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Intel Newsroom

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Intel® Cloud SSO Delivered on Force.com Platform and Aligned with McAfee Helps Enables Secure, Convenient Access to Popular Online Apps

 

NEWS HIGHLIGHTS

  • Identity and Access Management-as-a-Service offering delivered by leading security and cloud platform vendors Intel, McAfee*and salesforce.com*.
  • Salesforce credentials deliver single sign-on to all Force.com applications and thousands of cloud apps.
  • Protect users and ensure compliance with context-aware strong authentication based on network, mobile, or time based parameters.
  • Multi-tenant offering deployed on Force.com; available immediately via salesforce.com’s AppExchange and Intel.

 

 

SANTA CLARA, Calif., May 23, 2012 – Intel® Cloud SSO, a cloud-based Identity and Access Management-as-a-Service (IAMaaS) is now delivered on Force.com*, salesforce.com’s social enterprise platform, Intel Corporation announced today.

 

The solution will help enterprise users utilize their Salesforce credentials to access popular cloud applications. Single sign-on (SSO) from Force.com provides seamless access to applications, such as Box.com Cisco* WebEx*, Google* Apps and Salesforce, improving end-user convenience and increasing security, while reducing the number of passwords required. Enterprises can rely on Intel Cloud SSO to deliver identity and access management functions in the cloud; provision, synchronize and de-provision access to thousands of cloud applications; address security concerns with 2-factor mobile-based strong authentication; and deliver comprehensive reporting and auditing features to comply with regulatory requirements.

 

“Today, outsourcing identity and security as a service is a viable, fully functional and economical option for companies of all sizes,” said Girish Juneja, director, Intel Application Security and Identity Products. “The prospect of removing security complexity and relieving the burden of providing connectivity to an ever-increasing list of SaaS apps just makes business sense. Small companies will be able to dramatically increase security over custom in-house solutions and larger enterprises can quickly supplement on-premise identity infrastructure to secure remote, mobile or M&A-acquired user populations With Intel Cloud SSO’s support for federated SSO standards, a company can maintain full control and gain confidence that the solution is delivered via a proven cloud platform with Force.com.”

 

Intel and saleforce.com are joining forces to deliver this multi-tenant service offering on Force.com. Initial capabilities include cloud SSO, convenient strong 2-factor authentication using one-time password (OTP) delivered via mobile devices (including Apple* iPhone/iPad, Android* devices or RIM* Blackberry), user account provisioning/de-provisioning, as well as an application portal providing secure access to a catalog of authorized cloud applications. Administrators can manage and monitor user’s cloud access, and collect activity data for auditing and regulatory compliance from a centrally hosted management console. The application supports user authentication and account synchronization with on-premise enterprise identity repositories, such as Active Directory* or any LDAP-enabled directory, via a lightweight Identity Bridge that is available for download by an administrator. Support for industry standards, such as Security Assertion Markup Language (SAML), OpenID, Simple Cloud Identity Management (SCIM), offer assurance that the application will keep pace as the market matures.

 

“Social enterprises are changing the way they collaborate, communicate and share information in the cloud,” said Ron Huddleston, senior vice president, ISV and Channel at salesforce.com. “Intel Cloud SSO provides customers strong authentication from mobile devices and other platforms to help customers achieve heightened security while taking advantage of the social, mobile and trusted capabilities expected from the salesforce.com ecosystem.”

 

In addition, Box, a leading cloud-based collaboration and file-sharing company, has joined with Intel to offer a free Enterprise trial account to users who sign up for Intel Cloud SSO.

 

Intel Cloud SSO is part of a broader cloud security play from Intel and McAfee to provide an intervening, policy-driven layer among users, application services, and device endpoints – all centered around a model of identity-aware security. The McAfee Cloud Security Platform launched last year provides on-premise, or “as-a-service,” technology enablement solutions to simplify or broker consumption of cloud services for the enterprise or cloud service providers. Intel Cloud SSO will be the first identity as a service offering to be certified as having enterprise-class security controls by the Cloud Security Alliance’s STAR (Security Trust and Assurance Registry) initiative.

