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Honeybees provide up to 90 percent of the crop pollination that results in one third of our daily diet, however the U.S. honeybee population is declining at an alarming rate. To help revive the declining honeybee population, a team of Intel employees installed five bee boxes housing 200,000 bees on Intel's Folsom campus last month. The initiative was funded through Intel’s Sustainability in Action grant program, where employees can submit project ideas that foster environmental sustainability. In 2011, Intel provided $125,000 in funding for nine employee projects. To learn more about this project, read the blog post.

Whether you're spending the summer traveling or taking advantage of a stay-cation, make sure to download these apps from Intel AppUp® center. Use Grooveshark, a worldwide music library with no audio ads or listening limits. Catch up with your favorite Bollywood movies and the latest Bollywood celebrity news with Bollywood Movies & More. Get re-organized with Seesmic Ping, an app that allows for simultaneous posting to several social media accounts, including Facebook and Twitter. Share your vacation pictures and videos among all your devices with SugarSync, which enables you to sync and backup across platforms.

Intel Capital has made its first ever Ghana investment in Rancard Solutions, a provider of cloud-based mobile software. Ghana marks the 52nd country Intel Capital has invested in globally and is the second investment in Africa following the 2011 investment in South Africa's Altech. Rancard joins Intel Capital’s extensive list of technology investments in emerging markets including Brazil, Russia, Vietnam and India. With approximately half of investments made internationally, Intel Capital actively seeks innovation all over the world, with the intention of enabling each region to develop a thriving technology ecosystem. Learn more about Intel Capital's investment in Rancard here.


  • Intel commits €829 million (approximately $1.0 billion) to ASML's research and development programs to help accelerate deployment of new technologies for 450-millimeter (mm) wafers and extreme ultra-violet (EUV) lithography by as much as two years
  • Intel to also initially purchase 10 percent of pre-transaction issued shares of ASML for €1.7 billion (approximately $2.1 billion) and commit to purchase an additional 5 percent of post-transaction issued shares as part of ASML's program to enable minority investments of up to a 25 percent equity stake to its largest customers
  • R&D funding and equity investment agreements totaling €3.3 billion (approximately $4.1 billion)
  • Continued research and development in the field of lithography is critical to the long-term growth of the semiconductor industry


SANTA CLARA, Calif., July 9, 2012 – Intel Corporation today announced it has entered into a series of agreements with ASML Holding N.V. intended to accelerate the development of 450-millimeter (mm) wafer technology and extreme ultra-violet (EUV) lithography totaling €3.3 billion (approximately $4.1 billion). The objective is to shorten the schedule for deploying the lithography equipment supporting these technologies by as much as two years, resulting in significant cost savings and other productivity improvements for semiconductor manufacturers.


To achieve this, Intel is participating in a multi-party development program that includes a cash contribution by Intel to fund relevant ASML research and development (R&D) efforts as well as equity investments in ASML. The first phase of this program consists of Intel committing to R&D funding of €553 million (approximately $680 million) to assist ASML in accelerating the development and delivery of 450-mm manufacturing tools, as well as an equity investment of €1.7 billion (approximately $2.1 billion) for approximately 10 percent of ASML's pre-transaction issued shares. Intel will record the R&D investment as a combination of R&D expense and pre-payments on future tool deliveries.


The second phase of the program is conditioned upon ASML shareholder approval. It includes an additional commitment by Intel of R&D funding of €276 million (approximately $340 million) in ASML focused on accelerating EUV, as well as an equity investment of €838 million (approximately $1.0 billion) for an additional 5 percent of ASML post-transaction issued shares.


Intel will then hold a total of 15 percent of ASML's issued shares. The total equity investment will be €2.5 billion (approximately $3.1 billion). As part of these agreements, Intel is also committing to advanced purchase orders for 450-mm and EUV development and production tools from ASML.


Both phases of the program are subject to standard closing conditions, including customary regulatory approvals. The companies expect both phases of the transaction to close after the shareholder vote in the third quarter.


Summary of Agreements


Phase 1 450-mm LithographyPhase 2 EUV LithographyTotal
R&D Investment in ASML€553 million (~$680 million) over 5 yearsIncremental €276 million (~$340 million) over 5 years€829 million (~$1.0 billion) over 5 years
Equity Investment in ASML€1.7 billion (~$2.1 billion), 10 percent of pre-transaction sharesIncremental €838 million (~$1.0 billion), 5 percent of post-transaction shares€2.5 billion (~$3.1 billion) 15 percent of post-transaction shares
Total€2.2 billion (~$2.7 billion)€1.1 billion (~$1.4 billion)€3.3 billion (~$4.1 billion)
StatusPending regulatory approvalPending regulatory and ASML shareholder approvals


"Productivity improvements driven by enhanced wafer manufacturing technologies, especially larger silicon wafers and enhanced lithography technologies with EUV are direct enablers of Moore's Law, which delivers significant economic benefits to consumers," said Brian Krzanich, Intel senior vice president and chief operating officer. "The transition from one wafer size to the next has historically delivered a 30 to 40 percent reduction in die cost and we expect the shift from today's standard 300-mm wafers to larger 450-mm wafers to offer similar benefits. The faster we do this, the sooner we can gain the benefit of productivity improvements, which creates tremendous value for customers and shareholders."


ASML has stated its intention to sell up to a 25 percent aggregate stake in the company (on a post-transaction basis) to Intel and other semiconductor manufacturers in this program. ASML is currently in discussions with other customers and has publicly indicated it expects others in the industry to participate in the R&D and equity program. Regardless of the outcome of ASML's discussions with other customers and upon completion of this two-phase program, Intel's ownership stake in ASML will not exceed 15 percent of ASML's post-transaction issued shares and will be subject to lock-up and voting restrictions.


Intel intends to fund its R&D and equity investments in ASML from cash on hand at its offshore subsidiaries.


"We are extremely encouraged that Intel has made these investments, which will benefit every semiconductor manufacturer in the industry," said Eric Meurice, president and chief executive officer of ASML. "We hope to be able to announce additional investments by our other customers in the coming weeks."


A critically important aspect of this transaction is the additional funding it provides for ASML's industry-leading EUV development program. When deployed in conjunction with 450-mm wafer production, the productivity and cost benefits of EUV will be substantial for Intel and other semiconductor manufacturers. Intel was involved in the formation of the first EUV consortium in 1997. With these additional R&D investments for EUV, ASML and Intel hope to help lead the semiconductor industry in the transition to this critical technology.


Risk Factors

This press release contains forward-looking statements regarding the proposed transactions between Intel and ASML, including but not limited to statements regarding future Intel equity investments in ASML; future Intel R&D investments in ASML and in the development of 450-mm wafer technology and EUV lithography and production tools; the timing and benefits of developments in 450-mm wafer technology and EUV lithography; Intel's intentions regarding purchase orders for 450-mm and EUV development and production tools; and ASML's intentions regarding R&D and equity investments by third parties. Actual events or results may differ materially from those contained in these forward-looking statements. Among the important factors that could cause future events or results to vary from those addressed in the forward-looking statements are risks and uncertainties arising from, among other things, the possibility that one or more closings of the transactions may be delayed or may not occur; difficulties or delays in research and development of 450-mm and EUV technologies; the ability of Intel and ASML to retain key employees and customer and supplier relationships; demand for and market acceptance of products produced using such technologies or competing technologies; developments in competing technologies; pricing pressures and actions taken by competitors; the timing and execution of the manufacturing ramp, and manufacturing yields, at Intel's production facilities; and litigation or regulatory matters involving intellectual property, antitrust and other issues that could affect the closings of the transactions, the future operation of Intel or ASML and/or Intel's or other entities' dealings with ASML.


In addition, please refer to the documents that Intel files with the SEC on Forms 10-K, 10-Q and 8-K. The filings by Intel identify and address other important factors that could cause events and results to differ materially from those contained in the forward-looking statements set forth in this press release. Intel is under no duty to update any of the forward-looking statements after the date of this press release to conform to actual results.


EDITOR'S NOTE: A conference call hosted by Intel executives is planned for 2:15 p.m. PDT. To view the webcast live, please visit http://investor.shareholder.com/media/eventdetail.cfm?eventid=116011&CompanyID=ABEA-3VZHGF&e=1&mediaKey=A21887C59EBAAC12F1BCF4D43C080953


About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.


Intel is a trademark of Intel Corporation in the United States and other countries.


* Other names and brands may be claimed as the property of others.



  • Intel is a key technology partner supporting CERN in processing and distributing the massive data coming from the Higgs boson search.
  • CERN openlab is an important partner of the Intel Labs Europe Network demonstrating Intel's commitment to R&D in Europe.



GENEVA (SWITZERLAND), 4 JULY 2012 – Intel Corporation congratulates CERN, the European Organization for Nuclear Research, and the LHC community on the progress on the Higgs boson search. Intel is proud to partner with CERN through joint research to accelerate the development of innovative solutions used by the worldwide LHC community and hence to participate in the quest for the most coveted physics particle – the Higgs boson.


"The CERN team, which unites some of the most authoritative thinkers and physicists worldwide, always impresses us with its research," said Christian Morales Intel Vice President and General Manager, Europe, Middle East and Africa. "Intel is proud to be a technology partner with leading edge products and technologies to support the research around Higgs boson and look forward to working with CERN on unlocking even more mysteries of the universe."


Intel has been a major contributor to CERN openlab since 2003 and has been working with the researchers by participating in joint research and providing access to pioneering hardware and software technology to help them better understand the impact of massive amounts of data in a real world grid environment.


"CERN openlab is an amazing test environment where both scientific discoveries and technological innovation can be strongly validated," said Stephen Pawlowski, Intel Senior Fellow, Chief Technology Officer, Datacenter and Connected System Group and GM Intel Architecture Group. "We are proud to be a member of CERN openlab, which is an important partner of the Intel Labs Europe Network, and this collaboration strengthens Intel's commitment to European R&D".


For any further information:


About CERN:www.cern.ch

About CERN openlab: www.cern.ch/openlab

About WLCG: www.cern.ch/wlcg


About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.


Intel is a trademark of Intel Corporation in the United States and other countries.


* Other names and brands may be claimed as the property of others.

This summer, keep your mind agile with the following games from Intel AppUp® center. PBS Kids offers fun and educational pursuits with some of your all-time favorite characters, including Dr. Suess and Curious George. Download the highly acclaimed Dreamalings Playground for a family-friendly learning adventure that uses music, art, color, drama and more to cultivate smarts. Then, reconnect with classic arcade creatures like Pac-Man and Sega Classics - Sonic Spinball.

Connects Research to Real Life at 10th Anniversary R&D Event, Announces Latest Joint Academic Research Center



  • Intel Labs completed the roll-out of its $100 million Intel Science and Technology Center (ISTC) program.
  • The seventh ISTC is focused on social computing and hosted at the University of California, Irvine in collaboration with several other universities.
  • More than 20 research projects from around the globe explored technologies to change lives over the next 10 years, from smart cities, homes and offices to the way we shop, communicate and drive.
  • Intel Labs showcased a 10th anniversary Hall of Fame, highlighting key technologies invented by Intel Labs over the past decade that are now incorporated in products that impact the world.



SAN FRANCISCO, June 26, 2012 – Intel Labs opened its doors to media and analysts today on the 10th anniversary of Research at Intel. Justin Rattner, Intel Corporation chief technology officer, unveiled a "Facets of Future Life" showcase that featured more than 20 innovative research projects underway that will help transform the future of technology.


Rattner also announced the seventh Intel Science Technology Center (ISTC) focused on social computing and Intel's first university collaboration to focus specifically on user experience design.


Intel's ISTC -Social is hosted at University of California, Irvine, and includes partnerships with research groups at Cornell, Georgia Tech, Indiana University and NYU. The center represents the next $15 million installment that completes Intel's initial 5-year, $100 million ISTC program, first announced in January 2011. As with the other six ISTCs -- covering big data, cloud computing, embedded computing, visual computing, secure computing and pervasive computing -- the new social computing center is designed to foster tighter collaboration between Intel and academia. The center aims to create a new paradigm for computing and productive new research by a community of social scientists and technologists.


"Complementing Intel's acknowledged leadership in experience-driven innovation we have formed a multidisciplinary community of Intel, faculty and graduate student researchers from diverse fields to bridge the gap between technical and social disciplines to better advance each others' work," Rattner said. "This experience-driven approach can also be seen in technologies from across Intel Labs demonstrated here today, as well as our wildly successful inventions of the past. Past Intel Labs research has resulted in tangible products that impact our daily lives and our research today will enrich our future lives."


ISTC-Social will focus its research on exploring information technology and digital media as social and cultural phenomena. Referred to in academic circles as "the third wave" of social computing, people's digital and social lives will become more and more intertwined over time, providing opportunities for innovation in areas such as how they relate to each other through data and how groups can utilize digital tools to engage with others to make changes in the world. ISTC-Social seeks to stand at the forefront of how people use massively networked, mobile and cloud computing to realize new opportunities for progress.


"Facets of Future Life" Showcase

Demonstrations at the Research at Intel event are housed in four interactive zones connected by a cross-disciplinary "Sustainable Living Center" that explores the smart city, home and office of the future. The zones feature:


My Life: Gesture-driven and energy-conscious technologies to enhance and transform home living include in-home sensors that allow people to imagine a context-aware, worry-free and protected experience where keys no longer exist; updates to the "Magic Mirror" virtual dressing room technology incorporating 3-D human avatars that accurately map body shape and move realistically; and, technology that allows users to display and interact with media content on arbitrary surfaces such as a wall or counter in the home.


My Car: Innovations explore the connections among people, the highway and the information superhighway to enhance the driving experience. One demonstration showcases a prototype headlight system that would allow drivers to see through the rain. Utilizing software and Intel® architecture for imaging, illumination and computations, it avoids illuminating rain drops.


My Job: Enhanced meetings, dependable cloud services and visual analytics promise to transform the way we work. Demos include a Smart Meeting Assistant that combines and tunes several technologies to create a real-time transcription, captioning and translation experience for group meetings; three visualization demonstrations tackling "Big Data" challenges using data visualization and optimization algorithms to help identify important patterns and relationships to encourage exploration, knowledge discovery and support decision making.


Tech Essentials: Foundational innovations that will shape future devices and websites, and serve as the portals to future technology experiences, the zone features a host of technologies running the gamut from work from the visual computing ISTC developing core technologies that will enable high-fidelity, scalable, real-time, virtual characters that exhibit realistic behavior; 3-D browsing experiences built on "River Trail" technology; novel techniques to protect the privacy of user data in the cloud using a facial recognition application to authenticate users; and an intelligent video server that can stream video to several client devices simultaneously while tailoring the stream for the type of device people are using.


Sustainable Living: Technologies and services that will give people, service providers, authorities and devices the ability to seamlessly interact in a trusted environment. Intel Labs has developed a variety of novel sensors, software aggregators, actuators and interfaces that when combined can respond to these challenges. On display are technologies that manage and control energy usage in the home, create smart office buildings with localized control, as well as Intel-created sensors that help with traffic congestion, water and air quality, and even electric charging station infrastructure.


10th Anniversary Research to Reality Hall of Fame

For over 2 decades, researchers at Intel's R&D Labs have been producing groundbreaking technologies that enrich everyday life and reinvent the ways that people experience computing. In 2001, Intel founded the organization that is today known as Intel Labs and in 2003 it hosted the first Research at Intel event to showcase the diversity of ongoing research projects from around the globe. Research at Intel 2012 marks the event's 10th anniversary, and to commemorate the occasion Intel Labs built a digital display to celebrate 10 technologies imagined and invented by Intel Labs researchers that eventually became or were built into Intel products. These technologies, including the ThunderboltTM, Intel® AtomTM processor, Intel® Wireless Display and more, created entirely new or helped dramatically enhance the user experiences and capabilities of computing products.


More information on Research@Intel 2012 including presentations and pictures are available at www.intel.com/newsroom/research.


About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.


Intel, Thunderbolt, Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries.


* Other names and brands may be claimed as the property of others.

Today, Schneider Electric, a global specialist in energy management and one of two IDC "market leaders" in data center infrastructure management (DCIM), announce Schneider Electric's StruxureWare™ will soon feature aggregated power and thermal data from Intel® Data Center Manager (DCM). While global companies currently deliver proprietary DCIM products, this is the industry’s first agreement between two major global leaders to produce non-proprietary DCIM products to meet the growing demand for granular power data that is based on actual consumption, not on rated or estimated data. The first integrated product begins shipping in later this month.

Ever wonder what became of the research shown at the Research@Intel annual event? Check out some of the great technologies in market now or coming soon that were invented in the Intel Labs. Members of the media, be sure to attend the 10th Anniversary Research@Intel event next week to avoid missing out on the "next big thing" in research. Media can register by e-mail, julia.allyn@ogilvy.com or tune into one of the livestreams.

Intel Capital has led a $38 million investment round in Moscow-based KupiVIP Holding, an operator of popular Russian fashion ecommerce websites. The company operates KupiVIP.ru, the largest online Russian shopping club that offers over 1,500 brand name designer fashions and accessories at up to 90% off through daily flash sales. KupiVIP also operates ShopTime.ru which provides a wide assortment of fashion products, as well as white label ecommerce services to global fashion brands to help them operate online stores in Russia. Intel Capital’s investment in KupiVIP follows the organization’s 2011 investment in Sapato, another leading ecommerce retailer in Russia specializing in footwear, which was recently acquired by Ozon.

