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Intel Newsroom

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NEWS HIGHLIGHTS

  • Intel previews 1 gigabit per second DOCSIS 3.0 capability in its latest gateway solution, the Intel® Puma™ 6.
  • Next-generation Intel® Puma™ gateway allows service providers to extend their investments in current network infrastructure.
  • South Korea’s SKbroadband targeting deployment of 1Gbps network in 2013.

 

 

THE CABLE SHOW, Boston, May 21, 2012 – Intel Corporation today previewed its first DOCSIS* 3.0 cable gateway solution that is capable of 1 gigabit per second (Gbps). The Intel® Puma™ 6 technology solution will help enable service providers to meet consumer demand and offer new services while extending their extensive network investments. A test program by South Korea’s SKbroadband is targeting production deployment of 1Gbps in 2013.

 

As the number of Internet-connected devices in the home grows, service providers are challenged to provide higher broadband speeds to more customers utilizing an existing cable network. A service provider’s ability to scale up to this high level of bandwidth will help enable new high-bandwidth experiences for what the industry calls “TV Everywhere,” an immersive blend of Internet, television, gaming and applications across multiple screens throughout the home.

 

With the advanced technology of the DOCSIS 3.0 specification, multiple system operators (MSOs) can offer more users faster access to bandwidth-intensive experiences such as streaming video or online gaming using their existing network infrastructure and DOCSIS 3.0 equipment. Due to the flexibility of this technology, the Intel Puma 6 achieves the 1Gbps downstream speeds by bonding up to 24 DOCSIS channels (up from eight bonded channels in a typical deployment today). Intel Puma 6 has an upload speed that is double current-generation DOCSIS modems. With up to 240Mps upstream (eight bonded channels), more consumers will benefit from new services that include video conferencing, cloud storage and easy sharing.

 

“We continue to lead in DOCSIS technology, and are now providing cable gateway solutions with 1Gbps capability,” said Alan Crouch, general manager of Intel’s Service Provider Division. “Service providers can now deliver on consumer demands for higher broadband speeds, supporting a proliferation of new devices, services and experiences.”

 

The Intel Puma family system architecture provides OEMs with flexibility to easily customize their products to fit a wide range of MSO-required and optional features such as high data rates, wireless communications, power down modes and telephone support. Intel was the first to deploy DOCSIS 3.0 technology with Intel® Puma™ 5, and over 20 million DOCSIS 3.0 systems have shipped.

 

“SKbroadband is proud to lead the world in piloting a 1 gigabit Internet experience,” said Dae Chul Noh, team leader of SKbroadband’s Network Division. “Our customers use these lightning-fast Internet speeds for high-definition TV, multi-player gaming, video conferencing and more.”

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Puma and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Today, Intel released its 2011 Corporate Responsibility Report, which includes highlights from 2011 and new 2020 environmental goals. The 2011 highlights include Intel’s achievements in supply chain, renewable power, employee engagement, green building design and education. The 2020 goals include items such as 25x increases in notebook and data center product energy efficiency and 10 percent reduction in direct greenhouse gas emissions on a per chip basis. View the press release and the full report.

Jack Andraka of Crownsville, Md. Wins Top Prize at Intel International Science and Engineering Fair

 

NEWS HIGHLIGHTS

  • The world's largest high school science research competition, the Intel International Science and Engineering Fair, a program of Society for Science & the Public, announced its top winners in  Pittsburgh, Pa.
  • Jack Andraka of Crownsville, Md. received the Gordon E. Moore Award, a $75,000 prize named in honor of the Intel co-founder, retired chairman and CEO.
  • Two Intel Foundation Young Scientist Awards winners - Nicholas Schiefer of Pickering, Ontario, Canada and Ari Dyckovsky of Leesburg, Va. - each received prizes of $50,000 from the Intel Foundation.

 

 

PITTSBURGH, Pa., May 18, 2012 – Jack Andraka, 15, of Crownsville, Md. was awarded first place for his new method to detect pancreatic cancer at this year's Intel International Science and Engineering Fair, a program of Society for Science & the Public. Based on diabetic test paper, Jack created a simple dip-stick sensor to test blood or urine to determine whether or not a patient has early-stage pancreatic cancer. His study resulted in over 90 percent accuracy and showed his patent-pending sensor to be 28 times faster, 28 times less expensive and over 100 times more sensitive than current tests. Jack received the Gordon E. Moore Award, named in honor of Intel co-founder and retired chairman and CEO of $75,000.