 

The trial version of Intel Cloud SSO is available immediately at www.intelcloudsso.com, or on salesforce.com’s AppExchange, the app marketplace for the social enterprise, at appexchange.salesforce.com. For more information, visit www.intel.com/go/identity. For more on the McAfee Cloud Security Platform, visit www.mcafee.com/cloud.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Bryan Sawyer of Karigon Elementary School in Clifton, NY was named the winner of LIVE! With Kelly’s third annual “Top Teacher” award yesterday which honors school teachers across the country. Last week, as part of show’s “Top Teacher Week” program, Intel provided Bryan with 40 student-friendly Intel classmate PCs for his classroom. Part of the Intel Learning Series, Intel classmate PCs are shock-absorbent and water-resistant with rugged features making it a perfect tool for students. Intel also awarded Monica Dunn of Northeast High School in Pride, Louisiana – one of the “Top Teacher” finalists – with 35 Intel Core processor-powered ASUS 24” All-in-One PCs for her classroom, plus a 27” version for herself. The All-in-One PCs combine a high-definition, multi-touch display and full PC into a single, sleek device that offers a new, interactive way for learning and sharing.

Working closely with Intel, Wind River has developed comprehensive support, training and services for the development of applications based on the Intel® Data Plane Development Kit to help companies achieve new levels of packet processing performance. Available now, these offerings help customers create cost-effective, high-performance networking solutions based on the latest Intel® processors, on any Linux distribution of their choice. For more information, view the news release and offerings.

Today Intel was recognized for its supply chain operations, ranking #7 on “The Gartner Supply Chain Top 25 for 2012” List, up nine places from the list last year. This list identifies companies that meet the current supply chain demand while documenting best practices. Intel’s focus on performance, future innovation, agility in meeting volatile demand, and supply resiliency, contributed to this rank. Learn more.

While we all love notes by hand, how about keeping a visual record of your notes with the following photo-themed apps? Snap! lets you easily take pictures and share them using your webcam, and 100 Cameras in 1 allows you to adjust the effects and make your photo memos more memorable. In a traditional route, Evernote helps you stay organized by capturing notes, to-do lists and more, and makes them accessible across your devices. Similarly, Cozi Express offers a shared online calendar and centralized lists in order to make work and play time more effective.

Intel is previewing a 1 gigabit per second DOCSIS 3.0 capability in its latest gateway solution, the Intel® Puma™ 6, at The Cable Show in Boston starting today. This new technology solution lets service providers offer new services to their customers by simply extending their current network investments. As a benefit of this technology, their customers will have faster access to bandwidth-intensive experiences like streaming video or online gaming. For more information about the Intel Puma 6, check out the press release.

NEWS HIGHLIGHTS

  • Intel previews 1 gigabit per second DOCSIS 3.0 capability in its latest gateway solution, the Intel® Puma™ 6.
  • Next-generation Intel® Puma™ gateway allows service providers to extend their investments in current network infrastructure.
  • South Korea’s SKbroadband targeting deployment of 1Gbps network in 2013.

 

 

THE CABLE SHOW, Boston, May 21, 2012 – Intel Corporation today previewed its first DOCSIS* 3.0 cable gateway solution that is capable of 1 gigabit per second (Gbps). The Intel® Puma™ 6 technology solution will help enable service providers to meet consumer demand and offer new services while extending their extensive network investments. A test program by South Korea’s SKbroadband is targeting production deployment of 1Gbps in 2013.

 

As the number of Internet-connected devices in the home grows, service providers are challenged to provide higher broadband speeds to more customers utilizing an existing cable network. A service provider’s ability to scale up to this high level of bandwidth will help enable new high-bandwidth experiences for what the industry calls “TV Everywhere,” an immersive blend of Internet, television, gaming and applications across multiple screens throughout the home.

 

With the advanced technology of the DOCSIS 3.0 specification, multiple system operators (MSOs) can offer more users faster access to bandwidth-intensive experiences such as streaming video or online gaming using their existing network infrastructure and DOCSIS 3.0 equipment. Due to the flexibility of this technology, the Intel Puma 6 achieves the 1Gbps downstream speeds by bonding up to 24 DOCSIS channels (up from eight bonded channels in a typical deployment today). Intel Puma 6 has an upload speed that is double current-generation DOCSIS modems. With up to 240Mps upstream (eight bonded channels), more consumers will benefit from new services that include video conferencing, cloud storage and easy sharing.

