the car to enhance the driving experience for both drivers and passengers."

 

To help realize that vision, areas of investment for the Intel Capital Connected Car Fund will include technologies that advance the next generation of in-vehicle infotainment, advanced driver assistance systems and seamless mobile connectivity. This includes new in-vehicle applications and development tools, next-generation ADAS technologies and multimodal capabilities such as speech recognition, gesture recognition and eye tracking optimized for the connected car.

 

In addition to the Intel Capital Connected Car Fund, Intel Corporation President and CEO Paul Otellini also announced today at an event in Karlsruhe, Germany the opening of a new global Automotive Innovation and Product Development Center, an academic outreach program focused on IVI and telematics, and expansion of Intel Labs Experience and Interaction Research in automotive.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

         

 

About Intel Capital
Intel Capital, Intel's global investment and M&A organization, makes equity investments in innovative technology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software, and services targeting enterprise, mobility, health, consumer Internet, digital media, semiconductor manufacturing and cleantech. Since 1991, Intel Capital has invested more than US$10.5 billion in over 1,218 companies in 51 countries. In that timeframe, 196 portfolio companies have gone public on various exchanges around the world and 291 were acquired or participated in a merger. In 2011, Intel Capital invested US$526 million in 158 investments with approximately 51 percent of funds invested outside the U.S. and Canada. For more information on Intel Capital and its differentiated advantages, visit www.intelcapital.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 Gartner: Automobile of the Future: The Ultimate Connected Mobile Device (ID: G00175335)

Company Opens New Product Development Center, Expands Intel Labs Experience and Interaction Research

 

NEWS HIGHLIGHTS

  • Global Automotive Innovation and Product Development Center will accelerate innovations and product development for in-vehicle infotainment and telematics solutions based on Intel technology.
  • Intel invests in academic outreach program to foster innovative ideas, research and technology among academia, Intel and the automotive industry.
  • Company expands Intel Labs Interaction and Experience Research in automotive to further explore relationships among human behavior, cars and technology.
  • Intel Capital is the first global technology investment organization to announce $100 million Connected Car Fund focused on investing in automotive technology innovation.

 

 

SANTA CLARA, Calif., and KARLSRUHE, Germany, Feb. 29, 2012 – Intel Corporation today announced several automotive investments and initiatives designed to spur innovation and product development that will enable new and innovative connected car experiences. The investments include the new Automotive Innovation and Product Development Center, expansion of Intel Labs Interaction and Experience Research (IXR) in automotive, an academic outreach program, and the establishment of the $100 million Intel Capital Connected Car Investment Fund.

 

"In today's mobile world, personal computing touches every part of consumers' daily lives while at home, at the office and on the road," said Intel President and CEO Paul Otellini. "By broadening our research efforts, academic and capital investments and opening the Automotive Innovation and Product Development Center, Intel is deepening its understanding of how people interact with their cars and how Intel innovations can enhance the automotive experience."

 

The Automotive Innovation and Product Development Center will serve as Intel's global center of competence for the development of products and technologies for in-vehicle infotainment and telematics solutions for the connected car. The center will optimize Intel technologies for applications and services as well as capabilities for consumer electronics integration, performance optimization and system design.

 

Located in Karlsruhe, Germany, the site benefits from its proximity to top technical universities and a robust ecosystem of hardware and software vendors with expertise in automotive technology. The customized facility features a unique secured car park that provides an on-site location for Intel to install, test and showcase developments. Additional features include state-of-the-art instrumentation, a myriad of antennae to provide satellite, TV, digital video and GPS for development and testing, and a world-class engineering compute infrastructure.

 

Intel also announced plans for a comprehensive academic program that includes fundamental and applied research, curriculum development and internship programs to foster the exchange of innovative ideas among academia, Intel and the automotive industry. The program will be hosted at the Karlsruhe site and will tap into an extensive Intel European Research and Development network of researchers and developers, labs and research relationships.

 

Expanding Research to Explore Human Interactions in Vehicles

 

With the expansion of Intel Labs Interaction and Experience Research, Intel and its customers will obtain valuable insights into consumer experiences in the vehicle. Intel aims to apply that knowledge to the development of technology solutions for the vehicle and transportation infrastructure to make the driving experience more enjoyable, intuitive and safe. For example, Intel is looking at new ways to use the Internet, sensors and context-aware technology to determine what and how information should be presented to drivers and passengers to reduce complex interactions while driving.

 

Intel Capital Creates $100 Million Connected Car Fund

 

Today, Intel Capital became the first global technology investment organization to announce an investment fund focused on fostering automotive technology innovation. The Intel Capital Connected Car Fund aims to accelerate the seamless connection between the vehicle and consumer electronic devices as well as drive new in-vehicle applications, services and differentiated user experiences based on Intel technologies. Over the next 5 years, Intel Capital will invest in hardware, software and services companies that are developing leading-edge ingredient technology and platform capabilities that support Intel's focus areas in automotive.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Companies Expand Successful NAND Flash Memory Joint Development Program to Include Development of Emerging Memory Technologies

 

SANTA CLARA, Calif. and BOISE, Idaho, Feb. 28, 2012 – Intel Corporation and Micron Technology, Inc., today announced that the companies have entered into agreements to expand their NAND Flash memory joint venture relationship.

