1 2 3 125 Previous Next

Intel Newsroom

1,868 Posts

With graduation season underway, Intel and Her Campus Media teamed up to survey more than 500 college women in an informal online poll to explore where technology ranks in their hearts. Technology devices (such as a laptop, tablet or smartphone) proved to be trusted companions, with nearly two-thirds (64 percent) of respondents stating that they are independent women and rely more on their tech than any best friend, boyfriend or super smart lab partner. Furthermore, 68 percent would rather forgo their daily dose of caffeine than accidentally leave their tech at home when heading to class. And one in five has new technology at the top of their graduation gift wish list, over a plane ticket or cash. Check out Intel’s Spring Product Guide for some of the best devices for the 2015 graduating class

Visible from Mission College Blvd. in the heart of Silicon Valley, Intel has installed one of the world's largest operating rooftop arrays of wind micro-turbines on the roof of Intel's worldwide headquarters in Santa Clara, California. Intel's micro-turbines are a proof-of-concept project, in which Intel hopes to collect data that will help the company better understand green power and identify ways to continue evolving its sustainability programs. This is just the latest milestone in Intel's longstanding commitment to innovation and environmental sustainability.

 

Press Materials

 

Rendering_Wind_Micro_Turbines_Intel_RNB_Rooftop_1kpx.jpg

Rendering of the planned installation of 58 Wind Micro-Turbines on the rooftop of Intel's global headquarters building in Santa Clara, California. The installation is underway and will be complete in May 2015.  IMAGE SOURCE:  JLM Energy, Inc.

Intel_micro-turbines_1kpx.jpg

Located on the rooftop of Intel's headquarters Robert Noyce Building in Santa Clara, California, the company is installing a total of 58 micro turbines as part of a pilot wind power project.

 

Intel_Krzanich_RNB_Micro Turbines_2_1kpx.jpg Intel_Krzanich_RNB_Micro Turbines_1_1kpx.jpg

Intel CEO Brian Krzanich on the roof of Intel's headquarters Robert Noyce Building checking out the company's new wind microturbines. Intel is installing a total of 58 microturbines as part of a pilot wind power project. With Krzanich is Josh Beckwith, construction project manager with JLM Energy, the Rocklin California company that built and is installing the microturbines.

Doing the right things the right way – it’s who Intel is. Building on two decades of reporting, Intel released its 2014 Corporate Responsibility report, an assessment of its performance in areas including supply chain responsibility, environmental sustainability and more. From working to validate all of its products as conflict-free by 2016 to making a $300 million commitment to achieve a more diverse workforce, Intel remains committed to transparency, leadership in corporate responsibility and impacting the lives of people around the world. Read the new report.

Intel and the Food Network have teamed up to solve some of the messiest kitchen problems. By bringing Intel® RealSense™ technology to the mix, users can now create recipes with the help of voice and gesture control capabilities built into recipes on FoodNetwork.com which are optimized for the Intel RealSense 3D camera. Now cooks can simply take their Intel RealSense technology enabled-PC into the kitchen to prepare their favorite FoodNetwork.com recipes using voice or gesture with their hands in front of the camera — so it's OK if their hands are a mess. The top 100 Food Network recipes, including Perfect Roast Chicken and Super Sloppy Joes, are enabled with Intel RealSense technology. Check out the newly enabled recipes on the Food Network website. View a list of devices that support RealSense.

Intel has been recognized as a leader in conflict mineral reporting in a new report titled, Mining the Disclosures: An Investor Guide to Conflict Minerals Reporting. The report was released by Responsible Sourcing Network and Sustainalytics, and made note of Intel’s conflict-free efforts, specifically the company’s first commercially available conflict-free microprocessors in 2014. The report also referenced that Intel’s goal to establish all products as conflict-free starting in 2016. Learn more about Intel’s conflict-free efforts.

Today at the OpenStack Summit, Intel announced the availability of Intel Clear Containers, the latest feature coming from the Clear Linux Project for Intel Architecture. Intel Clear Containers bring a fast-booting, low-footprint Virtual Machine to the container usage model. Intel also announced Intel® Cloud Integrity Technology version 3.0, a root-of-trust based software solution for “remote attestation” delivering cloud workload transparency and control for OpenStack environments. Cloud Integrity Technology works with security features on Intel architecture based servers to help maintain security SLAs and regulations in the cloud. For more information, visit the Intel Clear Containers and Cloud Integrity Technology blogs.

asus_zenfone_2.jpeg

Today, ASUS announced that the ZenFone 2 will be available on May 19, 2015 in North America. This is the first smartphone powered by an Intel® Atom™ processor (Moorefield) paired with the Intel® XMM™ 7260 LTE Advanced modem in North America. The Intel Atom processor and Intel XMM 7260 LTE Advanced modem allows for fast speeds and advanced graphics for a great music and video streaming experience, as well as live multiplayer gaming on the Zenfone 2. The phone will start at $199 USD, and will be available at Amazon.com, Groupon.com and NewEgg.com in the U.S., and NCIX.com, Canada Computer and Memory Express in Canada.

