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Intel Newsroom

39 Posts authored by: Radek

Using analytics to unlock hidden insights in real-time allows companies to make smarter decisions that lead to better results, from improving sales and marketing tools, to optimizing supply chains. Intel is ushering businesses into this next phase of big data intelligence with the new Intel® Xeon® Processor E7 v2 family. With the most advanced technology for in-memory analytics, the Intel Xeon Processor E7 v2 family will make data analysis much faster and more thorough. For example, based on some initial testing, eBay has experienced significant boosts in analytics performance when combining the Intel Xeon Processor E7 v2 with SAP’s HANA* software. This improvement will translate into faster and greater understandings of large data sets that will help eBay drive additional revenue opportunities for their customers. More examples, product related videos and animations can be found in the online press kit.

Today Intel unveiled the 'Intel® Cloud Technology' program to help display cloud service capabilities for improved customer experience and value. The program helps users identify underlying technology, benefits cloud service providers (CSPs) by communicating differentiation in service offerings and informs customers how infrastructure technology can improve service performance, reliability and security, helping them maximize return on investment. Intel also announced the Intel® Cloud Finder online search engine, which is integrated into the program to allow users to find CSPs that provide Intel technology-based cloud services matching the required criteria, offering the ability to try services for free before purchasing. Get more information, videos and animations.

Today Intel introduced the Intel® Xeon® processor E5-2400 v2 product family (previously codenamed Ivy Bridge-EN) to compliment the E5-2600 v2 product family launched in September with lower core counts, lower frequency and lower TDP options. The new Intel Xeon processor E5-2400 v2 product family is based on 22nm manufacturing process and includes 12 different models. It is designed to offer performance and features to address small and medium business, enterprise storage and entry to mid-range communications markets. Dylan Larson, Director of Xeon Platform Marketing, shares more details in his blog.

Today Intel announced that it has signed a definitive agreement to acquire certain assets of the wireless infrastructure division of Mindspeed Technologies, Inc. Through this acquisition, Intel will gain a wireless infrastructure team with deep experience in delivering signal processing-related technologies and IP for base stations. Rose Schooler, vice president and general manager of Intel's Communications and Storage Infrastructure Group discusses the significance of this acquisition in her blog here.

Today at the Supercomputing Conference in Denver, Intel discussed form factors and memory configuration details of the next generation Intel® Xeon Phi™ processor (code named "Knights Landing"). The new revolutionary design will be based on the leading edge 14nm manufacturing technology and will be available as a host CPU with high-bandwidth memory on a processor package. This first-of-a-kind, highly integrated, many-core CPU will be more easily programmable for developers and improve performance by removing "off-loading" to PCIe devices, and increase cost effectiveness by reducing the number of components compared to current solutions. The company has also announced collaboration with the HPC community designed to deliver customized products to meet the diverse needs of customers, and introduced new Intel® HPC Distribution for Apache Hadoop* and Intel® Cloud Edition for Lustre* software tools to bring the benefits of Big Data analytics and HPC together. View the tech briefing.

Today during the Fujitsu Forum in Munich, Fujitsu demonstrated the world's first server solution featuring an Intel® Optical PCIe Express-based server connected to an external expansion box containing additional compute and storage nodes using Intel® Silicon Photonics. The solution demonstrated opportunities that Intel Silicon Photonics can bring to the data center with the ability to connect separate boxes with compute or storage nodes in a way that appears to the CPU to be on the main motherboard while actually being fully virtualized. Read a blog from Vic Krutul, director of marketing for the Silicon Photonics Operation at Intel, who explains in detail why this demonstration shows the future of the data center.

Today, Cloudian announced a cooperation with Intel and Penguin Computing to deliver an ultra low power, high density cloud storage solution based on 22nm Intel® Atom™ processor C2000 SoC. The new scale-out, multi-datacenter capable system will be built by Penguin Computing and sold as a bundled turnkey solution for OpenStack users.