 

The agreements, which are designed to improve the flexibility and efficiency of the joint venture, include a NAND Flash supply agreement for Micron to supply NAND products to Intel and agreements for certain joint venture assets to be sold to Micron. Under terms of the agreement, Intel is selling its stake in two wafer factories in exchange for approximately $600 million—the approximate book value of Intel's share. Additionally, Intel will be receiving approximately half of the consideration in cash and the remaining amount will be deposited with Micron, which may be refunded or applied to Intel's future purchases under the NAND Flash supply agreement. The agreements also extend the companies' successful NAND Flash joint development program and expand it to include emerging memory technologies.

 

"Micron's joint venture NAND development efforts with Intel are a model of innovation, productivity and effectiveness," said Micron Chief Executive Officer Mark Durcan. "With IM Flash and its associated programs, our companies have become leaders in the NAND Flash arena. These new agreements build on that success."

 

"The Intel-Micron partnership has created industry-leading NAND Flash memory technology and developed a robust global manufacturing network. The new NAND Flash supply agreement with Micron gives Intel better flexibility to meet growing demand for SSDs and other products," said Robert Crooke, Corporate Vice President and General Manager of the Non-Volatile Memory Solutions Group, Intel.

 

As part of these agreements, Micron will increase its share of the overall NAND Flash output and optimize its global manufacturing network by purchasing the assets of IM Flash Singapore (IMFS) and the IM Flash Technologies (IMFT) assets in Manassas, Va.

 

Micron has also agreed to supply Intel with NAND Flash memory from its facilities. The IMFT joint venture NAND manufacturing facility in Lehi, Utah, will continue to operate with minimal changes to its existing operations. The facility is currently in production on the companies' industry-leading 20nm NAND Flash memory technology. The transaction is expected to close during the first half of this year, subject to certain conditions.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

About Micron Technology, Inc.
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.

 

*Micron and the Micron logo are trademarks of Micron Technology, Inc. Intel is a trademark of Intel Corporation or its subsidiaries in the United States and other countries. All other trademarks are the property of their respective owners.

 

*This press release contains forward-looking statements related to the timing of the closing of the transaction between Micron and Intel (the "Companies") related to updating their NAND Flash joint venture relationship. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents the Companies file from time to time with the Securities and Exchange Commission, specifically each of their most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for each of the Companies to differ materially from those contained in our forward-looking statements. Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.

Today Intel announced a beta version of Intel® Cloud SSO, an identity and access management-as-a-service (IAMaaS) offering available on Force.com. With Intel Cloud SSO, enterprise users gain single sign-on access to all Salesforce.com applications and dozens of other SaaS apps, through a secure, personalized portal.  Strong two-factor mobile authentication, user account provisioning and de-provisioning, enterprise-class identity lifecycle management features, and integration with McAfee Cloud Security Platform provide end-to-end protection for cloud-based apps. The beta is available to a limited number of customers, with general availability scheduled for Q2. To be considered for the beta, visit here.

Multi-device, Multi-year Agreement to Develop Mobile Commerce Solutions for Smartphones and Tablets; Intel Smartphone Reference Device Certified for Use with Visa payWave

 

Barcelona, Spain, February 27, 2012 — Visa Inc. (NYSE:V) and Intel Corporation today announced a strategic agreement to develop mobile commerce solutions tailored to consumers in developed and developing countries. During a press conference at Mobile World Congress in Barcelona, the companies outlined plans to collaborate to ensure consumers enjoy a consistent, streamlined, secure mobile commerce experience across Intel® Atom™-based smartphones and tablets.

 

"Visa's agreement with Intel paves the way for financial institutions around the globe to offer their account holders mobile payments and financial services using innovative mobile devices and technologies designed by Intel," said John Partridge, President, Visa Inc. during the press conference. "This is another example of how Visa is making mobile payments broadly available across devices and operating systems and is ensuring that mobile commerce applications are aligned with existing technology and security standards established by the global payments industry."

 

The initial phase of the agreement between Visa and Intel includes:

 

  • Visa has certified Intel's Smartphone Reference Device powered by the Intel® Atom™ processor Z2460 for use with Visa payWave, Visa's mobile payment technology that enables consumers to make fast and secure payments at retail locations by simply waving their mobile phone in front of a payment terminal. This will enable turn-key implementation for OEMs delivering NFC-enabled smartphones.
  •  


  • The Intel Smartphone Reference Device will host the Visa payWave payment application and features NFC (Near Field Communication) technology, the short range communications standard that enables mobile phones to securely transmit payment information to a payment terminal.
  •  


  • When used in combination with a Visa-compliant UICC, smartphones based on the Intel Smartphone Reference Device handset can be enabled to connect to Visa Inc.'s mobile provisioning service providing financial institutions and mobile operators the means to securely download Visa payment account information and the Visa payWave application "over the air" to a secure chip on an NFC-equipped smartphone. The connection to Visa's mobile provisioning service can be enabled by a Trusted Services Management platform, such as Giesecke & Devrient's (G&D) platform.

