1 2 3 4 5 102 Previous Next

Intel Newsroom

1,530 Posts

Intel science fair alumni were named to a Business Insider list of the most impressive kids graduating from high school this year. Among the innovators were Intel Science Talent Search 2014 winner Eric Chen, who used big data to identify a new class of drugs that could treat influenza; Intel International Science and Engineering Fair 2014 Best of Category winner Harry Paul, who invented a unique spinal implant for children suffering from scoliosis; and Intel ISEF 2014 Best of Category winner Sara Sakowitz, who has become an advocate for girls pursuing STEM - science, technology, engineering and math. Learn more about Intel Education.

The vPro Management Workspace is now a featured enhancement to LabTech 2013.1, an integrated platform that IT service providers are turning to for managing large numbers of Intel® vPro™ Platform-based devices within enterprises. Onboarding multiple business-ready devices running Intel® Active Management Technology is easy and automated with full system details listed out. Unique hardware-assisted features for on-demand power management, automatic configuration, password storage, and KVM remote control—all native to vPro Management Workspace—are seamlessly integrated into the LabTech platform. For more information, visit LabTech's Partner Programs page.

Turkey’s İşbank is now the first financial institution worldwide to take advantage of Intel® Identity Protection Technology (Intel® IPT). İşbank customers can perform transactions without typing a One Time Password (OTP) by accessing İşCep via a mobile banking app for Android devices running Intel® Atom™ processors. İşbank customers enjoy this convenience with the assurance that their credentials are protected within the chipset against malware. Intel IPT itself generates a unique one-use, tamper-proof password that is sent directly to the bank’s system. Visit ipt.intel.com to learn more about how Intel IPT works.

Intel says congratulations to all students graduating this season with an image depicting one graduate’s journey from childhood, to graduation day, and on to the tech job of the future. Headlined by the words of Robert Noyce, Intel Co-founder (“Don’t be encumbered by history. Go off and do something wonderful”), the image depicts how one woman’s tinkering with a robot as a child laid the groundwork for her future as an innovator.



Intel today provided more details on the company’s efforts to accelerate support of the Chrome* and Android* operating systems. There will be more than 80 Intel tablets running Android and 20 Chrome OS designs in market or coming later this year. Intel has been an industry leader in 64-bit - its latest Intel® Atom™ processors are all 64-bit enabled and ready to support the a 64-bit Android as soon as it becomes available. Intel is also working to make Android and Chrome OS application development easier by providing a number of tools and resources that ease the development process.  At Google I/O yesterday, Google announced Android TV, an exciting new interactive home entertainment platform that Intel is supporting Google in bringing to market.  Intel will also fully support Google’s additional security features in the Android L release.


  • Joint research project between Ford and Intel explores new applications for interior cameras, using data from existing vehicle sensors to enhance the in-vehicle experience for drivers and passengers.
  • Mobile Interior Imaging, also known as Project Mobii, uses facial recognition software to offer enhanced privacy controls, and a more secure and personalized in-vehicle experience.
  • A mobile phone app enables a driver to remotely access the vehicle, allowing for a quick check of belongings left inside or authorizing/declining other drivers to operate the vehicle.



DEARBORN, Mich., June 25, 2014 – As vehicles become an integral part of the Internet of Things, Ford and Intel are researching new opportunities for the connected car, including giving drivers the ability to remotely peer into their car using a smartphone, or a vehicle that could identify its owner using facial recognition software.


The joint research project, called Mobile Interior Imaging, or Project Mobii, explores how interior-facing cameras could be integrated with sensor technology and data already generated within and around the vehicle to create a more personalized and seamless interaction between driver and vehicle that transforms the driving experience.


The Mobii research was a collaboration between Intel ethnographers, anthropologists and engineers alongside Ford research engineers, and incorporates perceptual computing technology to offer a more enjoyable and intuitive vehicle experience.


"Our goal with the Mobii research is to explore how drivers interact with technology in the car and how we can then make that interaction more intuitive and predictive," said Paul Mascarenas, chief technical officer and vice president, Ford Research and Innovation. "The use of interior imaging is purely research at this point; however, the insights we've gained will help us shape the customer experience in the long term."


Ford now uses exterior vehicle cameras for driver-assist features such as lane-keeping assist and lane departure warning. The Mobii research examines new applications for interior cameras, including driver authentication. The use of facial recognition software offers improved privacy controls, and enables Project Mobii to identify different drivers and automatically adjust features based on an individual's preferences.