 

 

WHAT:

Intel Corporation will deliver the opening keynote at Computex 2015 in Taipei, Taiwan, where the company will introduce and showcase a range of exciting new computing experiences from the PC to IoT that will enable a smart and connected world.

 

Press materials and multimedia will be available at: www.intel.com/newsroom/computex

WHEN:

June 2-6, 2015

ACTIVITIES:
kirk-skaugen_1.jpg

Computex Opening Keynote

June 2, 2-3 p.m. (Taipei local time) - Registration opens at 1:20 p.m.

Taipei International Convention Center (TICC)

No. 1, Sec 5, Hsin-Yi Road, Taipei

3F, Plenary Hall

 

Join Kirk Skaugen, Intel senior vice president and general manager of the Client Computing Group, for the opening keynote at Computex 2015 to see how Intel is enabling amazing new experiences that will transform the way we live, work and interact with technology.

 

The keynote will be available via live webcast:

http://intelstudios.edgesuite.net/computex/2015/index.html

 

Post-Keynote Media Q&A Session with Kirk Skaugen

June 2, 3:10-3:40 p.m. (Taipei local time)

Taipei International Convention Center

4F, VIP Room

 

Kirk Skaugen, senior vice president and general manager of the Client Computing Group, Intel. Open to registered media and analysts only.

 

Intel Booth Guided Tour for Media

June 3, 10:15-11:00 a.m. (Taipei local time)

Taipei World Trade Center (TWTC) Nangang Exhibition Hall

No. 1, Jing Mao 2nd Road, Nangang District, Taipei

 

Intel Booth, Nangang Exhibition Hall #M0420

 

 

Intel Internet of Things (IoT) Media Briefing (by invitation)

June 3, 1:00-2:00 p.m. (Taipei local time) - Registration at 12:30 p.m.

Le Meridien Taipei Hotel

No.38, Songren Rd., Xinyi Dist., Taipei

3F, Amber & Pearl

 

Doug Davis, senior vice president and general manager of the Internet of Things Group, Intel

MEDIA SUPPORT:

For more information and media materials, visit: www.intel.com/newsroom/computex or on-site at the reception counter of the Intel Exhibition Showcase at 4F, TWTC Nangang Exhibition Hall.

 

To request a media credential, please register at

http://www.e21forum.com.tw/Register.aspx?nav=9&lang=1 or onsite at the 1F reception counter of TICC.

MEDIA CONTACTS:

Intel Corporation:
Scott Massey, Intel PR manager (U.S.)

+1-503-696-1785, scott.massey@intel.com

 

 

Joe Huang, Intel PR manager (APJ)

+886-2-2514-3157, joe.huang@intel.com

 

Pallas PR Agency:
Elsa Chang, Pallas PR, +886-953-129-126, elsa.chang@pallaspr.com.tw

Irene Chen, Pallas PR, +886-933-897-596, irene.chen@pallaspr.com.tw

Plenary Hall, 3F, Taipei International Convention Center (TICC)

plenaryhall.png

VIP Room, 4F, Taipei International Convention Center

viproom.jpg

Amber & Pearl/Jadeite 3F, Le Meridien Taipei

amberandpearl.jpg

Raymond Wang of Canada Wins US$75,000 Top Prize at Intel International Science and Engineering Fair

 

NEWS HIGHLIGHTS

  • The world's largest high school science research competition, the Intel International Science and Engineering Fair, a program of Society for Science & the Public, announced its top winners in  Pittsburgh.
  • Raymond Wang of Canada received the Gordon E. Moore Award, a US$75,000 prize named in honor of the Intel co-founder and fellow scientist.
  • Two Intel Foundation Young Scientist Awards winners – Nicole Ticea of Canada and Karan Jerath of Friendswood, Texas – each received prizes of US$50,000 from the Intel Foundation.