 

"Intel's strategy is to enable more secure and compelling user experiences across a range of Intel-based mobile devices. Our alliance with Visa builds on this strategy and brings worldwide mobile payment and commerce solutions to Intel-based devices," said Mike Bell, Intel Vice President and General Manager of the company's Mobile and Communications Group. "Our work with Visa also extends to our customers designing products based on Intel's Smartphone Reference Device."

 

The agreement combines Visa's expertise in payment processing, account holder authentication and global network reach, with Intel's expertise and leadership in developing innovative technologies that serve as the foundation for the world's computing devices.

 

At Mobile World Congress in Barcelona, from February 27th to March 1st, the companies will showcase Visa mobile services on the new Intel mobile device, including V.me by Visa, Visa's new digital wallet service featuring the Visa payWave application; Movida, Visa's new payment service in India; and Visa Mobile Prepaid, Visa's new mobile-based product tailored to consumers in developing countries. Product demonstrations will be on display at Visa's booth in Hall 1, stand 1B19, and Intel's booth in Hall 8, stand B192.

 

About Visa Inc.
Visa is a global payments technology company that connects consumers, businesses, financial institutions and governments in more than 200 countries and territories to fast, secure and reliable digital currency. Underpinning digital currency is one of the world’s most advanced processing networks—VisaNet—that is capable of handling more than 20,000 transaction messages a second, with fraud protection for consumers and guaranteed payment for merchants. Visa is not a bank, and does not issue cards, extend credit or set rates and fees for consumers. Visa’s innovations, however, enable its financial institution customers to offer consumers more choices: Pay now with debit, ahead of time with prepaid or later with credit products. For more information, visit www.corporate.visa.com.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Lava Launches XOLO Brand, Bringing Best of Intel Computing to Mobile Users in India

 

MOBILE WORLD CONGRESS, Barcelona, Spainand New Delhi, India, Feb. 27, 2012 - Intel Corporation and Lava International Ltd., one of India's fastest-growing mobile handset companies, announced that the companies are collaborating to launch the XOLO X900 -- India's first smartphone with Intel Inside®. The XOLO X900 from Lava is based on Intel's smartphone reference design featuring the  Intel® Atom™ processor Z2460 with Intel® Hyper-Threading Technology and supporting HSPA+ with the Intel XMM 6260 Platform.

 

Lava is a successful and growing mobile phone brand in the Indian market. In order to bring a high- performance and differentiated smartphones to the market, Lava has collaborated with Intel to introduce its first Intel-based smartphone under the brand XOLO. The XOLO X900 Android smartphone is expected to hit retail shelves in India early in the second quarter this year and will support all major 2G and 3G networks.

 

"We are proud to partner with Intel on XOLO to bring a superior smartphone computing experience to customers in India," said Vishal Sehgal, co-founder and director, Lava International. "Over the last two and a half years, we have built our business in the feature phone segment where Lava has been the brand of choice for nearly 10 million Indian customers. With XOLO, we intend to now serve the discerning and fast-paced smartphone customer, which is where this collaboration with Intel is critical to us."

 

"India is one of the fastest-growing smartphone markets with the world's second-largest mobile subscriber base," said Mike Bell, Intel vice president and general manager of the Mobile and Communications Group. "We are pleased to be working with Lava to bring the best of Intel computing to the India market. Lava's XOLO X900 device is a great result of our collaboration. It also demonstrates how innovative and compelling products can be brought to market through strong partnerships by using Intel's smartphone reference design as a foundation."

 

The XOLO X900 is powered by a super-fast 1.6 Ghz processor and comes equipped with a 4.03-inch high-resolution LCD touch screen for crisp text and vibrant images. The smartphone delivers a fast application, Web browsing and multitasking experience, and also features two cameras for advanced imaging and video capabilities, including burst mode that allows individuals to capture 10 pictures in under a second with 8-megapixel quality. The smartphone also supports HDMI®, NFC and HD video playback.

 

As service providers roll out 3G services and connect more cities in India, the smartphone market will grow as more people access the Internet from their phones. The smartphone opportunity in India for 2012 stands at 19.1 million units which is a 78 percent growth year-on-year over 2011, according to Deepak Kumar, research director for Telecommunications and Mobile Phones, IDC India.

 

 

Lava_XOLO_Phone_With_Intel_Inside_front.jpgLava XOLO X900 Smartphone with Intel Inside®

Lava_XOLO_Phone_Intel_Inside_back.jpgLava XOLO X900 Smartphone with Intel Inside®

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

About Lava
Lava international is one of the fastest growing brands in Indian mobile market today. The organization started operations only 30 months back and is rapidly growing its market share. “Get the power in your hand”- with this motto as the guiding principle, Lava embarked on its journey to empower people with innovative products. Today the brand has a wide range of handsets in its portfolio. The company has already expanded its operations in all the states of India and has a network of 1,000 distributors and presence in ~50,000 retail counters.

