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San Francisco Bay Area Team Wins Intel International Science and Engineering Fair

 

NEWS HIGHLIGHTS
  • The Intel International Science and Engineering Fair, the world’s largest high school science research competition and a program of Society for Science & the Public, announced its top winners in Los Angeles.
  • A team from Lafayette, Calif. received the Gordon E. Moore Award, a $75,000 prize in honor of the Intel co-founder and retired chairman and CEO.
  • One team from Thailand and one individual from Reno, Nev. were named Intel Foundation Young Scientist Award winners and each received prizes of $50,000.

 

 

LOS ANGELES, May 13, 2011 – Matthew Feddersen and Blake Marggraff of Lafayette, Calif. were awarded the top prize at the Intel International Science and Engineering Fair, a program of Society for Science & the Public. They received $75,000 and the Gordon E. Moore Award, in honor of the Intel co-founder and retired chairman and CEO, for developing a potentially more effective and less expensive cancer treatment that places tin metal near a tumor before radiation therapy.

 

Taylor Wilson of Reno, Nev. was named an Intel Foundation Young Scientist Award winner and received $50,000. Taylor developed one of the lowest dose and highest sensitivity interrogation systems for countering nuclear terrorism.

 

The team of Pornwasu Pongtheerawan, Arada Sungkanit and Tanpitcha Phongchaipaiboon from Thailand also received an Intel Foundation Young Scientist Award. This team determined that a gelatin found in fish scales could be successfully used in modern day food packaging – an invention that could have positive, long-term effects for the environment.

 

"We champion the Intel International Science and Engineering Fair because we believe that math and science are imperative for innovation," said Shelly Esque, vice president of Intel's Corporate Affairs Group. "This global competition features youth trying to solve the world's most pressing challenges through science."

 

This year, more than 1,500 young entrepreneurs, innovators and scientists were selected to compete in the Intel International Science and Engineering Fair, the world's largest high school science research competition. They were selected from 443 affiliate fairs in 65 countries, regions and territories, including for the first time France, Tunisia, United Arab Emirates and Macao SAR of the People's Republic of China.

 

In addition to the winners mentioned above, more than 400 finalists received awards and prizes for their groundbreaking work. Awards included 17 "Best of Category" winners who each received a $5,000 prize. The Intel Foundation also awarded a $1,000 grant to each winner's school and the Intel International Science and Engineering Fair-affiliated fair they represent.

 

The following lists the 17 Best of Category winners, from which the top three were chosen:

CategoryNameCityState/Country
Animal SciencesAdrienne McCollSan PedroCalifornia
Behavioral and Social SciencesAndrew KimAthensGeorgia
BiochemistryDianna HuDix HillsNew York
Cellular and Molecular BiologyNithin TummaFort GratiotMichigan
ChemistryRaghavendra RamachanderanChennaiIndia
Computer ScienceLai XueChengduChina
Earth and Planetary SciencesJane CoxProvoUtah
Engineering: Electrical and MechanicalDemitri HopkinsTigardOregon
Forrest Betton
Eric ThomasBeaverton
Engineering: Materials and BioengineeringSamantha MarquesMidlothianVirginia
Energy and TransportationNathan KondamuriDyerIndiana
Environmental ManagementPornwasu PongtheerawanMeungThailand
Tanpitcha Phongchaipaiboon
Arada Sungkanit
Environmental SciencesJinyoung SeoGo-Yang CitySouth Korea
Dongju ShinSeoulSouth Korea
Mathematical SciencesMatthew BauerleFentonMichigan
Medicine and HealthMatthew FeddersenLafayetteCalifornia
Blake Marggraff
MicrobiologyErica PortnoyDix HillsNew York
Physics and AstronomyTaylor WilsonRenoNevada
Plant SciencesKira PowellOdessaWashington

 

Society for Science & the Public, a nonprofit organization dedicated to public engagement in scientific research and education, owns and has administered the International Science and Engineering Fair since its inception in 1950.

 

"We congratulate the top winners for having the drive and curiosity to tackle these significant scientific questions," said Elizabeth Marincola, president of Society for Science & the Public. "Their work, and the work of all of the finalists at the Intel International Science and Engineering Fair, demonstrates what students can accomplish when they are inspired to pursue inquiry-based research.

 

The Intel International Science and Engineering Fair finalists are evaluated onsite by hundreds of judges from nearly every scientific discipline, each with a Ph.D. or the equivalent of six years of related professional experience in one of the scientific disciplines. A full listing of finalists is available at www.societyforscience.org/intelisef2011. The Intel International Science and Engineering Fair 2011 is funded jointly by Intel and the Intel Foundation with additional awards and support from dozens of other corporate, academic, governmental and science-focused organizations.

 

To get the latest Intel International Science and Engineering Fair news, visit www.intel.com/newsroom/education, join the Facebook group at http://intel.ly/intel-edu and follow Twitter updates at http://twitter.com/intel_education. To join Intel's community of people sharing their stories with the hope of becoming a catalyst for action and a voice for change in global education, visit www.inspiredbyeducation.com.

 

To learn more about SSP, visit www.societyforscience.org, follow SSP on Twitter at www.twitter.com/society4science, or visit SSP's Facebook page at www.facebook.com/societyforscience.

 

Top-3-Winners-ISEF-2011.jpg

Young Top Award-Winning Scientists Celebrate at Intel International Science and Engineering Fair
LOS ANGELES, May 13, 2011 – Today top winners were announced at The Intel International Science and Engineering Fair, the world's largest high school science research competition and a program of Society for Science & the Public. One team from Lafayette, Calif. received the Gordon E. Moore Award, a $75,000 prize in honor of the Intel co-founder and retired chairman and CEO. Additionally, one team from Thailand and one individual from Reno, Nevada were named Intel Foundation Young Scientist Award winners and each received prizes of $50,000. Credit: Intel/Chris Ayers.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

During a keynote today at Interop in Las Vegas, Intel Vice President Kirk Skaugen discussed Intel’s “Cloud 2015” vision, and also addressed the impact that the recently announced 22nm 3-D Tri-Gate Transistor technology will have on the compute continuum of cloud devices – from smartphones to datacenters. During an educational session at Interop, Iddo Kadim, Intel’s director of data center virtualization technologies, showed a video featuring experts from public cloud provider Terremark, as well as from Hytrust, RSA and Cisco discussing how Intel® Trusted Execution Technology (Intel® TXT)  provides hardware-based defense against security breaches within the cloud. For more details on Intel’s activities at Interop, please go to: www.intel.com/go/cloudnews.

Today Google announced Chromebook devices from Samsung and Acer, powered by dual-core Intel® Atom™ processors, and running the Chrome open source operating system. To aid in delivering the best Internet experience, Intel Atom processors are specifically designed for low-power, energy-efficient performance with longer battery life. The Intel Atom processor continues to be the processor of choice for the netbook category, enabling over 90 million mobile companion devices since 2008.

Today Intel announces the Intel® Z68 Express chipset and Intel® Solid-State Drive 311 Series.  The Z68 chipset offers new overclocking and caching features for PC enthusiasts who want more control over their second-generation Intel® Core processor based desktops.  The 20GB Intel SSD 311 is optimized for the new Intel® Smart Response Technology caching feature in Z68 which helps speed boot times, application loads, and many other PC uses.

Brings Annual Dividend to 84 cents Per Share

 

SANTA CLARA, Calif., May 11, 2011 – Intel Corporation today announced that its board of directors has approved a 16 percent increase in the quarterly cash dividend to 21 cents per share (84 cents per share on an annual basis), beginning with the dividend that will be declared in the third quarter of 2011.

 

Today's announcement is the second dividend increase in the past 6 months. Intel previously raised the dividend 15 percent in November 2010. Intel's dividend payout has steadily increased at a 33 percent compound annual growth rate (CAGR) since 2003, compared to the Standard & Poor (S&P) 500 growth rate of 6 percent over the same period.

 

"Worldwide demand for computing continues to increase at a very rapid rate, putting Intel on track for revenue growth of over 20 percent this year, delivering another record year for the company," said Paul Otellini, Intel president and CEO. "Intel's current and projected growth is generating strong cash flow, allowing us to further increase our dividend. We are delivering on our commitment to return cash to shareholders with annual dividend growth that's already more than five times the S&P 500."

 

In addition to raising the dividend over 30 percent in the past 6 months, Intel also increased the authorization limit for share repurchases by an additional $10 billion in January, bringing the total outstanding buyback authorization to $14.2 billion. In the first quarter of 2011, Intel used $4 billion of the total buyback authorization to repurchase shares. Since the company's stock buyback program began in 1990 and through the end of the first quarter of 2011, Intel repurchased approximately 3.6 billion shares at a cost of approximately $74 billion.

 

Intel began paying a cash dividend in 1992 and has paid out approximately $22 billion to its shareholders in dividends. Intel cash dividends for 2010 totaled approximately $3.5 billion.

 

Taken together since their inception, Intel's dividends and stock buyback program have returned approximately $96 billion to shareholders.

 

Risk Factors

 

  • The above statements and any others in this document that refer to plans and expectations for the second, third and fourth quarters, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will," "should" and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel's actual results, and variances from Intel's current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the company's expectations.
  • Dividend declarations and the dividend rate are at the discretion of Intel's board of directors, and plans for future dividends may be revised by the board. Intel's dividend program could be affected by changes in Intel's operating results, its capital spending programs, changes in its cash flows and changes in the tax laws, as well as by the level and timing of acquisition and investment activity.
  • Demand could be different from Intel's expectations due to factors including changes in business and economic conditions, including supply constraints and other disruptions affecting customers; customer acceptance of Intel's and competitors' products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Potential disruptions in the high technology supply chain resulting from the recent disaster in Japan could cause customer demand to be different from Intel's expectations.
  • Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel's response to such actions; and Intel's ability to respond quickly to technological developments and to incorporate new features into its products.
  • The company's gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; product mix and pricing; the timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; product manufacturing quality/yields; and impairments of long-lived assets, including manufacturing, assembly/test and intangible assets.
  • Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits.
  • The company's effective tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets.
  • Gains or losses from equity securities and interest and other could vary from expectations depending on gains or losses on the sale, exchange, change in the fair value or impairments of debt and equity investments; interest rates; cash balances; and changes in fair value of derivative instruments.
  • The majority of Intel's non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management's plans with respect to Intel's investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains/losses on equity investments and interest and other.
  • Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates.
  • Intel's results could be affected by the timing of closing of acquisitions and divestitures.
  • Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. An unfavorable ruling could include monetary damages or an injunction prohibiting us from manufacturing or selling one or more products, precluding particular business practices, impacting Intel's ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property.

 

A detailed discussion of these and other factors that could affect Intel's results is included in Intel's SEC filings, including the report on Form 10-Q for the fiscal quarter ended April 2, 2011.

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Intel has just released an HD Graphics driver update for the 2nd Generation Intel Core processor family. Mainstream gaming just got more fun, with up to 40% performance improvements on select games, support for the latest games like Valve’s Portal 2 and Stereoscopic 3D playback on DisplayPort monitors. This driver also includes support for 1080p Blu-Ray playback and Intel Insider content playback over WiDi 2.0. Drivers can be found here in

32-bit and 64-bit flavors.

Intel to Unveil and Showcase the Latest Technology Innovations Spanning Mobile Computing
WHAT:

Intel Corporation is hosting a series of events to unveil and showcase its latest hardware and software technology innovations spanning a spectrum of mobile personal computing devices.

 

Intel’s presence at Computex 2011 will kick off with the opening keynote address by Sean Maloney, executive vice president and general manager, Intel Architecture Group,  at the Taipei International Convention Center (TICC), 3F Plenary Hall, on May 31.

 

Intel will exhibit a range of mobility products and technologies at the Taipei World Trade Center (TWTC) Nangang Exhibition Hall from May 31-June 4.

DATES:

Opening Ceremony:

Tue.-Fri., May 31-June 3 (9:30 a.m-6 p.m.)
Sat., June 4 (9:30 a.m-4 p.m.)

WHERE:

Intel Exhibition Showcase at Computex
Booth M0410
TWTC Nangang, 4F
(Address: No. 1, Jingmao 2nd Rd., Nangang District, Taipei City, Taiwan)

 

Intel Events
Details below

PRESS ACTIVITIES:

Computex Opening Keynote
Tuesday, May 31, 2-3 p.m. (Reception: 1:30–2 p.m.)

Speaker: Sean M. Maloney, executive vice president and general manager of Intel Architecture Group
TICC, 3F Plenary Hall
(Address: No. 1, Xin-yi Rd., Sec. 5, Hsin-yi District, Taipei City, Taiwan)

 

PC Client Event
Tuesday, May 31, 3:30-5 p.m. (Reception: 3-3:30 p.m.)
Grand Hyatt Hotel, 3F, Ballroom A
(Address: No. 2, Song Shou Rd., Hsin-yi District, Taipei City, Taiwan)

 

PC Client Event Post-Keynote Press Q&A Session
Tuesday, May 31, 4:30-5 p.m.
Grand Hyatt Hotel, Crane Room, 3/F

Intel Speaker:
Shmuel (Mooly) Eden, vice president and general manager of PC Client Group

 

Netbooks and Tablets Event: Companion Computing Gets Personal
Wednesday, June 1, 3-5 p.m. (Reception time: 3-3:30 p.m.)
Grand Hyatt Hotel, 3F, Ballroom A

 

Netbooks and Tablets Event Post-Keynote Press Q&A Session
Wednesday, June 1, 4:30-5 p.m.
Grand Hyatt Hotel, Crane Room, 3/F

Intel Speakers:
Douglas L. Davis, vice president and general manager of Netbook and Tablet Group
Douglas W. Fisher, vice president and general manager of Systems Software Division

 

Intel Booth Guided Tour for Media
Thursday, June 2, 10-11 a.m.
Booth M0410
TWTC Nangang, 4F

 

Computex Taipei Executive Speech 2011
Intel Session: Thursday, June 2, 2:35-3:05 p.m.
Speaker: Boyd A. Davis, vice president of Intel Architecture Group and general manager of Data Center Group
Marketing TICC, 3F, Banquet Hall

CONTACTS:

Intel Corporation:

Agnes Kwan, Intel U.S. PR manager

+1-408-765-5714, agnes.ck.kwan@intel.com

 

Ruby Au, Intel Asia-Pacific PR manager

+852-9849-6233, ruby.au@intel.com

 

Shardae Chiu, Intel Taiwan PR manager

+8862-2544-7752, shardae.chiu@intel.com

 

Pallas PR Agency:

Jennifer Chen, Pallas PR

+8862-2719-5077 Ext. 223, jennifer@pallaspr.com.tw

 

Elsa Chang, Pallas PR

+8862-2719-5077 Ext. 220, elsa.chang@pallasrp.com.tw

INTEL MEDIA SUPPORT AT COMPUTEX:

Please visit the reception of Intel Exhibition Showcase at 4/F, TWTC Nangang Exhibition Hall, to access the latest Intel news releases, fact sheets and other press materials.

 

Please visit www.intel.com/newsroom/computex/index.htm during Computex for updated press materials, video streaming, discussion and more information.

MAPS:

Intel® Expressway Cloud Access 360 and Intel® Expressway Service Gateway are available as modules in the McAfee Cloud Security Platform which launched today at Interop Las Vegas. The unified platform provides identity and access control in addition to protecting content during transit to and from the cloud. The platform enables companies to securely transmit email, web, and web services information between the enterprise and private or public clouds with consistent security policies and reporting. For more information, see the McAfee Cloud Security Platform announcement.

Tune in for MashUp Radio this Friday, May 13 from 12:00-12:30 p.m. PT to catch Intel’s Peter Biddle and blogger Steve “Chippy” Paine rap about the current state of tablets and what we can expect in the months ahead from the year’s most talked about technology. Chippy is the owner and editor of Carrypad and UMPCPortal (Ultra Mobile Personal Computing) and an admitted tablet- devotee. Peter and Chippy will discuss Apple’s biggest adversaries in the tablet wars, where they think the technology will shake out in the consumer market, and whether tablets will significantly change the way people access their content.

Intel® Core™ Processors Provide Foundation for Strong Channel Growth; Excitement Mounts Around New Platforms for Tablets & Netbooks

 

NEWS HIGHLIGHTS
  • Intel reinforces the 2011 Technology Provider Program, intended to position channel partners for success in today's challenging business environment.
  • Intel to help channel partners create, support and sell Intel-based products and solutions beyond the PC and traditional computer systems; and in different business models.
  • The 2nd generation Intel® Core™; new Intel® Atom™; and Intel® Xeon® processors provide the foundation for growth opportunities in adjacent markets.

 

 

INTEL SOLUTIONS SUMMIT, Melbourne, May 9, 2011 – Intel today shared details of its 2011 channels membership program at its annual Asia Pacific channel customer conference, the most important partner event for the company in the region.

 

The Intel® Technology Provider Program is intended to assist its partners for sustained success amidst the changing realities of today's IT business environment, in the real world and online, and in the different economies of Asia. The program will now extend to partners that not only build systems but also those which resell Intel technology-based systems and solutions, supporting their product development, technical support and sales efforts.

 

Intel executives also outlined the company's focus areas for 2011 and discussed new product opportunities to ignite growth for channel partners, including tablets, new form factors for netbooks and laptops, and embedded technologies such as digital signage and point-of-sales systems.

 

Steve Dallman, general manager of Intel's Worldwide Reseller Channel Organization, said: "Our channel partners remain tremendously important to Intel and were a significant contributor to Intel's first quarter results.Our strategy is to empower and enable our Channel Partners to succeed in today's changing environment. The 2011 Intel Technology Provider Program is intended to help train, support and position our channel partners for sustained growth, both in their current PC segments, while helping them capture new opportunities in reselling integrated solutions, and in high-growth emerging segments such as SSDs and PC-like embedded solutions."

 

The Intel® Technology Provider program retains the most successful elements of earlier channel programs and adds support and recognition for business models which feature Intel-based systems from a range of manufacturers, other Intel-based hardware such as digital signage and point-of-sales systems, and a variety of fulfillment models including online and traditional storefront.

 

Intel Processor Technologies Provide the Foundation for Growth

Delegates to the event witnessed the wide range of opportunities enabled by the recent introduction of Intel's 2nd generation Core processor family in areas beyond the traditional PC. The new Intel Core processors demonstrate advancement in computing performance and capabilities with enhanced visual graphics built right into the chips.

 

Further opportunity is created with the Intel® Atom™ processor Z670 and Intel SM35 Express Chipset platform, formerly codenamed "Oak Trail." The latest Intel® Atom™ platform is leading to a wave of innovation around tablets and netbooks based on a variety of operating systems including MeeGo*, Windows* or Android*.

 

The Intel® Xeon® processor E7 family also provides the computing power required for a whole new range of users and usage models. In the enterprise space, Intel® Xeon® processors are helping IT managers address today's data-intensive workloads, setting new standards in high-end computing applications, including business intelligence, real-time data analytics and virtualization.

 

Kamil Hasan, Director of Intel's Reseller Channel Organization Asia Pacific,said: "The latest generation of the Intel Core, the Intel Xeon and the Intel Atom processors, with the multitude of form factors and vast improvements in performance and energy efficiency, will bring forth a whole new range of product and solution opportunities for our partners. There is huge opportunity to bring Intel technologies to many product segments that are seeing strong growth.

 

"Intel will now be an important player in the tablet market, strengthening our position in the netbook market, bringing innovation in the embedded devices market, and with solid performance in the Enterprise market. All of these efforts will indeed support channel growth and evolution," Hasan conculded.

 

The Intel Solutions Summit APAC is held annually in Asia Pacific, underpinning Intel's strong focus in the market. Held this year in Melbourne, Australia over three days, this year's event saw more than 400 attendees from all over APAC.

 

About Intel Channel
Intel first established a reseller Channel sales organization more than a decade ago to focus on the needs of our worldwide network of distributors, resellers, dealers, retailers and local integrators. This drove dramatic sales increases and the reseller channel now accounts between 20 to 30 percent of all Intel processor unit sales, selling products through a network of more than 255 distributors with 1,100 warehouse locations to a broad organization of 225,000 members in 165 countries. In aggregate, the Channel is Intel’s largest customer and represents a powerful Intel strategic advantage.

 

About Intel Solutions Summit
ISS provides Intel's Channel community with access to key marketing and business strategies, leadership, and information regarding specific customer solutions designed to help partners succeed in the marketplace. Along with informative learning opportunities, ISS is an ideal setting for partners to garner valuable knowledge from their peers and from Intel. Valuable programs include keynotes, the product and solution showcase, the annual Channel awards, education sessions and networking opportunities. More information can be found at https://Channeleventsponsors.intel.com/issapac/index

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Intel and Micron's 3-bit-per-cell (3bpc) NAND flash memory has won the EE Times Annual Creativity in Electronics (ACE) Award for Most Popular Memory Product. Designed by the IM Flash Technologies (IMFT) NAND flash joint venture, the 64 gigabit memory device offers improved cost efficiencies for higher storage capacity for USB, SD flash cards and consumer electronics. The ACE Awards celebrate the creators of technology who demonstrate leadership and innovation in the global industry and shape the world we live in.

Intel Corporation’s Director of Creative Innovation will.i.am discusses future technologies with Genevieve Bell, Intel Fellow and director of Interaction & Experience Research, and Justin Rattner, Intel chief technology officer, at Intel TechFest Thursday in Portland, Ore. will.i.am was among 1,000 top senior technologists, Intel Fellows and experts from 22 countries who convened during a private, 3-day event at the Oregon Convention Center to share ideas and gain cross-discipline education. will.i.am was appointed Intel’s director of creative innovation in January.

 

 

willtechfest.jpg

Intel Corporation's Director of Creative Innovation will.i.am (center) discusses future technologies with Genevieve Bell, Intel Fellow and director of Interaction & Experience Research, and Justin Rattner, Intel chief technology officer, at Intel TechFest Thursday in Portland, Ore.

WHAT:

The world's largest high school science research competition, the Intel International Science and Engineering Fair 2011, a program of Society for Science & the Public, comes to Los Angeles next week. More than 1,500 high school students selected from 443 affiliate fairs in 65 countries, regions and territories will share ideas, showcase cutting-edge research and inventions, and compete for more than $4 million in awards.

WHEN:

Opening Ceremony:

Monday, May 9 at 7 p.m. PT

  • Jeffrey Katzenberg, CEO of DreamWorks Animation, will keynote the opening ceremony, which will celebrate the achievements of the young scientists from around the world that are gathered in Los Angeles for the competition.

 

Public Day:

Thursday, May 12 from 10 a.m.-2 p.m. PT

  • Media and the public are invited to meet with finalists as they display, describe, and answer questions about their award-winning research. This year's finalists' research projects include such topics as earthquake detection, oil spill cleanup, energy-efficient wind turbine technology, response technology for natural disasters such as tsunamis, Alzheimer's research, and alternative chemotherapy treatments.
  • Interviews with select Intel International Science and Engineering Fair finalists will be live streamed from 10 a.m.-11 a.m. PT at http://mfile.akamai.com/70132/live/reflector:22328.asx?bkup=22329. View this on a mobile device at: http://nc.livecast.com/m/isef2011.

 

Awards Ceremony:

Friday, May 13 from 9 a.m.-noon PT

  • Media are invited to attend the awards ceremony where the winners will be announced. The top prizes include the $75,000 Gordon E. Moore Award given by the Intel Foundation in honor of the Intel co-founder and retired chairman and CEO. Two additional top winning projects will receive Intel Foundation Young Scientist Awards of $50,000 each; more than $4 million total prizes are also up for grabs.
WHERE:

Los Angeles Convention Center

1201 South Figueroa Street

*Please reach out to media contacts listed below to register and obtain additional specifics on the location of each event.

WHO:

More than 1,500 high school students from selected from 443 affiliate fairs in 65 countries, regions and territories. A full listing of finalists is available at www.societyforscience.org/intelisef2011.

In addition, Katzenberg will keynote the opening ceremony; Society for Science & the Public President Elizabeth Marincola will speak at the awards gala; Shelly Esque, vice president of Intel's Corporate Affairs Group and Wendy Hawkins, executive director of the Intel Foundation, will also be available for comment.

QUOTES:

"Via a global network of local, national and regional science fairs, this competition encourages roughly 6 million students worldwide to explore their curiosity for how the world works and develop solutions to help solve the global challenges of the future. The finalists gathering in Los Angeles next week represent the best of the best and will serve as the world's future innovators and leaders." - Shelly Esque, vice president of Intel's Corporate Affairs Group

 

"The Intel International Science and Engineering Fair provides an opportunity for the best young scientists from around the globe to share ideas and showcase their cutting-edge science projects. By inspiring and rewarding young scientists, this program, now in its 62nd year, will help the next generation usher in new solutions to global challenges, which are vital to our common future." - Elizabeth Marincola, president of Society for Science & the Public.

MORE INFO:

To get the latest Intel Science Talent Search news, visit www.intel.com/newsroom/education and follow updates at http://intel.ly/intel-edu and www.twitter.com/intel_education.  To join Intel's community of people sharing their stories with the hope of becoming a catalyst for action and a voice for change in global education, visit www.inspiredbyeducation.com.

To learn more about SSP, visit www.societyforscience.org, follow SSP on Twitter at www.twitter.com/society4science, or visit SSP's Facebook page at www.facebook.com/societyforscience.

CONTACTS:

Gail Dundas, Intel

503-264-2154, gail.dundas@intel.com

 

Caitlin Jennings, Society for Science & the Public

202-785-2255, ext. 155, cjennings@societyforscience.org

 

Allison Kubota, Burson-Marsteller, for Intel

646-525-6718, allison.kubota@bm.com

New Transistors for 22 Nanometer Chips Have an Unprecedented Combination of Power Savings and Performance Gains

 

NEWS HIGHLIGHTS

  • Intel announces a major technical breakthrough and historic innovation in microprocessors: the world's first 3-D transistors, called Tri-Gate, in a production technology.
  • The transition to 3-D Tri-Gate transistors sustains the pace of technology advancement, fueling Moore's Law for years to come.
  • An unprecedented combination of performance improvement and power reduction to enable new innovations across a range of future 22nm-based devices from the smallest handhelds to powerful cloud-based servers.
  • Intel demonstrates a 22nm microprocessor – codenamed "Ivy Bridge" – that will be the first high-volume chip to use 3-D Tri-Gate transistors.

 

 

SANTA CLARA, Calif., May 4, 2011 – Intel Corporation today announced a significant breakthrough in the evolution of the transistor, the microscopic building block of modern electronics. For the first time since the invention of silicon transistors over 50 years ago, transistors using a three-dimensional structure will be put into high-volume manufacturing. Intel will introduce a revolutionary 3-D transistor design called Tri-Gate, first disclosed by Intel in 2002, into high-volume manufacturing at the 22-nanometer (nm) node in an Intel chip codenamed "Ivy Bridge." A nanometer is one-billionth of a meter.

 

The three-dimensional Tri-Gate transistors represent a fundamental departure from the two-dimensional planar transistor structure that has powered not only all computers, mobile phones and consumer electronics to-date, but also the electronic controls within cars, spacecraft, household appliances, medical devices and virtually thousands of other everyday devices for decades.

 

"Intel's scientists and engineers have once again reinvented the transistor, this time utilizing the third dimension," said Intel President and CEO Paul Otellini. "Amazing, world-shaping devices will be created from this capability as we advance Moore's Law into new realms."

 

Scientists have long recognized the benefits of a 3-D structure for sustaining the pace of Moore's Law as device dimensions become so small that physical laws become barriers to advancement. The key to today's breakthrough is Intel's ability to deploy its novel 3-D Tri-Gate transistor design into high-volume manufacturing, ushering in the next era of Moore's Law and opening the door to a new generation of innovations across a broad spectrum of devices.

 

Moore's Law is a forecast for the pace of silicon technology development that states that roughly every 2 years transistor density will double, while increasing functionality and performance and decreasing costs. It has become the basic business model for the semiconductor industry for more than 40 years.

 

Unprecedented Power Savings and Performance Gains

Intel's 3-D Tri-Gate transistors enable chips to operate at lower voltage with lower leakage, providing an unprecedented combination of improved performance and energy efficiency compared to previous state-of-the-art transistors. The capabilities give chip designers the flexibility to choose transistors targeted for low power or high performance, depending on the application.

 

The 22nm 3-D Tri-Gate transistors provide up to 37 percent performance increase at low voltage versus Intel's 32nm planar transistors. This incredible gain means that they are ideal for use in small handheld devices, which operate using less energy to "switch" back and forth. Alternatively, the new transistors consume less than half the power when at the same performance as 2-D planar transistors on 32nm chips.

 

"The performance gains and power savings of Intel's unique 3-D Tri-Gate transistors are like nothing we've seen before," said Mark Bohr, Intel Senior Fellow. "This milestone is going further than simply keeping up with Moore's Law. The low-voltage and low-power benefits far exceed what we typically see from one process generation to the next. It will give product designers the flexibility to make current devices smarter and wholly new ones possible. We believe this breakthrough will extend Intel's lead even further over the rest of the semiconductor industry."

 

Continuing the Pace of Innovation – Moore's Law

Transistors continue to get smaller, cheaper and more energy efficient in accordance with Moore's Law – named for Intel co-founder Gordon Moore. Because of this, Intel has been able to innovate and integrate, adding more features and computing cores to each chip, increasing performance, and decreasing manufacturing cost per transistor.

 

Sustaining the progress of Moore's Law becomes even more complex with the 22nm generation. Anticipating this, Intel research scientists in 2002 invented what they called a Tri-Gate transistor, named for the three sides of the gate. Today's announcement follows further years of development in Intel's highly coordinated research-development-manufacturing pipeline, and marks the implementation of this work for high-volume manufacturing.

 

The 3-D Tri-Gate transistors are a reinvention of the transistor. The traditional "flat" two-dimensional planar gate is replaced with an incredibly thin three-dimensional silicon fin that rises up vertically from the silicon substrate. Control of current is accomplished by implementing a gate on each of the three sides of the fin – two on each side and one across the top -- rather than just one on top, as is the case with the 2-D planar transistor. The additional control enables as much transistor current flowing as possible when the transistor is in the "on" state (for performance), and as close to zero as possible when it is in the "off" state (to minimize power), and enables the transistor to switch very quickly between the two states (again, for performance).

 

Just as skyscrapers let urban planners optimize available space by building upward, Intel's 3-D Tri-Gate transistor structure provides a way to manage density. Since these fins are vertical in nature, transistors can be packed closer together, a critical component to the technological and economic benefits of Moore's Law. For future generations, designers also have the ability to continue growing the height of the fins to get even more performance and energy-efficiency gains.

 

"For years we have seen limits to how small transistors can get," said Moore. "This change in the basic structure is a truly revolutionary approach, and one that should allow Moore's Law, and the historic pace of innovation, to continue."

 

World's First Demonstration of 22nm 3-D Tri-Gate Transistors

The 3-D Tri-Gate transistor will be implemented in the company's upcoming manufacturing process, called the 22nm node, in reference to the size of individual transistor features. More than 6 million 22nm Tri-Gate transistors could fit in the period at the end of this sentence.

 

Today, Intel demonstrated the world's first 22nm microprocessor, codenamed "Ivy Bridge," working in a laptop, server and desktop computer. Ivy Bridge-based Intel® Core™ family processors will be the first high-volume chips to use 3-D Tri-Gate transistors. Ivy Bridge is slated for high-volume production readiness by the end of this year.

 

This silicon technology breakthrough will also aid in the delivery of more highly integrated Intel® Atom™ processor-based products that scale the performance, functionality and software compatibility of Intel® architecture while meeting the overall power, cost and size requirements for a range of market segment needs.

 

 

 

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About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

At yesterday’s 7th Annual EETimes Creativity in Electronics (ACE) Awards ceremony, Intel Fellow and director of the Intel Photonics Technology Lab, Dr. Mario Paniccia, was named Innovator of the Year. Mario brought home this award for his work in leading innovation in silicon photonics and developing 50Gbps Silicon Photonic Link – the world’s first silicon integrated photonic chip with hybrid lasers operating at 50Gbps. Over the last decade Dr. Paniccia has been a leader, innovator, and visionary driving Silicon Photonics research.  The EETimes ACE Awards celebrates the creators of technology who demonstrate leadership and innovation in the global industry and shape the world we live in. Additional information on Mario, his research and its impact can be found here http://blogs.intel.com/research/2011/05/mario-ace.php.

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