 

 

ISEF2015_FirstPlace_RaymondWang.jpg

PITTSBURGH, Pa., May 15, 2015 – Raymond Wang, 17, of Canada, is celebrated by his fellow finalists for his first place win at the Intel International Science and Engineering Fair, the world's largest high school science research competition. Approximately 1,700 high schoolers from 78 countries, regions and territories competed for $4 million in awards this week. (PHOTO CREDIT: Intel/Kathy Wolfe)

PITTSBURGH, May 15, 2015 – Raymond Wang, 17, of Canada was awarded first place for engineering a new air inlet system for airplane cabins to improve air quality and curb disease transmission at this year's Intel International Science and Engineering Fair, a program of Society for Science & the Public.

 

Wang's system improves the availability of fresh air in the cabin by more than 190 percent while reducing pathogen inhalation concentrations by up to 55 times compared to conventional designs, and can be easily and economically incorporated in existing airplanes. Wang received the Gordon E. Moore Award of US$75,000, named in honor of the Intel co-founder and fellow scientist.

 

Nicole Ticea, 16, of Canada received one of two Intel Foundation Young Scientist Awards of US$50,000 for developing an inexpensive, easy-to-use testing device to combat the high rate of undiagnosed HIV infection in low-income communities. Her disposable, electricity-free device provides results in an hour and should cost less than US$5 to produce. Ticea has already founded her own company, which recently received a US$100,000 grant to continue developing her technology.

 

Karan Jerath, 18, of Friendswood, Texas, received the other Intel Foundation Young Scientist Award of US$50,000 for refining and testing a novel device that should allow an undersea oil well to rapidly and safely recover following a blowout. Jerath developed a better containment enclosure that separates the natural gas, oil and ocean water; accommodates different water depths, pipe sizes and fluid compositions; and can prevent the formation of potentially clogging methane hydrate.

 

"Intel believes young people are key to future innovation and that in order to confront the global challenges of tomorrow, we need students from all backgrounds to get involved in science, technology, engineering and math," said Wendy Hawkins, executive director of the Intel Foundation. "We hope these winners will inspire other young people to pursue their interest in these fields and apply their curiosity, creativity and ingenuity to the common good."

 

This year's Intel International Science and Engineering Fair featured approximately 1,700 young scientists selected from 422 affiliate fairs in more than 75 countries, regions and territories. In addition to the top winners, approximately 600 finalists received awards and prizes for their innovative research, including 20 "Best of Category" winners, who each received a US$5,000 prize. The Intel Foundation also awarded a US$1,000 grant to each winner's school and to the affiliated fair they represent.

 

The following lists the 20 Best of Category winners, from which the top three were chosen:

CategoryFirstLastCityState/Country
Animal ScienceNattapongChueasiritawornMuangThailand
ThananonHiranwanichchakorn
SutthilukRakdee
Behavioral and Social SciencesSophiaKornerLouisvilleKentucky
DiyaMathur
BiochemistryAmolPunjabiWorchesterMassachusetts
Biomedical and Health SciencesNicoleTiceaVancouverCanada
Cellular and Molecular BiologyDemetriMaximBethelMaine
ChemistryArneHenselHomburg (Efze)Germany
Computational Biology and BioinformaticsMichaelRetchinRichmondVirginia
MatthewRetchin
Earth and Environmental SciencesJoshuaZhouChapel HillNorth Carolina
Embedded SystemsNiklasFauthMarbach am NeckarGermany
Energy: ChemicalKathyLiuSalt Lake CityUtah
Energy: PhysicalSriharshitaMusunuriMill CreekWashington
Engineering MechanicsRaymondWangVancouverCanada
Environmental EngineeringKaranJerathFriendswoodTexas
Materials ScienceCatherineLiOrlandoFlorida
MathematicsSanath KumarDevalapurkarTorranceCalifornia
MicrobiologyCarlyCrumpJacksonvilleFlorida
Physics and AstronomyRuochenHaoJinanChina
Plant SciencesAbdul JabbarAlhamoodDhahranSaudi Arabia
Robotics and Intelligent MachinesAvaLakmazaheriAlexandriaVirginia
Systems SoftwareCharlesNoyesVilla ParkCalifornia

 

Society for Science & the Public, a nonprofit membership organization dedicated to public engagement in science and science education, has owned and administered the competition since its inception in 1950 as the National Science Fair.