 

Intel, Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries. Lava, Xolo and Lava Xolo are trademarks of Lava International Ltd.

 

* Other names and brands may be claimed as the property of others.

Announces Smartphone Device Engagements with Orange*, Lava*, ZTE* and Visa*

 

Discloses Range of New Smartphone SoCs and Communications Products

 

MOBILE WORLD CONGRESS, Barcelona, Spain, Feb. 27, 2012 – Intel Corporation President and CEO Paul Otellini today detailed a number of announcements and plans aimed at expanding the company's smartphone product portfolio and customer ecosystem, including strategic new engagements with Orange*, Lava International Ltd.*, ZTE*, and Visa*.

 

"We are very pleased to add new, important customers and capabilities to our phone offerings today. We remain focused on delivering exciting new features and outstanding performance to smartphone customers around the world." said Otellini.

 

Otellini made the announcements during an Intel news conference at Mobile World Congress. He also highlighted the company's plans to expand its smartphone SoC and communications product roadmaps for the performance and value smartphone market segments.

 

New Smartphone Customer Engagements

Building on strategic engagements with Motorola Mobility Inc.* and Lenovo*, Intel detailed new device relationships with Orange, Lava International Ltd. and ZTE.

 

Yves Maitre, Orange senior vice president of Mobile Multimedia and Devices, joined Otellini to discuss a new Orange smartphone based on the Intel® Atom™ processor Z2460 reference design. Housed in a sleek body, the design enables rich entertainment experiences and Orange services, including Orange TV, Daily Motion, Deezer, Orange Wednesdays and Orange Gestures. The Orange smartphone will be available in the United Kingdom and France later this summer.

 

Intel also announced plans to enter the high-growth market for smartphones in India through an alliance with Lava International Ltd., one of the fastest-growing Indian mobile handset companies.Vishal Sehgal, Lava co-founder and board director, announced the launch of XOLO Smartphone by Lava. The XOLO X900 is based on Intel's smartphone reference design and will be the first Intel technology-based smartphone in the India market. The device will be available from top retail outlets early in the second quarter of 2012 and will support major Indian cellular networks.

 

Similar to its previously announced partnership with Motorola Mobility, Intel also announced a multi-year mobile device collaboration across smartphones and tablets with global handset maker ZTE. Mr. He Shiyou, executive vice president and head of the Terminal Division of ZTE, discussed how his company's alliance with Intel will enable ZTE to move faster and create unique and differentiated products for wireless operators. He also announced that ZTE's first Intel-powered mobile device is scheduled to debut in the second half of 2012.

 

Expanding Smartphone SoC and Communications Roadmaps

Building on its ecosystem engagements, Intel announced plans for three new smartphone SoC products that expand the company's portfolio from the performance-to-value market segments.

 

Extending the leading performance and energy efficiency of the Intel™ Atom® processor Z2460, formerly codenamed "Medfield," Intel announced that the platform will now support speeds up to 2GHz.

 

Intel also announced the Atom™ Z2580 processor that doubles the performance of the Atom processor Z2460, and features an advanced multimode LTE/3G/2G solution. Intel will sample the Z2580 in the second half of the year with customer products scheduled in the first half of 2013.

 

Addressing the growing handset opportunity in emerging markets where consumers look for more value at lower prices, Intel disclosed plans for the Intel® Atom™ processor Z2000.

 

The Z2000 is aimed squarely at the value smartphone market segment, which industry sources predict could reach up to 500 million units by 20151.The platform includes a 1.0 GHz Atom CPU offering great graphics and video performance, and the ability to access the Web and play Google Android* games. It also supports the Intel® XMM 6265 3G HSPA+ modem with Dual-SIM 2G/3G, offering flexibility on data/voice calling plans to save on costs. Intel will sample the Z2000 in mid-2012 with customer products scheduled by early 2013.

 

Building on these 32nm announcements, Otellini discussed how the Atom™ processor will outpace Moore's Law and announced that Intel will ship 22nm SoCs for carrier certification next year, and is already in development on 14nm SoC technology.

 

In 2011, Intel shipped in more than 400 million cellular platforms. Building on this market segment position, Intel announced the XMM 7160, an advanced multimode LTE/3G/2G platform with support for 100Mbps downlink and 50Mbps uplink, and support for HSPA+ 42Mbps. Intel will sample the product in the second quarter with customer designs scheduled to launch by the end of 2012.

 

Intel also announced that it is sampling the XMM 6360 platform, a new slim modem 3G HSPA+ solution supporting 42Mbps downlink and 11.5Mbps uplink for small form factors.

 

Building Better Experiences on Intel Architecture

Intel's strategy is to create and enable engaging, consistent, aware and secure user experiences across a range of mobile devices.

