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Intel Newsroom

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To cater to the growing Internet of Things (IoT) market, Intel today extended the Intel® IoT Developer Kit by releasing the Intel® XDK IoT Edition, simplifying the development of IoT apps written in JavaScript. The tool provides makers with an integrated approach to create, run and debug apps on Intel® Edison and Intel® Galileo boards. In addition, Intel® XDK IoT Edition can be used to develop an HTML5 companion app that runs on phones, tablets and PCs to control the IoT devices. Intel® XDK IoT Edition is available as a free download for Windows, OS X and Ubuntu Linux.

Asha Keddy, vice president and general manager for standards and advanced technology at Intel’s Mobile Communication Group, recently penned a blog post on how 5G will be different from previous networks. Keddy shares her thoughts on the need for 5G to support the billions of smart ‘things’ by 2020 and how 5G will be unlike from any other wireless standards before it. In particular, bits per second is the standard way of measuring network performance, but measuring 5G will involve bits per joule, bits per Hertz, bits per square meter of coverage and bits per dollar because 5G will address a variety of challenges, including energy efficiency, spectrum performance, reliability and cost.

Basis, an Intel company, today revealed the next-generation Basis Peak™ fitness and sleep tracker featuring a new touchscreen design and improved sensor technology for a more precise view of fitness and health habits. With new features, including 24/7 monitoring and powerful optical blood flow sensors, combined with the reward-based healthy habits system, Basis Peak inspires users to transform daily habits and behaviors to improve their health and fitness. It will retail for $199 and will be available beginning late October.  See the Basis Peak video for more information.

SANTA CLARA, Calif., Sept. 29, 2014 – Intel Corporation today introduced cybersecurity executive Christopher Young as Intel's newest senior vice president and general manager of Intel Security. Young will join Intel's management committee and report to Intel President Renée James.

 

"Today is an exciting day for the tech industry and for Intel Security employees," said Intel President Renée James. "Chris Young is a world-class leader in cybersecurity, and I have full confidence that he'll establish Intel Security as the pre-eminent provider of pervasive security and identity protection. The opportunities for innovation and growth are unparalleled."

 

Young comes to Intel from Cisco*, where he was senior vice president of the global Security and Government Group, responsible for strategy, engineering and product development for the company's security product business. Prior to Cisco, he held executive roles in end user computing at VMware* and cybersecurity at RSA*. Young also co-founded and led Cyveillance Inc.* and served as president and chief operating officer.

 

Intel Security combines the McAfee business with Intel teams that have expertise in hardware, software and solutions. McAfee has a broad portfolio of security solutions that complement Intel's core business of delivering open platforms for partner innovation. Given the combined strengths of McAfee and Intel, the Intel Security team will infuse effective security for individuals and businesses to address the threats of today and tomorrow on all computing devices.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

Pilot Program Demonstrates the Benefits of End-to-End Internet of Things Connectivity in Industrial Settings

 

NEWS HIGHLIGHTS

  • Intel and Mitsubishi Electric are working together to advance factory automation (FA) systems utilizing end-to-end Internet of Things (IoT) connectivity and big data analytics.
  • The companies collaborated on a pilot at Intel's manufacturing facility in Malaysia, demonstrating the benefits of IoT. The pilot resulted in improved equipment uptime, increased yield and productivity, the ability to conduct predictive maintenance and reduced component failures.
  • As a result of the pilot, Intel realized US$9 million in savings through cost avoidance and improved decision making.
  • The companies are targeting product availability in 2015.

 

 

TOKYO, Sept. 29, 2014 – Intel Corporation and Mitsubishi Electric Corporation today announced a new collaboration to develop next-generation factory automation (FA) systems with Internet of Things (IoT) technologies and a pilot program at Intel's backend manufacturing facility in Malaysia.

 

The pilot demonstrates the benefits of IoT in a factory setting with a focus on delivering productivity enhancement through innovative functions, such as predictive failure, by combining Intel's expertise developing solutions for IoT and Mitsubishi Electric's "e-F@ctory" automation capabilities. Intel realized a savings of US$9 million over the course of the pilot.