"As a trusted technology leader and innovator, Intel understands the challenges automakers are facing and is a committed partner in this unprecedented opportunity," said Doug Davis, vice president, Internet of Things Group at Intel. "Project Mobii is a great example of Intel collaborating with Ford to help enable a secure, more connected driving experience."


Improved privacy and parental controls
Upon entering the vehicle, the driver is authenticated by Project Mobii through a front-facing camera using facial recognition software. The in-car experience is then personalized to display information specific to that driver, such as calendar, music and contacts. If Project Mobii detects a passenger in the car, a privacy mode activates to display only navigation.


If Project Mobii does not recognize the driver, a photo is sent to the primary vehicle owner's smartphone. That owner can then set permissions and specify features that should be enabled or disabled. If the driver is the child of the vehicle owner, for example, restrictions could be automatically set to require safety belt use and to limit speed, audio volume or mobile phone use while driving.


Gesture recognition software enables intuitive interaction for the driver. A combination of natural gestures and simple voice commands can simplify such tasks as turning the heat up and down, or opening and closing a sunroof while driving.


About Ford Motor Company
Ford Motor Company, a global automotive industry leader based in Dearborn, Mich., manufactures or distributes automobiles across six continents. With about 183,000 employees and 65 plants worldwide, the company's automotive brands include Ford and Lincoln. The company provides financial services through Ford Motor Credit Company. For more information regarding Ford and its products worldwide, please visit http://corporate.ford.com.


About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.


Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.


*Other names and brands may be claimed as the property of others.

Remember when you thought Mom had eyes in the back of her head? Today, new Mobile Interior Imaging (Mobii) reseach will top Mom’s super powers to see what’s going on in your car even when you aren’t in it. The technology stems from a joint research project from Intel and Ford that uses the Internet of Things to transform the way we interact with cars. Project Mobii uses data from in and around the car to personalize vehicle settings, increase privacy and deliver individualized experiences for drivers and passengers. The Mobii research also features a mobile app that gives remote access to the car, along with the ability to authorize or decline other drivers and peek inside to check on belongings.

During the Clinton Global Initiative America meeting today, the National Center for Women & Information Technology (NCWIT) announced a $3.71 million dollar Commitment to Action, in partnership with the Intel Foundation, to engage 10,000 middle school girls in learning computing concepts by delivering 400 computing-focused after-school programs across the U.S. through 2018. Notably, Secretary Hillary Clinton recognized this commitment on stage. The commitment serves as a long-term investment to scale out the successful AspireIT pilot program, which allows young women to become role models and build leadership skills while encouraging younger girls to pursue computing. Learn more about AspireIT.

Intel today announced it will hold its second Intel® Parallel Universe Computing Challenge at SC14, November 17-20, 2014 in New Orleans. The Intel Parallel Universe Computing Challenge is an educational and entertaining game show-style event where teams compete to win a grand prize of a $25,000 donation to a charitable organization. During the challenge, eight teams participate in a single elimination tournament designed to raise awareness of the importance of parallelization for improving the performance of technical computing applications. The event includes a live rapid-fire trivia competition and parallel code optimization where participants modify software. Learn more and submit your team for consideration.

Intel has been ranked #15 on Interbrand’s 2014 Best Global Green Brands list. Intel was selected based on its environmental performance and the market’s perception of the company’s efforts. Examples of such efforts include manufacturing the world’s first conflict-free microprocessors, being the largest purchaser of green power in the U.S. and saving 46 billion gallons of water over the past decade. Read more about Intel’s commitment to sustainability .


Note to Editors: Materials and multimedia available at Intel Education Solutions press kit.



Intel Education is more than technology – it's flexible, holistic solutions that transform learning and teaching. Based on more than a decade of on-the-ground experience working with educators, Intel's comprehensive approach addresses education needs at every level to promote student success. Join Intel at the International Society for Technology in Education (ISTE) 2014 Conference to find out what it really takes to transform learning in a classroom – from rich content solutions such as Kno, to active learning space concepts, to research-based guides on engaging students with technology. Below is an overview of Intel's presence at the conference and planned press activities. For general information, visit www.intel.com/iste.


June 28 – July 1, 2014


Georgia World Congress Center

285 Andrew Young International Blvd. NW

Atlanta, Georgia

Intel Booth: #1806


Intel's John Galvin, vice president of the Sales and Marketing Group and general manager of Intel Education; Eileen Lento, director of Global Education Marketing and Advocacy, recently named one of the 10 most influential people in education technology by Tech & Learning magazine; and Paige Johnson, U.S. K-12 Education Strategist, will be available for comment and meetings at the event.


Intel Booth



Booth #1806


Intel's booth at ISTE will feature interactive learning kiosks featuring Kno, designing active learning spaces, visionary strategies on personalized learning and transforming education, and a mobile device bar with a range of Intel's latest education products.


Attendees are encouraged to stop by the booth to pick up a free copy of "Transforming Education for the Next Generation, A Practical Guide for Learning and Teaching with Technology," a new guide for school leaders that includes expertise from industry visionaries from around the world and practical step-by-step actions to help schools create systemic change and transform education.


Intel will also give away codes for free digital downloads of "Personalized Learning: A Guide for Engaging Students with Technology," a book underwritten by Intel® Education and published by ISTE to help educators and administrators understand the concepts behind personalized learning and share with them strategies, policies, devices, services, techniques and resources to transform learning environments. Attendees can also buy a hardcover copy from ISTE.


Award-winning educators with real-world education technology experience will be hosting conversations in the booth, sharing their unique perspectives and discussing how technology has changed learning and teaching in their classrooms. One of these educators, Suzy Brooks, will be sharing her experience at ISTE via social media on Twitter and Pinterest.


Intel Education Overview

Sunday, June 29 from 10:30 – 11:30 a.m. ET

Intel Booth #1806

Invite Only


Join Intel's John Galvin and Eileen Lento to learn more about Intel's holistic approach to education technology – and for the announcement of Intel's newest education reference design. See how our solutions transform learning and teaching through the right devices, relevant software and content, teacher professional development and free planning resources. With over a decade of experience in technology implementation with schools and governments globally, they can answer questions on key elements that drive systemic change for student success.


ISTE Authors Luncheon, sponsored by Intel® Education

Sunday, June 29 from 12 – 1:30 p.m. ET

ISTE Press Suite, B209

Invite Only


An opportunity to hear from the authors of the four new ISTE-published books launching at the 2014 conference. Dr. Peggy Grant, co-author of the Intel® Education-underwritten book "Personalized Learning: A Guide for Engaging Students with Technology," will discuss how personalized learning with technology can be used to meet the needs of all learners—from gifted students to students with disabilities—and how it can help achieve school goals.


Hewlett-Packard Media Reception

Sunday, June 29 from 5:30 – 6:30 p.m. ET

Atlanta Marriott Marquis – Room A601

Invite Only


Join Paige Johnson, U.S K-12 education strategist at Intel, HP and Microsoft to hear firsthand from Baltimore County Public Schools for insights on its digital learning strategy, implementation and the benefits of 1:1 learning.


Gail Dundas, Intel

503-264-2154, gail.dundas@intel.com


Olivia Campbell, North of Nine Communications, for Intel

646-384-2095, olivia.campbell@nof9.com

Today at the International Supercomputing Conference in Leipzig, Germany, Intel unveiled details on the next-generation Intel® Xeon Phi™ processor  codenamed Knights Landing, which includes the newly integrated Intel® Omni Scale Fabric, an end-to-end interconnect optimized for fast data transfers and better efficiency. Knights Landing will feature high-bandwidth on-package memory and deliver up to three times the performance of the prior generation while using less energy. Intel technology was also showcased throughout the conference with Intel® Xeon® processors powering 85% of systems in the newly published TOP500 list, underscoring their role as the fundamental building block for the world’s most powerful supercomputers. The press release, Dr. Rajeeb Hazra’s ISC keynote, videos and other information on this news is available here.

At the International Supercomputing Conference today, Intel announced the latest release of the Intel® Enterprise Edition for Lustre software that combines the performance and scalability of open-source Lustre software with new tools to help IT use Lustre storage for the most data-intensive applications. Building on the Lustre 2.5 foundation, the Intel Enterprise Edition for Lustre features new capabilities to monitor vast amounts of dynamic data to identify and overcome performance constraints as well as larger sized configurations to meet the need for faster and more productive storage solutions. Additionally, the latest version includes a new Lustre client for Intel® Xeon Phi™ coprocessors that delivers 10 times improved streaming I/O compared to network file systems. To learn more, visit lustre.intel.com.