 

An emerging trend is the use of mobile devices to enable secure online and retail commerce. Otellini welcomed John Partridge, President, Visa Inc., who announced a strategic multi-year alliance to develop mobile commerce solutions tailored to consumers in developed and developing countries.

 

The effort includes collaboration across a range of Visa mobile services and Intel® Atom™-based smartphones and tablets to deliver compelling and secure user services. As a first step, Partridge announced that Intel's smartphone reference design is now certified for Visa payWave* mobile financial transactions. This means that customer products based on Intel's smartphone reference design will have time-to-market support of Visa mobile services.

 

Building on its collaboration with Google, Intel continues to work closely with ISVs to help ensure the majority of Android apps run on Intel Atom processor-based devices. Otellini discussed how Intel has all the right tools and expertise to support the robust mobile application developer ecosystem.

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries.  * Other names and brands may be claimed as the property of others.

 

* Other names and brands may be claimed as the property of others.

 

1 Strategy Analytics

Former Intel Chairman and CEO, Craig Barrett, was recognized today as one of eight Stanford Engineering Heroes, an honor bestowed upon Stanford University faculty and alumni engineers who have advanced the course of human, social, and economic progress through engineering. Now in its second year, the primary objective of this honor is to herald the profession and the profound effect engineering has on our everyday lives.

Intel is launching an online video conversation platform called 60 Second Insights, created to bring together leaders in their respective areas to share their visions and perspectives on technology and mobility - how our culture, business, art to our youth, family and health are impacted and how technology and mobility will evolve going forward. 60 Second Insights is out to capture the enthusiasm that we all share on mobility and technology and also create a platform for an ongoing conversation on where we go from here. The first of these videos featuring executives from companies such as Ericsson, DreamWorks, Pandora and TechShop and innovators including a National Geographic explorer and fashion designer are now LIVE for viewing.

Brazilian fashion e-commerce websites Coquelux and Fashion.me have received investments from Intel Capital. Coquelux is an online shopping club that provides exclusive access to flash events where members can purchase discounted premium and luxury labels. Fashion.me is a social platform in which members create customized looks from more than two million labels and share them in the Fashion.me social network. The two investments build out critical components of the e-commerce ecosystem in Brazil, offering opportunities to create online experiences tailored specifically to interests, needs and cultural preferences. As one of the first technology venture capital organizations in Brazil, Intel Capital long ago recognized the need to stimulate the local creation of compelling online experiences to keep pace with Brazil's rapid technology adoption. Since 1999, Intel Capital has invested approximately $75 million across the region. Full press release here.

Intel is taking its Ultrabook™ message to the streets, literally, using 60 synchronized and choreographed Ultrabook devices to create a "Pop-Up Theater" via a flash mob in and around Los Angeles landmarks. See the larger than life human mobile billboard.

Today, Arizona celebrates 100 years of statehood.  Noting important people, places and events that shaped the state, the Intel Pentium microprocessor is highlighted as one of the state's Top 10 innovations.  Intel first arrived in Arizona in 1979 and its factories in Chandler played a part in the production of the Intel Pentium Chips.  Now under construction in Chandler is soon to be the world’s most advanced high-volume semiconductor factory - Fab 42 – which will produce Intel Core processors on 14nm technology.

Forthcoming Platform to Boost Secure Network Performance, Scale with Needs of the Future

 

NEWS HIGHLIGHTS

  • New communications platform will consolidate packet, application and control processing on Intel® architecture for more efficient processing of multimedia content without sacrificing security.
  • Scalable platform to enable faster time to market and lower development costs for equipment manufacturers with better network efficiency for service providers. New platform will further expand Intel's offerings for the network infrastructure.

 

 

SANTA CLARA, Calif., Feb. 14, 2012 - Intel Corporation today disclosed several significant features for the company's next-generation communications platform, codenamed "Crystal Forest."Building upon Intel's strong presence in communications infrastructure, the platform will handle data processing across the network more efficiently and securely, while addressing the specialized needs for handling cloud connectivity and content processing.

 

Each minute of the day, 30 hours of video are uploaded across the network, and by 2015 it is estimated to take 5 years to watch all the video crossing IP networks each second.1 As these numbers continue to climb, the burden will be on equipment manufacturers and service providers to deliver platform solutions that can cost-effectively manage rapidly increasing traffic without compromising performance and security.

 

Currently, equipment manufacturers must combine a variety of highly specialized silicon co-processors with different software programming models to handle multiple communications workloads when building platforms for a scalable network - a very complex and expensive endeavor. With Crystal Forest, equipment manufacturers will be able to consolidate three communications workloads - application, control and packet processing - on multi-core Intel architecture processors to deliver better performance and accelerate time to market. They can also develop a scalable product line based on multiple Intel processor options to plan for future performance increases.

 

"The demand for increased network performance will continue to grow as more smart devices connect to the Internet every day," said Rose Schooler, general manager of Intel's Communications Infrastructure Division. "And with the popularity of social networking and other high-bandwidth services, such as video and photo uploads/downloads, interactive video, crowdcasting and online gaming, service providers will be challenged to efficiently provision sufficient upstream capacity and manage the spike in network traffic."

