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180 Petaflops System Based on Intel's HPC Scalable System Framework to Advance Scientific Research and Discovery

 

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Intel Selected by U.S. Department of Energy to Deliver Nation's Most Powerful Supercomputer

SANTA CLARA, Calif., April 9, 2015 – Intel Corporation today announced that the U.S. Department of Energy's (DOE) Argonne Leadership Computing Facility (ALCF) has awarded Intel Federal LLC, a wholly-owned subsidiary of Intel Corporation, a contract to deliver two next-generation supercomputers to Argonne National Laboratory.

 

The contract is part of the DOE's multimillion dollar initiative to build state-of-the-art supercomputers at Argonne, Lawrence Livermore and Oak Ridge National Laboratories that will be five to seven times more powerful than today's top supercomputers. The joint Collaboration of Oak Ridge, Argonne and Lawrence Livermore (CORAL) will help to advance U.S. leadership in scientific research and maintain its position at the forefront of next-generation exascale computing for years to come.

 

Intel was selected as the prime contractor and will work with Cray Inc. as the system integrator and manufacturer of these next-generation high-performance computing (HPC) systems for the ALCF. The largest system, to be called Aurora, is based on Intel's HPC scalable system framework and will be a next-generation Cray "Shasta" supercomputer. The Aurora system will be delivered in 2018 and have a peak performance of 180 petaflops, making it the world's most powerful system currently announced to date.

 

A second system, to be named Theta, will serve as an early production system for the ALCF. To be delivered in the 2016, the system will provide performance of 8.5 petaflops while requiring only 1.7 megawatts of power.

 

"The selection of Intel to deliver the Aurora supercomputer is validation of our unique position to lead a new era in HPC," said Raj Hazra, vice president, Data Center Group and general manager, Technical Computing Group at Intel. "Intel's HPC scalable system framework enables balanced, scalable and efficient systems while extending the ecosystem's decades of software investment to future generations. We look forward to the numerous scientific discoveries and the far-reaching impacts on society that Aurora will enable."

 

News Facts

  • Intel selected as prime contractor to deliver 180 petaflops supercomputer at the ALCF, marking the first time in nearly two decades that Intel is taking the prime contractor role in the delivery of a supercomputer.1
  • The Aurora system will be 18 times more powerful than its predecessor, Mira, while utilizing only 2.7 times the energy usage.2
  • Research goals for the Aurora system include: more powerful, efficient and durable batteries and solar panels; improved biofuels and more effective disease control; improving transportation systems and enabling production of more highly efficient and quieter engines; and wind turbine design and placement for improved efficiency and reduced noise.
  • Contracts valued at more than $200 million are in addition to the recent selections of Intel architecture for the DOE's next-generation Trinity and Cori  supercomputers.
  • Aurora will be based on Intel's scalable system framework combining multiple Intel HPC building blocks, including future generations of Intel® Xeon Phi™ processors and the Intel® Omni-Path Fabric high-speed interconnect technology, a new non-volatile memory architecture and advanced file system storage using Intel® Lustre* software.
  • The Theta system will be powered by Intel® Xeon® processors and next-generation Intel Xeon Phi processors, code-named Knights Landing, and will be based on the next-generation Cray XC supercomputer.

 

Intel's HPC Scalable System Framework
The Aurora supercomputer represents a new architectural direction based on Intel's HPC scalable system framework. The framework is a flexible blueprint for developing high-performance, balanced, power-efficient and reliable systems capable of supporting both compute- and data-intensive workloads. The framework combines next-generation Intel Xeon and Xeon Phi processors, Intel Omni-Path Fabric, innovative memory technologies, Intel® Silicon Photonics Technology and the Intel Lustre parallel file system – with the ability to efficiently integrate these components into a broad spectrum of HPC system solutions. The framework also provides a ubiquitous and standards-based programming model, extending the ecosystem's current investments in existing code for future generations.

 

Supporting Quotes

  • "Argonne's decision to utilize Intel's HPC scalable system framework stems from the fact it is designed to deliver a well-balanced and adaptable system capable of supporting both compute-intensive and data-intensive workloads," said Rick Stevens, associate laboratory director for Argonne National Laboratory. "We look forward to collaborating with both Intel and Cray on this important project that will be critically important to U.S. high-performance computing efforts for years to come."
  • "The Aurora system will be one of the most advanced supercomputers ever built, and Cray is honored and proud to be collaborating with two great partners in Intel and Argonne National Lab," said Peter Ungaro, president and CEO of Cray. "The combination of Cray's vast experience in building some of the world's largest and most productive supercomputers, combined with Intel's cutting-edge technologies will provide the ALCF with a leadership-class system that will be ready for advancing scientific discovery from day one."

 

Supporting Resources

 

Interactive Photo Capsule

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel, the Intel logo, Xeon and Intel Xeon Phi, Omni-Path Fabric and Silicon Photonics are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

 

Results have been estimated or simulated using internal Intel analysis or architecture simulation or modeling, and provided to you for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance.

 

1 ASCI Red at the Sandia National Laboratory

 

2 The ALCF's current Mira system delivers a peak performance of 10 petaflops and a peak power consumption of 4.8 megawatts. The Aurora system will have a peak performance of 180 petaflops and a peak power consumption of 13 megawatts.

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Today Dell unveiled the Dell Venue 10 7000, a premium Android tablet powered by a quad-core Intel® Atom™ Z3580 processor. The razor-thin device features a detachable, magnetic keyboard to enable enhanced productivity and can be used in five different configurations: tablet, slate, stand, tent and clamshell modes. Ideal for both work and play, the Venue 10 7000 also boasts the Intel® RealSense™ snapshot depth camera and the Dell Gallery application. Dell also announced the availability of the Venue 10 (5050) for Education and an update to Android 5.0 Lollipop on its award-winning Venue 8 7000. The Venue 10 7000 starts at USD $499.00 and will be available on Dell.com in the United States, Canada and China starting May, 2015.

MICA, My Intelligent Communication Accessory, the smart luxury accessory designed by Opening Ceremony and engineered by Intel, will now deliver horoscopes, styling tricks, trend reports and industry news from popular lifestyle site Refinery29 directly to the wrist so style-obsessed fashionistas can prepare for the week ahead. The new R29 Fashion and Horoscopes features for MICA provide wearers with a fun and unique look at what their future has in store while empowering them with fashion tips to start the week off right. The Refinery29-powered features are free and part of the MICA experience and will be updated every Monday. MICA wearers can download the new features by manually updating the device. Current MICA customers can download the new features by manually updating the device by going to SETTINGS>I> UPDATE YOUR MICA.

 

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R29 Fashion menu

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R29 Horoscopes menu

Intel® Software is simplifying new product development with the launch of Intel® Firmware Engine, a free graphical tool which helps Intel customers quickly create system firmware for tablets, IoT and embedded devices. Intel Firmware Engine makes use of a new binary-only approach to accelerate the creation of firmware, the basic software needed to initialize platform hardware and launch operating systems such as Microsoft Windows*, Android* and Linux*. Announced today by Doug Fisher, senior vice president and general manager of Intel’s Software and Services Group at the Intel Developer Forum in Shenzhen, China, Intel Firmware Engine supports multiple products based on the Intel® Atom™ and Intel® Quark™ processors. For more information, please read this blog by Intel Software and watch this product overview video.

Intel Extends Intel® Atom™ x3 Processor Roadmap to Internet of Things; Unveils Intel Mass Makerspace Accelerator Program to Drive Global Innovation, Entrepreneurship

 

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Intel CEO Brian Krzanich is joined on stage by Rockchip CEO Mr. Min Li at IDF Shenzhen. Li discussed the progress made since the companies formed a strategic collaboration last year to expand the offerings of the Intel® Atom™ x3 processor family (codenamed 'SoFIA') for entry and value tablets, phablets and smartphones.

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Quadcopter Swarm and Dance at Intel Developer Forum Shenzhen, China: Intel CEO Brian Krzanich closes his keynote in Shenzhen with a swarm of six 'Spaxel' LED-equipped quadcopters from Ars Electronica Future Lab. Together, the quadcopters can make up a drone swarm and also "draw" three dimensional figures in midair. Demonstrating these capabilities, the quadcopters performed the art of light painting, drawing the Chinese characters for the word collaboration as well as the Intel logo swirl. The six 'Spaxel' quadcopters ended the performance with a choreographed dance to music.

INTEL DEVELOPER FORUM, Shenzhen, China, April 8, 2015 – As Intel Corporation celebrates 30 years of local and global technology innovation this year with China, Intel CEO Brian Krzanich today announced additional investments and collaborations that promise to deliver value across a range of industries for the smart, connected world for years to come.

 

Krzanich, along with additional keynote speakers Ian Yang, president of Intel China, and Doug Fisher, senior vice president and general manager of Intel's Software and Services Group, opened the company's annual developer conference for Chinese developers today. Kirk Skaugen, senior vice president and general manager of Intel's Client Computing Group; Diane Bryant, senior vice president and general manager of Intel's Data Center Group; and Doug Davis, senior vice president and general manager of Intel's Internet of Things Group will speak on April 9.

 

Krzanich stressed the need for Intel and the developer community to provide leading- edge technologies to China that drive differentiation across a range of products and industries – from the data center to PC and mobile devices to wearables, as well as the Internet of Things (IoT). He also emphasized the importance of the maker community to develop new generations of computing and connected solutions.

 

"The local and global impact of our 50 years of Moore's Law innovation and 30 years of strong collaboration and winning together in China is unmatched," said Krzanich. "Intel remains focused on delivering leadership products and technologies in traditional areas of computing, while also investing in new areas and entrepreneurs – students, makers and developers – to find and fuel future generations of innovation with China."

 

New Products, Collaborations and Investments in China Drive Future Innovation

  • Rockchip CEO Min Li joined Krzanich on stage to discuss progress made since the companies formed a strategic collaboration last year to expand the offerings of the Intel® Atom™ x3 processor family (code-named "SoFIA") for entry and value tablets, phablets and smartphones. Multiple original design manufacturers (ODMs) are designing products based on the Intel® Atom™ x3-C3230RK quad-core processor reference design from Rockchip, with devices expected to be in market later this quarter. In addition, Intel previously announced ecosystem support from 20 companies, with more than 45 tablet, phablet and smartphone designs currently in development based on the Intel Atom x3 processor reference designs.
  • Intel showcased the first live demonstration of the Intel Atom x3 processor in a smartphone, supporting LTE-TDD connectivity over China Mobile's* network. The part is expected to ship in the second half of this year.
  • Intel announced the expansion of the Intel Atom x3 processor roadmap with the addition of 3G and LTE processors for the Internet of Things. The new purpose-built processors will be offered with an extended temperature range for extreme weather conditions, support for Linux* and Android*, and seven years of extended product lifecycle support. Developer kits will be available in the second half of this year.
  • Krzanich discussed how Intel® RealSense™ cameras can provide intuitive, vision-based capabilities for solving complex problems and delivering exciting new usages and capabilities across a variety of form factors. To that end, he showed for the first time a 6-inch smartphone prototype with a new, longer-range Intel RealSense camera built into the device.
  • Intel announced that the Intel® Pentium® and Intel® Celeron® processors (code-named "Braswell"), the next-generation system-on-chip (SoC) based on Intel's 14nm process technology, are now shipping to customers for 2 in 1 devices, laptops, tower and miniature desktops, and all in one PCs. These processors offer the ideal balance of cost, performance and power, and are optimized for the value and entry segments. The new processors are expected to deliver up to two times1 the graphics performance and increased battery life2 compared to the previous generation at a lower thermal design point. More than 40 designs from a variety of OEMs are expected later this year.
  • Building on a successful turnkey program for the Intel Atom x3 and Z3700 processors, Intel announced it will expand the program to include the Intel® Atom™ x5 processor to help reduce customers' cost and time to market for Intel-based tablets. The program offers a customizable reference design with differentiated applications and software, quality and certification support, software tools, and a component catalogue.
  • Intel unveiled the Mass Makerspace Accelerator program that aims to find and fund China's next global entrepreneurs, from makers and students to developers and startups, and includes a RMB 120 million investment.
  • Intel shared details of its collaborations with Chinese companies to help address opportunities in energy efficiency, transportation and pollution monitoring.
    • Vantron* and BII Group* worked together to incorporate Intel-based IoT gateways into the Beijing Friendship Hotel* to help gather sensor data and create a smart building that consumes less energy.
    • Intel is working with TransWiseway*, a Beijing traffic information service provider for vehicle monitoring and management solutions, to create an end-to-end commercial vehicle telematics platform based on Intel® Quark™ technology. The solution has received the Ministry of Transportation certification and approval, and a nationwide deployment of this solution is scheduled for this year.
    • Intel Chengdu Fab engineers created an air monitoring system using the Intel® Edison platform that Cylan*, a CTE customer, incorporated into its smart home gateway to create an end-to-end pollution and energy management system.
  • Intel, the Strategic Alliance of Smart Energy Industrial Technology Innovation* (SASE) and ecosystem partner BII Group announced their first joint IoT lab in China. Located in Beijing, the lab will demonstrate and promote solutions based on Intel® technology and support product validation and connecting to the energy cloud.
  • Intel and the Chinese Academy of Sciences' Supercomputing Department introduced the first Intel® Parallel Computing Center (Intel® PCC) in China. The Intel PCC will work to modernize software code for molecular dynamics models. The models will interact with billions of particles to provide insight for biology and DNA, potential cures to disease, genetics, and more.

 

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel, the Intel logo, Intel RealSense, Pentium, Celeron, Intel Atom and Quark are trademarks of Intel Corporation in the U.S. and/or other countries.

 

*Other names and brands may be claimed as the property of others.

 

1 Braswell-based Intel Celeron processor N3700 (6W TDP) expected to improve 3-D graphics performance by 2x compared to BYT-M based Intel Celeron processor N3540 (7.5W TDP) as measured on 3DMark* Sky Diver and GFXBench* 3.0 (Trex). System Configuration: Windows 8.1, 2x2GB DDR3L, 240GB SSD, 19x10 Panel.

 

2 Based on 1080p video playback scenario. Configuration: 35WHr Battery, 11.6-inch panel at 19x10 resolution operating at 200 nits with DPST enabled, non-Touch, non-PSR; 4GB DDR3L; eMMC 5.0 storage, PCIE WIFI. Assumed VR solution is SVID Vnn.

SANTA CLARA, Calif., April 6, 2015 -- Beginning with the publication of Intel Corporation's first-quarter earnings report on Tuesday, April 14, the company will revise the presentation of its operating segments to reflect the combination of the PC Client Group and the Mobile and Communications Group to create the Client Computing Group. The new group was created to address all aspects of the client computing market segment and utilize Intel's intellectual property to offer compelling customer solutions. The company is providing its updated financial reporting structure now, as shown below, in order to give visibility into the new model. Actual results will be reported with the first-quarter earnings report. At that time, Intel will also provide commentary on the company's goal to improve mobile profitability by $800 million in 2015.

 

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  • Client Computing Group: Includes platforms designed for the notebook (including Ultrabook™ devices), 2 in 1 systems, the desktop (including all-in-ones and high-end enthusiast PCs), tablets, and smartphones; mobile communication components; as well as wireless and wired connectivity products.
  • Data Center Group: Includes server, network, and storage platforms designed for enterprise, cloud, communications infrastructure, and technical computing segments.
  • Internet of Things Group: Includes platforms designed for embedded market segments including retail, transportation, industrial, and buildings and home, along with a broad range of other market segments.
  • Software and services operating segments consists of the following:
    • McAfee: Includes software products for endpoint security, network and content security, risk and compliance, and consumer and mobile security.
    • Software and Services Group: Includes software and hardware products and services that promote Intel® architecture as the platform of choice for software development.
  • All other consists of the following:
    • Non-Volatile Memory Solutions Group: Includes NAND flash memory products for use in a variety of devices.
    • New Devices Group: Includes reference devices and technology platforms ready to be used by customers as well as System-on-Chip architecture specifically designed for wearable and other emerging compute opportunities.
    • Corporate: Revenue, expenses, and charges such as:
      • Amounts included within restructuring and asset impairment charges;
      • A portion of employee benefits, compensation, and other expenses not allocated to the operating segments;
      • Divested businesses for which discrete operating results are not regularly reviewed by our chief executive officer;
      • Results of operations of startup businesses that support our initiatives, including our foundry business;
      • Acquisition-related costs, including amortization and any impairment of acquisition-related intangibles and goodwill.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel, the Intel logo and Ultrabook are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

Intel Education and Intel Capital have launched the Intel Education Accelerator, a specialized accelerator program designed to help education technology startups transform education for student success. Located in the heart of Silicon Valley, the Intel Education Accelerator will provide selected companies with the opportunity to receive guidance and insights from technology, business and education experts; leverage Intel’s global reach and relationships with educators and governments in more than 100 countries; and secure investments of up to $100,000 from Intel Capital. Apply or learn more about the Intel Education Accelerator.

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ASUS, AT&T and Intel introduced the ASUS MeMO Pad 7 LTE, an affordable Android* tablet powered by a quad-core Intel® Atom™ processor and paired with the LTE Advanced Intel® XMMTM 7260 modem. The ASUS MeMO Pad 7 LTE provides extensive battery life and enables users to quickly and seamlessly access apps, browse the Internet and enjoy quality entertainment and gaming. The tablet also boasts dual front stereo speakers, a high-definition IPS+ display with a 178-degree wide viewing angle, and a five megapixel rear-facing camera with advanced shooting modes such as Time Rewind and Selfie. The ASUS MeMO Pad 7 LTE, priced at $8.75 per month for 20 months with the AT&T Tablet Installment plan, or $74.99 with a two-year agreement, will be available in AT&T stores, www.att.com, and select national retailers beginning April 10.

Today, at the Transact 15 show in San Francisco, Intel announced acollaboration with Ingenico Group to  combine Intel technology with Ingenico Group secure payment technology for secure, connected mobile payment solutions. Together, the companies will develop a mobile tablet that supports EuroPay, MasterCard and Visa (EMV) and NFC payments. The tablet will feature Intel® Data Protection Technology for Transactions, which offers end-to-end protection of customer data from the moment a card is presented to information stored in the cloud. The collaboration comes just in time – in October 2015, the liability shift associated with the chip-and-pin payment system is due to take effect in the U.S., and merchants are starting to recognize the need for security practices beyond compliance while meeting customer experience expectations.

Collaboration Provides Retailers With Increased Security for Mobile Payments and Addresses Credit Card Fraud Deadline

 

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Doug Davis, senior vice president and general manager of Intel's Internet of Things Group, and Philippe Lazare, chairman and CEO of Ingenico Group, shake hands on stage at Transact 15 in San Francisco. Intel and Ingenico Group announced a collaboration to combine Intel technology and Ingenico Group secure payment acceptance for the Internet of Things.

SAN FRANCISCO and PARIS, April 2, 2015 - Today, Ingenico Group (Euronext: FR0000125346 - ING) and Intel Corporation announced a collaboration to combine Intel technology and Ingenico Group secure payment acceptance for the Internet of Things. The companies will jointly develop a mobile tablet that supports EMV1 and NFC payment functionalities, a standard required by banks to help prevent credit card fraud.

 

Today, banks are responsible for fraudulent activity on credit cards, costing them US$14 billion in 20132. By October 2015, banks will require retail merchants to upgrade their POS equipment to support EMV chip cards. If they do not, the retailers will be responsible for recovering the funds if fraud should occur.

 

Under the collaboration, Intel® Data Protection Technology for Transactions will be combined with Ingenico Group payment acceptance capabilities in mobile and future solutions in the United States and Canada, beginning with the jointly developed mobile tablets based on the Intel® Atom™ processor.

 

This will pave the way to a broader set of initiatives and value-added services to address other worldwide devices for the Internet of Things, including intelligent vending machines, kiosks and digital signage.

 

"We are very pleased to enter a collaboration with Intel, deploying secured payment acceptance into new connected devices," commented Philippe Lazare, chairman and CEO, Ingenico Group. "This is a great example of how innovation can simplify the purchasing experience and further enhance the merchant-consumer relationship. Bringing secure payment into connected devices will root our payment acceptance expertise in the Internet of Things".

 

"The shift in liability this October will be a major milestone in the United States for banks and credit card companies, but especially for retailers," said Doug Davis, senior vice president and general manager, Internet of Things Group, Intel. "Intel and Ingenico Group are working to bridge the retail experience and security gap while also making sure devices are easy to deploy and manage so we don't create new burdens for the merchants."

 

Both companies will be at the Transact 15 Annual Convention & Expo in San Francisco. For more information on the partnership, please stop by Ingenico Group's booth (#515) or Intel's booth (#1825), or visit the Intel online newsroom at www.intel.com/newsroom/iot.

 

About Ingenico Group
Ingenico Group (Euronext: FR0000125346 - ING) is the global leader in seamless payment, providing smart, trusted and secure solutions to empower commerce across all channels, in-store, online and mobile. With the world's largest payment acceptance network, we deliver secure payment solutions with a local, national and international scope. We are the trusted world-class partner for financial institutions and retailers, from small merchants to several of the world's best known global brands. Our solutions enable merchants to simplify payment and deliver their brand promise.

 

www.ingenico.com | twitter.com/ingenico

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel, the Intel logo and Intel Atom may be registered trademarks or trademarks of Intel Corporation in the United States and some other countries.

 

*Other names and brands may be claimed as the property of others.

 

1 EuroPay, MasterCard and Visa

 

2 Business Insider, March 4, 2014

 

SSD_750_photo_sm.jpgIntel today unveiled the Intel® Solid-State Drive (SSD) 750 Series, its highest performing SSD for use in client PC storage devices and workstations. The 750 series delivers greater than four times the performance of SATA-based SSDs by utilizing four lanes of PCIe 3.0 and the NVM Express (NVMe) standard. For added flexibility, it is available as both an add-in card for systems with an accessible PCIe 3.0 slot and as a 2.5 inch small form factor solution.  Intel also announced the availability of the Intel® SSD 535 Series which offers the ideal balance of cost and performance for mainstream client PC storage devices. Read more about the SSD 750 Series and SSD 535 Series, as well as tests and configurations.

SANTA CLARA, Calif., April 2, 2015 - Intel Corporation today published its 2014 annual report and 2015 proxy statement, which are now available at www.intc.com. The company also announced that its 2015 Annual Stockholders' Meeting will be held on May 21 at Intel's corporate headquarters in Santa Clara, and online at www.intc.com.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

Surface 3 powered by the Intel Atom x7 processor

Surface 3 powered by the Intel Atom x7 processor

Today, Microsoft introduces the new Surface 3, powered by the recently announced Intel® Atom™ x7 processor, the highest performing processor in the Intel Atom™ product family. The Intel Atom x7 processor doubles the graphics performance over the prior generation processor.  Surface 3 is the thinnest and lightest Surface yet and is optimized to run Windows and Office at an affordable price. The Surface 3 will be available for pre-order starting today on March 31.

Micron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies

 

NEWS HIGHLIGHTS

  • 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity1 than other NAND die in production.
  • Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB.
  • Innovative process architecture techniques extend Moore's Law for flash storage, bringing significant improvements in density while lowering the cost of NAND flash.

 

 

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Enables gum stick-sized SSDs with more than 3.5TB of storage

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Innovative process architecture techniques extend Moore's Law for flash storage to bring significant improvements in density and lower the cost of NAND flash

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Micron and Intel unveil new 3D NAND technology with three times higher capacity than other NAND die in production

BOISE, Idaho and SANTA CLARA, Calif., March 26, 2015 – Micron Technology, Inc. (Nasdaq: MU), and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

 

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity1 than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

 

Planar NAND flash memory is nearing its practical scaling limits, posing significant challenges for the memory industry. 3D NAND technology is poised to make a dramatic impact by keeping flash storage solutions aligned with Moore's Law, the trajectory for continued performance gains and cost savings, driving more widespread use of flash storage.

 

"Micron and Intel's collaboration has created an industry-leading solid-state storage technology that offers high density, performance and efficiency and is unmatched by any flash today," said Brian Shirley, vice president of Memory Technology and Solutions at Micron Technology. "This 3D NAND technology has the potential to create fundamental market shifts. The depth of the impact that flash has had to date—from smartphones to flash-optimized supercomputing—is really just scratching the surface of what's possible."

 

"Intel's development efforts with Micron reflect our continued commitment to offer leading and innovative non-volatile memory technologies to the marketplace," said Rob Crooke, senior vice president and general manager, Non-Volatile Memory Solutions Group, Intel Corporation. "The significant improvements in density and cost enabled by our new 3D NAND technology innovation will accelerate solid-state storage in computing platforms."

 

Innovative Process Architecture
One of the most significant aspects of this technology is in the foundational memory cell itself. Intel and Micron chose to use a floating gate cell, a universally utilized design refined through years of high-volume planar flash manufacturing. This is the first use of a floating gate cell in 3D NAND, which was a key design choice to enable greater performance and increase quality and reliability.

 

The new 3D NAND technology stacks flash cells vertically in 32 layers to achieve 256Gb multilevel cell (MLC) and 384Gb triple-level cell (TLC) die that fit within a standard package. These capacities can enable gum stick-sized SSDs with more than 3.5TB of storage and standard 2.5-inch SSDs with greater than 10TB. Because capacity is achieved by stacking cells vertically, the individual cell dimensions can be considerably larger. This is expected to increase both performance and endurance and make even the TLC designs well-suited for data center storage.

 

The key product features of this 3D NAND design include:

  • Large Capacities –Three times the capacity of existing 3D technology1—up to 48GB of NAND per die—enabling three-fourths of a terabyte to fit in a single fingertip-sized package.
  • Reduced Cost per GB – First-generation 3D NAND is architected to achieve better cost efficiencies than planar NAND.
  • Fast – High read/write bandwidth, I/O speeds and random read performance.
  • Green – New sleep modes enable low-power use by cutting power to inactive NAND die (even when other die in the same package are active), dropping power consumption significantly in standby mode.
  • Smart – Innovative new features improve latency and increase endurance over previous generations, and also make system integration easier.

 

The 256Gb MLC version of 3D NAND is sampling with select partners today, and the 384Gb TLC design will be sampling later this spring. The fab production line has already begun initial runs, and both devices will be in full production by the fourth quarter of this year. Both companies are also developing individual lines of SSD solutions based on 3D NAND technology and expect those products to be available within the next year.

 

Webcast Replay of 3D NAND Announcement

 

Related Information

 

Micron

Take part in Micron's social conversations where we're talking all things storage and memory:

 

Intel

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Micron Technology, Inc.
Micron Technology, Inc., is a global leader in advanced semiconductor systems. Micron's broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron's memory solutions enable the world's most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron's common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com

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1 Capacity difference based on comparison between Micron and Intel 384 Gb TLC 3D NAND die and other industry 3D NAND TLC

3D_NAND_Die_with_M2_SSD.jpg

Micron and Intel today announced the availability of their 3D NAND technology, enabling SSDs the size of a stick of gum that can hold more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB. The companies used innovative techniques to stack layers of data storage cells vertically – in three dimensions – to deliver the world's highest-density flash memory. By bringing more storage to fit in a smaller space, Intel and Micron help consumers and enterprise customers save significant cost, reduce power and add considerable performance. The 256Gb multilevel cell version of 3D NAND is sampling today with select partners, and the 384Gb triple-level cell design will begin sampling later this spring.

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