Next-Generation Intel® Xeon Phi™ Processor with Integrated Intel® Omni Scale Fabric to Deliver Up to 3 Times the Performance of Previous Generation at Lower Power



  • Announces new microarchitecture and memory details of the next-generation Intel® Xeon Phi™ processor (code-named Knights Landing), scheduled to power HPC systems in the second half of 2015.
  • Intel® Omni Scale Fabric– an end-to-end interconnect optimized for fast data transfers, reduced latencies and higher efficiency – initially available as discreet components in 2015, will also be integrated into next-generation Intel Xeon Phi processor (Knights Landing) and future 14nm Intel® Xeon® processors.
  • Intel continues to lead in HPC segment with 85 percent of all supercomputers on the latest TOP500* list powered by Intel Xeon processors.




INTERNATIONAL SUPERCOMPUTING CONFERENCE (ISC), Leipzig, Germany, June 23, 2014 – Intel Corporation today announced new details for its next-generation Intel® Xeon Phi™ processors, code-named Knights Landing, which promise to extend the benefits of code modernization investments being made for current generation products. These include a new high-speed fabric that will be integrated on-package and high-bandwidth, on-package memory that combined, promise to accelerate the rate of scientific discovery. Currently memory and fabrics are available as discrete components in servers limiting the performance and density of supercomputers.


The new interconnect technology, called Intel® Omni Scale Fabric, is designed to address the requirements of the next generations of high-performance computing (HPC). Intel Omni Scale Fabric will be integrated in the next generation of Intel Xeon Phi processors as well as future general-purpose Intel® Xeon® processors. This integration along with the fabric's HPC-optimized architecture is designed to address the performance, scalability, reliability, power and density requirements of future HPC deployments. It is designed to balance price and performance for entry-level through extreme-scale deployments.


"Intel is re-architecting the fundamental building block of HPC systems by integrating the Intel Omni Scale Fabric into Knights Landing, marking a significant inflection and milestone for the HPC industry," said Charles Wuischpard, vice president and general manager of Workstations and HPC at Intel. "Knights Landing will be the first true many-core processor to address today's memory and I/O performance challenges. It will allow programmers to leverage existing code and standard programming models to achieve significant performance gains on a wide set of applications. Its platform design, programming model and balanced performance makes it the first viable step towards exascale."


Knights Landing – Unmatched Integration
Knights Landing will be available as a standalone processor mounted directly on the motherboard socket in addition to the PCIe-based card option. The socketed option removes programming complexities and bandwidth bottlenecks of data transfer over PCIe, common in GPU and accelerator solutions. Knights Landing will include up to16GB high-bandwidth, on-package memory at launch – designed in partnership with Micron* – to deliver five times better bandwidth compared to DDR4 memory1, five times better energy efficiency2 and three times more density2 than current GDDR-based memory. When combined with integrated Intel Omni Scale Fabric, the new memory solution will allow Knights Landing to be installed as an independent compute building block, saving space and energy by reducing the number of components.


Powered by more than 60 HPC-enhanced Silvermont architecture-based cores, Knights Landing is expected to deliver more than 3 TFLOPS of double-precision performance3 and three times the single-threaded performance4 compared with the current generation. As a standalone server processor, Knights Landing will support DDR4 system memory comparable in capacity and bandwidth to Intel Xeon processor-based platforms, enabling applications that have a much larger memory footprint. Knights Landing will be binary-compatible with Intel Xeon processors5, making it easy for software developers to reuse the wealth of existing code.


For customers preferring discrete components and a fast upgrade path without needing to upgrade other system components, both Knights Landing and Intel Omni Scale Fabric controllers will be available as separate PCIe-based add-on cards. There is application compatibility between currently available Intel® True Scale Fabric and future Intel Omni Scale Fabric, so customers can transition to new fabric technology without change to their applications. For customers purchasing Intel True Scale Fabric today, Intel will offer a program to upgrade to Intel Omni Scale Fabric when it's available.


Knights Landing processors are scheduled to power HPC systems in the second half of 2015. For instance, in April the National Energy Research Scientific Computing Center (NERSC) announced an HPC installation planned for 2016, serving more than 5,000 users and over 700 extreme-scale science projects.


"We are excited about our partnership with Cray and Intel to develop NERSC's next supercomputer 'Cori,'" said Dr. Sudip Dosanjh, NERSC Director, Lawrence Berkeley National Laboratory. "Cori will consist of over 9,300 Intel Knights Landing processors and will serve as an on-ramp to exascale for our users through an accessible programming model. Our codes, which are often memory-bandwidth limited, will also greatly benefit from Knights Landing's high speed on package memory. We look forward to enabling new science that cannot be done on today's supercomputers."