 

Intel's next-generation communications platform, Crystal Forest, is expected to deliver up to 160 million packets per second performance for Layer 3 packet forwarding, making it possible to send thousands of high-definition videos across each network node. Previously, only ASIC or specialized processors were capable of sending more than 100 million packets per second. The Intel® Data Plane Development Kit, a set of software libraries and algorithms, improves the performance and throughput of packets on Intel architecture platforms to yield more than five times the performance over previous generations of Intel platforms.

 

Crystal Forest will also utilize Intel® QuickAssist technology, which processes and accelerates specialized packet workloads - cryptography, compression and deep packet inspection included - on standard Intel platforms. Using this technology, secure Internet transactions can be accelerated up to 100Gbps on the platform to give service providers the ability to handle many more secure transactions and without the cost of specialized solutions. The network will also be able to evolve to provide "always-on" secure Internet connections, as opposed to the opt-in connections currently used on select applications or for financial transactions online.

 

Designed to Grow with the Network

The Crystal Forest platform will enable equipment manufacturers to design more flexible platforms, from small- to medium-sized business firewalls to high-end routers. Service providers, too, can save money by deploying fewer complex platforms, making their network easier to manage and maintain. The Intel platform roadmap plans to deliver annual performance refreshes for several years, so equipment manufacturers and service providers will be able to scale and refresh their designs to meet future network needs. Additionally, Crystal Forest will use a common application programming interface and common drivers so that multiple designs can be implemented in much less time and at much lower development costs.

 

Full System Simulation of the Crystal Forest Platform

Developers can accelerate software development, testing and integration by utilizing a simulation model of the Crystal Forest platform provided by Wind River Simics*. With Simics, users can model any Crystal Forest target configuration and then run unmodified target software on that model. Wind River Simics enables developers to do BIOS bring-up, operating-system optimization and application development more efficiently.

 

The new platform is scheduled to be available later in 2012. For more information visit the Intel newsroom media kit.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 Cisco® Visual Networking Index: Forecast and Methodology, 2010-2015

Tune in for MashUp Radio this Friday, Feb. 17th at 12:00 p.m. PT for tips on how to ward off those extra winter pounds and stay fit ahead of swimsuit season.  Peter Biddle will be chatting with Robin Thurston, co-founder of MapMyFitness, about different ways to track, measure and expand your fitness opportunities with help from social communities and fitness websites.

Available exclusively on the Intel AppUpSM center, a one-stop shop for apps optimized for Ultrabooks and PCs, will.i.am’s willpower360 app enables users to enjoy a 360-degree music and video experience with updates throughout 2012. Users can change the music, video view they experience, listen to new tracks created by noted rapper and producer will.i.am on his Ultrabook and see how he performed those songs in concert.

SANTA CLARA, Calif. Feb. 9, 2012 – Intel Corporation and the New York Attorney General have agreed to terminate the lawsuit alleging violation of U.S. and state antitrust laws that was filed by the New York Attorney General in November 2009.

 

The agreement, which follows a December 2011 court ruling that greatly reduced the scope of the New York Attorney General’s lawsuit, expressly states that Intel does not admit either any violation of law or that the allegations in the complaint are true, and it calls for no changes to the way Intel does business. The agreement includes a payment of $6.5 million from Intel that is intended only to cover some of the costs incurred by the New York Attorney General in the litigation.

 

“Following recent court rulings in Intel’s favor that significantly and appropriately narrowed the scope of this case, we were able to reach an agreement with New York to bring to an end what remained of the case. We have always said that Intel’s business practices are lawful, pro-competitive and beneficial to consumers, and we are pleased this matter has been resolved,” said Doug Melamed, senior vice president and general counsel at Intel.

 

A copy of the agreement is available at www.intel.com/pressroom/legal/nyag.htm.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Hitachi's New Ultrastar™ enterprise-class solid state drive (SSD) family

Hitachi's New Ultrastar* enterprise-class solid state drive (SSD) family

Hitachi Global Storage Technologies (Hitachi GST) today announced  its new Ultrastar* enterprise-class solid state drive (SSD) family, the industry’s first to use 25-nanometer (nm) single-level cell (SLC) NAND flash. The Ultrastar SSD400S.B family combines Hitachi’s proven enterprise hard disk drive (HDD) expertise with Intel’s extensive capabilities in developing high-endurance SLC NAND flash memory and advanced SSD technology. Learn more at the Intel® SSD online press kit.

WHEN:

Feb. 27 - March 1, 2012

WHERE:

2012 Mobile World Congress at Montjuic, Fira de Barcelona, Spain. Intel Corporation will showcase leading mobile and communications solutions in Hall 8, Booth #B192. In addition to the main Intel booth, the company will have a presence in various showcase venues.

WHO:

Intel News Conference with Paul S. Otellini

Feb. 27, 5:30-6:30 p.m. CET

Watch at www.intel.com/newsroom/mwc

 

Intel will host a news conference on Monday, Feb. 27 at 5:30 p.m. CET. President and CEO Paul S. Otellini will highlight Intel's mobile strategy and progress to expand its presence in new and existing markets.

