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Intel Newsroom

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The White House has invited one of the 2009 Intel Science Talent Search winners, Gabriela Farfan, to help celebrate the 40th anniversary of Title IX. The Council on Women and Girls is hosting an event Wednesday, June 20, that will feature Farfan in a panel discussion on "Advancing Our Commitment to Title IX in Education." At 2:00 p.m. EST, the event will be livestreamed on www.whitehouse.gov/live. Learn more about Intel’s education initiatives here.


  • Nearly half of all travelers feel anxious without their mobile computing device
  • Nearly three-quarters of young Americans admit to suffering "outlet outrage" when traveling
  • "Peeping-tech" behaviors rank amongst travelers' top peeves while almost half fear device heists



SANTA CLARA, Calif., June 20, 2012 – A new survey conducted by Intel Corporation and commissioned by TNS to explore American attitudes towards travel and technology finds U.S. vacationers feel anxious when traveling without their mobile computing device, angry when they cannot access power sources to charge these devices and annoyed when others take uninvited glimpses of their computer screens, potentially compromising their personal information.


The "Intel Survey: Tech Norms for Travelers," exposed the deepening love affair between travelers and their Ultrabook™ devices, laptops and tablets, revealing Americans feel an emotional bond with these mobile devices to the point of feeling calmer and less stressed when they have access to this technology while vacationing.


Almost half (44 percent) of U.S. travelers admitted feeling anxious traveling without their mobile computing device (Ultrabook, tablet or laptop), and 87 percent of young adults (18-29 years old) feel happier when traveling with their devices. Survey respondents also ranked losing these mobile computing devices when traveling as more stressful than losing their wedding ring (77 percent vs. 55 percent).


Travelers' co-habitation with their devices has become so pervasive that they admit they will go to great lengths to keep connected. Almost half of all travelers (46 percent) and 63 percent of young travelers admit compromising their personal comfort and hygiene in pursuit of a power source to keep their device charged. This includes going out of their way to find an available power outlet, choosing a restaurant or coffee house based on outlet availability, searching public bathrooms or compromising comfort and hygiene to sit on the floor near an outlet. Sixty-four percent of survey respondents admitted to sacrificing their personal appearance – giving up hair dryers or styling tools, toiletries, sunscreen, workout clothes and even shoes – in favor of making space in their luggage for their beloved device.


"With summer travel now in full swing, we find that many people have a few common must-have items on their trip packing lists – Ultrabook, tablet and laptop. The bond between travelers and their tech devices has strengthened greatly over the past few years with the explosion of instant information, entertainment and services conveniently available on the Web," said Mike Fard, Intel Ambassador. "Gone are the days of travel as simple escape of 'daily life' as more people seek to enhance and share vacation experiences in real-time and use technology to truly make travel more fun and more memorable."


Tech Travel Syndromes: Key Survey Findings

Today's traveler has increased expectations and views each connected minute as invaluable, desiring to create, consume and share safely with a mobile device that is easy on the eye, and the back, with style and design paired with performance and long battery life. From the introduction of Intel® Centrino® mobile technology in 2003 to the creation of the Ultrabook category last year, Intel has fueled the emergence of go-everywhere technology.


Ultrabook devices inspired by Intel feature innovations tailor-made to address the anxieties of today's traveler, alleviating "outlet outrage" with a minimum of 5 hours of battery life and instant on capabilities; providing personal security benefits through the Intel® Anti-Theft Technology and Intel® Identity Protection Technology; and delivering stylish systems that are less than one inch thick and offered in touch-enabled and convertible designs later this year.


Tech Turbulence

  • Female travelers admit greater travel anxiety than men, being significantly more likely than male travelers to report losing their mobile computing device as very stressful (82 percent vs. 73 percent).
  • Three-quarters of all travelers surveyed bring their mobile computing device to stay connected to friends and family (75 percent), bucking the idea that dependence on technology detracts from time with family and friends.