 

Two students, Nicholas Schiefer, 17, of Pickering, Ontario, Canada and Ari Dyckovsky, 18, of Leesburg, Va., each received the Intel Foundation Young Scientist Award of $50,000.

 

Nicholas studied what he calls "microsearch," or the ability to search the fastest-growing information medium: small amounts of content, such as tweets and Facebook status updates.Through his research, Nicholas hopes to improve search engines' capabilities, which will in turn improve access to information.

 

Ari investigated the science of quantum teleportation. He found that once atoms are linked through a process called "entanglement," information from one atom will just appear in another atom when the quantum state of the first atom is destroyed. Using this method, organizations requiring high levels of data security, such as the National Security Administration, could send an encrypted message without running the risk of interception because the information would not travel to its new location; it would simply appear there.

 

"We support the Intel International Science and Engineering Fair because we know that math and science are imperative to future global growth," said Wendy Hawkins, executive director of the Intel Foundation. "This competition encourages millions of students to engage their skills for innovation and develop promising solutions for global challenges."

 

This year, more than 1,500 young scientists were chosen to compete in the Intel International Science and Engineering Fair. They were selected from 446 affiliate fairs in approximately 70 countries, regions and territories. In addition to the winners mentioned above, more than 400 finalists received awards and prizes for their groundbreaking work. Awards included 17 "Best of Category" winners who each received a $5,000 prize. The Intel Foundation also awarded a $1,000 grant to each winner's school and to the affiliated fair they represent.

 

The following lists the 17 Best of Category winners, from which the top three were chosen:

CategoryFirstLastCityState/Country
Animal SciencesLucyHritzoHollandPa.
Behavioral and Social SciencesBenjaminKornickRoslyn HeightsN.Y.
BiochemistryRebeccaAlfordCommackN.Y.
Cellular and Molecular BiologyRaghavTripathiPortlandOre.
ChemistryRaghavendraRamachanderanBengaluruIndia
Computer ScienceNicholasSchieferPickering, OntarioCanada
Earth and Planetary SciencesMofeedSawanLondon, OntarioCanada
Engineering: Electrical and MechanicalAssiyaKussainovaKaraganda, KaragandyKazakhstan
Engineering: Materials and BioengineeringRyotaIshizukaCos CobConn.
Energy and TransportationShyamalBuchFolsomCalif.
Environmental ManagementAdamNobleLakefield, OntarioCanada
Environmental SciencesNaomiShahPortlandOre.
Mathematical SciencesAishwaryaVardhanaBeavertonOre.
Medicine and HealthJackAndrakaCrownsvilleMd.
MicrobiologyFelixAngelovSkokieIll.
Physics and AstronomyAriDyckovskyLeesburgVa.
Plant SciencesHuihuiFanStaten IslandN.Y.

 

Society for Science & the Public, a nonprofit membership organization dedicated to public engagement in scientific research and education, owns and has administered the International Science and Engineering Fair since its inception in 1950, as the National Science Fair.

 

"We congratulate Jack, Nicholas, and Ari on their success here at the Intel International Science and Engineering Fair," said Elizabeth Marincola, president of Society for Science & the Public. "They and all the other finalists here this week further demonstrate how a background of STEM [science, technology, engineering, and math] education creates the breeding ground for creativity and ingenuity that will help solve the pressing issues of the future."

 

The Intel International Science and Engineering Fair includes some of the most promising rising student entrepreneurs, innovators and scientists from around the world. Finalists are selected annually from hundreds of affiliated fairs. Their projects are then evaluated onsite by more than 1,200 judges from nearly every scientific discipline, each with a Ph.D. or the equivalent of 6 years of related professional experience in one of the scientific disciplines.

 

A full listing of finalists is available in the event program (beginning on page 57). The Intel International Science and Engineering Fair 2012 is funded jointly by Intel and the Intel Foundation with additional awards and support from dozens of other corporate, academic, governmental and science-focused organizations.

 

To learn more about SSP, and its programs and publications, visit www.societyforscience.org, follow on Twitter, or visit the Facebook page.

To get the latest Intel education news, visit www.intel.com/newsroom/education, and join the conversation on Facebook and Twitter.