 

“We continue to lead in DOCSIS technology, and are now providing cable gateway solutions with 1Gbps capability,” said Alan Crouch, general manager of Intel’s Service Provider Division. “Service providers can now deliver on consumer demands for higher broadband speeds, supporting a proliferation of new devices, services and experiences.”

 

The Intel Puma family system architecture provides OEMs with flexibility to easily customize their products to fit a wide range of MSO-required and optional features such as high data rates, wireless communications, power down modes and telephone support. Intel was the first to deploy DOCSIS 3.0 technology with Intel® Puma™ 5, and over 20 million DOCSIS 3.0 systems have shipped.

 

“SKbroadband is proud to lead the world in piloting a 1 gigabit Internet experience,” said Dae Chul Noh, team leader of SKbroadband’s Network Division. “Our customers use these lightning-fast Internet speeds for high-definition TV, multi-player gaming, video conferencing and more.”

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Puma and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Today, Intel released its 2011 Corporate Responsibility Report, which includes highlights from 2011 and new 2020 environmental goals. The 2011 highlights include Intel’s achievements in supply chain, renewable power, employee engagement, green building design and education. The 2020 goals include items such as 25x increases in notebook and data center product energy efficiency and 10 percent reduction in direct greenhouse gas emissions on a per chip basis. View the press release and the full report.

Jack Andraka of Crownsville, Md. Wins Top Prize at Intel International Science and Engineering Fair

 

NEWS HIGHLIGHTS

  • The world's largest high school science research competition, the Intel International Science and Engineering Fair, a program of Society for Science & the Public, announced its top winners in  Pittsburgh, Pa.
  • Jack Andraka of Crownsville, Md. received the Gordon E. Moore Award, a $75,000 prize named in honor of the Intel co-founder, retired chairman and CEO.
  • Two Intel Foundation Young Scientist Awards winners - Nicholas Schiefer of Pickering, Ontario, Canada and Ari Dyckovsky of Leesburg, Va. - each received prizes of $50,000 from the Intel Foundation.

 

 

PITTSBURGH, Pa., May 18, 2012 – Jack Andraka, 15, of Crownsville, Md. was awarded first place for his new method to detect pancreatic cancer at this year's Intel International Science and Engineering Fair, a program of Society for Science & the Public. Based on diabetic test paper, Jack created a simple dip-stick sensor to test blood or urine to determine whether or not a patient has early-stage pancreatic cancer. His study resulted in over 90 percent accuracy and showed his patent-pending sensor to be 28 times faster, 28 times less expensive and over 100 times more sensitive than current tests. Jack received the Gordon E. Moore Award, named in honor of Intel co-founder and retired chairman and CEO of $75,000.

 

Two students, Nicholas Schiefer, 17, of Pickering, Ontario, Canada and Ari Dyckovsky, 18, of Leesburg, Va., each received the Intel Foundation Young Scientist Award of $50,000.

 

Nicholas studied what he calls "microsearch," or the ability to search the fastest-growing information medium: small amounts of content, such as tweets and Facebook status updates.Through his research, Nicholas hopes to improve search engines' capabilities, which will in turn improve access to information.

 

Ari investigated the science of quantum teleportation. He found that once atoms are linked through a process called "entanglement," information from one atom will just appear in another atom when the quantum state of the first atom is destroyed. Using this method, organizations requiring high levels of data security, such as the National Security Administration, could send an encrypted message without running the risk of interception because the information would not travel to its new location; it would simply appear there.

 

"We support the Intel International Science and Engineering Fair because we know that math and science are imperative to future global growth," said Wendy Hawkins, executive director of the Intel Foundation. "This competition encourages millions of students to engage their skills for innovation and develop promising solutions for global challenges."

 

This year, more than 1,500 young scientists were chosen to compete in the Intel International Science and Engineering Fair. They were selected from 446 affiliate fairs in approximately 70 countries, regions and territories. In addition to the winners mentioned above, more than 400 finalists received awards and prizes for their groundbreaking work. Awards included 17 "Best of Category" winners who each received a $5,000 prize. The Intel Foundation also awarded a $1,000 grant to each winner's school and to the affiliated fair they represent.