Today during the Structure Conference in San Francisco, Jason Waxman, GM of the Cloud Infrastructure Group outlined Intel’s vision and roadmap for microservers and discussed how they best suited to handle emerging “scale-out” applications. Waxman provided an update on Intel's roadmap for microservers including new generations of Intel® Xeon® processors and Intel® Atom™ architecture based 22nm SoC chips codenamed "Avoton", both scheduled for 2013. In his blog Jason also talks about why within the new segment of servers it is the application that will decide which core – Intel Atom or Xeon - will be the optimal solution. Waxman's presentation can be found here.

Justin Rattner, Intel chief technology officer spoke about the importance of U.S. innovation to job creation, the economy and the future of U.S. competitiveness at the U.S. Innovation Summit in Washington D.C.  Rattner discussed how Intel undertook a transformation in their approach to research and innovation and how far they've come in the past few years. This approach is a 21st century model of industrial research in contrast to the 20th century model of Bell Labs and the many U.S., European, and Asian companies that copied the Bell Labs model in the past. For the full transcript check out Rattner's blog.

Summertime is the perfect time to update your various social media accounts. With Seesmic Ping you can post to several accounts simultaneously, including those on Twitter, Facebook and LinkedIn. Streamline your Facebook with MenuTab for Facebook, an app that offers quick access to your account directly from the Notification Area. For Twitter, download BlueBirds and categorize your information sources to show timelines, mentions, favorites and profile details in a compact interface. Finally, keep your social media experience secure with McAfee Site Advisor, which adds site rating icons to your search results to alert you to risks and safer alternatives.

The White House has invited one of the 2009 Intel Science Talent Search winners, Gabriela Farfan, to help celebrate the 40th anniversary of Title IX. The Council on Women and Girls is hosting an event Wednesday, June 20, that will feature Farfan in a panel discussion on "Advancing Our Commitment to Title IX in Education." At 2:00 p.m. EST, the event will be livestreamed on www.whitehouse.gov/live. Learn more about Intel’s education initiatives here.


  • Nearly half of all travelers feel anxious without their mobile computing device
  • Nearly three-quarters of young Americans admit to suffering "outlet outrage" when traveling
  • "Peeping-tech" behaviors rank amongst travelers' top peeves while almost half fear device heists



SANTA CLARA, Calif., June 20, 2012 – A new survey conducted by Intel Corporation and commissioned by TNS to explore American attitudes towards travel and technology finds U.S. vacationers feel anxious when traveling without their mobile computing device, angry when they cannot access power sources to charge these devices and annoyed when others take uninvited glimpses of their computer screens, potentially compromising their personal information.


The "Intel Survey: Tech Norms for Travelers," exposed the deepening love affair between travelers and their Ultrabook™ devices, laptops and tablets, revealing Americans feel an emotional bond with these mobile devices to the point of feeling calmer and less stressed when they have access to this technology while vacationing.


Almost half (44 percent) of U.S. travelers admitted feeling anxious traveling without their mobile computing device (Ultrabook, tablet or laptop), and 87 percent of young adults (18-29 years old) feel happier when traveling with their devices. Survey respondents also ranked losing these mobile computing devices when traveling as more stressful than losing their wedding ring (77 percent vs. 55 percent).


Travelers' co-habitation with their devices has become so pervasive that they admit they will go to great lengths to keep connected. Almost half of all travelers (46 percent) and 63 percent of young travelers admit compromising their personal comfort and hygiene in pursuit of a power source to keep their device charged. This includes going out of their way to find an available power outlet, choosing a restaurant or coffee house based on outlet availability, searching public bathrooms or compromising comfort and hygiene to sit on the floor near an outlet. Sixty-four percent of survey respondents admitted to sacrificing their personal appearance – giving up hair dryers or styling tools, toiletries, sunscreen, workout clothes and even shoes – in favor of making space in their luggage for their beloved device.


"With summer travel now in full swing, we find that many people have a few common must-have items on their trip packing lists – Ultrabook, tablet and laptop. The bond between travelers and their tech devices has strengthened greatly over the past few years with the explosion of instant information, entertainment and services conveniently available on the Web," said Mike Fard, Intel Ambassador. "Gone are the days of travel as simple escape of 'daily life' as more people seek to enhance and share vacation experiences in real-time and use technology to truly make travel more fun and more memorable."


Tech Travel Syndromes: Key Survey Findings

Today's traveler has increased expectations and views each connected minute as invaluable, desiring to create, consume and share safely with a mobile device that is easy on the eye, and the back, with style and design paired with performance and long battery life. From the introduction of Intel® Centrino® mobile technology in 2003 to the creation of the Ultrabook category last year, Intel has fueled the emergence of go-everywhere technology.


Ultrabook devices inspired by Intel feature innovations tailor-made to address the anxieties of today's traveler, alleviating "outlet outrage" with a minimum of 5 hours of battery life and instant on capabilities; providing personal security benefits through the Intel® Anti-Theft Technology and Intel® Identity Protection Technology; and delivering stylish systems that are less than one inch thick and offered in touch-enabled and convertible designs later this year.


Tech Turbulence

  • Female travelers admit greater travel anxiety than men, being significantly more likely than male travelers to report losing their mobile computing device as very stressful (82 percent vs. 73 percent).
  • Three-quarters of all travelers surveyed bring their mobile computing device to stay connected to friends and family (75 percent), bucking the idea that dependence on technology detracts from time with family and friends.


Outlet Outrage

  • Sixty-three percent of young travelers admitted going out of their way to secure power for their device including compromising their comfort and hygiene by sitting on the floor (37 percent), searching public bathrooms (15 percent) or choosing a restaurant or coffee house based on outlet availability (33 percent).
  • Seventy-five percent of young travelers and 62 percent of all survey respondents are willing to pay more for a mobile computing device with longer battery life for when they travel.
  • Despite our tech addictions, 52 percent of all travelers are annoyed by the physical burdens traveling with technology brings, including heavy mobile devices, power cords and battery packs, and pulling their device out of their bag to go through the airline security check.

"Peeping-Techs" and the Fear of Device Heists

  • Forty-six percent of travelers say their biggest pet peeves about traveling with technology relates to device security, including worrying the device may be lost or stolen and someone glancing at their screen. This concern rises to 62 percent among young adult travelers.
  • Despite this reported paranoia, around one-quarter of travelers (26 percent) fail to take basic security precautions and admit to security risks including entering credit card details in public, using unsecured Wi-Fi networks, viewing sensitive documents on their device and even leaving their device unattended.
  • "Peeping-techs" are among travelers' top pet peeves. Half of American travelers (49 percent) admit getting annoyed when the behaviors of others compromise their traveling comfort and security, including screen glancing and viewing inappropriate content, with more than 29 percent of all travelers claiming they've caught fellow travelers peeping at their screens.
  • Despite "peeping-techs" topping the list of travel peeves, more than half (51 percent) of young adults admit to peeping at someone else's screen while 33 percent of travelers admitted being a "peeping-tech."

Mile-High Manners

  • Thirty percent of all travelers do not think they need to power off their devices when they fly.
  • Thirteen percent of young travelers admit to "hogging" an available power source.
  • Men readily admit to flaunting aviation rules in pursuit of connectivity and ignoring requests to power down their devices, with more than one in 10 admitting they have ignored instructions to power off their mobile computing device when flying (13 percent) and personally have been asked by a flight attendant to power off their mobile computing device because they ignored the initial directions (11 percent).

Tech Envy

  • Six in 10 of respondents (64 percent) reported they consider their mobile computing device a personal style accessory.
  • One-fifth of respondents (21 percent) admitted experiencing device envy with significantly more women than men, 34 percent vs. 22 percent, believing other mobile computing devices looked "cooler" than their own.


Survey Methodology

The survey was conducted online within the United States by TNS on behalf of Intel from May 9-13, 2012 among a nationally representative sample of 2,500 U.S. adults ages 18 and older with a margin of error of plus or minus 3.5 percentage points. Respondents were asked about traveling with Ultrabook devices, tablets and laptops. For additional information on the "Intel Survey: Tech Norms for Travelers" visit www.intel.com/newsroom/?travel.



The "Intel Survey: Tech Norms for Travelers" commissioned by TNS exposed the deepening love affair between travelers and their Ultrabook™ devices, laptops and tablets, revealing Americans feel an emotional bond with their mobile devices to the point of feeling calmer and less stressed when they have access to this technology while vacationing.


About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.


Intel, Intel Core, Centrino, Ultrabook and the Intel logo are registered trademarks of Intel Corporation in the United States and other countries.


* Other names and brands may be claimed as the property of others.

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