 

ISEF2012-Top-Three-Winners.jpg

PITTSBURGH, Pa., May 18, 2012 - Intel Corporation and Society for Science & the Public today announced the winners of the world's largest high school science research competition, the Intel International Science and Engineering Fair. Jack Andraka, center, of Crownsville, Md. received the top award, named for Intel founder Gordon Moore, of $75,000. Ari Dyckovsky of Leesburg, Va. (left) and Nicholas Schiefer of Pickering, Ontario, Canada (right) each took home an Intel Foundation Young Scientist Award of $50,000.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Dr. Jane Shaw Retires from Board of Directors

 

SANTA CLARA, Calif., May 17, 2012 – Intel Corporation today announced the results from votes at the company’s annual stockholders meeting.

 

Stockholders approved the following proposals:

  • The re-election of Charlene Barshefsky, Andy D. Bryant, Susan L. Decker, John J. Donahoe, Reed E. Hundt, Paul S. Otellini, James D. Plummer, David S. Pottruck, Frank D. Yeary and David B. Yoffie to the board of directors.
  • Ratification of Ernst & Young LLP as independent registered public accounting firm for 2012.
  • The advisory vote to approve executive compensation.

 

Stockholders rejected a stockholder proposal that asked for an annual advisory vote on political contributions.

 

The meeting also marked the retirement of Jane Shaw as chairman of the board of directors. Shaw had served as chairman since 2009.

 

“Jane has made tremendous contributions to Intel as a member of the board for the past 19 years, as chair of the audit and compensations committees, and most recently as chairman,” said Otellini, Intel’s president and chief executive officer. “Throughout her tenure Jane has provided Intel with the benefit of her extensive leadership experience as she has helped guide the company through significant challenges and growth. We are grateful for her service.”

 

As previously announced, Bryant will now serve as chairman. Susan Decker has been appointed as lead director.

 

Complete voting results with respect to the annual meeting is available at http://www.intc.com/.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Intel, Computing Industry Shape Future of Computing Experiences Across Devices and the Cloud

 

WHAT:

Intel Corporation will host a keynote and series of events at Computex Taipei 2012 to highlight its ongoing innovation and collaboration with the computing industry to deliver engaging, consistent and secure user experiences across devices to the cloud. These devices include Ultrabook systems, PCs, smartphones and tablets.

 

Intel’s presence at Computex 2012 will kick off with the opening keynote address by Tom Kilroy, senior vice president and general manager of Intel’s Sales and Marketing Group. His address will be June 5 at the Taipei International Convention Center (TICC), 3F Plenary Hall.

 

Intel will also organize satellite events on personal computing and the cloud in addition to exhibiting a wide range of devices and the latest technologies at the Nangang Exhibition Hall of the Taipei World Trade Center on June 5-9.

DATES:

June 5-8 (9:30 a.m.-6 p.m.)

June 9 (9:30 a.m.-4 p.m.)

WHERE:

Intel Exhibition Showcase at Computex

Booth M410

Taipei World Trade Center, Nangang Exhibition Hall

(No. 1, Jing Mao 2nd Road, Nangang District, Taipei)

MEDIA ACTIVITIES:

Intel Thunderbolt Technology Briefing

Event Time: June 4, 12-1 p.m. (Reception: 11:30 a.m.-noon)

Event Venue: B1 Gallery Room, Bellavita (28 Songren Road, Taipei)

Speakers:

Thomas Swinford, vice president, Intel Architecture Group, general manager, Communications and Networking Group

Jason Ziller, director of Thunderbolt marketing and planning, Intel Architecture Group

 

Intel Booth Guided Tour for Media

Event Time: June 5, 11 a.m.-noon

Event Venue: Booth M410, Taipei World Trade Center, Nangang Exhibition Hall, 4F (3/F, No.1, Jingmao 2nd Road, Taipei)

 

Please register at http://220.135.105.245/press2012/en.html or on site at the 1F reception counter of the Nangkang Exhibition Hall to get the media badge.

 

Computex Opening Keynote

Event Time: June 5, 2-3 p.m. (Reception: 1:20- p.m.)