 

IoT and Big Data in Action
As an initial collaboration, Intel and Mitsubishi Electric implemented the IoT and big data solution at Intel's backend manufacturing facility in Malaysia. Using an Intel® Atom™ processor-based IoT gateway called the C Controller from Mitsubishi Electric's iQ-Platform, Intel was able to securely gather and aggregate data for the analytics server. Data was then processed using Revolution R Enterprise* software from Revolution Analytics*, an analytics software solution that uses the open source R statistics language, which was hosted on Cloudera Enterprise*, the foundation of an enterprise data hub.

 

The solution has improved equipment component uptime, increased yield and productivity by minimizing misclassification of good units as bad, enabled predictive maintenance, and reduced component failures. Initial results include a savings of US$9 million through cost avoidance and improved decision making.

 

"The data mining and analytics pilots done in Malaysia have demonstrated great value and benefits for Intel manufacturing using Intel-based IoT products and technology," said Robin Martin, vice president and general manager of Intel's Assembly and Test Group. "Through this collaboration and pilot with Mitsubishi Electric, we will bring the know-how, assets and technology of both companies to develop next-generation factory automation systems with predictive analytic capabilities. This will allow other companies to reap the benefits of the Internet of Things for factory operations."

 

"The collaboration between Mitsubishi Electric and Intel on this IoT project has enabled field data from semiconductor manufacturing lines to be collected and analyzed to improve operational performance, yet also contribute energy savings for a more sustainable society," said Masayuki Yamamoto, group senior vice president, Factory Automation Systems, Mitsubishi Electric Corporation. "We believe that other manufacturers can benefit from this joint Intel-Mitsubishi Electric solution, which combines big data analysis, optimized data capture and processing to deliver improved performance and optimized maintenance."

 

The commercialization date for the product is 2015, and the companies will show a live demonstration of the solution in Intel's booth at the IoT Japan 2014 tradeshow, which will be held October 15-17 at Tokyo Big Sight in Japan.

 

Press Materials

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Saving Millions of Dollars

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Propelling Factory Success

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel, Intel Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

 

About Mitsubishi Electric Corporation
With over 90 years of experience in providing reliable, high-quality products, Mitsubishi Electric Corporation (TOKYO: 6503) is a recognized world leader in the manufacture, marketing and sales of electrical and electronic equipment used in information processing and communications, space development and satellite communications, consumer electronics, industrial technology, energy, transportation and building equipment. Embracing the spirit of its corporate statement, Changes for the Better, and its environmental statement, Eco Changes, Mitsubishi Electric endeavors to be a global, leading green company, enriching society with technology. The company recorded consolidated group sales of 4,054.3 billion yen (US$ 39.3 billion1) in the fiscal year ended March 31, 2014. For more information visit www.MitsubishiElectric.com.

 

1At an exchange rate of 103 yen to the U.S. dollar, the rate given by the Tokyo Foreign Exchange Market on March 31, 2014

 

e-F@ctory, iQ Platform, C Controller, CC-Link, CC-Link IE are trademarks of Mitsubishi Electric Corporation in Japan and other countries.

Intel to Invest Up to RMB 9 Billion (US$1.5 Billion) in Semiconductor Business under Tsinghua Unigroup

 

SANTA CLARA, Calif., Sept. 25, 2014 – Intel Corporation and Tsinghua Unigroup Ltd. ("Tsinghua Unigroup"), an operating subsidiary of Tsinghua Holdings Co., Ltd., a solely state-owned limited liability corporation funded by Tsinghua University in China, today jointly announced that both parties have signed a series of agreements. The purpose of the agreements is to expand the product offerings and adoption for Intel-based mobile devices in China and worldwide by jointly developing Intel® Architecture and communications-based solutions for mobile phones. Intel also has agreed to invest up to RMB 9 billion (about US$1.5 billion) for a minority stake of approximately 20 percent of the holding company under Tsinghua Unigroup  which will own Spreadtrum Communications and RDA Microelectronics, subject to regulatory approvals and other closing conditions.

 

Both Spreadtrum and RDA, controlled by Tsinghua Unigroup, are leading fabless semiconductor companies in China, which develop mobile chipset platforms for smart phones, feature phones and other consumer electronics products, supporting 2G, 3G and 4G wireless communications standards.

 

"China is now the largest consumption market for smartphones and has the largest number of Internet users in the world," said Brian Krzanich, Intel CEO. "These agreements with Tsinghua Unigroup underscore Intel's 29-year-long history of investing in and working in China. This partnership will also enhance our ability to support a wider range of mobile customers in China and the rest of the world by more quickly delivering a broader portfolio of Intel architecture and communications technology solutions."