 

The following lists the 17 Best of Category winners, from which the top three were chosen:

CategoryFirstLastCityState/Country
Animal SciencesLucyHritzoHollandPa.
Behavioral and Social SciencesBenjaminKornickRoslyn HeightsN.Y.
BiochemistryRebeccaAlfordCommackN.Y.
Cellular and Molecular BiologyRaghavTripathiPortlandOre.
ChemistryRaghavendraRamachanderanBengaluruIndia
Computer ScienceNicholasSchieferPickering, OntarioCanada
Earth and Planetary SciencesMofeedSawanLondon, OntarioCanada
Engineering: Electrical and MechanicalAssiyaKussainovaKaraganda, KaragandyKazakhstan
Engineering: Materials and BioengineeringRyotaIshizukaCos CobConn.
Energy and TransportationShyamalBuchFolsomCalif.
Environmental ManagementAdamNobleLakefield, OntarioCanada
Environmental SciencesNaomiShahPortlandOre.
Mathematical SciencesAishwaryaVardhanaBeavertonOre.
Medicine and HealthJackAndrakaCrownsvilleMd.
MicrobiologyFelixAngelovSkokieIll.
Physics and AstronomyAriDyckovskyLeesburgVa.
Plant SciencesHuihuiFanStaten IslandN.Y.

 

Society for Science & the Public, a nonprofit membership organization dedicated to public engagement in scientific research and education, owns and has administered the International Science and Engineering Fair since its inception in 1950, as the National Science Fair.

 

"We congratulate Jack, Nicholas, and Ari on their success here at the Intel International Science and Engineering Fair," said Elizabeth Marincola, president of Society for Science & the Public. "They and all the other finalists here this week further demonstrate how a background of STEM [science, technology, engineering, and math] education creates the breeding ground for creativity and ingenuity that will help solve the pressing issues of the future."

 

The Intel International Science and Engineering Fair includes some of the most promising rising student entrepreneurs, innovators and scientists from around the world. Finalists are selected annually from hundreds of affiliated fairs. Their projects are then evaluated onsite by more than 1,200 judges from nearly every scientific discipline, each with a Ph.D. or the equivalent of 6 years of related professional experience in one of the scientific disciplines.

 

A full listing of finalists is available in the event program (beginning on page 57). The Intel International Science and Engineering Fair 2012 is funded jointly by Intel and the Intel Foundation with additional awards and support from dozens of other corporate, academic, governmental and science-focused organizations.

 

To learn more about SSP, and its programs and publications, visit www.societyforscience.org, follow on Twitter, or visit the Facebook page.

To get the latest Intel education news, visit www.intel.com/newsroom/education, and join the conversation on Facebook and Twitter.

 

ISEF2012-Top-Three-Winners.jpg

PITTSBURGH, Pa., May 18, 2012 - Intel Corporation and Society for Science & the Public today announced the winners of the world's largest high school science research competition, the Intel International Science and Engineering Fair. Jack Andraka, center, of Crownsville, Md. received the top award, named for Intel founder Gordon Moore, of $75,000. Ari Dyckovsky of Leesburg, Va. (left) and Nicholas Schiefer of Pickering, Ontario, Canada (right) each took home an Intel Foundation Young Scientist Award of $50,000.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Dr. Jane Shaw Retires from Board of Directors

 

SANTA CLARA, Calif., May 17, 2012 – Intel Corporation today announced the results from votes at the company’s annual stockholders meeting.

 

Stockholders approved the following proposals:

  • The re-election of Charlene Barshefsky, Andy D. Bryant, Susan L. Decker, John J. Donahoe, Reed E. Hundt, Paul S. Otellini, James D. Plummer, David S. Pottruck, Frank D. Yeary and David B. Yoffie to the board of directors.
  • Ratification of Ernst & Young LLP as independent registered public accounting firm for 2012.
  • The advisory vote to approve executive compensation.

 

Stockholders rejected a stockholder proposal that asked for an annual advisory vote on political contributions.

 

The meeting also marked the retirement of Jane Shaw as chairman of the board of directors. Shaw had served as chairman since 2009.

 

“Jane has made tremendous contributions to Intel as a member of the board for the past 19 years, as chair of the audit and compensations committees, and most recently as chairman,” said Otellini, Intel’s president and chief executive officer. “Throughout her tenure Jane has provided Intel with the benefit of her extensive leadership experience as she has helped guide the company through significant challenges and growth. We are grateful for her service.”

 

As previously announced, Bryant will now serve as chairman. Susan Decker has been appointed as lead director.

 

Complete voting results with respect to the annual meeting is available at http://www.intc.com/.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Intel, Computing Industry Shape Future of Computing Experiences Across Devices and the Cloud

 

WHAT:

Intel Corporation will host a keynote and series of events at Computex Taipei 2012 to highlight its ongoing innovation and collaboration with the computing industry to deliver engaging, consistent and secure user experiences across devices to the cloud. These devices include Ultrabook systems, PCs, smartphones and tablets.

 

Intel’s presence at Computex 2012 will kick off with the opening keynote address by Tom Kilroy, senior vice president and general manager of Intel’s Sales and Marketing Group. His address will be June 5 at the Taipei International Convention Center (TICC), 3F Plenary Hall.

 

Intel will also organize satellite events on personal computing and the cloud in addition to exhibiting a wide range of devices and the latest technologies at the Nangang Exhibition Hall of the Taipei World Trade Center on June 5-9.

DATES:

June 5-8 (9:30 a.m.-6 p.m.)

June 9 (9:30 a.m.-4 p.m.)

WHERE:

Intel Exhibition Showcase at Computex

Booth M410

Taipei World Trade Center, Nangang Exhibition Hall

(No. 1, Jing Mao 2nd Road, Nangang District, Taipei)

MEDIA ACTIVITIES:

Intel Thunderbolt Technology Briefing

Event Time: June 4, 12-1 p.m. (Reception: 11:30 a.m.-noon)

Event Venue: B1 Gallery Room, Bellavita (28 Songren Road, Taipei)

Speakers:

Thomas Swinford, vice president, Intel Architecture Group, general manager, Communications and Networking Group

Jason Ziller, director of Thunderbolt marketing and planning, Intel Architecture Group

 

Intel Booth Guided Tour for Media

Event Time: June 5, 11 a.m.-noon

Event Venue: Booth M410, Taipei World Trade Center, Nangang Exhibition Hall, 4F (3/F, No.1, Jingmao 2nd Road, Taipei)

 

Please register at http://220.135.105.245/press2012/en.html or on site at the 1F reception counter of the Nangkang Exhibition Hall to get the media badge.

 

Computex Opening Keynote

Event Time: June 5, 2-3 p.m. (Reception: 1:20- p.m.)

Event Venue: Taipei International Convention Center, 3F Plenary Hall (No. 1, Xin-yi Road, Sec. 5, Hsin-yi District, Taipei)

Speaker:

Tom Kilroy, senior vice president and general manager, Sales and Marketing Group

 

Please register at http://www.e21forum.com.tw/Register.aspx?nav=9&lang=1 or on site at the 1F reception counter of the Taipei International Convention Center to get the media badge.

 

Post-Keynote Media Q&A Session with Kilroy

Event Time: June 5, 3:15-3:40 p.m.

Event Venue: Grand Hyatt Hotel, 2F, Drawing Room (No. 2, Song Shou Road, Hsin-yi District, Taipei)

Intel Speaker:

Tom Kilroy, senior vice president and general manager, Sales and Marketing Group

 

Personal Computing Satellite Event and Media Q&A

Event Time: June 5, 3:45-4:35 p.m. (Reception: 3:15-3:45 p.m.)

Event Venue: Grand Hyatt Hotel, 3F, Ballroom (No. 2, Song Shou Road, Hsin-yi District, Taipei). A media Q&A session with the speakers will immediately follow from 4:35-5 p.m.

Intel Speakers:

Kirk Skaugen, vice president and general manager, PC Client Group
Gregory Bryant, vice president, Sales and Marketing Group, and general manager, Asia-Pacific Region

 

Cloud Computing Satellite Event and Media Q&A

Event Time: June 6, 12:50-1:40 p.m. (Reception: 12:30-12:50 p.m.)

Event Venue: Grand Hyatt Hotel, 3F, Ballroom (No. 2, Song Shou Road, Hsin-yi District, Taipei). A media Q&A session with the speakers will immediately follow from 1:40-2 p.m.

Intel Speakers:

Boyd Davis, vice president, Intel Architecture Group, and general manager, Datacenter Infrastructure Group
Gregory Bryant, vice president, Sales and Marketing Group, and general manager, Asia-Pacific Region

INTEL MEDIA SUPPORT AT COMPUTEX:

Please visit the reception counter of the Intel Exhibition Showcase at 4/F, TWTC Nangang Exhibition Hall, to access the latest Intel news releases, fact sheets and other media materials.

MEDIA CONTACTS:

Intel Corporation:

Kari Aakre, Intel PR manager, +1-503-696-5068, kari.e.aakre@intel.com

Shardae Chiu, Intel PR manager, +8862-2544-7752, shardae.chiu@intel.com

 

Pallas PR Agency:

Jennifer Chen, Pallas PR, +8862-2719-5077 Ext. 223, jennifer@pallaspr.com.tw

Elsa Chang, Pallas PR, +8862-2719-5077 Ext. 220, elsa.chang@pallasrp.com.tw

MAPS:

Bellavita & Taipei International Convention Center & Grand Hyatt Hotel

map1.jpg

 

B1, Gallery Room, Bellavita

map2.jpg

 

3F, Plenary Hall, Taipei International Convention Center (TICC)

map3.jpg

 

2F, Drawing Room, Grand Hyatt Hotel

map4.jpg

 

3F, Ballroom, Grand Hyatt Hotel

map5.jpg

Today, Intel released its 2011 Corporate Responsibility Report, which includes highlights from 2011 and new 2020 environmental goals. The 2011 highlights include Intel’s achievements in supply chain, renewable power, employee engagement, green building design and education. The 2020 goals include items such as 25x increases in notebook and data center product energy efficiency and 10 percent reduction in direct greenhouse gas emissions on a per chip basis. View the press release and the full report.

On this prestigious and sugary occasion, we give you the top apps to commemorate National Chocolate Chip Day! Before tackling teaspoons of this and tablespoons of that, make sure you have your culinary questions answered with Wolfram Alpha. Then use cupNoz to quickly convert measurements for and while cooking. In between kneading dough and sprinkling chips, listen to mySongBook Player, an app that gives you access to full scores and songbooks. Once the baking is complete, share pictures of your chocolate chip success with the Snap! app.

Publishes 2011 Corporate Responsibility Report

 

NEWS HIGHLIGHTS

  • In its 2011 Corporate Responsibility Report, Intel sets new 2020 environmental goals to extend its path of innovation and environmental responsibility.
  • Intel incorporated an integrated approach into this report, providing information on the connection between corporate responsibility performance and the creation of business value.
  • Intel also reports on increased supplier assessments, renewable power and energy efficiency successes, employee engagement and green building design, among other topics.

 

 

SANTA CLARA, Calif., May 17, 2012 – Building on nearly 2 decades of reporting on its environmental commitments and performance, Intel Corporation today released its 2011 Corporate Responsibility Report, which includes new 2020 environmental goals to drive continuous improvement in the company's manufacturing operations and the energy efficiency of its products. Intel's new 2020 environmental goals include:

 

  • Reduce direct greenhouse gas emissions by 10 percent on a per chip basis by 2020 from 2010 levels1.
  • Design all new buildings to a minimum Leadership in Energy and Environmental Design (LEED) Silver Certification between 2010 and 2020.
  • Increase the energy efficiency of notebook computers and data center products 25 times by 2020 from 2010 levels2.
  • Achieve additional energy savings of 1.4 billion kWh from 2012 to 2015, and publish additional energy conservation targets for 2016–2020 in its 2012 report.
  • Reduce water use on a per chip basis below 2010 levels by 2020.
  • Achieve zero chemical waste to landfill by 2020.

 

"At Intel, corporate responsibility is a crucial component to the overall growth of our business," said Michael Jacobson, Intel's director of corporate responsibility. "From product to customer to employee to environment, corporate responsibility allows Intel to have a greater and more influential impact on industries, communities and the global economy."

 

Other highlights from the 2011 report include:

 

Supply Chain Responsibility

  • Intel was again recognized in the Gartner Supply Chain Top 25 list for excellence in supply chain management, ranking 16th in 2011, up from 18th in 2010 and 25th in 2009.
  • To address the issue of conflict minerals, through the end of 2011, Intel had identified 98 smelter sites and visited 48 of them in 16 countries to lay the groundwork for third-party audits. Intel's goal is to demonstrate that its microprocessors are validated as conflict-free for tantalum by the end of 2012, and to manufacture the world's first microprocessor fully validated as conflict-free across all four minerals (gold, tantalum, tin and tungsten) by the end of 2013.

 

Renewable Power

  • For the past 4 years, Intel has been recognized as the largest voluntary purchaser of green power in the United States, under the U.S. Environmental Protection Agency's Green Power Partnership program.
  • Since 2009, Intel has collaborated with third parties to complete 15 solar electric installations across nine Intel campuses in Arizona, California, New Mexico, Oregon, Israel and Vietnam — collectively generating more than 5 million kWh per year of clean energy.
  • Since 2001, Intel has invested more than $58 million and completed over 1,563 energy conservation and energy efficiency projects, saving more than 825 million kWh of energy, or the approximate CO2 emissions from the electricity use of more than 70,933 average U.S. homes for 1 year. These investments also enabled Intel to reduce energy costs in 2011 by $10.9 million.

 

Employee Engagement

  • Since 2008, Intel has linked a portion of its employees' variable compensation to environmental sustainability metrics.
  • In 2011, as part of Intel's Environmental Excellence Awards, 62 employee teams from around the world were nominated for their work that helped Intel reduce its environmental impact. In fact, the estimated annual cost savings from the 2011 winning projects exceeded $70 million.
  • In 2011, Intel provided $125,000 in funding for nine employee projects via its Sustainability in Action grant program — including the installation of a rainwater harvesting project at a school in Israel and the design of a zero-emissions heating and cooling control and supply system for a local community building in China.
  • In 2011, 50 percent of Intel employees donated over 1.1million hours of service through the Intel Involved volunteer program — an average of 13 hours per employee — at 5,100 schools and nonprofit organizations in 45 countries.

 

Green Building Design and LEED Certification

  • By the end of 2011, Intel had achieved LEED Silver Certification for a total of 18 buildings across five sites in Arizona, Costa Rica, China, Israel and Malaysia.

 

Education

  • In 2011, Intel reached its goal of providing professional development through the Intel Teach® program to over 10 million teachers in more than 70 countries, reaching over 300 million students. In addition, the program was introduced in Uganda, Zimbabwe, Gabon and Tanzania.
  • In 2011, Intel launched She Will, a campaign to educate and empower girls and women around the world by fostering equal economic and educational opportunities.

 

Intel has provided public reports on its environmental, health and safety performance since 1994 and produced an annual Corporate Responsibility Report since 2001. To read the new report, visit www.intel.com/go/responsibility. More information on Intel's corporate responsibility programs can be found at the CSR@Intel blog and on Twitter.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 Assuming a typical chip size of approximately 1 cm2 (chips vary in size depending on the specific product).

 

2 Data center energy efficiency is determined by server energy efficiency (as measured by SPECPower_ssj2008 or equivalent publications and using a 2010 baseline of an E56xx series processor-based server platform) as well as technology adoption that raises overall data center work output (such as virtualization technology). Notebook computer energy efficiency is determined by average battery life, battery capacity and number of recharge cycles of volume notebook computers in that model year.

As more personal information is shared online and more business transactions are made using technology, companies and consumers alike need to take security of their information and data into consideration.  Leaders from McAfee, HP, MasterCard, and Ubiquisys discuss the technology behind protecting personal data and maintaining consumer privacy in a world where social sharing, and commonly oversharing, has become the norm.  Visit Intel's 60 Second Insights for the latest executive perspectives.  

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