Event Venue: Taipei International Convention Center, 3F Plenary Hall (No. 1, Xin-yi Road, Sec. 5, Hsin-yi District, Taipei)

Speaker:

Tom Kilroy, senior vice president and general manager, Sales and Marketing Group

 

Please register at http://www.e21forum.com.tw/Register.aspx?nav=9&lang=1 or on site at the 1F reception counter of the Taipei International Convention Center to get the media badge.

 

Post-Keynote Media Q&A Session with Kilroy

Event Time: June 5, 3:15-3:40 p.m.

Event Venue: Grand Hyatt Hotel, 2F, Drawing Room (No. 2, Song Shou Road, Hsin-yi District, Taipei)

Intel Speaker:

Tom Kilroy, senior vice president and general manager, Sales and Marketing Group

 

Personal Computing Satellite Event and Media Q&A

Event Time: June 5, 3:45-4:35 p.m. (Reception: 3:15-3:45 p.m.)

Event Venue: Grand Hyatt Hotel, 3F, Ballroom (No. 2, Song Shou Road, Hsin-yi District, Taipei). A media Q&A session with the speakers will immediately follow from 4:35-5 p.m.

Intel Speakers:

Kirk Skaugen, vice president and general manager, PC Client Group
Gregory Bryant, vice president, Sales and Marketing Group, and general manager, Asia-Pacific Region

 

Cloud Computing Satellite Event and Media Q&A

Event Time: June 6, 12:50-1:40 p.m. (Reception: 12:30-12:50 p.m.)

Event Venue: Grand Hyatt Hotel, 3F, Ballroom (No. 2, Song Shou Road, Hsin-yi District, Taipei). A media Q&A session with the speakers will immediately follow from 1:40-2 p.m.

Intel Speakers:

Boyd Davis, vice president, Intel Architecture Group, and general manager, Datacenter Infrastructure Group
Gregory Bryant, vice president, Sales and Marketing Group, and general manager, Asia-Pacific Region

INTEL MEDIA SUPPORT AT COMPUTEX:

Please visit the reception counter of the Intel Exhibition Showcase at 4/F, TWTC Nangang Exhibition Hall, to access the latest Intel news releases, fact sheets and other media materials.

MEDIA CONTACTS:

Intel Corporation:

Kari Aakre, Intel PR manager, +1-503-696-5068, kari.e.aakre@intel.com

Shardae Chiu, Intel PR manager, +8862-2544-7752, shardae.chiu@intel.com

 

Pallas PR Agency:

Jennifer Chen, Pallas PR, +8862-2719-5077 Ext. 223, jennifer@pallaspr.com.tw

Elsa Chang, Pallas PR, +8862-2719-5077 Ext. 220, elsa.chang@pallasrp.com.tw

MAPS:

Bellavita & Taipei International Convention Center & Grand Hyatt Hotel

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B1, Gallery Room, Bellavita

map2.jpg

 

3F, Plenary Hall, Taipei International Convention Center (TICC)

map3.jpg

 

2F, Drawing Room, Grand Hyatt Hotel

map4.jpg

 

3F, Ballroom, Grand Hyatt Hotel

map5.jpg

Today, Intel released its 2011 Corporate Responsibility Report, which includes highlights from 2011 and new 2020 environmental goals. The 2011 highlights include Intel’s achievements in supply chain, renewable power, employee engagement, green building design and education. The 2020 goals include items such as 25x increases in notebook and data center product energy efficiency and 10 percent reduction in direct greenhouse gas emissions on a per chip basis. View the press release and the full report.

On this prestigious and sugary occasion, we give you the top apps to commemorate National Chocolate Chip Day! Before tackling teaspoons of this and tablespoons of that, make sure you have your culinary questions answered with Wolfram Alpha. Then use cupNoz to quickly convert measurements for and while cooking. In between kneading dough and sprinkling chips, listen to mySongBook Player, an app that gives you access to full scores and songbooks. Once the baking is complete, share pictures of your chocolate chip success with the Snap! app.

Publishes 2011 Corporate Responsibility Report

 

NEWS HIGHLIGHTS

  • In its 2011 Corporate Responsibility Report, Intel sets new 2020 environmental goals to extend its path of innovation and environmental responsibility.
  • Intel incorporated an integrated approach into this report, providing information on the connection between corporate responsibility performance and the creation of business value.
  • Intel also reports on increased supplier assessments, renewable power and energy efficiency successes, employee engagement and green building design, among other topics.