Outlet Outrage

  • Sixty-three percent of young travelers admitted going out of their way to secure power for their device including compromising their comfort and hygiene by sitting on the floor (37 percent), searching public bathrooms (15 percent) or choosing a restaurant or coffee house based on outlet availability (33 percent).
  • Seventy-five percent of young travelers and 62 percent of all survey respondents are willing to pay more for a mobile computing device with longer battery life for when they travel.
  • Despite our tech addictions, 52 percent of all travelers are annoyed by the physical burdens traveling with technology brings, including heavy mobile devices, power cords and battery packs, and pulling their device out of their bag to go through the airline security check.

"Peeping-Techs" and the Fear of Device Heists

  • Forty-six percent of travelers say their biggest pet peeves about traveling with technology relates to device security, including worrying the device may be lost or stolen and someone glancing at their screen. This concern rises to 62 percent among young adult travelers.
  • Despite this reported paranoia, around one-quarter of travelers (26 percent) fail to take basic security precautions and admit to security risks including entering credit card details in public, using unsecured Wi-Fi networks, viewing sensitive documents on their device and even leaving their device unattended.
  • "Peeping-techs" are among travelers' top pet peeves. Half of American travelers (49 percent) admit getting annoyed when the behaviors of others compromise their traveling comfort and security, including screen glancing and viewing inappropriate content, with more than 29 percent of all travelers claiming they've caught fellow travelers peeping at their screens.
  • Despite "peeping-techs" topping the list of travel peeves, more than half (51 percent) of young adults admit to peeping at someone else's screen while 33 percent of travelers admitted being a "peeping-tech."

Mile-High Manners

  • Thirty percent of all travelers do not think they need to power off their devices when they fly.
  • Thirteen percent of young travelers admit to "hogging" an available power source.
  • Men readily admit to flaunting aviation rules in pursuit of connectivity and ignoring requests to power down their devices, with more than one in 10 admitting they have ignored instructions to power off their mobile computing device when flying (13 percent) and personally have been asked by a flight attendant to power off their mobile computing device because they ignored the initial directions (11 percent).

Tech Envy

  • Six in 10 of respondents (64 percent) reported they consider their mobile computing device a personal style accessory.
  • One-fifth of respondents (21 percent) admitted experiencing device envy with significantly more women than men, 34 percent vs. 22 percent, believing other mobile computing devices looked "cooler" than their own.


Survey Methodology

The survey was conducted online within the United States by TNS on behalf of Intel from May 9-13, 2012 among a nationally representative sample of 2,500 U.S. adults ages 18 and older with a margin of error of plus or minus 3.5 percentage points. Respondents were asked about traveling with Ultrabook devices, tablets and laptops. For additional information on the "Intel Survey: Tech Norms for Travelers" visit www.intel.com/newsroom/?travel.



The "Intel Survey: Tech Norms for Travelers" commissioned by TNS exposed the deepening love affair between travelers and their Ultrabook™ devices, laptops and tablets, revealing Americans feel an emotional bond with their mobile devices to the point of feeling calmer and less stressed when they have access to this technology while vacationing.


About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.


Intel, Intel Core, Centrino, Ultrabook and the Intel logo are registered trademarks of Intel Corporation in the United States and other countries.


* Other names and brands may be claimed as the property of others.

The cloud is moving beyond its trendy reputation and evolving to become a quiet, omnipresent force that will drive the way people and companies seamlessly share and store data.  Leaders from Intel, National Geographic Explorer, and Ford discuss how the cloud enables the world to connect and share data in safer, more efficient—and soon ubiquitous—ways.  60 Second Insights, a video series launched earlier this year, brings together a variety of unique perspectives from entertainment, art, technology, business, culture, youth and more to explain how mobility touches various parts of our lives.

Today HP and Intel together announced that the first HP's "Project Moonshot" production system will be codenamed "Gemini" and powered by Intel® Atom® processors codename "Centerton".  These extreme low-energy servers, scheduled for production by the end of the year, are expected to deliver radical savings in space, power and cost for select scale-out workloads. HP has chosen 6 Watts TDP, dual-core  Intel® Atom® processor codename "Centerton" for their power and performance efficiency, data center-class features (64-bit support, ECC, Virtualization Technology) and broad software ecosystem support. Official HP’s announcement is available here.