 

"Mobile Innovation: A Vision of 2022;" Panel with Mike Bell, corporate vice president and general manager, Mobile and Communications Group, Intel

Fira, Hall 5, Auditorium 2

Feb. 29, 1:45-3:15 p.m. CET

 

The rapid pace of innovation in the mobile industry has accelerated even further in the last 12 months. With the arrival of LTE, the growth of embedded services and global adoption reaching new peaks, the potential for mobile has never been greater. Mobile has fundamentally transformed the way we interact and connect with each other. This session will look at future innovations and trends that will shape how we communicate in the next 10 years.

WHAT:

Intel Booth

Fira, Hall 8, Booth #B192

Feb. 27 – March 1, 9:00 a.m. – 7:00 p.m. CET


Intel will showcase how its products and technologies are transforming experiences from device to cloud. Through a variety of unique and interactive demonstrations, Intel will highlight compelling solutions across a range of mobile market segments, including Intel® Atom™ processor-based smartphone and tablets; and leading-edge wireless solutions from Intel Mobile Communications.

 

Intel in App Planet

App Planet Booth

Fira, Hall 7, #B28

Feb. 27 – March 1; 9:00 a.m. – 7:00p.m. CET

 

Check out the latest from the Intel AppUpSM center at Intel's booth in the App Planet Exhibition, which focuses on the latest technology driving the booming apps industry. Intel will feature the latest Intel AppUp center demos, as well as the Intel AppUpSM developer program.

 

Android Developer Brunch

Feb. 27, 9 a.m. – Noon CET
Fira, Hall 6, 6HS14

 

On Monday morning, Android developers and partners are invited to join Intel for an informal brunch to learn more about developing apps for smartphones and tablets based on Intel Architecture.

 

"Android on Intel® Architecture" Showcase

Feb. 29; 9 a.m. – 6 p.m CET

Mies van der Rohe Pavilion

 

On Wednesday, Feb. 29, Intel will showcase tools and tips for developers to create apps for Android devices based on Intel® Atom™ processors. Enjoy the catered event as attendees see the latest Intel Atom processor-based handsets and tablets running Android apps. Cocktail reception follows from 6 p.m. to 9 p.m.

 

Google Android Booth

Fira, Hall 8

Feb 27. – March 1, 9:00a.m. – 7:00p.m. CET

 

Intel will be featured within Google's Android booth. Showcasing Android on Intel Architecture optimizations, Intel will demonstrate Intel® Atom™ processor- based smartphones and tablets.

An additional three Intel engineers have been elected as IEEE Fellows, the highest level of membership for their exceptional contributions to  electrical engineering. The newly elected engineers from Intel include; Donald Stanley Gardner, for contributions to integrated circuit interconnects and integrated inductor technology, Yen-Kuang Chen, for contributions to algorithm-architecture co-design for multimedia signal processing and Valluri R. Rao for contributions to the characterization technologies for microprocessor and logic circuits. There are presently 29 IEEE Fellows at Intel.

Computerworld recognizes Malcolm Harkins, Intel VP and Chief Information Security Officer, as one of Computerworld's 2012 Premier 100 IT Leaders, an award which honors individuals who guide the effective use of information technology to improve their company's business performance. Harkins distinguished himself by implementing a novel approach to enterprise security at Intel, that balances business growth with reasonable levels of risk mitigation. As a result, Intel maintains a secure environment while embracing new usage models, such as social media and BYOD.

Intel® Solid-State Drive 520 Series

Intel® Solid-State Drive 520 Series

Intel Corporation announced today its fastest, most robust client/consumer solid-state drive (SSD) to date, the Intel® Solid-State Drive 520 Series. Aimed at delivering world-class performance for even the most demanding PC enthusiasts, gamers, professionals or small-medium businesses (SMBs), the Intel SSD 520 has fast throughput performance, new security features and unmatched reliability to meet even the most intensive user requirements. Visit the Intel SSD online press kit for multimedia and other related content.

Intel® Solid-State Drive 520 Series So Fast and Reliable, It Dramatically Impacts User Experience

 

NEWS HIGHLIGHTS

  • Intel SSD 520 speeds performance for the most demanding applications and intense multitasking, to dramatically improve user experience.
  • Intel SSD 520 gives users more capacity choices to drive increased SSD adoption across all corporate client/consumer computing platforms.
  • Highly reliable, the Intel SSD 520 6gbps SATA III SSD is backed by extensive Intel validation and comes with a 5-year warranty.

 

 

SANTA CLARA, Calif., Feb. 6, 2012 – Intel Corporation announced today its fastest, most robust client/consumer solid-state drive (SSD) to date, the Intel® Solid-State Drive 520 Series (Intel® SSD 520), a 6 gigabit-per-second (gbps) SATA III SSD produced using Intel compute-quality 25-nanometer (nm) NAND memory process technology. Aimed at delivering world-class performance for even the most demanding PC enthusiasts, gamers, professionals or small-medium businesses (SMBs), the Intel SSD 520 has fast throughput performance, new security features and unmatched reliability to meet even the most intensive user requirements.

