Hitachi's New Ultrastar™ enterprise-class solid state drive (SSD) family

Hitachi's New Ultrastar* enterprise-class solid state drive (SSD) family

Hitachi Global Storage Technologies (Hitachi GST) today announced  its new Ultrastar* enterprise-class solid state drive (SSD) family, the industry’s first to use 25-nanometer (nm) single-level cell (SLC) NAND flash. The Ultrastar SSD400S.B family combines Hitachi’s proven enterprise hard disk drive (HDD) expertise with Intel’s extensive capabilities in developing high-endurance SLC NAND flash memory and advanced SSD technology. Learn more at the Intel® SSD online press kit.


Feb. 27 - March 1, 2012


2012 Mobile World Congress at Montjuic, Fira de Barcelona, Spain. Intel Corporation will showcase leading mobile and communications solutions in Hall 8, Booth #B192. In addition to the main Intel booth, the company will have a presence in various showcase venues.


Intel News Conference with Paul S. Otellini

Feb. 27, 5:30-6:30 p.m. CET

Watch at


Intel will host a news conference on Monday, Feb. 27 at 5:30 p.m. CET. President and CEO Paul S. Otellini will highlight Intel's mobile strategy and progress to expand its presence in new and existing markets.


"Mobile Innovation: A Vision of 2022;" Panel with Mike Bell, corporate vice president and general manager, Mobile and Communications Group, Intel

Fira, Hall 5, Auditorium 2

Feb. 29, 1:45-3:15 p.m. CET


The rapid pace of innovation in the mobile industry has accelerated even further in the last 12 months. With the arrival of LTE, the growth of embedded services and global adoption reaching new peaks, the potential for mobile has never been greater. Mobile has fundamentally transformed the way we interact and connect with each other. This session will look at future innovations and trends that will shape how we communicate in the next 10 years.


Intel Booth

Fira, Hall 8, Booth #B192

Feb. 27 – March 1, 9:00 a.m. – 7:00 p.m. CET

Intel will showcase how its products and technologies are transforming experiences from device to cloud. Through a variety of unique and interactive demonstrations, Intel will highlight compelling solutions across a range of mobile market segments, including Intel® Atom™ processor-based smartphone and tablets; and leading-edge wireless solutions from Intel Mobile Communications.


Intel in App Planet

App Planet Booth

Fira, Hall 7, #B28

Feb. 27 – March 1; 9:00 a.m. – 7:00p.m. CET


Check out the latest from the Intel AppUpSM center at Intel's booth in the App Planet Exhibition, which focuses on the latest technology driving the booming apps industry. Intel will feature the latest Intel AppUp center demos, as well as the Intel AppUpSM developer program.


Android Developer Brunch

Feb. 27, 9 a.m. – Noon CET
Fira, Hall 6, 6HS14


On Monday morning, Android developers and partners are invited to join Intel for an informal brunch to learn more about developing apps for smartphones and tablets based on Intel Architecture.


"Android on Intel® Architecture" Showcase

Feb. 29; 9 a.m. – 6 p.m CET

Mies van der Rohe Pavilion


On Wednesday, Feb. 29, Intel will showcase tools and tips for developers to create apps for Android devices based on Intel® Atom™ processors. Enjoy the catered event as attendees see the latest Intel Atom processor-based handsets and tablets running Android apps. Cocktail reception follows from 6 p.m. to 9 p.m.


Google Android Booth

Fira, Hall 8

Feb 27. – March 1, 9:00a.m. – 7:00p.m. CET


Intel will be featured within Google's Android booth. Showcasing Android on Intel Architecture optimizations, Intel will demonstrate Intel® Atom™ processor- based smartphones and tablets.

An additional three Intel engineers have been elected as IEEE Fellows, the highest level of membership for their exceptional contributions to  electrical engineering. The newly elected engineers from Intel include; Donald Stanley Gardner, for contributions to integrated circuit interconnects and integrated inductor technology, Yen-Kuang Chen, for contributions to algorithm-architecture co-design for multimedia signal processing and Valluri R. Rao for contributions to the characterization technologies for microprocessor and logic circuits. There are presently 29 IEEE Fellows at Intel.

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