1 2 3 4 5 124 Previous Next

Intel Newsroom

1,848 Posts

Collaboration Provides Retailers With Increased Security for Mobile Payments and Addresses Credit Card Fraud Deadline

 

Doug_Davis-Philippe_Lazare-Transact15.jpg

Doug Davis, senior vice president and general manager of Intel's Internet of Things Group, and Philippe Lazare, chairman and CEO of Ingenico Group, shake hands on stage at Transact 15 in San Francisco. Intel and Ingenico Group announced a collaboration to combine Intel technology and Ingenico Group secure payment acceptance for the Internet of Things.

SAN FRANCISCO and PARIS, April 2, 2015 - Today, Ingenico Group (Euronext: FR0000125346 - ING) and Intel Corporation announced a collaboration to combine Intel technology and Ingenico Group secure payment acceptance for the Internet of Things. The companies will jointly develop a mobile tablet that supports EMV1 and NFC payment functionalities, a standard required by banks to help prevent credit card fraud.

 

Today, banks are responsible for fraudulent activity on credit cards, costing them US$14 billion in 20132. By October 2015, banks will require retail merchants to upgrade their POS equipment to support EMV chip cards. If they do not, the retailers will be responsible for recovering the funds if fraud should occur.

 

Under the collaboration, Intel® Data Protection Technology for Transactions will be combined with Ingenico Group payment acceptance capabilities in mobile and future solutions in the United States and Canada, beginning with the jointly developed mobile tablets based on the Intel® Atom™ processor.

 

This will pave the way to a broader set of initiatives and value-added services to address other worldwide devices for the Internet of Things, including intelligent vending machines, kiosks and digital signage.

 

"We are very pleased to enter a collaboration with Intel, deploying secured payment acceptance into new connected devices," commented Philippe Lazare, chairman and CEO, Ingenico Group. "This is a great example of how innovation can simplify the purchasing experience and further enhance the merchant-consumer relationship. Bringing secure payment into connected devices will root our payment acceptance expertise in the Internet of Things".

 

"The shift in liability this October will be a major milestone in the United States for banks and credit card companies, but especially for retailers," said Doug Davis, senior vice president and general manager, Internet of Things Group, Intel. "Intel and Ingenico Group are working to bridge the retail experience and security gap while also making sure devices are easy to deploy and manage so we don't create new burdens for the merchants."

 

Both companies will be at the Transact 15 Annual Convention & Expo in San Francisco. For more information on the partnership, please stop by Ingenico Group's booth (#515) or Intel's booth (#1825), or visit the Intel online newsroom at www.intel.com/newsroom/iot.

 

About Ingenico Group
Ingenico Group (Euronext: FR0000125346 - ING) is the global leader in seamless payment, providing smart, trusted and secure solutions to empower commerce across all channels, in-store, online and mobile. With the world's largest payment acceptance network, we deliver secure payment solutions with a local, national and international scope. We are the trusted world-class partner for financial institutions and retailers, from small merchants to several of the world's best known global brands. Our solutions enable merchants to simplify payment and deliver their brand promise.

 

www.ingenico.com | twitter.com/ingenico

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel, the Intel logo and Intel Atom may be registered trademarks or trademarks of Intel Corporation in the United States and some other countries.

 

*Other names and brands may be claimed as the property of others.

 

1 EuroPay, MasterCard and Visa

 

2 Business Insider, March 4, 2014

 

SSD_750_photo_sm.jpgIntel today unveiled the Intel® Solid-State Drive (SSD) 750 Series, its highest performing SSD for use in client PC storage devices and workstations. The 750 series delivers greater than four times the performance of SATA-based SSDs by utilizing four lanes of PCIe 3.0 and the NVM Express (NVMe) standard. For added flexibility, it is available as both an add-in card for systems with an accessible PCIe 3.0 slot and as a 2.5 inch small form factor solution.  Intel also announced the availability of the Intel® SSD 535 Series which offers the ideal balance of cost and performance for mainstream client PC storage devices. Read more about the SSD 750 Series and SSD 535 Series, as well as tests and configurations.

SANTA CLARA, Calif., April 2, 2015 - Intel Corporation today published its 2014 annual report and 2015 proxy statement, which are now available at www.intc.com. The company also announced that its 2015 Annual Stockholders' Meeting will be held on May 21 at Intel's corporate headquarters in Santa Clara, and online at www.intc.com.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

Surface 3 powered by the Intel Atom x7 processor

Surface 3 powered by the Intel Atom x7 processor

Today, Microsoft introduces the new Surface 3, powered by the recently announced Intel® Atom™ x7 processor, the highest performing processor in the Intel Atom™ product family. The Intel Atom x7 processor doubles the graphics performance over the prior generation processor.  Surface 3 is the thinnest and lightest Surface yet and is optimized to run Windows and Office at an affordable price. The Surface 3 will be available for pre-order starting today on March 31.