 

Any consumer application requiring high throughput and bandwidth, low latencies and accelerated speed will benefit from the Intel SSD 520. Software developers, architects, accountants, engineers, musicians, media creators and artists are just some of the professionals that will find that the Intel SSD 520's full package of features can make a dramatic impact on their productivity. With faster performance for graphic renderings, compiling, data transfers and system boot-ups, users can speed through multi-tasking or once-cumbersome application wait times with an Intel SSD 520 Series.

 

"We tapped Intel engineering to create a client SSD that delivers performance on all fronts with obsessively high reliability," said Rob Crooke, Intel vice president and general manager of the Intel Non-Volatile Memory Solutions Group. "The Intel SSD 520 once again raises the industry bar on SSD performance, quality and reliability to dramatically improve user experience."

 

Unlike a traditional hard disk drive (HDD) with spinning disks and moveable parts, an SSD is based on silicon, NAND flash memory specifically, to create a lower power, more reliable and drastically faster storage solution that can keep up with today's most demanding applications, Internet streaming and intense multi-tasking. Based on its own industry-leading 25nm Intel compute-quality NAND flash memory and a 6gbps SATA III interface, the Intel SSD 520 uses an LSI SandForce Flash Storage Processor with an Intel co-defined and validated firmware release, to create an SSD that sets new industry performance benchmarks. The Intel SSD 520 delivers up to 80,000 maximum 4K random write Input-Output Operations Per Second (IOPS) and up to 50,000 4K random read IOPS to speed through every day operations. High sequential read performance of up to 550 megabytes-per-second (MB/s) and up to 520MB/s sequential writes also markedly accelerate and improve user productivity. This is backed by thousands of hours of Intel testing and validation, including more than 5,000 individual tests, as well as a 5-year limited warranty.

 

"We worked closely with Intel to leverage their deep understanding of the NAND flash, ultimately providing a unique and optimized solution for client computing applications with the LSI SandForce Flash Storage Processor," said Michael Raam, vice president and general manager of LSI's Flash Components Division, formed by LSI's acquisition of SandForce. "Working through Intel's extensive validation process ensures the Intel 520 SSD will raise the bar in delivering top-tier performance and superior quality and reliability over the life of the drive."

 

The Intel SSD 520 will mark the high end of its client SSD offerings and include these new features: a wide range of user capacities from 60GB to 480GB, Advanced Encryption Standard (AES) 256 bit encryption capabilities and stronger password protection for added security in the event of theft or power loss. According to PCMark Vantage benchmarking, users of the Intel SSD 520 may see significant productivity gains through an up to 78 percent boost in overall PC responsiveness, and gamers will see an up to 88 percent jump in performance to enhance their gaming experience.** IT professionals will not onlyprovide this additional performance and productivity to their customers/employees, but find that the Intel SSD 520 also delivers on reliability, improved security, smoother operations and lower total operational costs.

 

"Our game development workflow involves a combination of large batch process and aggressive interactive pre-visualization, all highly parallelized to the point that the storage performance becomes a major bottleneck," said John Carmack, founder and technical director of id* Software, a gaming software developer and creators of Doom and Quake. "For many of our workloads, Intel SSDs have doubled throughput, and in some cases involving mapping tens of gigabytes of image data, we have seen an honest order of magnitude performance improvement, which is a rare and wonderful thing."

 

With a broad range of capacity choices, the Intel SSD 520 Series is priced as follows, based on 1,000-unit quantities: 60GB for $149, 120GB at $229, 180GB at $369, 240GB at $509 and 480GB at $999. It comes with a 5-year limited warranty. To download the multimedia press kit go to http://www.intel.com/newsroom/ssd. For more information on Intel SSDs go to www.intel.com/go/ssd or follow Intel SSDs on Twitter (@intelssd), Facebook (www.intel.com/go/ssdfacebook or communities.intel.com).

 

SSD_Rope_03.jpgLatest Consumer Solid-State Drive (SSD) from Intel
Any consumer application requiring high throughput and bandwidth, low latencies and accelerated speed will benefit from the new Intel SSD 520 Series. Software developers, architects, accountants, engineers, musicians, media creators and artists are just some of the professionals that will find that the Intel SSD 520’s full package of features can make a dramatic impact on their productivity.

 

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

**Based on Intel research and comparative testing of an Intel SSD 520 Series and 10K RPM 6Gbps HDD using PCMark Vantage Productivity and PCMark Vantage Gaming benchmarks.

This week, The Environmental Protection Agency (EPA) ranked Intel first on its Green Power Partnership Rankings list, which showcases the annual green power purchases of leading organizations in the United States and across individual industry sectors. Previously, Intel was named the EPA Partner of the Year in 2008, 2009 and 2011, and received the EPA Green Power Leadership Award in 2010. Learn more about Intel’s environment initiatives.

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