 

"Congratulations to Raymond, Nicole and Karan! Their selection as top winners really demonstrates the extraordinary work they have been able to accomplish at a young age in diverse topics," said Maya Ajmera, president and CEO of Society for Science & the Public. "We look forward to watching not only them, but the rest of the Intel International Science and Engineering Fair finalists as they progress further and pursue their interests in STEM. These talented young students are the problem solvers and innovators of their generation."

 

The Intel International Science and Engineering Fair honors the world's most promising student scientists, inventors and engineers. Finalists are selected annually from hundreds of affiliated fairs. Their projects are then evaluated onsite by approximately 1,000 judges from nearly every scientific discipline, each with a Ph.D. or the equivalent of six years of related professional experience in one of the scientific disciplines.

 

A full listing of finalists is available in the event program. The Intel International Science and Engineering Fair 2015 is funded jointly by Intel and the Intel Foundation with additional awards and support from dozens of other corporate, academic, governmental and science-focused organizations. This year, approximately US$4 million was awarded.

 

To learn more about Society for Science & the Public, visit www.societyforscience.org, and follow the organization on Facebook and Twitter.

 

To get the latest Intel education news, visit www.intel.com/newsroom/education, and join the conversation on Facebook and Twitter.

 

 

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

Gartner Research began ranking company's supply chains a decade ago in order to identify companies that best demonstrate leadership in applying demand-driven principles to drive business results. This week Gartner announced 2015 rankings at their annual Gartner Supply Chain Executive Conference in Phoenix, Arizona. This is the seventh consecutive year Intel has been named one of the top 25. See Gartner's press release to see who else made it into the top 25 this year, and see Gartner's supply chain web page for more info.

Intel was named as a LATINO 100 top company by Latino Magazine and recognized for providing opportunities for Latinos and programs that benefit the Latino community. Intel’s efforts focus on developing, progressing and retaining its Hispanic employee population and include a chartered strategic employee resource group. Intel also partners with external organizations focused on building a stronger Latino community. Visit Intel’s Diversity page to learn more about the company’s diversity efforts.

Intel announced today plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the “cloud.” This collaboration is part of Intel’s strategy to integrate re programmable technology with Intel® Xeon® processors to provide cloud customers with custom solutions that greatly improve performance, power and cost.

Companies Plan to Deliver Custom Intel® Xeon® Processors with eASIC Platforms to Speed Workloads like Security, Big Data, and Other Applications

 

SANTA CLARA, Calif., May 12, 2015 – Intel Corporation today announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the "cloud." The new parts will enable acceleration of up to two times that of a field programmable gate array (FPGA) for workloads like security and big data analytics while also speeding the time to market for custom application specific integrated circuit (ASIC) development by as much as 50 percent1.

 

The tremendous growth of cloud computing has spurred greater demand for customized chips that make a particular application or workload run faster. To enable this, eASIC plans to integrate its eASIC platform technology with future Intel® Xeon® processors, providing cloud service providers a highly customized, integrated hardware solution for their particular workload.

 

eASIC's technology can increase flexibility and fast-time-to-market when compared to traditional ASICs and increase performance and lower power consumption when compared to FPGAs. By integrating hardware accelerator solutions with the eASIC platform, Intel can deliver much faster and more flexible systems for cloud customers.

 

"Having the ability to highly customize our solutions for a given workload will not only make the specific application run faster, but also help accelerate the growth of exciting new applications like visual search," said Diane Bryant, senior vice president and general manager of Intel's Data Center Group. "This announcement helps broaden our portfolio of customized products to provide our customers with the flexibility and performance they need."

 

This collaboration is part of Intel's strategy to integrate reprogrammable technology with Intel Xeon processors to greatly improve performance, power and cost.

 

"We believe our eASIC technology has unique characteristics that will benefit cloud service providers to get the most from their applications," said Ronnie Vasishta, president and chief executive office at eASIC. "The combination of eASIC and Intel technology will help bring break through cost and performance to our customers."

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

 

About eASIC
eASIC is a semiconductor company offering a differentiated solution that enables us to rapidly and cost-effectively deliver custom integrated circuits (ICs), creating value for our customers' hardware and software systems. Our eASIC solution consists of our eASIC platform which incorporates a versatile, pre-defined and reusable base array and customizable single-mask layer, our easicopy ASICs, our standard ASICs and our proprietary design tools. Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Crescendo Ventures, Seagate Technology, Kleiner Perkins Caufield and Byers (KPCB) and Evergreen Partners. For more information on eASIC please visit www.easic.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 Source: eASIC website http://www.easic.com/products/28-nm-easic-nextreme-3/.

