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Intel Newsroom

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Today, Intel announced the Intel® Ethernet Controller X540, the industry’s first fully integrated 10GBASE-T controller. This space-saving single-chip solution delivers outstanding performance for low-cost, low-power LAN on motherboard (LOM) and Converged Network Adapter (CNA) designs. The Intel Ethernet Controller X540 will help drive broader 10 Gigabit Ethernet (10GbE) adoption by providing connections that are backward-compatible with existing Gigabit Ethernet networks. Like other Intel Ethernet 10 Gigabit products, the Intel Ethernet Controller X540 features advanced I/O virtualization, supports Internet Small Computer System Interface (iSCSI) and Fibre Channel over Ethernet (FCoE), and takes advantage of platform I/O enhancements in the Intel® Xeon® processor E5 family.

New Intel® Xeon® Processor E5-2600 Product Family at Heart of a Flexible, Efficient Data Center

 

NEWS HIGHLIGHTS

  • New Intel® Xeon® processor E5-2600 product family is built to scale to meet the demands of an increasingly connected world.
  • New server processors deliver up to 80 percent1,2 improved performance compared to the prior generation.
  • New Intel® Integrated I/O with PCI Express* 3.0 can up to triple3 the movement of data into and out of the processor so information can be made available faster than ever to support data-hungry applications.
  • Best data center performance per watt with over 50 percent1,4 gain on SPECpower_ssj*2008 plus extends platform power control with Intel® Node Manager and Intel® Data Center Manager.

 

 

SANTA CLARA, Calif., March 6, 2012 – Addressing the incredible growth of data  traffic in the cloud, Intel Corporation announced the record-breaking Intel Xeon processor E5-2600 product family. These new processors deliver leadership performance, best data center performance per watt1,4, breakthrough I/O innovation and trusted hardware security features to enable IT to scale. These processors are not only at the heart of servers and workstations, but will also power the next generation of storage and communication systems from leading vendors around the world.

 

Forecasts call for 15 billion connected devices5 and over 3 billion connected users6 by 2015. The amount of global data center IP traffic is forecasted to grow by 33 percent annually through 2015, surpassing 4.8 zetabytes per year, more than 3 times the amount in 20116. At these levels, each connected user will generate more than 4GB of data traffic every day – the equivalent of a 4-hour HD movie. This will increase the amount of data that needs to be stored by almost 50 percent per year7. In order to scale to meet this growth, the worldwide number of cloud servers is expected to more than triple by 20158.

 

"The growth in cloud computing and connected devices is transforming the way businesses benefit from IT products and services," said Diane Bryant, Intel vice president and general manager of the Datacenter and Connected Systems Group. "For businesses to capitalize on these innovations, the industry must address unprecedented demand for efficient, secure and high-performing datacenter infrastructure. The Intel Xeon processor E5-2600 product family is designed to address these challenges by offering unparalleled, balanced performance across compute, storage and network, while reducing operating costs."

 

The key requirements to enable IT to scale are performance, energy efficiency, I/O bandwidth and security. With the best combination of performance, built-in capabilities and cost-effectiveness, the new Intel Xeon processor E5-2600 product families are designed to address these requirements, and become the heart of the next-generation data center powering servers, storage and communication systems.

 

Leadership Performance with Best Data Center Performance per Watt

Supporting up to eight cores per processor and up to 768GB of system memory, the Intel Xeon processor E5-2600 product family increases performance by up to 80 percent1,2 compared to the previous-generation Intel® Xeon® processor 5600 series. The family also supports Intel® Advanced Vector Extension (Intel® AVX) that increases the performance on compute-intensive applications such as financial analysis, media content creation and high performance computing up to 2 times9.

 

Additional built-in technologies such as  Intel® Turbo Boost Technology 2.0, Intel Hyper-Threading Technology and Intel® Virtualization Technology  provide IT with flexible capabilities to increase the performance of their infrastructure dynamically. These performance advances have led the Intel Xeon processor E5-2600 product family to capture 1510 new dual socket x86 world records.

 

Modern data centers must improve the raw performance they deliver, but also do so efficiently by reducing power consumption and operating costs. The Intel Xeon processor E5-2600 product family continue Intel's focus on reducing total cost of ownership by improving energy efficient performance more than 50 percent1,4 as measured by SPECpower_ssj*2008 compared to the previous generation Intel Xeon processor 5600 series. These processors offer support for tools to monitor and control power usage such as Intel® Node Manager and Intel® Data Center Manager, which provide accurate, real-time power and thermal data to system management consoles. In addition, Intel's leadership performance allows IT managers to meet their growing demands while optimizing software license and capital costs.

 

I/O Innovation and Network Capabilities

With the unprecedented growth in data traffic it is essential that systems not only improve computational abilities, but also enable data to flow faster to support data-hungry applications and increase the bandwidth within the data center. The Intel Xeon processor E5-2600 product family meets these needs with Intel® Integrated I/O (Intel® IIO) and Intel® Data Direct I/O (Intel® DDIO). Intel® DDIO allows Intel Ethernet controllers and adapters to route I/O traffic directly to processor cache, reducing trips to system memory reducing power consumption and I/O latency. The Intel Xeon processor E5-2600 product family is also the first server processors to integrate the I/O controller supporting PCI Express* 3.0 directly into the microprocessor. This integration reduces latency up to 30 percent11 compared to prior generations and with PCI Express* 3.0 can up to triple3 the movement of data into and out of the processor.