Justin Rattner, Intel chief technology officer, will host Intel’s 10th Anniversary Research@Intel media event on Tuesday, June 26 at the Yerba Buena Center for the Arts, San Francisco, Calif. Intel will showcase 20 must-see innovations from Intel’s R&D labs from around the world in addition to showing 10 technologies that began in Intel Labs and are now in market. The event kicks-off with a presentation by Rattner at 9:00 a.m. PDT and the technology demo showcase displaying Intel’s vision of the future will take place from 9:30 a.m. – 2:00 p.m. PDT. Media interested in additional details or would like to attend the event, please email Julia Allyn at julia.allyn@ogilvy.com. If you can’t join us in person, you can still experience the event via LiveCast, videos and photos by visiting Intel’s Newsroom.

Global Technology Leader to Acquire Approximately 1,700 Patents and Applications Related to 3G, LTE, 802.11 from InterDigital


KING OF PRUSSIA, Pa. and SANTA CLARA, Calif., June 18, 2012 — InterDigital, Inc. (NASDAQ: IDCC) and Intel Corporation (NASDAQ: INTC) today announced that certain of InterDigital's subsidiaries have signed a definitive agreement to sell to Intel roughly 1,700 patents and patent applications for $375 million in cash.


The agreement involves patents primarily related to 3G, LTE and 802.11 technologies. InterDigital is an active developer of advanced wireless technologies including WCDMA (Wideband CDMA), HSDPA (High Speed Download Packet Access) and HSUPA (High Speed Upload Packet Access) 3G technologies as well as LTE (Long Term Evolution) and LTE-Advanced 4G technologies.


"The acquisition of this portfolio of InterDigital's technologies by a global technology leader like Intel affirms the efforts of our research and development team which actively shares our innovations with the worldwide standards bodies, defining technologies that are central to the world's major wireless systems and devices," said Scott McQuilkin, Senior Executive Vice President, Strategy and Finance at InterDigital. "This transaction, which involves a small portion of our overall patent portfolio, marks an important milestone of InterDigital's stated strategy of expanding the monetization of its large and growing intellectual property portfolio. By executing on our business plan, which has been broadened to include patent sales, licensing partnerships and other possibilities, we see tremendous potential to expand revenue and build shareholder value."


"These patents will support Intel's strategic investments in the mobile segment," said Doug Melamed, Intel Senior Vice President and General Counsel. "The addition of these patents expands our already large, strong and diverse portfolio of intellectual property."


The companies expect the transaction to be completed in third quarter 2012, subject to customary closing conditions and any required regulatory approvals.


Forward-Looking Statements

This press release contains forward-looking statements within the meaning of Section 21E of the Securities Exchange Act of 1934, as amended. Such statements include information regarding InterDigital's and Intel's current beliefs, plans and expectations, including with respect to (i) the completion, and expected timing of the completion of the transaction; (ii) InterDigital's belief that this transaction marks an important milestone of its stated strategy of expanding the monetization of its large and growing intellectual property portfolio; and (iii) InterDigital's belief that by executing on its business plan, there is tremendous potential to expand its revenue and build shareholder value.


Forward-looking statements are subject to risks and uncertainties. Actual outcomes could differ materially from those expressed in or anticipated by such forward-looking statements due to a variety of factors, including, without limitation, (i) the approval of the transaction by regulatory authorities and the satisfaction of other closing conditions; (ii) InterDigital's ability to enter into additional sales and/or licensing partnership or other arrangements for non-core portions of its patent assets; and (iii) changes in InterDigital's business plan. Neither InterDigital nor Intel undertake any duty to update publicly any forward-looking statement, whether as a result of new information, future events or otherwise, except as may be required by applicable law, regulation or other competent legal authority.


About InterDigital
InterDigital develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. We solve many of the industry's most critical and complex technical challenges, inventing solutions for more efficient broadband networks and a richer multimedia experience years ahead of market deployment. InterDigital has licenses and strategic relationships with many of the world's leading wireless companies.  For more information, visit: www.interdigital.com.


About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.


Intel is a trademark of Intel Corporation in the United States and other countries.


* Other names and brands may be claimed as the property of others.

During the International Supercomputing Conference (ISC12) in Hamburg, Germany, Intel highlighted the rapid adoption of the Intel® Xeon® processor E5 product family on the top500 list of most powerful supercomputers with 45 systems ranked on the list only 3 months after technology introduction. The company also announced the new brand name for all products based on Intel® Many Integrated Core architecture - the Intel® Xeon® Phi™ product family - new technology that is aimed to bring industry leading performance and energy efficiency when processing highly parallel applications. Raj Hazra, Intel VP and general manager of High Performance Computing at Intel shares his thoughts here on how Intel® Xeon® Phi™ product family will help to accelerate the pace of discovery and innovation and pave the way to Exascale computing by 2018.

Intel Announces Intel® Xeon® Phi™ Brand for Products Based on Intel® Many Integrated Core Architecture



  • Recently launched Intel® Xeon® processor E5 family achieves fastest adoption of new technology on the 39th edition of the Top500 list of supercomputers by powering 45 systems, including 3 new Petascale class systems. The largest of these is "SuperMUC" at LRZ, delivering 2.9 Petaflops, which makes it the most powerful supercomputer in Europe, and the most powerful ever built on x86 architecture.
  • Intel continues to lead the Top500 list of most powerful supercomputers in the world with 74 percent of all systems and 77 percent of new entries based on Intel® architecture.
  • Intel® Xeon® Phi™ is the new brand name for all future Intel® Many Integrated Core Architecture based products targeted at HPC, enterprise, datacenters and workstations. The first Intel® Xeon® Phi™ product family member is scheduled for volume production by the end of 2012 and the first Intel® Xeon® Phi™ coprocessor-based cluster is already ranked 150th on the Top500 list.



SANTA CLARA, Calif. and HAMBURG, Germany, June 18, 2012 – The Intel® Xeon® processor E5-2600 product family reached a new supercomputing milestone as the fastest adopted new processing technology to power 44 systems, including 3 Petascale-class supercomputers on the 39th edition of the Top500 list announced today.


The "SuperMUC" supercomputer at LRZ in Germany, which ranked fourth on the list, delivers 2.9 PetaFLOPs of performance, making it the most powerful in Europe, as well as the largest installation based on the new Intel Xeon processors E5 family.


At the International Supercomputing Conference, Intel Corporation also announced that Intel® Xeon® Phi™ is the new brand name for all future Intel® Many Integrated Core Architecture (Intel MIC architecture) based products. Available by the end of 2012, the first generation of Intel Xeon Phi product family (coprocessors codenamed "Knights Corner") will complement the existing Intel Xeon processor E5-2600/4600 product families and deliver new levels of performance for highly parallel workloads. While the first generation primarily targets high performance computing (HPC), future generations of Intel Xeon Phi products will also address enterprise datacenters and workstations.


"The Intel Xeon processor E5 family is powering exponential performance gains in high performance computing and we're proud that it is having such a profound impact on the industry as demonstrated by its presence inside 45 of the Top500 supercomputers," said Raj Hazra, Intel Corporation VP and general manager of the Technical Computing at Data Center and Connected Systems Group. "As we add Intel Xeon Phi products to our portfolio, scientists, engineers and IT professionals will experience breakthrough levels of performance to effectively address challenges ranging from climate change to risk management. This is the next step of Intel's commitment to achieve exascale-level computation by 2018, and create a unique technology category that delivers unprecedented performance for today's highly parallel applications."


First Intel® Xeon® Phi™ Coprocessor Due This Year

Intel disclosed new technical details of the first commercially available product from its Intel Xeon Phi product family, a coprocessor codenamed "Knights Corner." In addition to delivering breakthrough performance for highly parallel applications, Intel Xeon Phi coprocessor's ease of use is bolstered by the benefits of familiar programming models, techniques and developer tools available with Intel architecture. With greater use of parallel CPU code, software companies and IT departments do not have to retrain developers on proprietary programming models associated with accelerators.


Beyond its compatibility with x86 programming models, the Intel Xeon Phi coprocessor will be visible to applications as an HPC-optimized, highly-parallel, separate compute node that runs its own Linux-based operating system independent of the host OS. This feature allows more flexibility when implementing cluster solutions that are not available with alternative graphics accelerator-based technologies.


Made with Intel's innovative 22nm, 3-D tri-gate transistors, the Intel Xeon Phi coprocessor, available in a PCIe form factor, contains more than 50 cores and is capable of supporting over 8GB of GDDR5 memory. It also features 512b wide SIMD support that improves performance by enabling multiple data elements to be processed with a single instruction. Last year Intel showed a live demonstration of the single Knights Corner coprocessor delivering over 1 TeraFLOPs (1 trillion floating point operations per second) of double precision real life performance, as measured by DGEMM. At ISC'12 Intel demonstrated the same effective performance of more than 1 TeraFLOPs per node but measured by the industry standard benchmark Linpack (Rmax)1. By comparison, in 1997, it took more than 9000 Intel® Pentium® processors inside the ASCII RED* supercomputer to break the 1 TeraFLOPs barrier.


While initial production product shipments are planned for the second half of 2012, Intel has announced that the first Intel Xeon Phi coprocessor-based development cluster is up and running and ranked 150th on the Top500 list, delivering 118 TFLOPs of performance.


The Intel Xeon Phi coprocessor has strong industry support, with 44 manufacturers including Bull, Cray, Dell, HP, IBM, Inspur, SGI and NEC committed to including it in their system roadmaps.


"We are very excited to announce that our next-generation supercomputer code-named 'Cascade' will be available with the Intel Xeon Phi coprocessors, giving Cray customers the ability to push the limits of research and discovery," said Peg Williams, Cray's senior vice president of high performance computing systems. "Our Cascade system will feature some of the most advanced and highly innovative HPC technologies ever put into a Cray supercomputer. Combining these features with industry-leading Intel Xeon processors and the new Intel Xeon Phi coprocessors will result in a very compelling system for HPC centers around the world."


Due to power-on in early 2013, the first Petascale class supercomputer powered by a combination of the Intel Xeon processor E5 family and Intel Xeon Phi coprocessors will be "Stampede." Intel expects a growing number of Petascale-class machines in the next year that take advantage of the Intel Xeon Phi coprocessors' programmability and performance efficiency.


Race to Exascale fuels growth and investments in HPC market

Providing a two week weather forecast with the same level of accuracy as in a 48-hour forecast, or mapping the human genome within 12 hours at less than $1000 as compared to the current two weeks at $60,000, are two examples of the many challenges that HPC will address with more compute capacity. The insatiable need for performance has driven the tremendous growth of HPC processor shipments over the last five years, and Intel predicts this growth will reach more than 20 percent CAGR in the next 5 years. Intel forecasts2 that the most powerful supercomputer in 2013 will feature the amount of CPUs greater than 1 percent of its own server CPU shipments in 2011.


Reaching Exascale levels of performance requires innovation across the architecture and fabric within HPC. To deliver on its promise to reach Exascale performance by 2018, Intel made significant investments in areas that will accelerate its capabilities to deliver this performance in the future. The recent acquisition of Infiniband and interconnect assets from QLogic and Cray present key areas for Intel to innovate as the company eliminates the bottlenecks in delivering scalable Exascale-class platforms in the future.


TOP500 Supercomputers

More than 74 percent (372 systems) of the supercomputers on the 39th edition of the Top500 list are powered by Intel processors. Of those systems making their first appearance on the list, Intel-powered systems account for more than 77 percent. The complete report is available at www.top500.org.

More information on ISC'12 including Hazra's presentation and pictures are available at http://www.intel.com/newsroom/isc.


About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.


Intel, Xeon, Xeon Phi and the Intel logo are trademarks of Intel Corporation in the United States and other countries.


* Other names and brands may be claimed as the property of others.


Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.


For more complete information about performance and benchmark results, visit Performance Test Disclosure


1. (1TFLOPs KNC performance by Linpack) Source: Top500 list, available at www.top500.org.Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark.


2. (Intel forecasts on most powerful supercomputer and # of CPUs) Intel internal forecasts.