 

 

SANTA CLARA, Calif., May 17, 2012 – Building on nearly 2 decades of reporting on its environmental commitments and performance, Intel Corporation today released its 2011 Corporate Responsibility Report, which includes new 2020 environmental goals to drive continuous improvement in the company's manufacturing operations and the energy efficiency of its products. Intel's new 2020 environmental goals include:

 

  • Reduce direct greenhouse gas emissions by 10 percent on a per chip basis by 2020 from 2010 levels1.
  • Design all new buildings to a minimum Leadership in Energy and Environmental Design (LEED) Silver Certification between 2010 and 2020.
  • Increase the energy efficiency of notebook computers and data center products 25 times by 2020 from 2010 levels2.
  • Achieve additional energy savings of 1.4 billion kWh from 2012 to 2015, and publish additional energy conservation targets for 2016–2020 in its 2012 report.
  • Reduce water use on a per chip basis below 2010 levels by 2020.
  • Achieve zero chemical waste to landfill by 2020.

 

"At Intel, corporate responsibility is a crucial component to the overall growth of our business," said Michael Jacobson, Intel's director of corporate responsibility. "From product to customer to employee to environment, corporate responsibility allows Intel to have a greater and more influential impact on industries, communities and the global economy."

 

Other highlights from the 2011 report include:

 

Supply Chain Responsibility

  • Intel was again recognized in the Gartner Supply Chain Top 25 list for excellence in supply chain management, ranking 16th in 2011, up from 18th in 2010 and 25th in 2009.
  • To address the issue of conflict minerals, through the end of 2011, Intel had identified 98 smelter sites and visited 48 of them in 16 countries to lay the groundwork for third-party audits. Intel's goal is to demonstrate that its microprocessors are validated as conflict-free for tantalum by the end of 2012, and to manufacture the world's first microprocessor fully validated as conflict-free across all four minerals (gold, tantalum, tin and tungsten) by the end of 2013.

 

Renewable Power

  • For the past 4 years, Intel has been recognized as the largest voluntary purchaser of green power in the United States, under the U.S. Environmental Protection Agency's Green Power Partnership program.
  • Since 2009, Intel has collaborated with third parties to complete 15 solar electric installations across nine Intel campuses in Arizona, California, New Mexico, Oregon, Israel and Vietnam — collectively generating more than 5 million kWh per year of clean energy.
  • Since 2001, Intel has invested more than $58 million and completed over 1,563 energy conservation and energy efficiency projects, saving more than 825 million kWh of energy, or the approximate CO2 emissions from the electricity use of more than 70,933 average U.S. homes for 1 year. These investments also enabled Intel to reduce energy costs in 2011 by $10.9 million.

 

Employee Engagement

  • Since 2008, Intel has linked a portion of its employees' variable compensation to environmental sustainability metrics.
  • In 2011, as part of Intel's Environmental Excellence Awards, 62 employee teams from around the world were nominated for their work that helped Intel reduce its environmental impact. In fact, the estimated annual cost savings from the 2011 winning projects exceeded $70 million.
  • In 2011, Intel provided $125,000 in funding for nine employee projects via its Sustainability in Action grant program — including the installation of a rainwater harvesting project at a school in Israel and the design of a zero-emissions heating and cooling control and supply system for a local community building in China.
  • In 2011, 50 percent of Intel employees donated over 1.1million hours of service through the Intel Involved volunteer program — an average of 13 hours per employee — at 5,100 schools and nonprofit organizations in 45 countries.

 

Green Building Design and LEED Certification

  • By the end of 2011, Intel had achieved LEED Silver Certification for a total of 18 buildings across five sites in Arizona, Costa Rica, China, Israel and Malaysia.

 

Education

  • In 2011, Intel reached its goal of providing professional development through the Intel Teach® program to over 10 million teachers in more than 70 countries, reaching over 300 million students. In addition, the program was introduced in Uganda, Zimbabwe, Gabon and Tanzania.
  • In 2011, Intel launched She Will, a campaign to educate and empower girls and women around the world by fostering equal economic and educational opportunities.

 

Intel has provided public reports on its environmental, health and safety performance since 1994 and produced an annual Corporate Responsibility Report since 2001. To read the new report, visit www.intel.com/go/responsibility. More information on Intel's corporate responsibility programs can be found at the CSR@Intel blog and on Twitter.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 Assuming a typical chip size of approximately 1 cm2 (chips vary in size depending on the specific product).

 

2 Data center energy efficiency is determined by server energy efficiency (as measured by SPECPower_ssj2008 or equivalent publications and using a 2010 baseline of an E56xx series processor-based server platform) as well as technology adoption that raises overall data center work output (such as virtualization technology). Notebook computer energy efficiency is determined by average battery life, battery capacity and number of recharge cycles of volume notebook computers in that model year.

As more personal information is shared online and more business transactions are made using technology, companies and consumers alike need to take security of their information and data into consideration.  Leaders from McAfee, HP, MasterCard, and Ubiquisys discuss the technology behind protecting personal data and maintaining consumer privacy in a world where social sharing, and commonly oversharing, has become the norm.  Visit Intel's 60 Second Insights for the latest executive perspectives.  

“iQ by Intel,” launched today as a public beta, is a new publishing platform curated by researchers, engineers and visionaries at Intel. The site, at iQ.intel.com, is inspired by technology trends of how people discover and share content online. iQ is focused on the larger global impact of technology on our world. Specifically, it serves as a discovery tool that narrates technology’s influence and effect on “Media,” “Life” and our “Planet." It’s here to remind us of how fast we’re moving as a global culture, to be cognizant of how far we’ve come as humankind and to reflect on where our planet is headed in the 21st century. The iQ platform was created to spotlight how people are using technology in inspiring ways, and its mission is simple: Share and source content that inspires, educates, entertains and helps all of us to better understand our modern world.

Intel today announced its 3rd generation Intel® Core™ vPro™ processor platform that will deliver innovations in performance, security, and automation. As part of that announcement, the company also released the latest version of Intel® Setup and Configuration Software (Intel® SCS). Intel SCS allows organizations to discover, setup and configure, and establish a secure connection to every vPro managed device on its network. Click to learn more about how to use Intel SCS for unlocking the features and the value of systems with Intel Core vPro technology.

Today Intel announced its 3rd generation Intel® Core™ vPro™ processors based on Intel’s 22nm microarchitecture. Businesses can take advantage of the latest Intel Core vPro processors through a multitude of devices including Ultrabook™ devices, laptops, desktops, workstations and all-in-one PCs. In addition, the 3rd generation Intel Core vPro processors are poised to accelerate the move from isolated, fixed-function systems to intelligent systems in industrial, healthcare and retail sectors.

Dr. Genevieve Bell, director of user interaction and experience at Intel was named by WITI (Women In Technology International) as one of the the recipients of the 17th Annual WITI Hall of Fame Awards. The Women in Science and Technology Hall of Fame Awards are considered among the most illustrious honors for women in science and technology as noted by Rob Enderle, president and principal analyst of the Enderle Group.

NEWS HIGHLIGHTS

  • The 3rd generation Intel® Core™ vPro™ processor platform provides businesses and intelligent system designs the security, performance and form factor improvements needed to compute with confidence.
  • Embedded security features help businesses protect themselves in four ways: threat management, identity and access, data protection, and monitoring and remediation.
  • Future Ultrabook™ devices built with the 3rd Generation Intel Core vPro processor platform are designed to bridge the gap between IT and business end users.
  • Enhanced designs help accelerate the move from fixed function and disconnected systems to intelligent systems in retail, industrial and healthcare industries.

 

 

SANTA CLARA, Calif., May 15, 2012 - Today's IT managers face a range of challenges from complex business processes to sophisticated security threats. Additionally, a number of industries such as retail, healthcare and industrial are turning to technology to develop innovative solutions to solve the unique challenges facing them in an increasingly connected world. To address these challenges, Intel Corporation has announced the availability of its 3rd Generation Intel® Core™ vPro™ processor-based platforms for business and intelligent systems.

 

The enhancements to the Intel Core vPro processor platform provide a more secure platform for business computing and drive the next wave of innovation in intelligent systems. The Intel Core vPro processor-based platforms address the realities of today's business climate, where data integrity and organizational efficiency create a competitive advantage. New capabilities embed security at every layer, including the silicon, without compromising performance. Software innovation allows IT managers to set up and configure systems within minutes to quickly implement compelling solutions. Additionally, the enhanced graphics and secure manageability help accelerate the transition and growth in intelligent systems for the retail, industrial, and healthcare industries.