 

The high-performance processing power along with Intel® Integrated I/O and advanced storage features such as PCIe* non-transparent bridging and asynchronous DRAM refresh, makes the Intel Xeon processor E5-2600 product family also an ideal choice for storage and communications solutions.

 

Increasing bandwidth demands driven by server virtualization and data and storage network consolidation have led to strong growth in 10 Gigabit Ethernet deployments, with adapter port shipments exceeding 1 million units in each quarter of 201113. Today's announcement of the Intel® Ethernet Controller X540 demonstrates Intel's commitment to driving 10 Gigabit Ethernet to the mainstream by reducing implementation costs. This industry-first single-chip 10GBASE-T solution is designed for low-cost, low-power LAN on motherboard (LOM) and includes flexible I/O Virtualization and Unified networking support at no additional cost.

 

Trusted Security

The Intel Xeon processor E5-2600 product family reaffirms Intel's commitment to providing a more secure hardware foundation for today's data centers. Intel® Advanced Encryption Standard New Instruction (Intel® AES-NI14) helps systems to quickly encrypt and decrypt data running over a range of applications and transactions. Intel® Trusted Execution Technology (Intel® TXT15) creates a trusted foundation to reduce the infrastructure exposure to malicious attacks. These features in partnership with leading software applications will help IT protect their data centers against attack and scale to meet the demands of their customers.

 

Extensive Industry Support

Starting today, system manufacturers from around the world are expected to announce hundreds of Intel® Xeon® processor E5 family-based platforms. These manufacturers include Acer*, Appro*, Asus*, Bull*, Cisco*, Dell*, Fujitsu*, HP*, Hitachi*, Huawei*, IBM*, Inspur*, Lenovo*, NEC*, Oracle*, Quanta*, SGI*, Sugon*, Supermicro* and Unisys*.

 

Product, Pricing Details

The Xeon processor E5-2600 product family will be offered with 17 different parts which range in price from $198 to $2,050 in quantities of 1,000. Additionally three single-socket Intel Xeon processor E5-1600 parts will be offered for workstations which range in price from $284 to $1,080. Complete pricing details can be found in the Intel Newsroom. For more details on these new Intel Xeon processors, visit www.intel.com/xeon. For more details on world records and other claims, visit www.intel.com/performance/server/.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to www.intel.com/performance

 

 

2 (Generational Performance) Source: Performance comparison using best submitted/published 2-socket server results on the SPECfp*_rate_base2006 benchmark as of 6 March 2012. Baseline score of 271 published by Itautec on the Servidor Itautec MX203* and Servidor Itautec MX223* platforms based on the prior generation Intel® Xeon® processor X5690. New score of 492 submitted for publication by Dell on the PowerEdge T620 platform and Fujitsu on the PRIMERGY RX300 S7* platform based on the Intel® Xeon® processor E5-2690. For additional details, please visit www.spec.org. 16.

 

3 (I/O Bandwidth) Source: Intel internal measurements of maximum achievable I/O R/W bandwidth (512B transactions, 50% reads, 50% writes) comparing Intel® Xeon® processor E5-2680 based platform with 64 lanes of PCIe* 3.0 (66 GB/s) vs. Intel® Xeon® processor X5670 based platform with 32 lanes of PCIe* 2.0 (18 GB/s). Baseline Configuration: Green City system with two Intel® Xeon® processor X5670 (2.93 GHz, 6C), 24GB memory @ 1333, 4 x8 Intel internal PCIe* 2.0 test cards. New Configuration: Rose City system with two Intel® Xeon processor E5-2680 (2.7GHz, 8C), 64GB memory @1600 MHz, 2 x16 Intel internal PCIe* 3.0 test cards on each node (all traffic sent to local nodes).

 

4 (Energy Efficient Performance) Source: Performance comparison using best submitted/published 2-socket single-node server results on the SPECpower_ssj*2008 benchmark as of 6 March 2012. Baseline score of 3,329 ssj*_ops/watt published by Hewlett-Packard on the ProLiant DL360 G7* platform based on the prior generation Intel® Xeon® processor X5675. Score of 5,093 ssj*_ops/watt submitted for publication by Fujitsu on the PRIMERGY RX300 S7* platform based on the Intel® Xeon® processor E5-2660. For additional details, please visit www.spec.org.1,16.

 

5 (Connect devices) Source: "Worldwide Device Estimates Year 2020 - Intel One Smart Network Work" forecast

 

6 (datacenter traffic forecast) Source: Cisco® Global Cloud Index: Forecast and Methodology 2010 – 2015. http://www.cisco.com/en/US/solutions/collateral/ns341/ns525/ns537/ns705/ns1175/Cloud_Index_White_Paper.html

 

7 (Data Storage) Source: "IDC Worldwide Enterprise Storage Systems 2010-2014 Forecast"

 

8 (Cloud system) Intel internal projections of cloud market growth between 2011 and 2015

 

9 (AVX) Source: Performance comparison using Linpack benchmark. Baseline score of 159.4 based on Intel internal measurements as of 5 December 2011 using a Supermicro* X8DTN+ system with two Intel® Xeon® processor X5690, Turbo Enabled, EIST Enabled, Hyper-Threading Enabled, 48 GB RAM, Red Hat* Enterprise Linux Server 6.1. New score of 347.7 based on Intel internal measurements as of 5 December 2011 using an Intel® Rose City platform with two Intel® Xeon® processor E5-2690, Turbo Enabled or Disabled, EIST Enabled, Hyper-Threading Enabled, 64 GB RAM, Red Hat* Enterprise Linux Server 6.1. 16.

 

10 (World Record Performance) Source: Best available submitted/published performance benchmark results on 2S x86 server platforms as of 6 March 2012. For a full summary of world record performance results, please visit www.intel.com/content/www/us/en/benchmarks/server/xeon-e5-2600-summary.html . For additional details, please visit www.spec.org, www.sap.com/solutions/benchmark, www.vmware.com/a/vmmark, and www.tpc.org.

 

11 (I/O Latency) Source: Intel internal measurements of average time for an I/O device read to local system memory under idle conditions comparing the Intel® Xeon® processor E5-2600 product family (230 ns) vs. the Intel® Xeon® processor 5500 series (340 ns). Baseline Configuration: Green City system with two Intel® Xeon® processor E5520 (2.26GHz, 4C), 12GB memory @ 1333, C-States Disabled, Turbo Disabled, SMT Disabled. New Configuration: Meridian system with two Intel® Xeon® processor E5-2665 (2.4GHz, 8C), 32GB memory @1600 MHz, C-States Enabled, Turbo Enabled. The measurements were taken with a LeCroy* PCIe* protocol analyzer using Intel internal Rubicon (PCIe* 2.0) and Florin (PCIe* 3.0) test cards running under Windows* 2008 R2 w/SP1.

 

12 (PCIe* 3.0) Source: 8 GT/s and 128b/130b encoding in PCIe* 3.0 specification enables double the interconnect bandwidth over the PCIe* 2.0 specification (www.pcisig.com/news_room/November_18_2010_Press_Release/ ). Intel internal measurements of maximum achievable I/O R/W bandwidth (512B transactions, 50% reads, 50% writes) using Xeon® processor E5-2680 based platform. Configuration: Rose City system with two Intel® Xeon processor E5-2680 (2.7GHz, 8C), 64GB memory @1600 MHz, 2 x16 Intel internal PCIe* 3.0 test cards on each node (all traffic sent to local nodes).

 

13 (10GBe) Crehan Research: Server-class Adapter and LOM Market 4Q10

 

14 (AES-NI) Intel® AES-NI requires a computer system with an AES-NI enabled processor, as well as non-Intel software to execute the instructions in the correct sequence. AES-NI is available on select Intel® processors. For availability, consult your reseller or system manufacturer. For more information, see software.intel.com/en-us/articles/intel-advanced-encryption-standard-instructions-aes-ni/

 

15 (TXT) No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visit www.intel.com/technology/security

 

16 Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.

Intel® Visual Computing Source launches today as a resource site for game and media application developers. The site provides free downloads of application developer tools and the latest information on Intel’s visual computing tools including Intel® Graphics Performance Analyzers, Intel® Media Software Development Kit (SDK) and Intel® OpenCL SDK. Intel Visual Computing Source also provides technical papers, case studies, videos, product briefs and sample code. Keep tabs on updates to Intel Visual Computing Source on Twitter @VC_Developer or Facebook.

Expands Support to Smartphones, Tablets and Ultrabook™ Devices

 

NEWS HIGHLIGHTS

  • Intel releases Intel® GPA 2012, the latest suite of tools for game and media app developers to optimize performance.
  • Intel® GPA 2012 now available for smartphone, tablet and Ultrabook™ app developers.
  • Support for Google Android*-based devices to be publically available this year.

 

 

GAME DEVELOPERS CONFERENCE, San Francisco, March 5, 2012 – Intel Corporation today introduced Intel® Graphics Performance Analyzers (Intel® GPA) 2012, the latest version of a powerful tool suite to optimize performance of gaming, media and entertainment applications. Expanding upon Intel's mobile momentum, Intel® GPA 2012 will support mobile applications for Ultrabook™ devices and Android*-based smartphones and tablets for the first time.

 

Previously available only on PC platforms, Intel GPA helps developers improve the experience of game and media applications by accessing powerful tools to analyze and optimize performance on Intel® Core™ and Intel® Atom™ processor-based platforms. The tool suite enables developers to enhance application performance on smartphones, tablets, Ultrabooks and PCs. Developers can also optimize Web content for browsers that support hardware-accelerated rich media, including Microsoft Internet Explorer* 9, Google Chrome* and Mozilla Firefox*.


"Gaming is one of the largest consumer segments for smartphones, but nobody wants a game that drains a smartphone battery," said Craig Hurst, Intel's director of Visual Computing Product Management. "There are few choices for developers who want to optimize apps for power, so Intel GPA 2012 introduces power metrics,  ensuring that a game not only has great performance, but also runs longer on Ultrabooks, Android tablets and smartphones."

 

The Intel GPA tool suite includes:

 

  • Intel®  GPA System Analyzer – Analyzes game performance and identifies potential bottlenecks that slow down performance or affect graphics. This tool allows developers to perform optimization experiments to fine-tune performance without changing application code. New in Intel GPA 2012, Intel GPA System Analyzer now supports a standalone mode that enables real-time analysis of application performance on smartphones, tablets and Ultrabooks, including Android devices. Intel GPA System Analyzer can be used to analyze an application's power usage and how it will affect battery life on mobile devices.
  •  


  • Intel®  GPA Frame Analyzer – Offers application developers deep frame analysis of individual application elements such as shaders, textures and pixel history. Intel GPA Frame Analyzer shows the visual and performance impact of each individual element in real time without affecting the application source code.
  •  


  • Intel®  GPA Platform Analyzer – Developers can visualize performance of application tasks and the effect on devices by viewing CPU metrics and graphics workloads. PC application developers can also see how their software would perform in a multi-core environment. Intel GPA Platform Analyzer has been rebuilt from the ground up for the release of Intel GPA 2012 to provide more system behavior information. Additionally, the tool is capable of handling large volumes of data to emulate application performance on an extended run.
  •  


  • Intel®  GPA Media Analyzer – When used in conjunction with Intel® Media SDK, Media Analyzer enables developers to see how effectively an application uses hardware-accelerated video encode and decode in real-time.

 

Intel GPA 2012 is available as a free download at www.intel.com/software/gpa. Support for Android devices is expected to be publically released this year.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3 and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality or effectiveness of any optimization on microprocessors not manufactured by Intel.

 

Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

Yesterday Intel received a Climate Leadership Award, recognizing the company as an industry leader in driving innovative solutions to reduce greenhouse gas emissions. The Climate Leadership Awards were given for the first time this year, through a partnership between the U.S. EPA, the Association of Climate Change Officers, the Center for Climate and Energy Solutions, and The Climate Registry. Learn more about the actions Intel has taken to reduce greenhouse gases and why it won this prestigious award.

Intel is collaborating with DENSO Corporation for joint research into next-generation in-vehicle information and communication systems. The goal of the collaboration is to develop a platform for in-vehicle information and communications systems that can seamlessly connect and share information with mobile devices and to safely provide drivers with information about their vehicles. The joint research will combine Intel’s expertise in developing technologies for personal computing and DENSO’s knowledge of in-vehicle IT products and advanced infotainment functions.

Intel announced several initiatives and investments to spur product development and research for new connected car experiences. The investments include the new global Automotive Innovation and Product Development Center, the expansion of Intel Labs Interaction and Experience Research (IXR), an academic outreach program for automotive projects, and the newly-established $100 million Intel Capital Connected Car Investment Fund. Located in Karlsruhe, Germany, the Automotive Innovation and Product Development Center aims to accelerate innovations for in-vehicle infotainment and telematics solutions based on Intel technology. And with the expansion of Intel Labs IXR, Intel will gain valuable insights into the relationships between humans, cars and technology.

NEWS HIGHLIGHTS

  • Intel Capital creates a $100 million Intel Capital Connected Car Fund to accelerate technology innovation in the automotive industry.
  • Intel Capital Connected Car Fund targeted at technologies that will deliver new in-vehicle infotainment solutions, seamless mobile connectivity, compelling applications and advanced driver assistance systems.
  • By 2014, automobiles will be among the top three fastest-growing market segments for connected devices and Internet content.

 

 

SANTA CLARA, Calif. and KARLSRUHE/FELDKIRCHEN, Germany, Feb. 29, 2012 – Intel Capital today announced a $100 million investment fund to help accelerate innovation and the adoption of new technology and services in the automotive industry. Intel Capital is the first global technology investment organization headquartered in Silicon Valley to announce a dedicated focus on automotive technology innovation.

 

The Intel Capital Connected Car Fund will be invested globally over the next 4 to 5 years in hardware, software and services companies developing technologies to promote new, compelling in-vehicle applications and enable the seamless connection between vehicles and any connected device, including mobile devices and sensors.

 

"Technology has become an integral component of everyday life, with consumers demanding uninterrupted access to the Internet and the constant flow of information, news, entertainment, and social media," said Arvind Sodhani, president of Intel Capital and Intel executive vice president. "Automobiles must be able to provide these same consistent and engaging computing experiences, but in a safe manner. The Intel Capital Connected Car Fund will drive the development of technologies to enhance the in-vehicle experience of the future."

 

The announcement is part of Intel's ongoing work with automakers and in-vehicle infotainment suppliers to help integrate advanced technologies into cars. Ultimately, the connected car will have the intelligence and context awareness to offer the right information, at the right time and in the right way to keep drivers and passengers informed, entertained and productive while maintaining optimal safety. Once the car becomes connected, it can also communicate with the cloud, the transportation infrastructure and even other vehicles to provide additional services such as advanced driver assistance and real-time traffic information to optimize the flow of traffic.

 

"The car is the ultimate mobile device," said Staci Palmer, general manager of Intel's Automotive Solutions Division. "By 2014, automobiles will be among the top three fastest-growing areas for connected devices and Internet content.¹ Intel's experience in developing personal computing, software, security and cloud computing technologies will bring a new level of innovation to the car to enhance the driving experience for both drivers and passengers."

 

To help realize that vision, areas of investment for the Intel Capital Connected Car Fund will include technologies that advance the next generation of in-vehicle infotainment, advanced driver assistance systems and seamless mobile connectivity. This includes new in-vehicle applications and development tools, next-generation ADAS technologies and multimodal capabilities such as speech recognition, gesture recognition and eye tracking optimized for the connected car.

 

In addition to the Intel Capital Connected Car Fund, Intel Corporation President and CEO Paul Otellini also announced today at an event in Karlsruhe, Germany the opening of a new global Automotive Innovation and Product Development Center, an academic outreach program focused on IVI and telematics, and expansion of Intel Labs Experience and Interaction Research in automotive.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

         

 

About Intel Capital
Intel Capital, Intel's global investment and M&A organization, makes equity investments in innovative technology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software, and services targeting enterprise, mobility, health, consumer Internet, digital media, semiconductor manufacturing and cleantech. Since 1991, Intel Capital has invested more than US$10.5 billion in over 1,218 companies in 51 countries. In that timeframe, 196 portfolio companies have gone public on various exchanges around the world and 291 were acquired or participated in a merger. In 2011, Intel Capital invested US$526 million in 158 investments with approximately 51 percent of funds invested outside the U.S. and Canada. For more information on Intel Capital and its differentiated advantages, visit www.intelcapital.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 Gartner: Automobile of the Future: The Ultimate Connected Mobile Device (ID: G00175335)

Company Opens New Product Development Center, Expands Intel Labs Experience and Interaction Research

 

NEWS HIGHLIGHTS

  • Global Automotive Innovation and Product Development Center will accelerate innovations and product development for in-vehicle infotainment and telematics solutions based on Intel technology.
  • Intel invests in academic outreach program to foster innovative ideas, research and technology among academia, Intel and the automotive industry.
  • Company expands Intel Labs Interaction and Experience Research in automotive to further explore relationships among human behavior, cars and technology.
  • Intel Capital is the first global technology investment organization to announce $100 million Connected Car Fund focused on investing in automotive technology innovation.

 

 

SANTA CLARA, Calif., and KARLSRUHE, Germany, Feb. 29, 2012 – Intel Corporation today announced several automotive investments and initiatives designed to spur innovation and product development that will enable new and innovative connected car experiences. The investments include the new Automotive Innovation and Product Development Center, expansion of Intel Labs Interaction and Experience Research (IXR) in automotive, an academic outreach program, and the establishment of the $100 million Intel Capital Connected Car Investment Fund.

 

"In today's mobile world, personal computing touches every part of consumers' daily lives while at home, at the office and on the road," said Intel President and CEO Paul Otellini. "By broadening our research efforts, academic and capital investments and opening the Automotive Innovation and Product Development Center, Intel is deepening its understanding of how people interact with their cars and how Intel innovations can enhance the automotive experience."

 

The Automotive Innovation and Product Development Center will serve as Intel's global center of competence for the development of products and technologies for in-vehicle infotainment and telematics solutions for the connected car. The center will optimize Intel technologies for applications and services as well as capabilities for consumer electronics integration, performance optimization and system design.

 

Located in Karlsruhe, Germany, the site benefits from its proximity to top technical universities and a robust ecosystem of hardware and software vendors with expertise in automotive technology. The customized facility features a unique secured car park that provides an on-site location for Intel to install, test and showcase developments. Additional features include state-of-the-art instrumentation, a myriad of antennae to provide satellite, TV, digital video and GPS for development and testing, and a world-class engineering compute infrastructure.

 

Intel also announced plans for a comprehensive academic program that includes fundamental and applied research, curriculum development and internship programs to foster the exchange of innovative ideas among academia, Intel and the automotive industry. The program will be hosted at the Karlsruhe site and will tap into an extensive Intel European Research and Development network of researchers and developers, labs and research relationships.

 

Expanding Research to Explore Human Interactions in Vehicles

 

With the expansion of Intel Labs Interaction and Experience Research, Intel and its customers will obtain valuable insights into consumer experiences in the vehicle. Intel aims to apply that knowledge to the development of technology solutions for the vehicle and transportation infrastructure to make the driving experience more enjoyable, intuitive and safe. For example, Intel is looking at new ways to use the Internet, sensors and context-aware technology to determine what and how information should be presented to drivers and passengers to reduce complex interactions while driving.

 

Intel Capital Creates $100 Million Connected Car Fund

 

Today, Intel Capital became the first global technology investment organization to announce an investment fund focused on fostering automotive technology innovation. The Intel Capital Connected Car Fund aims to accelerate the seamless connection between the vehicle and consumer electronic devices as well as drive new in-vehicle applications, services and differentiated user experiences based on Intel technologies. Over the next 5 years, Intel Capital will invest in hardware, software and services companies that are developing leading-edge ingredient technology and platform capabilities that support Intel's focus areas in automotive.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Companies Expand Successful NAND Flash Memory Joint Development Program to Include Development of Emerging Memory Technologies

 

SANTA CLARA, Calif. and BOISE, Idaho, Feb. 28, 2012 – Intel Corporation and Micron Technology, Inc., today announced that the companies have entered into agreements to expand their NAND Flash memory joint venture relationship.

 

The agreements, which are designed to improve the flexibility and efficiency of the joint venture, include a NAND Flash supply agreement for Micron to supply NAND products to Intel and agreements for certain joint venture assets to be sold to Micron. Under terms of the agreement, Intel is selling its stake in two wafer factories in exchange for approximately $600 million—the approximate book value of Intel's share. Additionally, Intel will be receiving approximately half of the consideration in cash and the remaining amount will be deposited with Micron, which may be refunded or applied to Intel's future purchases under the NAND Flash supply agreement. The agreements also extend the companies' successful NAND Flash joint development program and expand it to include emerging memory technologies.

 

"Micron's joint venture NAND development efforts with Intel are a model of innovation, productivity and effectiveness," said Micron Chief Executive Officer Mark Durcan. "With IM Flash and its associated programs, our companies have become leaders in the NAND Flash arena. These new agreements build on that success."

 

"The Intel-Micron partnership has created industry-leading NAND Flash memory technology and developed a robust global manufacturing network. The new NAND Flash supply agreement with Micron gives Intel better flexibility to meet growing demand for SSDs and other products," said Robert Crooke, Corporate Vice President and General Manager of the Non-Volatile Memory Solutions Group, Intel.

 

As part of these agreements, Micron will increase its share of the overall NAND Flash output and optimize its global manufacturing network by purchasing the assets of IM Flash Singapore (IMFS) and the IM Flash Technologies (IMFT) assets in Manassas, Va.

 

Micron has also agreed to supply Intel with NAND Flash memory from its facilities. The IMFT joint venture NAND manufacturing facility in Lehi, Utah, will continue to operate with minimal changes to its existing operations. The facility is currently in production on the companies' industry-leading 20nm NAND Flash memory technology. The transaction is expected to close during the first half of this year, subject to certain conditions.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

About Micron Technology, Inc.
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.

 

*Micron and the Micron logo are trademarks of Micron Technology, Inc. Intel is a trademark of Intel Corporation or its subsidiaries in the United States and other countries. All other trademarks are the property of their respective owners.

 

*This press release contains forward-looking statements related to the timing of the closing of the transaction between Micron and Intel (the "Companies") related to updating their NAND Flash joint venture relationship. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents the Companies file from time to time with the Securities and Exchange Commission, specifically each of their most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for each of the Companies to differ materially from those contained in our forward-looking statements. Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.

Today Intel announced a beta version of Intel® Cloud SSO, an identity and access management-as-a-service (IAMaaS) offering available on Force.com. With Intel Cloud SSO, enterprise users gain single sign-on access to all Salesforce.com applications and dozens of other SaaS apps, through a secure, personalized portal.  Strong two-factor mobile authentication, user account provisioning and de-provisioning, enterprise-class identity lifecycle management features, and integration with McAfee Cloud Security Platform provide end-to-end protection for cloud-based apps. The beta is available to a limited number of customers, with general availability scheduled for Q2. To be considered for the beta, visit here.

Multi-device, Multi-year Agreement to Develop Mobile Commerce Solutions for Smartphones and Tablets; Intel Smartphone Reference Device Certified for Use with Visa payWave

 

Barcelona, Spain, February 27, 2012 — Visa Inc. (NYSE:V) and Intel Corporation today announced a strategic agreement to develop mobile commerce solutions tailored to consumers in developed and developing countries. During a press conference at Mobile World Congress in Barcelona, the companies outlined plans to collaborate to ensure consumers enjoy a consistent, streamlined, secure mobile commerce experience across Intel® Atom™-based smartphones and tablets.

 

"Visa's agreement with Intel paves the way for financial institutions around the globe to offer their account holders mobile payments and financial services using innovative mobile devices and technologies designed by Intel," said John Partridge, President, Visa Inc. during the press conference. "This is another example of how Visa is making mobile payments broadly available across devices and operating systems and is ensuring that mobile commerce applications are aligned with existing technology and security standards established by the global payments industry."

 

The initial phase of the agreement between Visa and Intel includes:

 

  • Visa has certified Intel's Smartphone Reference Device powered by the Intel® Atom™ processor Z2460 for use with Visa payWave, Visa's mobile payment technology that enables consumers to make fast and secure payments at retail locations by simply waving their mobile phone in front of a payment terminal. This will enable turn-key implementation for OEMs delivering NFC-enabled smartphones.
  •  


  • The Intel Smartphone Reference Device will host the Visa payWave payment application and features NFC (Near Field Communication) technology, the short range communications standard that enables mobile phones to securely transmit payment information to a payment terminal.
  •  


  • When used in combination with a Visa-compliant UICC, smartphones based on the Intel Smartphone Reference Device handset can be enabled to connect to Visa Inc.'s mobile provisioning service providing financial institutions and mobile operators the means to securely download Visa payment account information and the Visa payWave application "over the air" to a secure chip on an NFC-equipped smartphone. The connection to Visa's mobile provisioning service can be enabled by a Trusted Services Management platform, such as Giesecke & Devrient's (G&D) platform.

 

"Intel's strategy is to enable more secure and compelling user experiences across a range of Intel-based mobile devices. Our alliance with Visa builds on this strategy and brings worldwide mobile payment and commerce solutions to Intel-based devices," said Mike Bell, Intel Vice President and General Manager of the company's Mobile and Communications Group. "Our work with Visa also extends to our customers designing products based on Intel's Smartphone Reference Device."

 

The agreement combines Visa's expertise in payment processing, account holder authentication and global network reach, with Intel's expertise and leadership in developing innovative technologies that serve as the foundation for the world's computing devices.

 

At Mobile World Congress in Barcelona, from February 27th to March 1st, the companies will showcase Visa mobile services on the new Intel mobile device, including V.me by Visa, Visa's new digital wallet service featuring the Visa payWave application; Movida, Visa's new payment service in India; and Visa Mobile Prepaid, Visa's new mobile-based product tailored to consumers in developing countries. Product demonstrations will be on display at Visa's booth in Hall 1, stand 1B19, and Intel's booth in Hall 8, stand B192.

 

About Visa Inc.
Visa is a global payments technology company that connects consumers, businesses, financial institutions and governments in more than 200 countries and territories to fast, secure and reliable digital currency. Underpinning digital currency is one of the world’s most advanced processing networks—VisaNet—that is capable of handling more than 20,000 transaction messages a second, with fraud protection for consumers and guaranteed payment for merchants. Visa is not a bank, and does not issue cards, extend credit or set rates and fees for consumers. Visa’s innovations, however, enable its financial institution customers to offer consumers more choices: Pay now with debit, ahead of time with prepaid or later with credit products. For more information, visit www.corporate.visa.com.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Lava Launches XOLO Brand, Bringing Best of Intel Computing to Mobile Users in India

 

MOBILE WORLD CONGRESS, Barcelona, Spainand New Delhi, India, Feb. 27, 2012 - Intel Corporation and Lava International Ltd., one of India's fastest-growing mobile handset companies, announced that the companies are collaborating to launch the XOLO X900 -- India's first smartphone with Intel Inside®. The XOLO X900 from Lava is based on Intel's smartphone reference design featuring the  Intel® Atom™ processor Z2460 with Intel® Hyper-Threading Technology and supporting HSPA+ with the Intel XMM 6260 Platform.

 

Lava is a successful and growing mobile phone brand in the Indian market. In order to bring a high- performance and differentiated smartphones to the market, Lava has collaborated with Intel to introduce its first Intel-based smartphone under the brand XOLO. The XOLO X900 Android smartphone is expected to hit retail shelves in India early in the second quarter this year and will support all major 2G and 3G networks.

 

"We are proud to partner with Intel on XOLO to bring a superior smartphone computing experience to customers in India," said Vishal Sehgal, co-founder and director, Lava International. "Over the last two and a half years, we have built our business in the feature phone segment where Lava has been the brand of choice for nearly 10 million Indian customers. With XOLO, we intend to now serve the discerning and fast-paced smartphone customer, which is where this collaboration with Intel is critical to us."

 

"India is one of the fastest-growing smartphone markets with the world's second-largest mobile subscriber base," said Mike Bell, Intel vice president and general manager of the Mobile and Communications Group. "We are pleased to be working with Lava to bring the best of Intel computing to the India market. Lava's XOLO X900 device is a great result of our collaboration. It also demonstrates how innovative and compelling products can be brought to market through strong partnerships by using Intel's smartphone reference design as a foundation."

 

The XOLO X900 is powered by a super-fast 1.6 Ghz processor and comes equipped with a 4.03-inch high-resolution LCD touch screen for crisp text and vibrant images. The smartphone delivers a fast application, Web browsing and multitasking experience, and also features two cameras for advanced imaging and video capabilities, including burst mode that allows individuals to capture 10 pictures in under a second with 8-megapixel quality. The smartphone also supports HDMI®, NFC and HD video playback.

 

As service providers roll out 3G services and connect more cities in India, the smartphone market will grow as more people access the Internet from their phones. The smartphone opportunity in India for 2012 stands at 19.1 million units which is a 78 percent growth year-on-year over 2011, according to Deepak Kumar, research director for Telecommunications and Mobile Phones, IDC India.

 

 

Lava_XOLO_Phone_With_Intel_Inside_front.jpgLava XOLO X900 Smartphone with Intel Inside®

Lava_XOLO_Phone_Intel_Inside_back.jpgLava XOLO X900 Smartphone with Intel Inside®

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

About Lava
Lava international is one of the fastest growing brands in Indian mobile market today. The organization started operations only 30 months back and is rapidly growing its market share. “Get the power in your hand”- with this motto as the guiding principle, Lava embarked on its journey to empower people with innovative products. Today the brand has a wide range of handsets in its portfolio. The company has already expanded its operations in all the states of India and has a network of 1,000 distributors and presence in ~50,000 retail counters.

 

Intel, Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries. Lava, Xolo and Lava Xolo are trademarks of Lava International Ltd.

 

* Other names and brands may be claimed as the property of others.

Announces Smartphone Device Engagements with Orange*, Lava*, ZTE* and Visa*

 

Discloses Range of New Smartphone SoCs and Communications Products

 

MOBILE WORLD CONGRESS, Barcelona, Spain, Feb. 27, 2012 – Intel Corporation President and CEO Paul Otellini today detailed a number of announcements and plans aimed at expanding the company's smartphone product portfolio and customer ecosystem, including strategic new engagements with Orange*, Lava International Ltd.*, ZTE*, and Visa*.

 

"We are very pleased to add new, important customers and capabilities to our phone offerings today. We remain focused on delivering exciting new features and outstanding performance to smartphone customers around the world." said Otellini.