Micron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies

 

NEWS HIGHLIGHTS

  • 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity1 than other NAND die in production.
  • Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB.
  • Innovative process architecture techniques extend Moore's Law for flash storage, bringing significant improvements in density while lowering the cost of NAND flash.

 

 

3D_NAND_Die_with_M2_SSD.jpg

Enables gum stick-sized SSDs with more than 3.5TB of storage

3D_NAND_Die.jpg

Innovative process architecture techniques extend Moore's Law for flash storage to bring significant improvements in density and lower the cost of NAND flash

3D_NAND_Wafer_Close-Up.jpg

Micron and Intel unveil new 3D NAND technology with three times higher capacity than other NAND die in production

BOISE, Idaho and SANTA CLARA, Calif., March 26, 2015 – Micron Technology, Inc. (Nasdaq: MU), and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

 

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity1 than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

 

Planar NAND flash memory is nearing its practical scaling limits, posing significant challenges for the memory industry. 3D NAND technology is poised to make a dramatic impact by keeping flash storage solutions aligned with Moore's Law, the trajectory for continued performance gains and cost savings, driving more widespread use of flash storage.

 

"Micron and Intel's collaboration has created an industry-leading solid-state storage technology that offers high density, performance and efficiency and is unmatched by any flash today," said Brian Shirley, vice president of Memory Technology and Solutions at Micron Technology. "This 3D NAND technology has the potential to create fundamental market shifts. The depth of the impact that flash has had to date—from smartphones to flash-optimized supercomputing—is really just scratching the surface of what's possible."

 

"Intel's development efforts with Micron reflect our continued commitment to offer leading and innovative non-volatile memory technologies to the marketplace," said Rob Crooke, senior vice president and general manager, Non-Volatile Memory Solutions Group, Intel Corporation. "The significant improvements in density and cost enabled by our new 3D NAND technology innovation will accelerate solid-state storage in computing platforms."

 

Innovative Process Architecture
One of the most significant aspects of this technology is in the foundational memory cell itself. Intel and Micron chose to use a floating gate cell, a universally utilized design refined through years of high-volume planar flash manufacturing. This is the first use of a floating gate cell in 3D NAND, which was a key design choice to enable greater performance and increase quality and reliability.

 

The new 3D NAND technology stacks flash cells vertically in 32 layers to achieve 256Gb multilevel cell (MLC) and 384Gb triple-level cell (TLC) die that fit within a standard package. These capacities can enable gum stick-sized SSDs with more than 3.5TB of storage and standard 2.5-inch SSDs with greater than 10TB. Because capacity is achieved by stacking cells vertically, the individual cell dimensions can be considerably larger. This is expected to increase both performance and endurance and make even the TLC designs well-suited for data center storage.

 

The key product features of this 3D NAND design include:

  • Large Capacities –Three times the capacity of existing 3D technology1—up to 48GB of NAND per die—enabling three-fourths of a terabyte to fit in a single fingertip-sized package.
  • Reduced Cost per GB – First-generation 3D NAND is architected to achieve better cost efficiencies than planar NAND.
  • Fast – High read/write bandwidth, I/O speeds and random read performance.
  • Green – New sleep modes enable low-power use by cutting power to inactive NAND die (even when other die in the same package are active), dropping power consumption significantly in standby mode.
  • Smart – Innovative new features improve latency and increase endurance over previous generations, and also make system integration easier.

 

The 256Gb MLC version of 3D NAND is sampling with select partners today, and the 384Gb TLC design will be sampling later this spring. The fab production line has already begun initial runs, and both devices will be in full production by the fourth quarter of this year. Both companies are also developing individual lines of SSD solutions based on 3D NAND technology and expect those products to be available within the next year.

 

Webcast Replay of 3D NAND Announcement

 

Related Information

 

Micron

Take part in Micron's social conversations where we're talking all things storage and memory:

 

Intel

Contribute to the SSD conversations through Intel's social channels:

 

Micron Technology, Inc.
Micron Technology, Inc., is a global leader in advanced semiconductor systems. Micron's broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron's memory solutions enable the world's most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron's common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com

©2015 Micron Technology, Inc. All rights reserved. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

 

This document contains forward looking statements. Forward looking statements are predictions, projections and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual results to differ materially from the forward-looking statements in this document. A detailed discussion of the factors that could affect Intel's results and plans is included in Intel's SEC filings, including the annual report on Form 10-K.

 

1 Capacity difference based on comparison between Micron and Intel 384 Gb TLC 3D NAND die and other industry 3D NAND TLC

3D_NAND_Die_with_M2_SSD.jpg

Micron and Intel today announced the availability of their 3D NAND technology, enabling SSDs the size of a stick of gum that can hold more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB. The companies used innovative techniques to stack layers of data storage cells vertically – in three dimensions – to deliver the world's highest-density flash memory. By bringing more storage to fit in a smaller space, Intel and Micron help consumers and enterprise customers save significant cost, reduce power and add considerable performance. The 256Gb multilevel cell version of 3D NAND is sampling today with select partners, and the 384Gb triple-level cell design will begin sampling later this spring.

IoTScreenShot_1.png

Intel's IoT vision is straightforward: it senses generates data for many devices, collects and communicates that data, analyzes that data to turn it into actionable insight, and uses that insight to optimize how things work.

Intel today announced the next generation of the Intel® Industrial Solutions System Consolidation Series, offering OEMs, machine builders and system integrators an expanded set of software configurations to simplify the development of industrial solutions using 4th generation Intel® Core™ vPro™ processor-based platforms. The latest version of the pre-validated, pre-integrated software stack utilizes Wind River* and McAfee* technology to help reduce costs and complexity of developing industrial devices by merging multiple discrete systems to deliver more efficient automation. The software allows embedded machines to run multiple instances of Wind River VxWorks 7, Wind River Linux 7 64bit and Microsoft* Windows 7 64bit using Wind River VxWorks Virtualization Profile, as well as McAfee Embedded Control for expanded security management. The first industrial platform to be certified by Intel for its latest release of the Intel® Industrial Solutions System Consolidation Series software is the EPC-S2100 by Contec DTx*.

 

ASUS ZenFone 2

The ASUS ZenFone 2 is the first smartphone powered by the Intel® Atom™ processor and five-mode Intel® XMM™ 7262 LTE Advanced modem in China.

Today, ASUS announced the availability of the ASUS ZenFone 2 for the China market. The ASUS ZenFone 2  is the first smartphone in China powered by the 64-bit Intel® Atom™ processor (Moorefield) and the five-mode Intel® XMM™ 7262 LTE Advanced modem, which supports LTE Advanced up to Category 6, carrier aggregation and FDD & TDD for high-speed connectivity in China and global markets.  The Intel Atom processor and Intel XMM 7262 LTE Advanced modem allows for fast speeds and advanced graphics, making the ZenFone 2 perfect for streaming music and videos, as well as live multiplayer gaming.

Dell and Intel will debut their latest social film titled “What Lives Inside,” exclusively on Hulu on March 25, 2015. Directed by two-time Oscar-winner Robert Stromberg (“Maleficent”) and starring Colin Hanks (TV’s “Fargo”), J.K. Simmons (“Whiplash”) and Catherine O’Hara (“Best In Show”) along with the world’s thinnest tablet, the new Dell Venue 8 7000 Series tablet with Intel® RealSense™ snapshot and the Intel® Atom™ processor. The series will debut on March 25 exclusively on Hulu. This year’s social component involved Stromberg inviting the public to collaborate with him to complete the film by submitting character sketches for potential inclusion. The winning drawings were handpicked by Stromberg and his team and appear in the film. View the press release and backgrounder for more information.

 

Interactive Photo Capsule: "What Lives Inside" Social Film

NEWS HIGHLIGHTS

  • Dell presents an all-new social film, "What Lives Inside," in collaboration with Intel; visit www.whatlivesinside.com
  • Fans can submit character sketches for potential inclusion in the film starting on January 13; first episode of the social film will be streamed exclusively on Hulu on March 25
  • Film stars Colin Hanks, J.K. Simmons and Catherine O'Hara and will be directed by two-time Oscar-winner Robert Stromberg, who last directed "Maleficent"

 

 

ROUND ROCK, Texas, Jan. 13, 2015 – Dell Inc. today announced a collaboration with Intel Corporation on the latest social film titled, "What Lives Inside," the fourth film of the 'Inside Films' series. The film will be directed by two-time Oscar*-winner Robert Stromberg ("Maleficent") and stars Colin Hanks (TV's "Fargo"), J.K. Simmons ("Whiplash") and Catherine O'Hara ("Best In Show"), along with the world's thinnest tablet, the new Dell Venue 8 7000 Series tablet with Intel® RealSense™ snapshot and an Intel® Atom™ processor. The series will debut on March 25 exclusively on Hulu*, and new episodes will premiere for four weeks. Starting May 6, the full series will be available on WhatLivesInside.com and on YouTube*.

 

'Inside Films' is the longest-running branded content series and has adopted a new genre and social activation each time ranging from thriller, romance, science fiction and now fantasy. This year's social component involves Stromberg inviting the public to collaborate with him to complete the film by submitting character sketches and drawings for potential inclusion in the story. Submissions will be accepted on www.WhatLivesInside.com  from Jan. 13 through March 9, 2015 and the winning drawings will be handpicked by Stromberg to appear in the film.

 

The film centers around Taylor (Hanks), the son of an absentee father who finds himself on a journey of self-discovery. His father (Simmons) was a well-known and acclaimed children's puppeteer who was widely celebrated for his creativity. After his passing, Taylor discovers a mysterious world of his dad's creation and finds himself on an adventure that will soon unlock his own creativity. The Intel-powered Dell Venue 8 7000 Series tablet with Intel® RealSense™ snapshot will play a critical character in the film, accompanying Taylor on every step of the journey and helping to unlock his creativity. Integrated into the viewing experience in an organic manner, the product's unique features become the perfect tools for the emerging artist in Taylor to showcase his work. The stunning organic light-emitting diodes (OLED) infinity edge-to-edge screen with more than 4 million pixels captures the rich and saturated colors of his creations. The tablet is also the first to integrate the Intel® RealSense™ Snapshot technology that captures a depth map for every picture taken, allowing Taylor to make instant measurements on his journey.

 

"The story has become a very personal journey for me," said Stromberg. "As a working father in Hollywood, I can relate to the father's struggles in the movie, which made me very passionate about how the characters evolved. I am also extremely excited about the prospect of directing a social film and find myself daily thinking of ways to increase fan involvement in the film. This unique format will allow us to bridge the emotional and fantasy elements to create something not only unforgettable, but personal."

 

"Dell's commitment to innovation is brought to life stunningly through the lens of 'What Lives Inside,'" said Marissa Tarleton, executive director of Consumer and Small Business, North America Marketing for Dell. "Working with Intel on this project will allow us to continue to inspire consumers, foster creativity among social film fans new and old, and promote the new wave of computing among these communities. Our products have always been at the forefront of innovation and now, through the 'Inside Films' series, we have been able to showcase a unique approach to marketing products to consumers."

 

This is the first time Dell has collaborated with an award-winning director and cast to produce a Hollywood-quality film. The series, now in its fourth year, has worked with a range of top talent. Past films have featured Hollywood stars such as Harvey Keitel, Emmy Rossum and Topher Grace, and the films have repeatedly won the admiration of Emmy* and Cannes* committees, as well as over 200 million viewers worldwide.

 

"This social film provides an engaging and unique way to showcase the capabilities of the Intel RealSense technology through the Dell Venue 8 7000 series," said Doug Parker, vice president of Intel Partner Marketing.

 

Viewers can visit www.WhatLivesInside.com or www.Facebook.com/insidefilms to submit character sketches for the chance to have their work featured in the film. Fans can also view the director's video and the behind the scenes video.

 

Press Materials

 

Interactive Photo Capsule: "What Lives Inside" Social Film

 

About Dell
Dell Inc. listens to customers and delivers innovative technology and services that give them the power to do more. For more information, visit www.dell.com.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel, RealSense and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

Dell, Dell Venue and Inspiron are trademarks of Dell Inc. Dell disclaims any proprietary interest in the marks and names of others.

 

*Other names and brands may be claimed as the property of others.

Four budding scientists, who are also Intel science competition alumni, are at the White House Science Fair today. The alumni—Kelly Charley, Anvita Gupta, Nathan Han, and Harry Paul—are among the 100 bright, young minds showcasing their innovative technology and engineering research for President Obama. Learn more about Intel Education.

TAG Heuer, Google and Intel are collaborating on a Swiss smartwatch based on Intel® technology and Android Wear. The effort was unveiled today during a press conference at Baselworld in Switzerland featuring Jean-Claude Biver, president of the watch division LVMH Group and CEO of TAG Heuer, David Singleton, director of engineering for Android Wear, and Michael Bell, Intel vice president and general manager of the New Devices Group. The collective effort signifies a new era of collaboration between Swiss watchmakers and Silicon Valley, bringing together each company’s respective expertise in luxury watchmaking, software and hardware.

TAG_Heuer.jpg

TAG Heuer, Google and Intel announce a collaboration to launch a Swiss smartwatch powered by Intel technology and Android Wear. Pictured left to right: Guy Sémon, General Manager of TAG Heuer; Jean-Claude Biver, President of the Watch Division LVMH Group and CEO of TAG Heuer, Michael Bell, Corporate Vice President and General Manager of Intel's New Devices Group and David Singleton, Director of Engineering for Android Wear.

Baselworld, Switzerland, 19 March 2015 — TAG Heuer, Google and Intel have announced a partnership to launch a Swiss smartwatch powered by Intel® technology and Android Wear. The effort signifies a new era of collaboration between Swiss watchmakers and Silicon Valley, bringing together each company's respective expertise in luxury watchmaking, software and hardware.

 

The collaboration was made official at Baselworld, during a press conference held on Thursday 19th March at the TAG Heuer booth. Jean-Claude Biver, President of the Watch Division LVMH Group and CEO of TAG Heuer, David Singleton, Director of Engineering for Android Wear, and Michael Bell, Corporate Vice President and General Manager of Intel's New Devices Group, joined each other on stage.

 

Together, these companies will create a product that is both luxurious and seamlessly connected to its wearer's daily life -- a culmination of innovation, creativity and design from Silicon Valley in California and the Watch Valley in La Chaux-de-Fonds, Switzerland.

 

"Swiss watchmaking and Silicon Valley is a marriage of technological innovation with watchmaking credibility. Our collaboration provides a rich host of synergies, forming a win-win partnership, and the potential for our three companies is enormous,"said Jean-Claude Biver.   

 

Guy Sémon, General Manager of TAG Heuer added: "The quality of Swiss watches is renowned worldwide. When this is allied with the creative technology and global power of two companies like Intel and Google, using the Android Wear platform and based on Intel technology, we can see the launch of a technological revolution in our industry, of which I am proud to be a pioneer today with TAG Heuer."

 

David Singleton noted,  "By fusing beauty with technology, the Swiss watch has inspired generations of artists and engineers alike -- including us at Google. So we're thrilled to be working with TAG Heuer and Intel to bring a unique blend of emotion and innovation to the luxury market. Together, and using the Android Wear platform, we can imagine a better, beautiful, smarter watch."

 

"As we work to enable technology experiences that provide greater utility and value to people, Intel is confident that a collective approach will inspire new innovation in wearable technology. The collaboration with TAG Heuer and Google brings us closer to realizing the vision of wearable technology with a distinctive smartwatch that elevates the category," remarked Michael Bell.

 

Baselworld Press Conference Replay

 

 

About TAG HEUER
TAG Heuer, the avant-garde of Swiss watchmaking since 1860. TAG Heuer has always pushed back the boundaries ever further, inventing incredible watches and chronographs for those who love to challenge conventions. This technical know-how was harnessed at a very early stage for achieving extreme precision in time control. The long standing partnerships cultivated with motor racing and elite sportsmen echo the teamwork, courage and taste for challenge and risk, which drive TAG Heuer to always gobeyond the traditions of the watchmaking industry. The brand identity is intimately linked to its founding principle of anti-conformism. Its slogan, "#Dontcrackunderpressure", is far more than a figure of speech: it is a state of mind. Additional information about TAG Heuer is available at presscorner.tagheuer.com/

 

About Google
Google is a global technology leader focused on improving the ways people connect with information. Google's innovations in web search and advertising have made its website a top internet property and its brand one of the most recognized in the world. Google is a trademark of Google Inc. All other company and product names may be trademarks of the respective companies with which they are associated.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

SANTA CLARA, Calif., March 19, 2015 - Intel Corporation's board of directors has declared a quarterly dividend of 24 cents per share (96 cents per share on an annual basis) on the company's common stock. The dividend will be payable on June 1, 2015, to stockholders of record on May 7, 2015.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

Today Microsoft announced Windows Hello, a new Windows 10 authentication feature supported by the Intel® RealSense™ 3D Camera. Windows Hello will use facial recognition and other biometrics to let people access their Windows 10 devices and supported apps and sites without a password. Intel has a vision for a "no passwords" user experience, so we are excited to work closely with Microsoft to enable Windows Hello on all existing and future systems with the Intel RealSense 3D Camera.

Filter News Archive

By author:
By date:
By tag: