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http://www.intel.com/newsroom/kits/idf/2014_fall/gallery/images/Intel_Edison_with_stamp_p.jpgDuring his IDF Mega Session today, Mike Bell, Intel New Devices Group VP, highlighted several Intel® Edison-powered prototypes – from quad copters and audio speakers to a braille printer and 3D garment. By shrinking the size of the microprocessor to rely on very little power, Intel Edison is available now to allow Intel and inventors to rethink where – and in what situations – computing is possible and desirable. Also learn more in the Makers press kit.

IDF_IOTG_Graphic4.jpgWhat do kegs, wheelchairs and big rig trucks have in common? They are just some of the everyday objects that are being transformed into intelligent, data-driven solutions for real-world problems as a part of the Internet of Things (IoT). At this year’s Intel Developer Forum (IDF), Intel’s Doug Davis will highlight the top 10 Intel-based IoT solutions, three of which will be demonstrated at IDF, including a connected wheelchair, the SteadyServ iKeg System, and fleet management solution with Vnomics. Intel will also announce collaborations with AT&T, Cisco, GE and IBM to build complete IoT solutions and create innovative product plans. These exciting new technologies will help build the connected future in which we’ll all live, work and play.

During Intel CEO Brain Krzanich’s keynote today at the Intel Developer Forum, Michael Dell, chairman and CEO of Dell, previewed the upcoming Dell Venue 8 7000 Series – the first tablet with Intel® RealSense™ snapshot and the world’s thinnest tablet, measuring only 6mm in thickness. Intel RealSense snapshot is an enhanced photography solution that creates a high-definition depth map to enable measurement, refocus, and selective filters with a touch of a finger. It will introduce new capabilities and new ways of using the tablet, opening up a new creative horizon for developers to come up with apps that change how consumers engage with their photos.   For example, consumer can change the focus of a photo to different objects or foregrounds in editing.  Objects within the photo can also be measured.  The Android-based tablet is powered by the Intel® Atom™ Z3500 processor series and will be available in time for holiday.

Announces Availability of Intel® Edison and 2nd Generation LTE Modem Platforms

 

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The Dell Venue 8 7000 Series with Intel® RealSense™ snapshot, powered by Intel® Atom™ Z3500 processer series is the world's thinnest tablet. RealSense snapshot is Intel's enhanced 3-D photography solution that captures depth information, without sacrificing image quality, to bring new life to flat, static photos.

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It was announced today at the Intel Developer Forum (IDF) that Intel® Edison, only slightly larger than a postage stamp, is now available to pro makers and entrepreneurs to power small and worn devices.

INTEL DEVELOPER FORUM, San Francisco, Sept. 9, 2014 – Intel Corporation CEO Brian Krzanich kicked off Intel's annual technical conference with a broad set of computing initiatives and projects showing how the company is moving quickly to enable new market segments where everything is smart and connected. Krzanich and other executives announced new hardware and software developer tools, previewed upcoming Intel technologies and announced new products across several technology segments.

 

"With our diverse product portfolio and developer tools that span key growth segments, operating systems and form factors, Intel offers hardware and software developers new ways to grow as well as design flexibility," said Brian Krzanich, Intel CEO. "If it's smart and connected, it is best with Intel."

 

During the keynote, Krzanich was joined on the keynote stage by several Intel executives, Michael Dell, chairman and CEO of Dell*, and Greg McKelvey, executive vice president and chief strategy and marketing officer of the Fossil Group*.

 

The technical conference's format and content were revamped this year to appeal to an expanded range of engineers and programmers, reflecting Intel's efforts to extend the reach of Intel technology. The agenda and technology showcase content expanded beyond PCs, mobile and the data center to also include the Internet of Things (IoT) and wearables and other new devices created by so-called "makers" and inventors. More than 4,500 people are attending the forum this week from around the world.

 

Developer Tools News Items

  • Intel announced the Intel Reference Design for Android  program to offer tablet users a high quality, consistent experience based on the latest Android* operating system. Intel will help scale the deployment process of Android for tablet manufacturers by providing the software engineering work, streamlined access to Google Mobile Services*, as well as support for updates and upgrades to future Android releases.
  • Intel announced the Analytics for Wearables (A-Wear) developer program that will accelerate development and deployment of new wearable applications with data-driven intelligence. The developer program integrates a number of software components, including tools and algorithms from Intel and data management capabilities from Cloudera* CDH all deployed on a cloud infrastructure optimized on Intel® architecture. Developers of Intel wearables will use the A-Wear developer program free of charge.

 

Intel Product Availability News Items

  • Intel announced the first commercial availability of the Intel® XMM™ 7260 modem, now shipping in the Samsung* Galaxy Alpha smartphone for Europe and other regional markets. The Intel XMM 7260 and Intel® XMM™ 7262 modems support one of the industry's fastest mobile standards, delivering Category 6 data rates up to 300 Mbps. The modems are Intel's second-generation LTE platforms and provide device manufacturers a high-performance, power-efficient solution for the coming wave of LTE-Advanced networks and devices.
  • Intel® Edison, a postage stamp-size computer with built-in wireless that was announced at CES, is now shipping and available. The platform is designed to enable rapid innovation and product development from inventors, entrepreneurs and consumer product designers by simplifying the design process, increasing durability and providing additional cost savings.
  • AT&T* will be the exclusive carrier for the"My Intelligent Communication Accessory" (MICA) bracelet designed by Opening Ceremony, engineered by Intel, that was introduced last week in New York.

 

Product and Innovation Preview News Items

  • Michael Dell and Krzanich previewed an upcoming Dell tablet with first-of-its-kind photo capabilities. The new Dell Venue 8 7000 Series with Intel® RealSense™ snapshot is the world's thinnest tablet and will be available in time for the holiday season. Intel RealSense snapshot is an enhanced photography solution that creates a high-definition depth map to enable measurement, refocus and selective filters with a touch of a finger. It will introduce new capabilities and new ways of using the tablet, opening up a new creative horizon for developers to come up with apps that change how consumers engage with their photos.
  • Intel® Wireless Gigabit Docking – a full wireless experience that includes wireless docking, wireless display and wireless charging – was demonstrated via an Intel reference design based on a 14nm next-generation Intel processor.
  • Developers got a preview of the next generation 14nm Intel® Core™ processor for 2015.
  • Renowned physicist Stephen Hawking joined the conference via video to discuss how technology for the disabled is often a proving ground for the technology of the future. In connection with Hawking's video attendance, Intel revealed for the first time a unique Connected Wheelchair Project, a proof of concept designed by Intel interns as part of the Intel Collaborators program. The project demonstrated how to transform standard "things" into data-driven, connected machines using the Intel Galileo Development Kit, based on Intel® Quark processors, and Intel® Gateway Solutions for the IoT, featuring Wind River* and McAfee* security products.

 

IDF Preview

  • Developers will experience 164 technical sessions with industry and Intel experts.
  • Intel's business units and more than 180 leading companies from around the world will showcase 700 hands-on demonstrations of their newest innovations and future technologies at the IDF Industry Technology Showcase.
  • During the IoT mega session this morning, Intel Vice President Doug Davis will address interoperability and security challenges and describe Intel's integrated hardware and software building blocks for edge-to-cloud IoT solutions. He will disclose that Intel is collaborating with AT&T*, Cisco*, GE* and IBM* to create complete solutions utilizing their platforms and Intel's building blocks. The companies will announce joint products that are available today in addition to future product plans.
  • In the Intel Edison, Wearables and New Devices mega session this afternoon, Intel Vice President Mike Bell will preview several Intel Edison-powered prototype devices, including a 3-D printed interactive garment and a braille printer and embosser. Meridian Audio*, a top high performance audio and video component manufacturer, will also discuss how Intel Edison contributes to advancing its wireless audio product offerings.
  • During the Software Developer mega session this afternoon, Intel Vice President Doug Fisher will introduce tools that help developers create software easier, faster and across ecosystems. He will also talk about the ease with which OEMs and ODMs will be able to build a Windows-* or Android-based device using customized tools and reference designs from Intel.
  • In the Mobile Technology mega session this afternoon, Intel Vice President Hermann Eul will challenge developers to play a role in solving the world's most critical problems and advancing societies across the globe, in particular in developing countries, through innovations for the most prominent technology in people's hands, the mobile device. He will highlight the hardware, software and communications technologies that will allow developers to tap into this opportunity and aid in providing change, progress and innovation.
  • During the Data Center mega session tomorrow morning, Intel Senior Vice President Diane Bryant will discuss how data centers are being re-architected, driven in large part by the rise of the digital service economy. This session will include an update on future Intel silicon photonics products and details on how Intel is tailoring products for individual data center customers.
  • In the PC Reinvention and Innovation mega session tomorrow morning, Intel Senior Vice President Kirk Skaugen will discuss how developers can address the 600 million unit global opportunity of 4-year-old and older PCs that could be replaced with exciting new form factors and new experiences across multiple operating systems. Skaugen will update developers on ChromeOS* and Intel® Wireless Display momentum, and as well as the Alliance for Wireless Power wireless charging consortium.

 

Supporting Resources

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel, Intel Core, Intel RealSense, XMM, Quark and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

To support the next generation Intel® Xeon® processor E5-2600 v3 family, Intel announced three new product families spanning multiple server use-cases, including server motherboards, systems, server chassis, RAID, and spares/accessory parts. The Intel® Server Board S2600WT Family offers maximum product flexibility for expansion designed for the enterprise and medium business IT, big data and cloud server use-cases. The Intel® Server Board S2600KP Family offers a 2-socket half-width, 8 DIMM rack 2U/4-node chassis for HPC and big data and the Intel® Server Board S2600CW Family offers a 2-socket rack for purpose-built appliance, SMB, storage and cloud. Intel Server Products provide Intel technology providers and system resellers with industry-leading and trusted server building blocks based on the latest Intel Xeon processor technology. Server building blocks are available now with more products available soon. Get more information.

To meet the rapidly evolving needs of data centers, Intel today introduced the Intel® Xeon® processor E5-2600/1600 v3 product families. Setting 27 new performance world-records, with increases of up to 3x compared with previous generation, and providing new monitoring and management features, the processors help enable the re-architecture of the data center to take full advantage of the benefits of cloud-based services. For more information, visit the newsroom, and for photos and videos, visit the Transforming Business site.

New Technologies Provide a Range of Capabilities and Are Central to Enabling a Software Defined Infrastructure

 

NEWS HIGHLIGHTS

  • New monitoring and management features aid rapid, automated deployment of workloads, increase efficiency and improve service quality.
  • Provides leadership performance for compute, storage and network workloads to enable efficient and dynamic operation in cloud environments.
  • Twenty-seven new performance world records1, with increases up to 3x compared with previous generation2.
  • Up to 50 percent more cores and cache3 than the previous generation, and first-ever server platform supporting DDR4 memory for improved application performance.

 

 

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SANTA CLARA, Calif., Sept. 8, 2014 – Intel Corporation today introduced the Intel® Xeon® processor E5-2600/1600 v3 product families to address the requirements of diverse workloads and the rapidly evolving needs of data centers. The new processor families include numerous enhancements that provide performance increases of up to 3x over the previous generation2, world-class energy efficiency and enhanced security. To facilitate the explosive demand for software defined infrastructure (SDI), the processors expose key metrics, through telemetry, which enable the infrastructure to deliver services with the best performance, resilience and optimized total cost of ownership.

 

The processors will be used in servers, workstations, storage and networking infrastructure to power a broad set of workloads such as data analytics, high-performance computing, telecommunications and cloud-based services, as well as back-end processing for the Internet of Things.

 

"The digital services economy imposes new requirements on the data center, requirements for automated, dynamic and scalable service delivery," said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. "Our new Intel processors deliver unmatched performance, energy efficiency and security, as well as provide visibility into the hardware resources required to enable software defined infrastructure. By enabling the re-architecture of the data center, Intel is helping companies fully exploit the benefits of cloud-based services."

 

Enabling Software Defined Infrastructure
Software defined infrastructure (SDI) is the foundation for cloud computing. The digital services economy requires agility and scale that demands all infrastructure resources be programmable and highly configurable. These abilities, coupled with telemetry, analytics, and automated actions, allow the data center to become highly optimized. Intel continues to invest in delivering this vision of an automated data center, and with the new Xeon E5-2600 v3 product family, the company has introduced key sensors and telemetry that further enhance SDI.

 

The Intel Xeon processor E5-2600 v3 product family introduce new features that provide greater visibility into the system than ever before. A new cache monitoring feature provides data to enable orchestration tools to intelligently place and rebalance workloads resulting in faster completion times. This also provides the ability to conduct analysis of performance anomalies due to competition for cache in a multitenant cloud environment where there is little visibility into what workloads consumers are running.

 

The new processors also include platform telemetry sensors and metrics for CPU, memory and I/O utilization. With the addition of thermal sensors for airflow and outlet temperature, the visibility and control has increased significantly from the prior generation. The processors offer a holistic set of sensors and telemetry for any SDI orchestration solution to more closely monitor, manage and control system utilization to help maximize data center efficiency for a lower total cost of ownership.

 

Increased Performance and Energy Efficiency
With up to 18 cores per socket and 45MB of last-level cache, the Intel Xeon E5-2600 v3 product family provides up to 50 percent more cores and cache compared to the previous generation processors. In addition, an extension to Intel® Advanced Vector Extensions 2 (Intel AVX2)4 doubles the width of vector integer instructions to 256 bits per clock cycle for integer sensitive workloads and delivers up to 1.9x higher performance gains5.

 

The Xeon E5-2600 v3 product family also increases virtualization density, allowing support for up to 70 percent more VMs per server compared to the previous generation processors6, which helps to reduce data center operational expenses. Memory bandwidth constrained workloads will gain up to 1.4x higher performance compared to the previous generation7 with the support of next-generation DDR4 memory. Intel Advanced Encryption Standard New Instructions (Intel® AES-NI) have also been enhanced to accelerate data encryption and decryption by up to 2x without sacrificing application response times8.

 

The processors are built using Intel's industry-leading and energy-efficient 22nm, 3-D Tri-Gate technology, cutting power consumption while boosting performance of transistors. The new "per-core" power states dynamically regulate and adjust power in each processor core for more power-efficient workload processing.

 

Combining both record performance and advanced efficiency features, the Intel Xeon processor E5-2600 v3 product family sets a new world record for server energy efficiency9 based on performance per watt.

 

Creating Open, Flexible Networks with Intel Xeon E5-2600 v3 Processors
Intel Xeon E5-2600 v3 processors can be paired with the Intel® Communications Chipset 89xx series featuring Intel® Quick Assist Technology to enable faster encryption and compression performance10 to improve security in a wide range of workloads. Service providers and networking equipment providers can use the platform to consolidate multiple communications workloads onto a single, standardized and flexible architecture to speed up services deployment, reduce costs, and create a more consistent and secure user experience.

 

In addition, the new Intel® Ethernet Controller XL710 family helps address the increasing demands on networks with capabilities to enable better performance for virtualized servers and networks. The flexible 10/40 gigabit Ethernet controller provides twice the bandwidth while consuming half the power compared with the previous generation11.

 

Extensive industry support
Starting today, system manufacturers from around the world are expected to announce hundreds of Intel® Xeon® processor E5 v3 family-based platforms. These manufacturers across servers, storage and networking include Bull*, Cray*, Cisco*, Dell*, Fujitsu*, Hitachi*, HP*, Huawei*, IBM*, Inspur*, Lenovo*, NEC*, Oracle*, Quanta*, Radisys*, SGI*, Sugon* and Supermicro*, among many others.

 

Pricing details
The Intel Xeon processor E5-2600 v3 product family will be offered with 26 different parts that range in price from $213 to $2,702 in quantities of 1,000. Intel Xeon processor E5-1600 workstations will be offered with six different parts in prices ranging from $295 to $1,723. Complete pricing details can be found in the Intel Newsroom. For more details on these new Intel Xeon processors, visit the online press kit.

 

 

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

 

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

 

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

 

1 Twenty-seven performance world records based on two-socket configurations. Source as of Sept. 8, 2014. Full details available at: http://www.intel.com/content/www/us/en/benchmarks/server/xeon-e5-2600-v3/xeon-e5-2600-v3-summary.html.

 

2 Source as of Sep. 8, 2014. New configuration: Hewlett-Packard Company HP ProLiant ML350 Gen9 platform with two Intel Xeon Processor E5-2699 v3, Oracle Java Standard Edition 8 update 11, 190,674 SPECjbb2013-MultiJVM max-jOPS, 47,139 SPECjbb2013-MultiJVM critical-jOPS. Source. Baseline: Cisco Systems Cisco UCS C240 M3 platform with two Intel Xeon Processor E5-2697 v2, Oracle Java Standard Edition 7 update 45, 63,079 SPECjbb2013-MultiJVM max-jOPS , 23,797 SPECjbb2013-MultiJVM critical-jOPS. Source.

 

3 Intel® Xeon® Processor E5-2699 v3 (18C, 45M Cache) compared to Intel® Xeon® Processor E5-2697 v2 (12C, 30M Cache).

 

4 Intel® Advanced Vector Extensions (Intel® AVX)* provides higher throughput to certain processor operations. Due to varying processor power characteristics, utilizing AVX instructions may cause a) some parts to operate at less than the rated frequency and b) some parts with Intel® Turbo Boost Technology 2.0 to not achieve any or maximum turbo frequencies. Performance varies depending on hardware, software, and system configuration and you can learn more at http://www.intel.com/go/turbo.

 

5 Source as of August 2014 TR#3034 on Linpack*. Baseline configuration: Intel® Server Board S2600CP with two Intel® Xeon® Processor E5-2697 v2, Intel® HT Technology disabled, Intel® Turbo Boost Technology enabled, 8x8GB DDR3-1866, RHEL* 6.3, Intel® MKL 11.0.5, score: 528 GFlops. New configuration: Intel® Server System R2208WTTYS with two Intel® Xeon® Processor E5-2699 v3, Intel® HT Technology disabled, Intel® Turbo Boost Technology enabled, 8x16GB DDR4-2133, RHEL* 6.4, Intel® MKL 11.1.1, score: 1,012 GFlops

 

6 Source as of Sept. 8, 2014. New configuration: Hewlett-Packard Company ProLiant DL360 Gen9 with two Intel Xeon Processor E5-2699 v3, SPECvirt_sc2013 1614 @ 95 VMs. Source.  Baseline: IBM System x3650 M4 platform with two Intel Xeon Processor E5-2697 v2, SPECvirt_sc2013 947.0 @ 53 VMs. Source.

 

7 Source as of August 2014 TR#3044 on STREAM (triad): Intel® Server Board S2600CP with two Intel® Xeon® Processor E5-2697 v2, 24x16GB DDR3-1866 @1066MHz DR-RDIMM, score: 58.9 GB/sec. New Configuration: Intel® Server System R2208WTTYS with two Intel® Xeon® Processor E5-2699 v3, 24x16GB DR4-2133 @ 1600MHz DR-RDIMM, score: 85.2 GB/sec.

 

8 Source as of June 2014 on AES-128-GCM Encryption algorithm: Intel internal measurements using Intel® Server Board S2600CW2S with two Intel® Xeon® Processor E5-2658 v3, DDR4-2133, CentoOS v3.8.4, Open SSL v1.0.2-beta1. Baseline Configuration: Intel internal measurements with two E5-2658 v2, DDR3-1866, CentoOS v3.8.4, Open SSL v1.0.2-beta1.

 

9 Comparison based onSPECpower_ssj2008 results published (http://www.spec.org/) as of Aug. 26, 2014. Sugon I620-G20 platform with two Intel Xeon Processor E5-2699 v3, IBM J9 VM, 10,599 overall ssj_ops/watt. Source (http://www.sugon.com/).

 

10 Intel® Communications Chipset 8920 (20Gbps) compared to Intel Communication Chipset 8955 (50Gbps) capable of up to 2.5x more encryption acceleration. Intel® Communications Chipset 8920 (8Gbps) compared to Intel Communication Chipset 8955 (24Gbps) capable of up to 3x more compression acceleration. 8920 Configuration: C8920 PCIe x16 QA Driver/SDK Release 1.0.0-77 Stargo/ Gladden 4C-8T-8 MB LLC - 2GHz, 2C-4T used for peak CCK throughputs. 8955 Configuration: [8955 PCIe x16 on a Shumway development Platform with Ivy Bridge EP CPUs and QA Driver/SDK 1.00. Tests were performed using UP/8 cores; Measured by Intel].

 

11 Source as of Aug 2014: Calculated Gb/Watt for 2@ Intel Ethernet CNA X520-DA2 Dual-port Twinax Typical Power 11.6W 2: 1@ Intel Ethernet CNA X710-DA4 Quad-port Twinax Typical Power 3.4W for a 222% increase in Gb/Watt (Typical).

At IFA, Intel showcased its portfolio of Intel® RealSense™ Technology, which aims to make computing more natural, intuitive and immersive. While broad availability of Intel RealSense applications and systems is expected in early 2015, momentum is building. There are currently more than sixty ISVs actively developing Intel RealSense applications. Intel demonstrated early versions of several RealSense applications at IFA including one from Scholastic Interactive based on the award-winning, best-selling children’s book series I Spy. The I Spy application features visually rich graphics and immersive interaction that allows the player to discover what they are looking for in fun, new ways. Intel is lining up retail and OEM support for the technology, which will find its way into PCs and tablets from a variety of manufacturers beginning this year. During the event, Intel also showcased its plans for RealSense Technology in tablets as well. Learn more about Intel RealSense Technology.

Fossil Group, Inc. and Intel Corporation announced today they will be collaborating to further develop wearable technology for the fashion industry.  In addition, Fossil Group will work closely with Intel Capital, Intel’s global investment organization, to identify and evaluate co-investments in emerging technologies to accelerate industry innovation and stay at the forefront of the wearable consumer trend. Read more in this blog by Mike Bell, Intel vice president and general manager of Intel’s New Devices Group.

Richardson, TX. September 5th, 2014 – Fossil Group, Inc. (NASDAQ: FOSL) (the "Company") and Intel Corporation (NASDAQ: INTC) announced today that they will be collaborating to further develop wearable technology for the fashion industry.

 

Fossil Group, a global design, marketing and distribution company specializing in fashion accessories will partner with Intel, a leader and innovator in the technology industry, to identify, support and develop emerging trends in the wearable technology space. The companies will work together on emerging products and technologies that will be developed for the fashion-oriented consumer. Fossil Group is committed to being a leader in the space and its work with Intel will enable iconic fashion brands within the Company's portfolio to participate in wearable technology in a fashionable way.

 

Kosta Kartsotis, Chief Executive Officer of Fossil Group, commented: "We are very excited about collaborating with Intel and working to develop the next innovation in the emerging wearable technology space. Combining our fashion lifestyle brands with Intel's expertise in technology, hardware and innovation will position us to be a leader in this segment."

 

Mike Bell, Vice President of Intel and General Manager of the New Devices Group, said: "The combination of Intel's technology and Fossil Group's ability to design innovative fashion accessories and to create, market and distribute globally is why we are confident about this initiative. We are focused on identifying trends and emerging uses of technology and accelerating wearable technology innovation worldwide."

 

In addition, Fossil Group will work closely with Intel Capital, Intel's global investment organization, to identify and evaluate co-investments in emerging technologies to accelerate industry innovation and stay at the forefront of the wearable consumer trend. Intel Capital has invested in a wide range of start-ups in the wearables space, including Thalmic Labs and Basis.

 

Safe Harbor
Certain statements contained herein that are not historical facts, including future earnings guidance, constitute "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995 and involve a number of risks and uncertainties. The actual results of the future events described in such forward-looking statements could differ materially from those stated in such forward-looking statements. Among the factors that could cause actual results to differ materially are: changes in economic trends and financial performance, changes in consumer demands, tastes and fashion trends, lower levels of consumer spending resulting from a general economic downturn, shifts in market demand resulting in inventory risks, changes in foreign currency exchange rates, and the outcome of current and possible future litigation, as well as the risks and uncertainties set forth in the Company's Annual Report on Form 10-K for the fiscal year ended December 28, 2013 filed with the Securities and Exchange Commission (the "SEC").

 

About Fossil Group, Inc.
Fossil Group, Inc. is a global design, marketing and distribution company that specializes in consumer lifestyle and fashion accessories. The Company's principal offerings include an extensive line of men's and women's fashion watches and jewelry sold under a diverse portfolio of proprietary and licensed brands, handbags, small leather goods, accessories and clothing. The Company's products are sold to department stores, specialty retail stores and specialty watch and jewelry stores in the U.S. and in approximately 150 countries worldwide through approximately 25 Company-owned foreign sales subsidiaries and a network of over 60 independent distributors. The Company also distributes its products in over 550 Company-owned and operated retail stores, through its international e-commerce websites and through the Company's U.S. e-commerce website at www.fossil.com. Certain press release and SEC filing information concerning the Company is also available at www.fossilgroup.com.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

 

About Intel Capital
Intel Capital, Intel's global investment organization, makes equity investments in innovative technology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software, and services targeting enterprise, mobility, consumer Internet, digital media and semiconductor manufacturing. Since 1991, Intel Capital has invested more than US$11 billion in over 1,370 companies in 56 countries. In that timeframe, 207 portfolio companies have gone public on various exchanges around the world and 354 were acquired or participated in a merger. In 2013, Intel Capital invested US$333 million in 146 investments with approximately 49 percent of funds invested outside North America. For more information on Intel Capital and its differentiated advantages, visit www.intelcapital.com or follow @Intelcapital.

 

The Intel® Business App Portfolio, a collection of useful business apps to boost productivity and enhance security of small businesses, is now available on the latest Intel-based tablets and 2 in 1 devices running the Windows OS. And, with the app bundle on some of the newest devices powered by Intel® Core™ M processors, users will realize additional benefits with up to 8 hours of battery life with full HD display and up to 50 percent faster CPU performance. Previously offered only on Intel-based tablets running the Android OS, the mobile app bundle includes special offers—valued at more than $250—and is now available with the following Windows apps: AirWatch, Calc Pro HD, CamCard, Dictionary, DocuSign, Drawboard PDF, McAfee Anti-Virus Plus, Microsoft Office 365 Business, OneDrive, OneNote, Skype, SpeechTrans and Splashtop Business. It is available for free by purchasing a qualifying device from Intel® Technology Provider members in North America, Latin America and Europe or through Amazon.com (in the U.S. and Canada). Visit www.intel.com/businessapps to learn more.

New Intel® Core™ M Processor Enables Razor-thin, Fanless Designs with the Optimal Blend of Beauty, Performance and Battery Life; Available Holiday 2014

 

NEWS HIGHLIGHTS

  • Acer*, ASUS*, Dell*, HP*, Lenovo* and Toshiba* to introduce new Intel® Core™ M processor-based 2 in 1s. Some systems available starting in October.
  • Intel Core M processor delivers amazing performance and battery life for the thinnest, fanless 2 in 1 devices.
  • At a power-sipping 4.5 watts, it is the most energy-efficient Intel® Core™ processor in the company's history.1

 

 

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IFA, Berlin, Sept. 5, 2014 – At IFA, a global trade show for consumer electronics and home appliances, Intel launched the new Intel® Core™ M processor, which will power new 2 in 1 devices from a variety of manufacturers including: Acer*, ASUS*, Dell*, HP*, Lenovo* and Toshiba*. Delivering the optimal blend of mobility and performance, Intel's new processor was purpose-built for amazing performance in the thinnest, fanless ultra-mobile devices. The Intel Core M processor can power razor-thin devices with Intel Core processor-level performance and deliver up to double the battery life when compared to a 4-year-old system.2

 

"We've been on a multi-year mission to address end-user requirements and transform mobile computing," said Kirk Skaugen, senior vice president and general manager of personal computing at Intel Corporation. "The introduction of Core M marks a significant milestone in that journey. Core M is the first of a new product family designed to deliver the promise of one of the world's thinnest laptops and highest performance tablets in a single 2 in 1 device."

 

Faster Performance, Even More Battery Life
The Intel Core M processor enables up to 50 percent faster compute performance and 40 percent faster graphics performance versus the comparable, previous 4th generation Intel Core processor.3 Consumers with older PCs will notice a more significant performance improvement. The Intel Core M processor delivers up to two times the compute performance and up to seven times better graphics compared to a 4- year-old PC, for example.2

 

In 2013, Intel delivered the biggest generation-over-generation battery life improvement in the company's history. The Intel Core M processor and platform power reductions raise the bar on battery life even higher. The Intel Core M processor can handle more than 8 hours of video play, which is up to 20 percent (1.7 hours) longer battery life versus the previous-generation Intel Core processor4 and double the battery life of the average 4-year-old PC.1

 

Thin, Fanless 2 in 1s Available for Holiday 2014...and Beyond
The Intel Core M processor package is 50 percent smaller and, at 4.5 watts, has 60 percent lower thermal power than the previous generation.5 This lets OEMs design sleek, fanless systems less than 9 mm thin – thinner than an AAA battery and today's sleekest laptops. There are already more than 20 Intel Core M processor-based OEM products in the development pipeline. The first systems based on the Intel Core M processor will be on shelves for the holiday selling season.

 

At IFA, manufacturers including Acer, ASUS, Dell, HP, and Lenovo unveiled new, coming-soon Intel Core M processor-based devices across a range of sizes, styles and price points.

 

  • In Q4, Acer will expand its popular 2-in-1 series of notebooks with the Aspire Switch 12*, featuring a 12.5-inch FHD display with unique kickstand and magnet keyboard to move smoothly between five modes.
  • ASUS introduced the ASUS Zenbook UX305*, an incredibly light and thin Ultrabook™ with a 13-inch QHD display and the ASUS Transformer Book T300FA* 2 in 1, which was unveiled during the Intel keynote. The Transformer Book T300FA is a high-performance 2 in 1 and is expected to be available in Europe this fall for an estimated €599. Looking ahead, ASUS plans to go even thinner with the ASUS Transformer T300 Chi*.
  • Dell has announced its first commercial 2 in 1, the Latitude 13 7000 Series*, which combines a lightweight business Ultrabook and a detachable tablet in one powerful, no-compromise device.
  • HP further extends its award-winning ENVY portfolio with the addition of two new HP ENVY x2* detachable PCs, available in 13.3-inch and 15.6-inch form factors.
  • The new Lenovo ThinkPad Helix*, available in October, is 12 percent lighter and measures 15 percent thinner than its predecessor while packing even more power thanks to the Intel Core M processor.

 

Intel also previewed a forthcoming Intel Core M processor-based design from Toshiba, and said broader availability of Intel Core M processor-based devices is expected in the first half of next year.

 

To further system choice and availability, Intel said it is working with ODMs including Wistron* and others. Wistron plans an Intel Core M processor-based design inspired by the Intel "Llama Mountain" reference device. Intel first unveiled the stunning, fanless Llama Mountain reference device, which measures 7.2 mm thin and weighs a mere 670 grams, at Computex in Taiwan earlier this year.

 

A "Conflict-Free" Processor; Additional Features
Intel Core M is a "conflict-free" product, which means this product does not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.

 

The Intel Core M processor is available in several versions: the up to 2.0 GHz Intel Core M-5Y10/5Y10a processors and the up to 2.6 GHz Intel Core M-5Y70 processor. The Core M-5Y70 is the highest performing Intel Core M processor and is also available with Intel® vPro™ technology for business 2 in 1s with built-in security features to help protect data, user identities and network access.6

 

Additional Intel Core M platform features include support for high-quality audio, Intel® Wireless Display 5.0, Intel's second-generation 802.11ac products and will evolve to support wireless docking with WiGig from Intel. For more information visit: www.intel.com.

 

 

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

 

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

 

Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.

 

1Energy efficiency based on SPEC CPU2006 Intel estimates for both performance and core power. Comparison made vs. Intel prior generation Intel Core family CPU Processors.

 

2Intel® Core™ M-5Y70 Processor (up to 2.60GHz, 4T/2C, 4M Cache) vs. Normalized to a 4-year-old PC with Intel® Core™ i5-520UM. Performance based on SYSmark* 2014. Intel® Core™ M 5Y70 compared to Intel® Core™ i5-520UM. Weight based on Intel® Core™ M processor-based 2 in 1 based on Intel® FFRD Llama Mountain. Old PC is OEM laptop with Intel® Core™ i5-520UM and 62WHr battery, 3 lbs weight, 1.1-inch thick.

 

3Up to 50 percent faster vs. 4th generation Intel Core processors based on: Specfp_rate_base 2006 comparing Intel® Core™ M-5Y70 Processor compared to previous-generation Intel® Core™ i5-4302Y at 4.5W. Up to 40 percent faster graphics vs. 4th generation Intel Core processors based on: 3D Mark Ice Storm comparing Intel® Core™ M-5Y70 Processor with Intel HD graphics 5300 vs. Previous Generation Intel® Core™ i5-4302Y at 4.5W with HD Graphics 4200.

 

4Intel Core M battery life tested vs. 4th generation Intel® Core™ processor based platforms – 11.6-inch panel; 19x10; 200 nits; 35WHr battery; SSD; 4GB memory. Full HD Local Video Playback Battery Rundown-measured using a Tears of Steel 1080p 10 Mbps video. Configuration: In the device settings, disable all radios. Disable Intel® Display Power Saving Technology (Intel® DPST), set up the system to specified screen brightness using a full screen white background, and re-enable Intel DPST. Turn OFF the adaptive brightness setting under Power Options in Control Panel. Set "Dim the display" to never on both battery and AC. Set "Put the computer to sleep" to never on both battery and AC. Wait 15 minutes after boot. Launch the default video player (Windows* 8.1 Style UI video player for win), start the workload video in a loop, and disconnect the AC plug to start the test. Measure the time until battery is exhausted.

 

54th generation Intel® CoreTM Processor (40 X 24 X 1.5 mm; 960 mm; 11.5W) vs. Intel® Core™ M processor (30 X 16.5 X 1.05 mm; 495 mm; 4.5W)

 

6No computer system can provide absolute security. Requires an enabled Intel processor, enabled chipset, firmware and/or software optimized to use the technologies. Consult your system manufacturer and/or software vendor for more information.

Tune in this Friday, September 5 at 8 a.m. PT to listen to a live-stream of Intel's keynote address at IFA Berlin 2014. Kirk Skaugen, senior vice president and general manager of personal computing at Intel Corporation, will reveal new products and Intel’s plans to usher in a new era of computing devices with its latest technology at 2014 IFA in Berlin. Visit the Intel at IFA press kit for more information.

Intel CEO Brian Krzanich will open the company’s annual technical conference next Tuesday with a keynote that will be webcast live. Krzanich and other executives are expected to highlight for developers how the company is enabling new market segments where everything is smart and connected. Developers will see a revamped conference that showcases content related to the Internet of Things and wearables, in addition to mobile, data center and PC technology. Intel expects more than 4,500 attendees during the three day event.

Leading into IFA Berlin 2014, various new tablets were launched based on Intel® Atom™ processors. Toshiba introduced the Encore 2 Write tablets, available in both 8- and 10.1-inch screen-size, as well as the Encore Mini — all running on Windows 8.1*. Lenovo revealed the Lenovo TAB S8, the company’s first Android tablets. Acer introduced the Iconia Tab 8 W, an 8-inch tablet equipped with Windows 8.1*. The company also has expanded its colorful Iconia One series with the Iconia One 8 to bring a faster processor, larger 8-inch display and Android 4.4*. All five tablets will be powered by the Intel® Atom™ Z3700 series processor (“Bay Trail”). ASUS showcased an updated version of its MeMO Pad 7 powered by an Intel® Atom™ Z3565 processor (“Moorefield”). The MeMO Pad 7 and Tab S8 will both have the Intel® XMMTM 7160 modem to bring high-speed LTE connectivity experience for users. Pro7Sat1, one of the largest broadcasting companies in Germany, introduced the Pro7 Entertainment Pad powered by ASUS with the Intel Atom processor, offering a custom-built navigation bar enabled by Intel and pre-installed with exclusive entertainment content and services. An Austrian-based company, AlpenTab, bring a new look and feel and ultra-light weight “Wienerwald” wooden tablet powered by Intel. Learn more about Intel-powered tablets at IFA Berlin 2014.

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