New Fabric, New Speeds with Intel Omni Scale Fabric
Intel Omni Scale fabric is built upon a combination of enhanced acquired IP from Cray and QLogic, and Intel's own in-house innovations. It will include a full product line offering consisting of adapters, edge switches, director switch systems, and open-source fabric management and software tools. Additionally, traditional electrical transceivers in the director switches in today's fabrics will be replaced by Intel® Silicon Photonics-based solutions, enabling increased port density, simplified cabling and reduced costs6. Intel Silicon Photonics-based cabling and transceiver solutions may also be used with Intel Omni Scale-based processors, adapter cards and edge switches.


Intel Supercomputing Momentum Continues
The current generation of Intel Xeon processors and Intel Xeon Phi coprocessors powers the top-rated system in the world – the 35 PFLOPS "Milky Way 2" in China. Intel Xeon Phi coprocessors are also available in more than 200 OEM designs worldwide.


Intel-based systems account for 85 percent of all supercomputers on the 43rd edition of the TOP500 list announced today and 97 percent of all new additions. Within 18 months after the introduction of Intel's first many-core architecture products, Intel Xeon Phi coprocessor-based systems already make up 18 percent of the aggregated performance of all TOP500 supercomputers. The complete TOP500 list is available at www.top500.org.


To help optimize applications for many-core processing, Intel has also established more than 30 Intel Parallel Computing Centers (IPCC) in cooperation with universities and research facilities around the world. Today's parallel optimization investment with the Intel Xeon Phi coprocessor will carry forward to Knights Landing, as optimizations using standards-based, common programming languages persist with a recompile. Incremental tuning gains will be available to take advantage of innovative new functionality.





Press Materials


About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.


Intel, Xeon, Intel Xeon Phi, Intel Atom and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States or other countries.


*Other names and brands may be claimed as the property of others.


All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.


Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.


The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.


Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2®, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.


Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.


Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase"


1 Projected result based on internal Intel analysis of STREAM benchmark using a Knights Landing processor with 16GB of high-bandwidth versus DDR4 memory only with all channels populated


2 Projected results based on internal Intel analysis of Knights Landing's on-package memory MCDRAM vs Knights Corner's GDDR5 memory


3 Internal and preliminary projections of theoretical double-precision performance measured by Linpack. Based on current expectations of Knights Landing's cores, clock frequency and floating point operations per cycle.


4. Projected peak theoretical single-thread performance relative to 1st Generation Intel® Xeon Phi™ Coprocessor 7120P (formerly code-named Knights Corner)


5 Binary Compatible with Intel Xeon processors using Haswell Instruction Set (except TSX - Transactional Synchronization Extensions)


6 The TCO or other cost reduction scenarios described in this document are intended to enable you to get a better understanding of how the purchase of a given Intel product, combined with a number of situation-specific variables, might affect your future cost and savings. Circumstances will vary and there may be unaccounted-for costs related to the use and deployment of a given product. Nothing in this document should be interpreted as either a promise of or contract for a given level of costs."


  • CEO of Workday, Inc., increases enterprise software and cloud computing expertise of Intel board


SANTA CLARA, Calif., June 23, 2014 –Intel Corporation announced that Aneel Bhusri, co-founder and chief executive officer of Workday, Inc. (NYSE: WDAY), has been elected to serve on the company's board of directors.


"We are very pleased to have Aneel Bhusri as an Intel director," said Andy Bryant, chairman of the board of Intel. "His more than 20 years' experience in enterprise software innovation and cloud computing will increase our board's depth in areas that are key to Intel's business and crucial in today's connected world."


Bhusri, 48, co-founded Workday, Inc., in 2005 and served as its co-chief executive officer from 2009 and chairman from 2012 until May of this year, when he was named chief executive officer. Workday is a leading provider of enterprise cloud applications for human resources and finance. In addition, Bhusri serves as a partner at Greylock Partners, a venture capital firm. Previously, he held a number of leadership positions at PeopleSoft, including senior vice president responsible for product strategy, business development and marketing, and vice chairman of the board.


Bhusri received an MBA from Stanford University and holds bachelor's degrees in electrical engineering and in economics from Brown University. He also is a Crown Fellow at the Aspen Institute.


About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.


Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.


* Other names and brands may be claimed as the property of others.

Filter News Archive

By author:
By date:
By tag: