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Nithin Tumma of Fort Gratiot, Mich. Wins $100,000 Award from the Intel Foundation

 

NEWS HIGHLIGHTS

  • Nithin Tumma, whose research could lead to less toxic and more effective breast cancer treatments, received the top award of $100,000 at the Intel Science Talent Search 2012, a program of Society for Science & the Public.
  • Other finalists from across the U.S. took home additional awards totaling $530,000.
  • The Intel Science Talent Search, the nation's oldest and most prestigious pre-college science and math competition, recognizes 40 high school seniors who are poised to be the next leaders in innovation and help solve some of the world's greatest challenges.

 

 

WASHINGTON, D.C., March 13, 2012 – From medical treatments to alternative energy solutions, innovation has been top of mind in our nation's capital this week. Honoring high school seniors with exceptional promise in math and science, Intel Corporation and Society for Science & the Public (SSP) recognized the winners of the nation's most elite and demanding high school research competition, the Intel Science Talent Search.

 

Nithin Tumma, 17, of Fort Gratiot, Mich., won the top award of $100,000 from the Intel Foundation for his research, which could lead to more direct, targeted, effective and less toxic breast cancer treatments. He analyzed the molecular mechanisms in cancer cells and found that by inhibiting certain proteins, we may be able to slow the growth of cancer cells and decrease their malignancy. Nithin is first in his class of 332, a varsity tennis player and a volunteer for the Port Huron Museum, where he started a restoration effort for historical and cultural landmarks.

 

Second place honors and $75,000 went to Andrey Sushko, 17, of Richland, Wash., for his development of a tiny motor, only 7 mm (almost 1/4 inch) in diameter, which uses the surface tension of water to turn its shaft. Born in Russia, Andrey worked from home to create his miniature motor, which could pave the way for other micro-robotic devices. Andrey, a long-time builder of small boats, recently filed for a Guinness World Record for the smallest radio-controlled sailing yacht.

 

Third place honors and $50,000 went to Mimi Yen, 17, of Brooklyn, N.Y., for her study of evolution and genetics, which focuses on microscopic worms, specifically looking at their sex habits and hermaphrodite tendencies. Mimi believes that through research such as hers, we may better understand the genes that contribute to behavioral variations in humans. Mimi was born in Honduras and is fluent in Cantonese. She plays French horn and volunteers to prepare and deliver meals to people with serious illnesses.

 

These finalists join the ranks of other notable Science Talent Search alumni who over the past 70 years have gone on to win seven Nobel Prizes, two Fields Medals, four National Medals of Science, 11 MacArthur Foundation Fellowships and even an Academy Award for Best Actress.

 

"We invest in America's future when we recognize the innovative achievements of our nation's brightest young minds," said Intel President and CEO Paul Otellini. "Hands-on experience with math and science, such as that required of Intel Science Talent Search finalists, encourages young people to think critically, solve problems and understand the world around them. Rather than simply memorizing facts and formulas, or repeating experiments with known outcomes, this competition engages students in an exciting way and provides a deeper level of understanding in such important but challenging subjects."

 

Other top honors from the competition include:

 

  • Fourth Place: Fengning (David) Ding of Albany, Calif. received a $40,000 award for his work on representation theory of Cherednik algebras, a topic in theoretical mathematics that sheds light on deformations of important symmetries, which are related to conservation laws.
  • Fifth Place: Benjamin van Doren of White Plains, N.Y. received a $30,000 award for investigating a poorly understood behavior of nocturnal migratory birds, called morning flight, which has potential implications for the growing wind power industry.
  • Sixth Place: Neel Patel of Geneva, Fla. received a $25,000 award for studying how non-speech patterns of sounds – called sonifications – can convey information, which could lead to a computer-user interface as revolutionary as the graphical interface was 30 years ago.
  • Seventh Place: Anirudh Prabhu of West Lafayette, Ind. received a $25,000 award for his investigation of the odd perfect number problem, and his suggestion that odd perfect numbers do not exist.
  • Eighth Place: Clara Fannjiang of Davis, Calif. received a $20,000 award for developing enhanced radio telescope data collection methods, which may help astronomers see farther into the universe, and generate clearer images and save processing time.
  • Ninth Place: Alissa Zhang of Saratoga, Calif. received a $20,000 award for her approaches to monitoring glucose levels in diabetic patients, which may allow for measuring glucose levels in bodily fluids, such as tears, as opposed to blood.
  • Tenth Place: Jordan Cotler of Northbrook, Ill. received a $20,000 award for inventing a cryptography protocol that permits the detection of eavesdroppers.

 

In total, the Intel Foundation awarded $1.25 million for the Intel Science Talent Search 2012. When Intel assumed the title sponsorship 14 years ago, it increased the annual awards by more than $1 million to bring greater attention to math and science achievement, encourage more youth to embrace these fields, and further show the impact these subjects have on the country's future success.

 

This year's finalists hail from 16 states and represent 39 schools. Of the 1,839 high school seniors who entered the Intel Science Talent Search 2012, 300 were announced as semifinalists in January. Of those, 40 were chosen as finalists and invited to Washington, D.C., to compete for the top 10 awards.

 

Society for Science & the Public, a nonprofit membership organization dedicated to public engagement in scientific research and education, has owned and administered the Science Talent Search since its inception in 1942.

 

"The Intel Science Talent Search celebrates the accomplishments of our future top researchers and innovators," said Society President Elizabeth Marincola. "Society for Science & the Public is proud to join Intel in congratulating Nithin Tumma and all of the Intel Science Talent Search 2012 finalists. Their dedication to science is inspiring, and the quality and depth of their work bodes well for our nation's continued innovation and economic prosperity."

 

To learn more about SSP, and its programs and publications, visit www.societyforscience.org, follow SSP on Twitter at www.twitter.com/society4science, or visit SSP's Facebook page at www.facebook.com/societyforscience.

 

Intel is committed to supporting math and science innovation across all levels of education. The Intel Science Talent Search is just one example of Intel's support of education at the high school level. Tomorrow, at the collegiate level, Otellini will announce STAY WITH IT, a community focused on connecting university engineering students with their peers, experienced engineers, role models and influencers, and motivate them to stay with their specific engineering field of study. The program will launch at Georgia Tech in conjunction with "Day of Engineering." The schedule for this day includes a Facebook Live event at 3 p.m. ET, available at www.facebook.com/engineering; click Tech Talk Live.

 

To get the latest Intel education news, visit www.intel.com/newsroom/education, and join the conversation on Facebook and Twitter.

 

 

STS2012_Top-Winner1.jpg

WASHINGTON, D.C., March 13, 2012 - Nithin Tumma, 17, of Fort Gratiot, Mich., accepts the Intel Science Talent Search top award of $100,0000 from Intel President and CEO Paul Otellini. The Intel Science Talent Search is a program of Society for Science & the Public. Nithin and the 39 other finalists now join the ranks of Nobel Laureates and Fields Medals recipients as alumnae of the nation's oldest and most prestigious high school science and math research competition.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Following the acquisition of Telmap navigation and location-based services, Intel has introduced a new developer services beta providing location-based APIs for enhanced app development capabilities on Ultrabooks and other mobile devices. Developers can use these APIs cross-platform, cross-device and cross-operating systems for functionalities such as geocoding, reverse geocoding, mapping, directions and point of interest to create location-aware games, social networking, lifestyle and other apps for use on any device. Enroll in the developer services beta by signing up today.

Kurtis Carsch, 17, of Plano, Tex. discusses with a curious young man his research, which could result in cleaner, lower-cost fuel.

Kurtis Carsch, 17, of Plano, Tex. discusses with a curious young man his research, which could result in cleaner, lower-cost fuel.

At the Intel Science Talent Search, a program of Society for Science & the Public, Kurtis Carsch, 17, of Plano, Tex. discussed with a curious young man his research which could result in cleaner, lower-cost fuel. Kurtis is one of 40 Intel Science Talent Search finalists competing this week in the nation’s oldest and most prestigious high school science research competition. The top winners in this year’s competition will be announced on Tuesday evening around 9 pm ET. Follow the news here.

Intel is heading to Austin, TX for SXSW 2012 which kicks off today and runs through Mar. 18. This past week, Intel sponsored a 3-day DJ battle on Turntable.fm, and the winning DJ earned an Ultrabook™ inspired by Intel and will now DJ live at the Turntable.fm event Mar. 10. And to close out SXSW, Intel will sponsor the third annual MOG at The Mohawk music event Mar. 17 which will be streamed live on MOG.com with headline act The Roots. For more information on Intel’s presence at SXSW this year, read “Your Guide to Intel at SXSW 2012.”

Today Intel announced its latest server technology aimed to power the data centers to meet the requirements of ever growing connected world. With more than 3 billion users and 15 billion devices forecasted to be online by 2015, the data centers have to scale to handle 3 times bigger data traffic than today, be more efficient and secure. New, introduced Intel Xeon processors E5-2600 product family are designed to address all key data center challenges with 80% more performance, 50% more performance per watt compared to previous generation. Read here to find all the details about the engine that will power the future of the connected world.

Today, Intel announced the Intel® Ethernet Controller X540, the industry’s first fully integrated 10GBASE-T controller. This space-saving single-chip solution delivers outstanding performance for low-cost, low-power LAN on motherboard (LOM) and Converged Network Adapter (CNA) designs. The Intel Ethernet Controller X540 will help drive broader 10 Gigabit Ethernet (10GbE) adoption by providing connections that are backward-compatible with existing Gigabit Ethernet networks. Like other Intel Ethernet 10 Gigabit products, the Intel Ethernet Controller X540 features advanced I/O virtualization, supports Internet Small Computer System Interface (iSCSI) and Fibre Channel over Ethernet (FCoE), and takes advantage of platform I/O enhancements in the Intel® Xeon® processor E5 family.

New Intel® Xeon® Processor E5-2600 Product Family at Heart of a Flexible, Efficient Data Center

 

NEWS HIGHLIGHTS

  • New Intel® Xeon® processor E5-2600 product family is built to scale to meet the demands of an increasingly connected world.
  • New server processors deliver up to 80 percent1,2 improved performance compared to the prior generation.
  • New Intel® Integrated I/O with PCI Express* 3.0 can up to triple3 the movement of data into and out of the processor so information can be made available faster than ever to support data-hungry applications.
  • Best data center performance per watt with over 50 percent1,4 gain on SPECpower_ssj*2008 plus extends platform power control with Intel® Node Manager and Intel® Data Center Manager.

 

 

SANTA CLARA, Calif., March 6, 2012 – Addressing the incredible growth of data  traffic in the cloud, Intel Corporation announced the record-breaking Intel Xeon processor E5-2600 product family. These new processors deliver leadership performance, best data center performance per watt1,4, breakthrough I/O innovation and trusted hardware security features to enable IT to scale. These processors are not only at the heart of servers and workstations, but will also power the next generation of storage and communication systems from leading vendors around the world.

 

Forecasts call for 15 billion connected devices5 and over 3 billion connected users6 by 2015. The amount of global data center IP traffic is forecasted to grow by 33 percent annually through 2015, surpassing 4.8 zetabytes per year, more than 3 times the amount in 20116. At these levels, each connected user will generate more than 4GB of data traffic every day – the equivalent of a 4-hour HD movie. This will increase the amount of data that needs to be stored by almost 50 percent per year7. In order to scale to meet this growth, the worldwide number of cloud servers is expected to more than triple by 20158.

 

"The growth in cloud computing and connected devices is transforming the way businesses benefit from IT products and services," said Diane Bryant, Intel vice president and general manager of the Datacenter and Connected Systems Group. "For businesses to capitalize on these innovations, the industry must address unprecedented demand for efficient, secure and high-performing datacenter infrastructure. The Intel Xeon processor E5-2600 product family is designed to address these challenges by offering unparalleled, balanced performance across compute, storage and network, while reducing operating costs."

 

The key requirements to enable IT to scale are performance, energy efficiency, I/O bandwidth and security. With the best combination of performance, built-in capabilities and cost-effectiveness, the new Intel Xeon processor E5-2600 product families are designed to address these requirements, and become the heart of the next-generation data center powering servers, storage and communication systems.

 

Leadership Performance with Best Data Center Performance per Watt

Supporting up to eight cores per processor and up to 768GB of system memory, the Intel Xeon processor E5-2600 product family increases performance by up to 80 percent1,2 compared to the previous-generation Intel® Xeon® processor 5600 series. The family also supports Intel® Advanced Vector Extension (Intel® AVX) that increases the performance on compute-intensive applications such as financial analysis, media content creation and high performance computing up to 2 times9.

 

Additional built-in technologies such as  Intel® Turbo Boost Technology 2.0, Intel Hyper-Threading Technology and Intel® Virtualization Technology  provide IT with flexible capabilities to increase the performance of their infrastructure dynamically. These performance advances have led the Intel Xeon processor E5-2600 product family to capture 1510 new dual socket x86 world records.

 

Modern data centers must improve the raw performance they deliver, but also do so efficiently by reducing power consumption and operating costs. The Intel Xeon processor E5-2600 product family continue Intel's focus on reducing total cost of ownership by improving energy efficient performance more than 50 percent1,4 as measured by SPECpower_ssj*2008 compared to the previous generation Intel Xeon processor 5600 series. These processors offer support for tools to monitor and control power usage such as Intel® Node Manager and Intel® Data Center Manager, which provide accurate, real-time power and thermal data to system management consoles. In addition, Intel's leadership performance allows IT managers to meet their growing demands while optimizing software license and capital costs.

 

I/O Innovation and Network Capabilities

With the unprecedented growth in data traffic it is essential that systems not only improve computational abilities, but also enable data to flow faster to support data-hungry applications and increase the bandwidth within the data center. The Intel Xeon processor E5-2600 product family meets these needs with Intel® Integrated I/O (Intel® IIO) and Intel® Data Direct I/O (Intel® DDIO). Intel® DDIO allows Intel Ethernet controllers and adapters to route I/O traffic directly to processor cache, reducing trips to system memory reducing power consumption and I/O latency. The Intel Xeon processor E5-2600 product family is also the first server processors to integrate the I/O controller supporting PCI Express* 3.0 directly into the microprocessor. This integration reduces latency up to 30 percent11 compared to prior generations and with PCI Express* 3.0 can up to triple3 the movement of data into and out of the processor.

 

The high-performance processing power along with Intel® Integrated I/O and advanced storage features such as PCIe* non-transparent bridging and asynchronous DRAM refresh, makes the Intel Xeon processor E5-2600 product family also an ideal choice for storage and communications solutions.

 

Increasing bandwidth demands driven by server virtualization and data and storage network consolidation have led to strong growth in 10 Gigabit Ethernet deployments, with adapter port shipments exceeding 1 million units in each quarter of 201113. Today's announcement of the Intel® Ethernet Controller X540 demonstrates Intel's commitment to driving 10 Gigabit Ethernet to the mainstream by reducing implementation costs. This industry-first single-chip 10GBASE-T solution is designed for low-cost, low-power LAN on motherboard (LOM) and includes flexible I/O Virtualization and Unified networking support at no additional cost.

 

Trusted Security

The Intel Xeon processor E5-2600 product family reaffirms Intel's commitment to providing a more secure hardware foundation for today's data centers. Intel® Advanced Encryption Standard New Instruction (Intel® AES-NI14) helps systems to quickly encrypt and decrypt data running over a range of applications and transactions. Intel® Trusted Execution Technology (Intel® TXT15) creates a trusted foundation to reduce the infrastructure exposure to malicious attacks. These features in partnership with leading software applications will help IT protect their data centers against attack and scale to meet the demands of their customers.

 

Extensive Industry Support

Starting today, system manufacturers from around the world are expected to announce hundreds of Intel® Xeon® processor E5 family-based platforms. These manufacturers include Acer*, Appro*, Asus*, Bull*, Cisco*, Dell*, Fujitsu*, HP*, Hitachi*, Huawei*, IBM*, Inspur*, Lenovo*, NEC*, Oracle*, Quanta*, SGI*, Sugon*, Supermicro* and Unisys*.

 

Product, Pricing Details

The Xeon processor E5-2600 product family will be offered with 17 different parts which range in price from $198 to $2,050 in quantities of 1,000. Additionally three single-socket Intel Xeon processor E5-1600 parts will be offered for workstations which range in price from $284 to $1,080. Complete pricing details can be found in the Intel Newsroom. For more details on these new Intel Xeon processors, visit www.intel.com/xeon. For more details on world records and other claims, visit www.intel.com/performance/server/.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to www.intel.com/performance

 

 

2 (Generational Performance) Source: Performance comparison using best submitted/published 2-socket server results on the SPECfp*_rate_base2006 benchmark as of 6 March 2012. Baseline score of 271 published by Itautec on the Servidor Itautec MX203* and Servidor Itautec MX223* platforms based on the prior generation Intel® Xeon® processor X5690. New score of 492 submitted for publication by Dell on the PowerEdge T620 platform and Fujitsu on the PRIMERGY RX300 S7* platform based on the Intel® Xeon® processor E5-2690. For additional details, please visit www.spec.org. 16.

 

3 (I/O Bandwidth) Source: Intel internal measurements of maximum achievable I/O R/W bandwidth (512B transactions, 50% reads, 50% writes) comparing Intel® Xeon® processor E5-2680 based platform with 64 lanes of PCIe* 3.0 (66 GB/s) vs. Intel® Xeon® processor X5670 based platform with 32 lanes of PCIe* 2.0 (18 GB/s). Baseline Configuration: Green City system with two Intel® Xeon® processor X5670 (2.93 GHz, 6C), 24GB memory @ 1333, 4 x8 Intel internal PCIe* 2.0 test cards. New Configuration: Rose City system with two Intel® Xeon processor E5-2680 (2.7GHz, 8C), 64GB memory @1600 MHz, 2 x16 Intel internal PCIe* 3.0 test cards on each node (all traffic sent to local nodes).

 

4 (Energy Efficient Performance) Source: Performance comparison using best submitted/published 2-socket single-node server results on the SPECpower_ssj*2008 benchmark as of 6 March 2012. Baseline score of 3,329 ssj*_ops/watt published by Hewlett-Packard on the ProLiant DL360 G7* platform based on the prior generation Intel® Xeon® processor X5675. Score of 5,093 ssj*_ops/watt submitted for publication by Fujitsu on the PRIMERGY RX300 S7* platform based on the Intel® Xeon® processor E5-2660. For additional details, please visit www.spec.org.1,16.

 

5 (Connect devices) Source: "Worldwide Device Estimates Year 2020 - Intel One Smart Network Work" forecast

 

6 (datacenter traffic forecast) Source: Cisco® Global Cloud Index: Forecast and Methodology 2010 – 2015. http://www.cisco.com/en/US/solutions/collateral/ns341/ns525/ns537/ns705/ns1175/Cloud_Index_White_Paper.html

 

7 (Data Storage) Source: "IDC Worldwide Enterprise Storage Systems 2010-2014 Forecast"

 

8 (Cloud system) Intel internal projections of cloud market growth between 2011 and 2015

 

9 (AVX) Source: Performance comparison using Linpack benchmark. Baseline score of 159.4 based on Intel internal measurements as of 5 December 2011 using a Supermicro* X8DTN+ system with two Intel® Xeon® processor X5690, Turbo Enabled, EIST Enabled, Hyper-Threading Enabled, 48 GB RAM, Red Hat* Enterprise Linux Server 6.1. New score of 347.7 based on Intel internal measurements as of 5 December 2011 using an Intel® Rose City platform with two Intel® Xeon® processor E5-2690, Turbo Enabled or Disabled, EIST Enabled, Hyper-Threading Enabled, 64 GB RAM, Red Hat* Enterprise Linux Server 6.1. 16.

 

10 (World Record Performance) Source: Best available submitted/published performance benchmark results on 2S x86 server platforms as of 6 March 2012. For a full summary of world record performance results, please visit www.intel.com/content/www/us/en/benchmarks/server/xeon-e5-2600-summary.html . For additional details, please visit www.spec.org, www.sap.com/solutions/benchmark, www.vmware.com/a/vmmark, and www.tpc.org.

 

11 (I/O Latency) Source: Intel internal measurements of average time for an I/O device read to local system memory under idle conditions comparing the Intel® Xeon® processor E5-2600 product family (230 ns) vs. the Intel® Xeon® processor 5500 series (340 ns). Baseline Configuration: Green City system with two Intel® Xeon® processor E5520 (2.26GHz, 4C), 12GB memory @ 1333, C-States Disabled, Turbo Disabled, SMT Disabled. New Configuration: Meridian system with two Intel® Xeon® processor E5-2665 (2.4GHz, 8C), 32GB memory @1600 MHz, C-States Enabled, Turbo Enabled. The measurements were taken with a LeCroy* PCIe* protocol analyzer using Intel internal Rubicon (PCIe* 2.0) and Florin (PCIe* 3.0) test cards running under Windows* 2008 R2 w/SP1.

 

12 (PCIe* 3.0) Source: 8 GT/s and 128b/130b encoding in PCIe* 3.0 specification enables double the interconnect bandwidth over the PCIe* 2.0 specification (www.pcisig.com/news_room/November_18_2010_Press_Release/ ). Intel internal measurements of maximum achievable I/O R/W bandwidth (512B transactions, 50% reads, 50% writes) using Xeon® processor E5-2680 based platform. Configuration: Rose City system with two Intel® Xeon processor E5-2680 (2.7GHz, 8C), 64GB memory @1600 MHz, 2 x16 Intel internal PCIe* 3.0 test cards on each node (all traffic sent to local nodes).

 

13 (10GBe) Crehan Research: Server-class Adapter and LOM Market 4Q10

 

14 (AES-NI) Intel® AES-NI requires a computer system with an AES-NI enabled processor, as well as non-Intel software to execute the instructions in the correct sequence. AES-NI is available on select Intel® processors. For availability, consult your reseller or system manufacturer. For more information, see software.intel.com/en-us/articles/intel-advanced-encryption-standard-instructions-aes-ni/

 

15 (TXT) No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visit www.intel.com/technology/security

 

16 Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.

Intel® Visual Computing Source launches today as a resource site for game and media application developers. The site provides free downloads of application developer tools and the latest information on Intel’s visual computing tools including Intel® Graphics Performance Analyzers, Intel® Media Software Development Kit (SDK) and Intel® OpenCL SDK. Intel Visual Computing Source also provides technical papers, case studies, videos, product briefs and sample code. Keep tabs on updates to Intel Visual Computing Source on Twitter @VC_Developer or Facebook.

Expands Support to Smartphones, Tablets and Ultrabook™ Devices

 

NEWS HIGHLIGHTS

  • Intel releases Intel® GPA 2012, the latest suite of tools for game and media app developers to optimize performance.
  • Intel® GPA 2012 now available for smartphone, tablet and Ultrabook™ app developers.
  • Support for Google Android*-based devices to be publically available this year.

 

 

GAME DEVELOPERS CONFERENCE, San Francisco, March 5, 2012 – Intel Corporation today introduced Intel® Graphics Performance Analyzers (Intel® GPA) 2012, the latest version of a powerful tool suite to optimize performance of gaming, media and entertainment applications. Expanding upon Intel's mobile momentum, Intel® GPA 2012 will support mobile applications for Ultrabook™ devices and Android*-based smartphones and tablets for the first time.

 

Previously available only on PC platforms, Intel GPA helps developers improve the experience of game and media applications by accessing powerful tools to analyze and optimize performance on Intel® Core™ and Intel® Atom™ processor-based platforms. The tool suite enables developers to enhance application performance on smartphones, tablets, Ultrabooks and PCs. Developers can also optimize Web content for browsers that support hardware-accelerated rich media, including Microsoft Internet Explorer* 9, Google Chrome* and Mozilla Firefox*.


"Gaming is one of the largest consumer segments for smartphones, but nobody wants a game that drains a smartphone battery," said Craig Hurst, Intel's director of Visual Computing Product Management. "There are few choices for developers who want to optimize apps for power, so Intel GPA 2012 introduces power metrics,  ensuring that a game not only has great performance, but also runs longer on Ultrabooks, Android tablets and smartphones."

 

The Intel GPA tool suite includes:

 

  • Intel®  GPA System Analyzer – Analyzes game performance and identifies potential bottlenecks that slow down performance or affect graphics. This tool allows developers to perform optimization experiments to fine-tune performance without changing application code. New in Intel GPA 2012, Intel GPA System Analyzer now supports a standalone mode that enables real-time analysis of application performance on smartphones, tablets and Ultrabooks, including Android devices. Intel GPA System Analyzer can be used to analyze an application's power usage and how it will affect battery life on mobile devices.
  •  


  • Intel®  GPA Frame Analyzer – Offers application developers deep frame analysis of individual application elements such as shaders, textures and pixel history. Intel GPA Frame Analyzer shows the visual and performance impact of each individual element in real time without affecting the application source code.
  •  


  • Intel®  GPA Platform Analyzer – Developers can visualize performance of application tasks and the effect on devices by viewing CPU metrics and graphics workloads. PC application developers can also see how their software would perform in a multi-core environment. Intel GPA Platform Analyzer has been rebuilt from the ground up for the release of Intel GPA 2012 to provide more system behavior information. Additionally, the tool is capable of handling large volumes of data to emulate application performance on an extended run.
  •  


  • Intel®  GPA Media Analyzer – When used in conjunction with Intel® Media SDK, Media Analyzer enables developers to see how effectively an application uses hardware-accelerated video encode and decode in real-time.

 

Intel GPA 2012 is available as a free download at www.intel.com/software/gpa. Support for Android devices is expected to be publically released this year.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3 and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality or effectiveness of any optimization on microprocessors not manufactured by Intel.

 

Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

Yesterday Intel received a Climate Leadership Award, recognizing the company as an industry leader in driving innovative solutions to reduce greenhouse gas emissions. The Climate Leadership Awards were given for the first time this year, through a partnership between the U.S. EPA, the Association of Climate Change Officers, the Center for Climate and Energy Solutions, and The Climate Registry. Learn more about the actions Intel has taken to reduce greenhouse gases and why it won this prestigious award.

Intel is collaborating with DENSO Corporation for joint research into next-generation in-vehicle information and communication systems. The goal of the collaboration is to develop a platform for in-vehicle information and communications systems that can seamlessly connect and share information with mobile devices and to safely provide drivers with information about their vehicles. The joint research will combine Intel’s expertise in developing technologies for personal computing and DENSO’s knowledge of in-vehicle IT products and advanced infotainment functions.

Intel announced several initiatives and investments to spur product development and research for new connected car experiences. The investments include the new global Automotive Innovation and Product Development Center, the expansion of Intel Labs Interaction and Experience Research (IXR), an academic outreach program for automotive projects, and the newly-established $100 million Intel Capital Connected Car Investment Fund. Located in Karlsruhe, Germany, the Automotive Innovation and Product Development Center aims to accelerate innovations for in-vehicle infotainment and telematics solutions based on Intel technology. And with the expansion of Intel Labs IXR, Intel will gain valuable insights into the relationships between humans, cars and technology.

NEWS HIGHLIGHTS

  • Intel Capital creates a $100 million Intel Capital Connected Car Fund to accelerate technology innovation in the automotive industry.
  • Intel Capital Connected Car Fund targeted at technologies that will deliver new in-vehicle infotainment solutions, seamless mobile connectivity, compelling applications and advanced driver assistance systems.
  • By 2014, automobiles will be among the top three fastest-growing market segments for connected devices and Internet content.

 

 

SANTA CLARA, Calif. and KARLSRUHE/FELDKIRCHEN, Germany, Feb. 29, 2012 – Intel Capital today announced a $100 million investment fund to help accelerate innovation and the adoption of new technology and services in the automotive industry. Intel Capital is the first global technology investment organization headquartered in Silicon Valley to announce a dedicated focus on automotive technology innovation.

 

The Intel Capital Connected Car Fund will be invested globally over the next 4 to 5 years in hardware, software and services companies developing technologies to promote new, compelling in-vehicle applications and enable the seamless connection between vehicles and any connected device, including mobile devices and sensors.

 

"Technology has become an integral component of everyday life, with consumers demanding uninterrupted access to the Internet and the constant flow of information, news, entertainment, and social media," said Arvind Sodhani, president of Intel Capital and Intel executive vice president. "Automobiles must be able to provide these same consistent and engaging computing experiences, but in a safe manner. The Intel Capital Connected Car Fund will drive the development of technologies to enhance the in-vehicle experience of the future."

 

The announcement is part of Intel's ongoing work with automakers and in-vehicle infotainment suppliers to help integrate advanced technologies into cars. Ultimately, the connected car will have the intelligence and context awareness to offer the right information, at the right time and in the right way to keep drivers and passengers informed, entertained and productive while maintaining optimal safety. Once the car becomes connected, it can also communicate with the cloud, the transportation infrastructure and even other vehicles to provide additional services such as advanced driver assistance and real-time traffic information to optimize the flow of traffic.

 

"The car is the ultimate mobile device," said Staci Palmer, general manager of Intel's Automotive Solutions Division. "By 2014, automobiles will be among the top three fastest-growing areas for connected devices and Internet content.¹ Intel's experience in developing personal computing, software, security and cloud computing technologies will bring a new level of innovation to the car to enhance the driving experience for both drivers and passengers."

 

To help realize that vision, areas of investment for the Intel Capital Connected Car Fund will include technologies that advance the next generation of in-vehicle infotainment, advanced driver assistance systems and seamless mobile connectivity. This includes new in-vehicle applications and development tools, next-generation ADAS technologies and multimodal capabilities such as speech recognition, gesture recognition and eye tracking optimized for the connected car.

 

In addition to the Intel Capital Connected Car Fund, Intel Corporation President and CEO Paul Otellini also announced today at an event in Karlsruhe, Germany the opening of a new global Automotive Innovation and Product Development Center, an academic outreach program focused on IVI and telematics, and expansion of Intel Labs Experience and Interaction Research in automotive.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

         

 

About Intel Capital
Intel Capital, Intel's global investment and M&A organization, makes equity investments in innovative technology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software, and services targeting enterprise, mobility, health, consumer Internet, digital media, semiconductor manufacturing and cleantech. Since 1991, Intel Capital has invested more than US$10.5 billion in over 1,218 companies in 51 countries. In that timeframe, 196 portfolio companies have gone public on various exchanges around the world and 291 were acquired or participated in a merger. In 2011, Intel Capital invested US$526 million in 158 investments with approximately 51 percent of funds invested outside the U.S. and Canada. For more information on Intel Capital and its differentiated advantages, visit www.intelcapital.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 Gartner: Automobile of the Future: The Ultimate Connected Mobile Device (ID: G00175335)

Company Opens New Product Development Center, Expands Intel Labs Experience and Interaction Research

 

NEWS HIGHLIGHTS

  • Global Automotive Innovation and Product Development Center will accelerate innovations and product development for in-vehicle infotainment and telematics solutions based on Intel technology.
  • Intel invests in academic outreach program to foster innovative ideas, research and technology among academia, Intel and the automotive industry.
  • Company expands Intel Labs Interaction and Experience Research in automotive to further explore relationships among human behavior, cars and technology.
  • Intel Capital is the first global technology investment organization to announce $100 million Connected Car Fund focused on investing in automotive technology innovation.

 

 

SANTA CLARA, Calif., and KARLSRUHE, Germany, Feb. 29, 2012 – Intel Corporation today announced several automotive investments and initiatives designed to spur innovation and product development that will enable new and innovative connected car experiences. The investments include the new Automotive Innovation and Product Development Center, expansion of Intel Labs Interaction and Experience Research (IXR) in automotive, an academic outreach program, and the establishment of the $100 million Intel Capital Connected Car Investment Fund.

 

"In today's mobile world, personal computing touches every part of consumers' daily lives while at home, at the office and on the road," said Intel President and CEO Paul Otellini. "By broadening our research efforts, academic and capital investments and opening the Automotive Innovation and Product Development Center, Intel is deepening its understanding of how people interact with their cars and how Intel innovations can enhance the automotive experience."

 

The Automotive Innovation and Product Development Center will serve as Intel's global center of competence for the development of products and technologies for in-vehicle infotainment and telematics solutions for the connected car. The center will optimize Intel technologies for applications and services as well as capabilities for consumer electronics integration, performance optimization and system design.

 

Located in Karlsruhe, Germany, the site benefits from its proximity to top technical universities and a robust ecosystem of hardware and software vendors with expertise in automotive technology. The customized facility features a unique secured car park that provides an on-site location for Intel to install, test and showcase developments. Additional features include state-of-the-art instrumentation, a myriad of antennae to provide satellite, TV, digital video and GPS for development and testing, and a world-class engineering compute infrastructure.

 

Intel also announced plans for a comprehensive academic program that includes fundamental and applied research, curriculum development and internship programs to foster the exchange of innovative ideas among academia, Intel and the automotive industry. The program will be hosted at the Karlsruhe site and will tap into an extensive Intel European Research and Development network of researchers and developers, labs and research relationships.

 

Expanding Research to Explore Human Interactions in Vehicles

 

With the expansion of Intel Labs Interaction and Experience Research, Intel and its customers will obtain valuable insights into consumer experiences in the vehicle. Intel aims to apply that knowledge to the development of technology solutions for the vehicle and transportation infrastructure to make the driving experience more enjoyable, intuitive and safe. For example, Intel is looking at new ways to use the Internet, sensors and context-aware technology to determine what and how information should be presented to drivers and passengers to reduce complex interactions while driving.

 

Intel Capital Creates $100 Million Connected Car Fund

 

Today, Intel Capital became the first global technology investment organization to announce an investment fund focused on fostering automotive technology innovation. The Intel Capital Connected Car Fund aims to accelerate the seamless connection between the vehicle and consumer electronic devices as well as drive new in-vehicle applications, services and differentiated user experiences based on Intel technologies. Over the next 5 years, Intel Capital will invest in hardware, software and services companies that are developing leading-edge ingredient technology and platform capabilities that support Intel's focus areas in automotive.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Companies Expand Successful NAND Flash Memory Joint Development Program to Include Development of Emerging Memory Technologies

 

SANTA CLARA, Calif. and BOISE, Idaho, Feb. 28, 2012 – Intel Corporation and Micron Technology, Inc., today announced that the companies have entered into agreements to expand their NAND Flash memory joint venture relationship.

 

The agreements, which are designed to improve the flexibility and efficiency of the joint venture, include a NAND Flash supply agreement for Micron to supply NAND products to Intel and agreements for certain joint venture assets to be sold to Micron. Under terms of the agreement, Intel is selling its stake in two wafer factories in exchange for approximately $600 million—the approximate book value of Intel's share. Additionally, Intel will be receiving approximately half of the consideration in cash and the remaining amount will be deposited with Micron, which may be refunded or applied to Intel's future purchases under the NAND Flash supply agreement. The agreements also extend the companies' successful NAND Flash joint development program and expand it to include emerging memory technologies.

 

"Micron's joint venture NAND development efforts with Intel are a model of innovation, productivity and effectiveness," said Micron Chief Executive Officer Mark Durcan. "With IM Flash and its associated programs, our companies have become leaders in the NAND Flash arena. These new agreements build on that success."

 

"The Intel-Micron partnership has created industry-leading NAND Flash memory technology and developed a robust global manufacturing network. The new NAND Flash supply agreement with Micron gives Intel better flexibility to meet growing demand for SSDs and other products," said Robert Crooke, Corporate Vice President and General Manager of the Non-Volatile Memory Solutions Group, Intel.

 

As part of these agreements, Micron will increase its share of the overall NAND Flash output and optimize its global manufacturing network by purchasing the assets of IM Flash Singapore (IMFS) and the IM Flash Technologies (IMFT) assets in Manassas, Va.

 

Micron has also agreed to supply Intel with NAND Flash memory from its facilities. The IMFT joint venture NAND manufacturing facility in Lehi, Utah, will continue to operate with minimal changes to its existing operations. The facility is currently in production on the companies' industry-leading 20nm NAND Flash memory technology. The transaction is expected to close during the first half of this year, subject to certain conditions.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

About Micron Technology, Inc.
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.

 

*Micron and the Micron logo are trademarks of Micron Technology, Inc. Intel is a trademark of Intel Corporation or its subsidiaries in the United States and other countries. All other trademarks are the property of their respective owners.

 

*This press release contains forward-looking statements related to the timing of the closing of the transaction between Micron and Intel (the "Companies") related to updating their NAND Flash joint venture relationship. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents the Companies file from time to time with the Securities and Exchange Commission, specifically each of their most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for each of the Companies to differ materially from those contained in our forward-looking statements. Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.

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