Today Lawrence Livermore National Laboratory together with Cray and Intel announced a unique high-performance computing cluster called "Catalyst" aimed to serve research scientists in providing a proving ground for new HPC and big data technologies and architectures. "Catalyst", made of 324 nodes powered by the latest 12-core Intel® Xeon® processor E5-2695v2 product family will deliver 150 teraflops of performance. Additionally, installed Intel SSD-based NVRAM storage of 800GB per compute node and 3.2 terabytes per Lustre node will allow for exploration of new approaches to big data analytics, application check-pointing and in-situ visualization.

Announced recently, the supercomputer located in BP's Center for High-Performance Computing in Houston will be the world's largest installation for commercial research. 2.2 Petaflops of computing power is delivered by 10,864 Intel® Xeon® processors (5432 nodes, 96,992 cores) and is aimed to enhance BP’s ability to find new energy resources by reducing the time needed to analyze massive quantities of seismic data, and enabling more detailed in-house modeling of rock formations before drilling begins. The supercomputer also relies on support of a Lustre-based storage system with over 100 petabytes of storage space.

Today Intel announced the Intel Parallel Computing Center program aimed to accelerate the creation of open standard, portable and scalable parallel applications by combining computational science, hardware, programmer tools, compilers and libraries, with domain knowledge and expertise. The first five centers are CINECA, Purdue University, Texas Advanced Computing Center at the University of Texas (TACC), The University of Tennessee, and Zuse Institut Berlin (ZIB). Raj Hazra, vice president and general manager of Technical Computing Group at Intel, shares his thoughts about this new initiative in his blog. Also James Reinders, from Intel Software Solutions Group talks about top 3 concerns he hears from programmers and how IPCC can help addressing them.

SK Telecom and Intel announced that both companies have signed a memorandum of understanding (MOU) for the development of next-generation intelligent base stations aimed to deliver better quality and more advanced services to users of mobile devices. The cooperation will focus on both building and qualification of future base station test beds powered by Intel-based servers with virtualization technologies. The agreement also includes conducting joint research on future solutions to effectively address traffic congestion and the evolution of next-generation wireless networks.

Corning and Intel crushed their own distance record by demonstrating the 25Gb/s transmission of data across 820 meters using multi-mode fiber. Earlier this month, the companies announced the Corning* ClearCurve LX optical fiber optimized for Intel’s Silicon Photonics technology that could operate up to 300 meters. This reach would be able to address future data centers’ critical needs for higher line rate transmission over longer distances. Engineers from Intel and Corning presented the breakthrough at the prestigious European Conference on Optical Communications (ECOC) 2013 in London.

Today Unisys and Intel announced a collaboration to combine Unisys' advanced secure partitioning technology with innovative computing and security functions available in Intel® Xeon® processors. The new platform will offer an enterprise-level security, availability and scalability for Cloud computing and Big Data workloads. It will also allow for a cost-efficient migration path from RISC systems running Unix while ensuring all required mission-critical computing attributes are available. The full press release is available here.

Today, the Top500 list of the most powerful supercomputers in the world, announced at the International Supercomputing Conference (ISC'13) in Germany, revealed a new leader: the "Milky Way 2" system powered by 32,000 Intel® Xeon® processors and 48,000 Intel® Xeon Phi™ coprocessors. Intel technology also powered more than 80 percent of all listed systems, including 98 percent of the newly added supercomputers. During the conference, Raj Hazra, Intel vice president and general manager of the Technical Computing Group, also announced the new Intel Xeon Phi coprocessors and disclosed the first details of the next generation of this technology, codenamed "Knights Landing", featuring Intel's leading 14nm process technology. Get more information about Intel at ISC'13.

Today Intel introduced the new Intel® Xeon® processor E3-1200 v3 product family based on Haswell microarchitecture and the company's 22nm manufacturing process. When deployed in cloud data center environments, the new Intel Xeon processors will help reduce costs and increase media processing capabilities for cloud-based media service providers to better support customers wanting to upload and share videos with friends across different mobile devices. In addition to a better offering for cloud media workloads than discrete graphic-based servers, new Intel Xeon processors offer exceptional energy efficiency and lowest TDP ever at 13 Watts for highly dense environments like microservers. Get the Intel Xeon processor E3-1200 v3 product family fact sheet.

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