A team of researchers from the Intel Science and Technology Center for Cloud Computing set multiple new records for energy-efficient sorting in the 2012 Joulesort competition. The results delivered up to 7x improvements in energy efficiency over prior records. For more information find the published reports at http://sortbenchmark.org.

One hour at a time, Intel employees and retirees are changing lives and changing the world. Under the Intel Involved Matching Grant program, the Intel Foundation expands the impact of volunteering by making grants to schools and non-profits based on the number of hours employees and retirees report volunteering. In June 2012, Intel sites around the world announced $8,227,179 in matching grants to 3,193 schools and non- governmental/non-profit organizations in 21 countries. The grants were based on 939,196 eligible hours of volunteerism  by Intel employees and retirees during 2011. The Intel Involved Matching Grant program aims to recognize and motivate Intel employees and retirees to engage in outreach and volunteerism to make their communities a better place to live, work, and play. The objective is to support employees giving their time and talent to good causes and to give employees an opportunity to earn money for organizations that are meaningful to them. Read about Small Gestures, a volunteer effort that generated $4,500 in matching grants.

After years as a leader in providing LCD HDTV experiences to consumers, VIZIO is entering the realm of personal computing  with the slim, stylish and responsive VIZIO Thin + Light Ultrabook™ device, Notebook and a beautiful ALL-IN-ONE PC. To create these sophisticated products, VIZIO researched what consumers wanted from their technology and the result is a line of innovative devices that combine the power of the latest 3rd Generation Intel® Core™ processors with best of class entertainment design synonymous with Vizio. The VIZIO line starts at $898 and is available for pre-order at Vizio.com.

Today, Intel released graphics drivers for Windows 8 Release Preview and Windows 7 supporting Intel® Core™ processors with HD Graphics 4000/3000/2500/2000. The Windows 8 driver supports the Windows Display Driver Model Version 1.2 (WDDM1.2) and features such as native stereoscopic 3D support, optimized screen rotation detection and integrated DirectX 11 video playback. Intel encourages users to try the latest driver and provide feedback for future releases. The Windows 7 driver corrects some gaming experience issues and adds support for OpenGL version 3.3.

Intel is proud to be a founding partner of mPowering Frontline Health Workers, a new public-private partnership. Created by the United States Agency for International Development (USAID) and the mHealth Alliance, this partnership joins innovative public and private sector companies to increase the use of mobile technologies by frontline health workers. Mobile technologies are a critical tool for child survival and support a variety of healthcare related tasks. This new initiative is part of Intel’s ongoing work with USAID and supports the Intel World Ahead Program, which promotes access to technology, connectivity and healthcare. Learn more about this announcement here.

Today, IT leaders representing cloud services and solutions, enterprise IT and standards organizations shared their vision for cloud computing at Open Data Center Alliance Forecast 2012. In the opening keynote, Lockheed Martin’s Curt Aubley said that the industry is at the tipping point of broad scale cloud deployment as the industry embraces benefits such as cost-efficiency, agility and innovation. During the second keynote, Andy Brown with UBS told the audience that the cloud is empowering the entire organization, and pointed to investments in Big Data, sustainability and security. ODCA Forecast 2012 also marked the debut of two new usage models; the Alliance now has 14 usage models  in total that address the top IT priorities that will drive widespread cloud adoption. The Alliance today also launched the Member Engagement and Education Tool (MEET), which will enhance networking and sharing among ODCA members. Intel is technical advisor to the ODCA. For more information on ODCA Forecast2012, please visit www.opendatacenteralliance.org/forecast2012 or the ODCA newsroom.

Intel Corporation is delivering myriad presentations, panel discussions and demonstrations at this year’s VLSI Symposia. A highlight paper discloses new details about Intel’s 22nm process – the industry’s first fully depleted 3-D Tri-Gate technology with superior low voltage and low power capabilities. Other Intel papers describe innovations in reducing power consumption for graphics processing, advances in transistors made with compound semiconductors, a viable option for future ultra-low power transistors, fundamental leaps in energy-efficient computing and integrated digital radio and SoC technology. The details of the presented papers are available here.

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