 

"With the 3rd generation Intel Core vPro processor platform, Intel is leading the way into a new era, delivering the comprehensive and manageable computing solutions to business that enable them to deal with security threats, while providing the flexibility and form factors users demand," said Rick Echevarria, vice president, Intel Architecture Group and general manager, Business Client Platform Division.

 

Businesses can take advantage of the latest Intel Core vPro processor platform through a multitude of devices including Ultrabook™ devices, laptops, desktops, workstations and all-in-one PCs.

 

Embedded Security

To defend against identity theft, Intel introduced Intel® Identity Protection Technology with public key infrastructure (Intel® IPT with PKI) into Intel Core vPro processors. The technology provides a new second layer of authentication embedded into the PC that allows websites and business networks to validate that a legitimate user is logging in from a trusted PC by using a private key stored in a PC's firmware. Intel has been working with solution providers and online Web properties such as Feitian, InfoSERVER, Symantec and VASCO to take advantage of Intel IPT technology to ultimately safeguard users' identity.

 

The latest version of the Intel Core vPro Processor platform also features Intel® OS Guard and Intel® Secure Key. Intel Secure Key, with Intel® AES New Instructions, protects media, data and assets from loss, while Intel OS Guard detects and prevents malware.

 

Strengthened security from the Intel Core vPro processor platform and McAfee* includes tools such as ePO Deep Command and allow for secure data exchange across increasingly connected ecosystems such as healthcare where doctor's offices share sensitive information with labs and hospitals.

 

Remote Management and Automation

The Intel Core vPro Processor family includes Intel® Active Management Technology (Intel® AMT) to remotely manage computing issues. Businesses in a range of industries can use Intel AMT to achieve power savings, remote management and inventory control. For example, retailers with point-of-sale machines, digital signs or other intelligent devices can remotely diagnose and quickly fix problems over their network so customer transactions are not interrupted and sales are not lost. With a typical IT service call averaging $200 in a retail environment, large-scale retailers can save millions of dollars in service calls with the ability to remotely manage thousands of systems using Intel AMT.

 

Industrial computing systems can also use 3rd generation Intel Core processors to consolidate multiple automation functions onto one platform so factories can achieve greater efficiencies in managing all devices and systems. Once all devices and systems are connected, factory managers can collect real-time data for decision making, diagnosis and predictive maintenance.

 

Intelligent Performance

The 3rd generation Intel Core vPro processors continue to enhance the computing experience in all areas, including the use of business intelligence and big data. The 3rd generation Intel Core vPro processors put greater performance in the hands of more information workers, giving them the ability to access and glean insights from all the information accumulating in their data banks, right on their PC. With the power to handle and manipulate this information faster, familiar PC tools such as Excel are evolving to support this process of creating, collaborating and sharing big data insights.

 

Additionally, the 3rd generation Intel Core vPro processor family drives significant improvements in compute performance as well as media and graphics capabilities for intelligent systems to meet the needs of compute-intensive applications in retail, industrial and healthcare industries. For example, the support for up to three independent displays makes it possible for a digital sign to drive more displays out of one system versus the previous-generation Intel Core processors. With Intel® Quick Sync Video and Intel® Clear Video HD Technology, medical diagnostic equipment can convert and process digital images and video streams faster, enabling delivery of smoother visuals for healthcare professionals to make timely and accurate diagnoses. The technology also enables end-to-end high definition video conferencing for business users.

 

The performance improvements also provide the processing power needed to run real-time analytics applications such as Intel® Audience Impression Metrics Suite (Intel® AIM Suite). Intel AIM Suite is an audience detection technology designed for digital signs and retail solutions that need instant metrics gathering to offer more targeted advertising and advanced measurement.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Intel Core vPro, Ultrabook and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Celebrating 25 years in Brazil, Intel today held its Intel Developers Forum in Brazil, now the world’s third largest PC market after China and the US. The event included announcements of Banco do Brasil adopting Intel’s Identity Protection Technology for its online banking customers. In addition, Intel announced a public school initiative that will put Classmate Convertible PCs into the hands of over 160,000 Brazilian elementary school students. Intel first launched its Education Program in Brazil over a decade ago, and has since helped 500,000 students across 600 cities there.

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