 

Otellini made the announcements during an Intel news conference at Mobile World Congress. He also highlighted the company's plans to expand its smartphone SoC and communications product roadmaps for the performance and value smartphone market segments.

 

New Smartphone Customer Engagements

Building on strategic engagements with Motorola Mobility Inc.* and Lenovo*, Intel detailed new device relationships with Orange, Lava International Ltd. and ZTE.

 

Yves Maitre, Orange senior vice president of Mobile Multimedia and Devices, joined Otellini to discuss a new Orange smartphone based on the Intel® Atom™ processor Z2460 reference design. Housed in a sleek body, the design enables rich entertainment experiences and Orange services, including Orange TV, Daily Motion, Deezer, Orange Wednesdays and Orange Gestures. The Orange smartphone will be available in the United Kingdom and France later this summer.

 

Intel also announced plans to enter the high-growth market for smartphones in India through an alliance with Lava International Ltd., one of the fastest-growing Indian mobile handset companies.Vishal Sehgal, Lava co-founder and board director, announced the launch of XOLO Smartphone by Lava. The XOLO X900 is based on Intel's smartphone reference design and will be the first Intel technology-based smartphone in the India market. The device will be available from top retail outlets early in the second quarter of 2012 and will support major Indian cellular networks.

 

Similar to its previously announced partnership with Motorola Mobility, Intel also announced a multi-year mobile device collaboration across smartphones and tablets with global handset maker ZTE. Mr. He Shiyou, executive vice president and head of the Terminal Division of ZTE, discussed how his company's alliance with Intel will enable ZTE to move faster and create unique and differentiated products for wireless operators. He also announced that ZTE's first Intel-powered mobile device is scheduled to debut in the second half of 2012.

 

Expanding Smartphone SoC and Communications Roadmaps

Building on its ecosystem engagements, Intel announced plans for three new smartphone SoC products that expand the company's portfolio from the performance-to-value market segments.

 

Extending the leading performance and energy efficiency of the Intel™ Atom® processor Z2460, formerly codenamed "Medfield," Intel announced that the platform will now support speeds up to 2GHz.

 

Intel also announced the Atom™ Z2580 processor that doubles the performance of the Atom processor Z2460, and features an advanced multimode LTE/3G/2G solution. Intel will sample the Z2580 in the second half of the year with customer products scheduled in the first half of 2013.

 

Addressing the growing handset opportunity in emerging markets where consumers look for more value at lower prices, Intel disclosed plans for the Intel® Atom™ processor Z2000.

 

The Z2000 is aimed squarely at the value smartphone market segment, which industry sources predict could reach up to 500 million units by 20151.The platform includes a 1.0 GHz Atom CPU offering great graphics and video performance, and the ability to access the Web and play Google Android* games. It also supports the Intel® XMM 6265 3G HSPA+ modem with Dual-SIM 2G/3G, offering flexibility on data/voice calling plans to save on costs. Intel will sample the Z2000 in mid-2012 with customer products scheduled by early 2013.

 

Building on these 32nm announcements, Otellini discussed how the Atom™ processor will outpace Moore's Law and announced that Intel will ship 22nm SoCs for carrier certification next year, and is already in development on 14nm SoC technology.

 

In 2011, Intel shipped in more than 400 million cellular platforms. Building on this market segment position, Intel announced the XMM 7160, an advanced multimode LTE/3G/2G platform with support for 100Mbps downlink and 50Mbps uplink, and support for HSPA+ 42Mbps. Intel will sample the product in the second quarter with customer designs scheduled to launch by the end of 2012.

 

Intel also announced that it is sampling the XMM 6360 platform, a new slim modem 3G HSPA+ solution supporting 42Mbps downlink and 11.5Mbps uplink for small form factors.

 

Building Better Experiences on Intel Architecture

Intel's strategy is to create and enable engaging, consistent, aware and secure user experiences across a range of mobile devices.

 

An emerging trend is the use of mobile devices to enable secure online and retail commerce. Otellini welcomed John Partridge, President, Visa Inc., who announced a strategic multi-year alliance to develop mobile commerce solutions tailored to consumers in developed and developing countries.

 

The effort includes collaboration across a range of Visa mobile services and Intel® Atom™-based smartphones and tablets to deliver compelling and secure user services. As a first step, Partridge announced that Intel's smartphone reference design is now certified for Visa payWave* mobile financial transactions. This means that customer products based on Intel's smartphone reference design will have time-to-market support of Visa mobile services.

 

Building on its collaboration with Google, Intel continues to work closely with ISVs to help ensure the majority of Android apps run on Intel Atom processor-based devices. Otellini discussed how Intel has all the right tools and expertise to support the robust mobile application developer ecosystem.

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries.  * Other names and brands may be claimed as the property of others.

 

* Other names and brands may be claimed as the property of others.

 

1 Strategy Analytics

Former Intel Chairman and CEO, Craig Barrett, was recognized today as one of eight Stanford Engineering Heroes, an honor bestowed upon Stanford University faculty and alumni engineers who have advanced the course of human, social, and economic progress through engineering. Now in its second year, the primary objective of this honor is to herald the profession and the profound effect engineering has on our everyday lives.

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