 

Mr. Zhao Weiguo, Chairman and President of Tsinghua Unigroup, added, "It has become a national priority of China to grow its semiconductor industry. The strategic collaboration between Tsinghua Unigroup and Intel ranges from design and development to marketing and equity investments, which demonstrate Intel's confidence in the Chinese market and strong commitment to Chinese semiconductor industry, which will accelerate the technology development and further strengthen the competitiveness and market position of Chinese semiconductor companies."

 

Under the terms of the agreement, Spreadtrum Communications, Inc. will jointly create and sell a family of Intel Architecture-based system-on-chips (SoCs). Initial products will be available beginning in the second half of next year and will be Intel Architecture-based SoCs sold by both companies.

 

"The adoption of Intel's architecture technology will enable us to accelerate the development of mobile SoCs that expand the breadth of our portfolio, benefiting handset makers addressing both China and the global market," said Dr. Leo Li, Chairman and CEO of Spreadtrum. "We are pleased to embark on collaboration with Intel around these new product offerings."

 

The companies expect Intel's investment to close in early 2015.

 

Risk Factors
This news release contains forward-looking statements regarding the proposed transactions between Intel and Tsinghua Unigroup, including but not limited to statements regarding the development of future Intel products, the availability of these products, and the timing of the closing of Intel's equity investment in Tsinghua Unigroup. Actual events or results may differ materially from those contained in these forward-looking statements. Among the important factors that could cause future events or results to vary from those addressed in the forward-looking statements are risks and uncertainties arising from, among other things, the possibility that one or more closings of the transactions may be delayed or may not occur; and litigation or regulatory matters involving intellectual property, antitrust and other issues that could affect the closings of the transaction, the future operation of Intel or Tsinghua Unigroup and/or Intel's or other entities' dealings with Tsinghua Unigroup.

 

In addition, please refer to the documents that Intel files with the SEC on Forms 10-K, 10-Q and 8-K. The filings by Intel identify and address other important factors that could cause events and results to differ materially from those contained in the forward-looking statements set forth in this press release. Intel is under no duty to update any of the forward-looking statements after the date of this press release to conform to actual results.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.


About Tsinghua Unigroup
Tsinghua Unigroup Ltd. is a subsidiary of Tsinghua Holdings Co., Ltd., a state-owned company  affiliated to Tsinghua University. Tsinghua Unigroup focuses on the integrated circuit (IC) segment to develop an industry chain spanning IC design, IC industrial park development, School of Communications and Microelectronics, as well as the IC industry fund operation. For additional information, please see the Company's website at http://www.unigroup.com.cn.

 

About Spreadtrum Communications
Spreadtrum Communications, Inc. is a fabless semiconductor company that develops mobile chipset platforms for smart phones, feature phones and other consumer electronics products, supporting 2G, 3G and 4G wireless communications standards. Spreadtrum Communications, Inc.'s solutions combine its highly integrated, power-efficient chipsets with customizable software and reference designs in a complete turnkey platform, enabling customers to achieve faster design cycles with a lower development cost. Spreadtrum's customers include global and China-based manufacturers developing mobile products for consumers in China and emerging markets around the world. For more information, please visit www.spreadtrum.com.

 

About RDA Microelectronics
RDA is a fabless semiconductor company that designs, develops and markets wireless system-on-chip and radio-frequency semiconductors for cellular, connectivity and broadcast applications. The Company's product portfolio currently includes baseband, radio-frequency front-end modules, power amplifiers, transceivers, Bluetooth system-on-chip, Wi-Fi, Bluetooth and FM combo chips, FM radio receivers, set-top box tuners, analog mobile television receivers, CMMB mobile television receivers, walkie-talkie transceivers and LNB satellite down converters. For more information, please visit www.rdamicro.com.

 

The International Fund for Agricultural Development (IFAD) is working with Intel to drive greater food security, job creation and long-term economic growth for farmers and their families in developing countries. Goals for IFAD and Intel are to increase small farmers’ access to Information and Communication Technology (ICT)-based knowledge platforms via a new Intel software suite called eAgro that will help small farmers with more informed decision making on key aspects including seed and fertilizer selection, harvest planning and sales management.

The Intel® RealSense™ SDK for Windows Beta, a developer toolkit for building applications for Intel RealSense 3-D cameras, is now live. The SDK allows developers to build applications that incorporate gesture, hand/finger tracking, facial analysis, speech recognition and augmented reality for a more natural and intuitive experience. To take advantage of these capabilities, developers should download the SDK now and reserve a peripheral 3-D camera. Learn more about Intel RealSense technology and the Intel RealSense App Challenge 2014.

Intel-based mobile devices have the flexibility to fit all your needs. Whether kids need a new device for the start of the school year or parents are looking for new technology for work and play, with lightning-fast processing times, portability and versatility, there is an Intel-based mobile device for every member of the family. Check out this mobile devices b-roll that highlights the wide variety of Intel-based tablets, 2 in 1 devices and portable all-in-one PCs; you can read more about these devices in the 2014 Intel Buying Guide and at shop.intel.com.

Calling all Ducks Football and sports fans! The University of Oregon collaborated with Intel to produce an Oregon Football branded avatar, available in Intel’s Pocket Avatar app, which can be used to communicate with Duck fans on game day or any other time. Pocket Avatars is a messaging application that offers consumers a unique and fun way to communicate via animated avatars. Duck Fans will be able to select “Speedy,” an Oregon football player avatar, from a broad selection within the Pocket Avatars app (available at the Apple or Google Play app stores) and use the character to record a personalized, 3-D video message, mirroring the users’ facial gestures and voice. Oregon fans can then send the message to friends, family and fans of the Ducks’ upcoming opponent via text, email, social networks such as Facebook and Twitter, or the Pocket Avatars app itself.

Tune in this Thursday, Sept. 18 at 2:15 p.m. PT to view a live-stream of Intel’s keynote address at MakerCon New York 2014. Intel CEO Brian Krzanich will talk about “making,” or do-it-yourself technology tinkering, in a corporate environment. There are more than 1,000 Intel employees that are “makers.” In the last year their tinkering and entrepreneurial spirit has led to some new product ideas, including the Intel® Edison, and examples of faster and novel ways for developing technology prototypes. In addition to prepared remarks, Krzanich will be interviewed on-stage by Dale Dougherty, CEO and founder of Maker Media and publisher of Make Magazine.

Switch SUPERNAP and Intel today announced they are working with UNLV to make the Intel “Cherry Creek” supercomputer available to UNLV researchers. The Cherry Creek supercomputer is among the world’s fastest and most powerful supercomputers. It is housed in Switch’s Las Vegas SUPERNAP data center and is available to UNLV researchers through SUPERNAP’s connectivity network. Cherry Creek uses a combination of Intel® Xeon® processors, Xeon Phi™ coprocessors and Intel® True Scale Fabric to process data roughly seven times faster than UNLV’s supercomputing center currently allows. It will act as a catalyst for scientific discovery, the modernization of applications and regional economic development efforts.

Last week at IDF Intel showed developers the latest and greatest in Intel® processor graphics technologies. Intel is the number one PC Graphics company by volume according to the latest Q3 ’14 Mercury Research study, and developers attended dozens of IDF sessions and demos last week to get an update. Key news around OpenCL 2.0 support in our new Intel® Core™ M processor family, ‘Gen8’ graphics architecture, Intel® Wireless Display, and high-performance Intel® Iris™ and Iris™ Pro graphics was disclosed. Read more here.

Intel has taken some important steps towards the company's goal of being second in LTE modem volume by the end of 2014. Intel's XMM™ 7262 LTE platform is now certified on China Mobile, China’s biggest carrier. Certification on China Mobile’s network gives Intel more opportunities to work with OEMs in China, one of the most exciting LTE subscriber markets. The Intel XMM 7262 offers China and the global TD-LTE ecosystem a new cost-effective option for developing mass-market LTE devices. The XMM 7262 modem features up to 23 LTE bands on a single SKU for worldwide coverage and roaming and carrier aggregation. More information is available on our blog.

For the eighth consecutive year, Intel was included in the 2014 Working Mother 100 Best Companies list. Working Mother recognized Intel for its consistent quality-of-life improvements and commitment to progressive workplace programs, including benefits, women’s issues and work-life balance such as its company culture, maternity leave and health and wellness programs.

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