1,700 High School Students Compete for Approximately US$4M in Pittsburgh

 

WHAT:
Intel_ISEF_2015_Logo_Pittsburgh.jpg

The Intel International Science and Engineering Fair, a program of Society for Science & the Public and the world's largest high school science research competition, will take place in Pittsburgh from May 10-15. Approximately 1,700 high school students selected from 422 affiliate fairs in more than 75 countries, regions and territories will showcase cutting-edge research and inventions and compete for approximately US$4 million in awards. The full list of finalists is available in the event program (starting on page 61).

 

Wendy Hawkins, executive director of the Intel Foundation, and Maya Ajmera, president and CEO of Society for Science & the Public, will be available for comment at the event.

 

Media must be registered to attend. To register, reach out to the contacts listed below.

WHEN:

Public Exhibition of Projects

Thursday, May 14 from 10 a.m.-2 p.m. ET

  • This is the best opportunity for registered media to see, interview, film and photograph students from across the country and the world who are working to find solutions to global challenges through science, technology, engineering and math research. This year, research topics range from wearable technology to big data analytics to renewable energy.

 

Awards Ceremony

Friday, May 15 from 9-11:30 a.m. ET

  • Registered media are invited to attend the awards ceremony where the winners will be announced. The top prizes awarded by the Intel Foundation include the US$75,000 Gordon E. Moore Award, named for the Intel co-founder and fellow scientist. Two additional top winning projects will receive Intel Foundation Young Scientist Awards of US$50,000 each.
WHERE:

David L. Lawrence Convention Center

1000 Fort Duquesne Blvd.

Public Exhibition of Projects – DLCC Halls B and DE

Awards Ceremony – DLCC Hall A

QUOTES:

"The Intel International Science and Engineering Fair provides 1,700 brilliant teenagers with a unique opportunity to share cutting-edge ideas, exchange cultural perspectives and build lifelong friendships," said Wendy Hawkins, executive director of the Intel Foundation. "We're inspired by these young innovators and problem-solvers who are using science and technology to tackle our toughest global challenges and create a brighter future."

 

"Uniting students from around the world this year in Pittsburgh, the Intel International Science and Engineering Fair provides a unique opportunity for the world's top young innovators to compete for millions of dollars in awards while sharing their research and visions for the future with their peers," said Maya Ajmera, president and CEO of Society for Science & the Public. "We look forward with great anticipation to what these students will contribute individually and as a community to make our world a better place."

MORE INFO:

To get the latest Intel education news, visit www.intel.com/newsroom/education, and join the conversation on Facebook and Twitter.

 

To learn more about Society for Science & the Public, visit www.societyforscience.org, and follow the organization on Facebook and Twitter.

CONTACTS:

Gail Dundas, Intel

503-264-2154, gail.dundas@intel.com

 

Olivia Campbell, North of Nine Communications, for Intel

646-384-2095, olivia.campbell@nof9.com

 

Sarah Wood, Society for Science & the Public

202-872-5110, swood@societyforscience.org

Turning 50 this month, Moore’s Law is the cornerstone on which today’s innovation is built. IHS said today that Moore’s Law has generated a minimum of $3 trillion in incremental GDP and up to $11 trillion when including the indirect impact. At an event tonight, Gordon Moore is expected to highlight that without increasing funding for basic research and focus on STEM education advancements such as Moore’s Law may not happen in the future, potentially hobbling economic growth and increases in living standards.

ML50_Gordon-Moore_BK_2.jpg

When Intel CEO Brian Krzanich showed 86-year-old Intel co-founder Dr. Gordon Moore the Intel® Edison-powered Spiderbot, Moore promptly pointed out that the robot does not have the correct number of legs -- spiders have eight.

ml50.jpg

On the evening of May 11 in a rare opportunity, former and current Intel chairmen and CEOs gather at an event in San Francisco to celebrate the 50th anniversary of Moore's Law: Intel Co-Founder Dr. Gordon Moore, Intel Chairman Andy Bryant, retired Intel Chairman Arthur Rock and Intel CEO Brian Krzanich (left to right).  Credit: Intel, Walden Kirsch.

 

Gordon Moore: Thoughts on the 50th Anniversary of Moore’s Law

 

Infographic: Moore's Law Celebrating Five Decades of Innovation

infographic-moores-law-five-decades.jpg

Filter News Archive

By author:
By date:
By tag: