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Intel Newsroom

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Today, ASUS announced that the ZenFone 2 will be available on May 19, 2015 in North America. This is the first smartphone powered by an Intel® Atom™ processor (Moorefield) paired with the Intel® XMM™ 7260 LTE Advanced modem in North America. The Intel Atom processor and Intel XMM 7260 LTE Advanced modem allows for fast speeds and advanced graphics for a great music and video streaming experience, as well as live multiplayer gaming on the Zenfone 2. The phone will start at $199 USD, and will be available at Amazon.com, Groupon.com and NewEgg.com in the U.S., and NCIX.com, Canada Computer and Memory Express in Canada.

 

 

WHAT:

Intel Corporation will deliver the opening keynote at Computex 2015 in Taipei, Taiwan, where the company will introduce and showcase a range of exciting new computing experiences from the PC to IoT that will enable a smart and connected world.

 

Press materials and multimedia will be available at: www.intel.com/newsroom/computex

WHEN:

June 2-6, 2015

ACTIVITIES:
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Computex Opening Keynote

June 2, 2-3 p.m. (Taipei local time) - Registration opens at 1:20 p.m.

Taipei International Convention Center (TICC)

No. 1, Sec 5, Hsin-Yi Road, Taipei

3F, Plenary Hall

 

Join Kirk Skaugen, Intel senior vice president and general manager of the Client Computing Group, for the opening keynote at Computex 2015 to see how Intel is enabling amazing new experiences that will transform the way we live, work and interact with technology.

 

The keynote will be available via live webcast:

http://intelstudios.edgesuite.net/computex/2015/index.html

 

Post-Keynote Media Q&A Session with Kirk Skaugen

June 2, 3:10-3:40 p.m. (Taipei local time)

Taipei International Convention Center

4F, VIP Room

 

Kirk Skaugen, senior vice president and general manager of the Client Computing Group, Intel. Open to registered media and analysts only.

 

Intel Booth Guided Tour for Media

June 3, 10:15-11:00 a.m. (Taipei local time)

Taipei World Trade Center (TWTC) Nangang Exhibition Hall

No. 1, Jing Mao 2nd Road, Nangang District, Taipei

 

Intel Booth, Nangang Exhibition Hall #M0420

 

 

Intel Internet of Things (IoT) Media Briefing (by invitation)

June 3, 1:00-2:00 p.m. (Taipei local time) - Registration at 12:30 p.m.

Le Meridien Taipei Hotel

No.38, Songren Rd., Xinyi Dist., Taipei

3F, Amber & Pearl

 

Doug Davis, senior vice president and general manager of the Internet of Things Group, Intel

MEDIA SUPPORT:

For more information and media materials, visit: www.intel.com/newsroom/computex or on-site at the reception counter of the Intel Exhibition Showcase at 4F, TWTC Nangang Exhibition Hall.

 

To request a media credential, please register at

http://www.e21forum.com.tw/Register.aspx?nav=9&lang=1 or onsite at the 1F reception counter of TICC.

MEDIA CONTACTS:

Intel Corporation:
Scott Massey, Intel PR manager (U.S.)

+1-503-696-1785, scott.massey@intel.com

 

 

Joe Huang, Intel PR manager (APJ)

+886-2-2514-3157, joe.huang@intel.com

 

Pallas PR Agency:
Elsa Chang, Pallas PR, +886-953-129-126, elsa.chang@pallaspr.com.tw

Irene Chen, Pallas PR, +886-933-897-596, irene.chen@pallaspr.com.tw

Plenary Hall, 3F, Taipei International Convention Center (TICC)

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VIP Room, 4F, Taipei International Convention Center

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Amber & Pearl/Jadeite 3F, Le Meridien Taipei

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Raymond Wang of Canada Wins US$75,000 Top Prize at Intel International Science and Engineering Fair

 

NEWS HIGHLIGHTS

  • The world's largest high school science research competition, the Intel International Science and Engineering Fair, a program of Society for Science & the Public, announced its top winners in  Pittsburgh.
  • Raymond Wang of Canada received the Gordon E. Moore Award, a US$75,000 prize named in honor of the Intel co-founder and fellow scientist.
  • Two Intel Foundation Young Scientist Awards winners – Nicole Ticea of Canada and Karan Jerath of Friendswood, Texas – each received prizes of US$50,000 from the Intel Foundation.

 

 

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PITTSBURGH, Pa., May 15, 2015 – Raymond Wang, 17, of Canada, is celebrated by his fellow finalists for his first place win at the Intel International Science and Engineering Fair, the world's largest high school science research competition. Approximately 1,700 high schoolers from 78 countries, regions and territories competed for $4 million in awards this week. (PHOTO CREDIT: Intel/Kathy Wolfe)

PITTSBURGH, May 15, 2015 – Raymond Wang, 17, of Canada was awarded first place for engineering a new air inlet system for airplane cabins to improve air quality and curb disease transmission at this year's Intel International Science and Engineering Fair, a program of Society for Science & the Public.

 

Wang's system improves the availability of fresh air in the cabin by more than 190 percent while reducing pathogen inhalation concentrations by up to 55 times compared to conventional designs, and can be easily and economically incorporated in existing airplanes. Wang received the Gordon E. Moore Award of US$75,000, named in honor of the Intel co-founder and fellow scientist.

 

Nicole Ticea, 16, of Canada received one of two Intel Foundation Young Scientist Awards of US$50,000 for developing an inexpensive, easy-to-use testing device to combat the high rate of undiagnosed HIV infection in low-income communities. Her disposable, electricity-free device provides results in an hour and should cost less than US$5 to produce. Ticea has already founded her own company, which recently received a US$100,000 grant to continue developing her technology.

 

Karan Jerath, 18, of Friendswood, Texas, received the other Intel Foundation Young Scientist Award of US$50,000 for refining and testing a novel device that should allow an undersea oil well to rapidly and safely recover following a blowout. Jerath developed a better containment enclosure that separates the natural gas, oil and ocean water; accommodates different water depths, pipe sizes and fluid compositions; and can prevent the formation of potentially clogging methane hydrate.

 

"Intel believes young people are key to future innovation and that in order to confront the global challenges of tomorrow, we need students from all backgrounds to get involved in science, technology, engineering and math," said Wendy Hawkins, executive director of the Intel Foundation. "We hope these winners will inspire other young people to pursue their interest in these fields and apply their curiosity, creativity and ingenuity to the common good."

 

This year's Intel International Science and Engineering Fair featured approximately 1,700 young scientists selected from 422 affiliate fairs in more than 75 countries, regions and territories. In addition to the top winners, approximately 600 finalists received awards and prizes for their innovative research, including 20 "Best of Category" winners, who each received a US$5,000 prize. The Intel Foundation also awarded a US$1,000 grant to each winner's school and to the affiliated fair they represent.

 

The following lists the 20 Best of Category winners, from which the top three were chosen:

CategoryFirstLastCityState/Country
Animal ScienceNattapongChueasiritawornMuangThailand
ThananonHiranwanichchakorn
SutthilukRakdee
Behavioral and Social SciencesSophiaKornerLouisvilleKentucky
DiyaMathur
BiochemistryAmolPunjabiWorchesterMassachusetts
Biomedical and Health SciencesNicoleTiceaVancouverCanada
Cellular and Molecular BiologyDemetriMaximBethelMaine
ChemistryArneHenselHomburg (Efze)Germany
Computational Biology and BioinformaticsMichaelRetchinRichmondVirginia
MatthewRetchin
Earth and Environmental SciencesJoshuaZhouChapel HillNorth Carolina
Embedded SystemsNiklasFauthMarbach am NeckarGermany
Energy: ChemicalKathyLiuSalt Lake CityUtah
Energy: PhysicalSriharshitaMusunuriMill CreekWashington
Engineering MechanicsRaymondWangVancouverCanada
Environmental EngineeringKaranJerathFriendswoodTexas
Materials ScienceCatherineLiOrlandoFlorida
MathematicsSanath KumarDevalapurkarTorranceCalifornia
MicrobiologyCarlyCrumpJacksonvilleFlorida
Physics and AstronomyRuochenHaoJinanChina
Plant SciencesAbdul JabbarAlhamoodDhahranSaudi Arabia
Robotics and Intelligent MachinesAvaLakmazaheriAlexandriaVirginia
Systems SoftwareCharlesNoyesVilla ParkCalifornia

 

Society for Science & the Public, a nonprofit membership organization dedicated to public engagement in science and science education, has owned and administered the competition since its inception in 1950 as the National Science Fair.

 

"Congratulations to Raymond, Nicole and Karan! Their selection as top winners really demonstrates the extraordinary work they have been able to accomplish at a young age in diverse topics," said Maya Ajmera, president and CEO of Society for Science & the Public. "We look forward to watching not only them, but the rest of the Intel International Science and Engineering Fair finalists as they progress further and pursue their interests in STEM. These talented young students are the problem solvers and innovators of their generation."

 

The Intel International Science and Engineering Fair honors the world's most promising student scientists, inventors and engineers. Finalists are selected annually from hundreds of affiliated fairs. Their projects are then evaluated onsite by approximately 1,000 judges from nearly every scientific discipline, each with a Ph.D. or the equivalent of six years of related professional experience in one of the scientific disciplines.

 

A full listing of finalists is available in the event program. The Intel International Science and Engineering Fair 2015 is funded jointly by Intel and the Intel Foundation with additional awards and support from dozens of other corporate, academic, governmental and science-focused organizations. This year, approximately US$4 million was awarded.

 

To learn more about Society for Science & the Public, visit www.societyforscience.org, and follow the organization on Facebook and Twitter.

 

To get the latest Intel education news, visit www.intel.com/newsroom/education, and join the conversation on Facebook and Twitter.

 

 

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

Gartner Research began ranking company's supply chains a decade ago in order to identify companies that best demonstrate leadership in applying demand-driven principles to drive business results. This week Gartner announced 2015 rankings at their annual Gartner Supply Chain Executive Conference in Phoenix, Arizona. This is the seventh consecutive year Intel has been named one of the top 25. See Gartner's press release to see who else made it into the top 25 this year, and see Gartner's supply chain web page for more info.

Intel was named as a LATINO 100 top company by Latino Magazine and recognized for providing opportunities for Latinos and programs that benefit the Latino community. Intel’s efforts focus on developing, progressing and retaining its Hispanic employee population and include a chartered strategic employee resource group. Intel also partners with external organizations focused on building a stronger Latino community. Visit Intel’s Diversity page to learn more about the company’s diversity efforts.

Intel announced today plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the “cloud.” This collaboration is part of Intel’s strategy to integrate re programmable technology with Intel® Xeon® processors to provide cloud customers with custom solutions that greatly improve performance, power and cost.

Companies Plan to Deliver Custom Intel® Xeon® Processors with eASIC Platforms to Speed Workloads like Security, Big Data, and Other Applications

 

SANTA CLARA, Calif., May 12, 2015 – Intel Corporation today announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the "cloud." The new parts will enable acceleration of up to two times that of a field programmable gate array (FPGA) for workloads like security and big data analytics while also speeding the time to market for custom application specific integrated circuit (ASIC) development by as much as 50 percent1.

 

The tremendous growth of cloud computing has spurred greater demand for customized chips that make a particular application or workload run faster. To enable this, eASIC plans to integrate its eASIC platform technology with future Intel® Xeon® processors, providing cloud service providers a highly customized, integrated hardware solution for their particular workload.

 

eASIC's technology can increase flexibility and fast-time-to-market when compared to traditional ASICs and increase performance and lower power consumption when compared to FPGAs. By integrating hardware accelerator solutions with the eASIC platform, Intel can deliver much faster and more flexible systems for cloud customers.

 

"Having the ability to highly customize our solutions for a given workload will not only make the specific application run faster, but also help accelerate the growth of exciting new applications like visual search," said Diane Bryant, senior vice president and general manager of Intel's Data Center Group. "This announcement helps broaden our portfolio of customized products to provide our customers with the flexibility and performance they need."

 

This collaboration is part of Intel's strategy to integrate reprogrammable technology with Intel Xeon processors to greatly improve performance, power and cost.

 

"We believe our eASIC technology has unique characteristics that will benefit cloud service providers to get the most from their applications," said Ronnie Vasishta, president and chief executive office at eASIC. "The combination of eASIC and Intel technology will help bring break through cost and performance to our customers."

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

 

About eASIC
eASIC is a semiconductor company offering a differentiated solution that enables us to rapidly and cost-effectively deliver custom integrated circuits (ICs), creating value for our customers' hardware and software systems. Our eASIC solution consists of our eASIC platform which incorporates a versatile, pre-defined and reusable base array and customizable single-mask layer, our easicopy ASICs, our standard ASICs and our proprietary design tools. Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Crescendo Ventures, Seagate Technology, Kleiner Perkins Caufield and Byers (KPCB) and Evergreen Partners. For more information on eASIC please visit www.easic.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 Source: eASIC website http://www.easic.com/products/28-nm-easic-nextreme-3/.

1,700 High School Students Compete for Approximately US$4M in Pittsburgh

 

WHAT:
Intel_ISEF_2015_Logo_Pittsburgh.jpg

The Intel International Science and Engineering Fair, a program of Society for Science & the Public and the world's largest high school science research competition, will take place in Pittsburgh from May 10-15. Approximately 1,700 high school students selected from 422 affiliate fairs in more than 75 countries, regions and territories will showcase cutting-edge research and inventions and compete for approximately US$4 million in awards. The full list of finalists is available in the event program (starting on page 61).

 

Wendy Hawkins, executive director of the Intel Foundation, and Maya Ajmera, president and CEO of Society for Science & the Public, will be available for comment at the event.

 

Media must be registered to attend. To register, reach out to the contacts listed below.

WHEN:

Public Exhibition of Projects

Thursday, May 14 from 10 a.m.-2 p.m. ET

  • This is the best opportunity for registered media to see, interview, film and photograph students from across the country and the world who are working to find solutions to global challenges through science, technology, engineering and math research. This year, research topics range from wearable technology to big data analytics to renewable energy.

 

Awards Ceremony

Friday, May 15 from 9-11:30 a.m. ET

  • Registered media are invited to attend the awards ceremony where the winners will be announced. The top prizes awarded by the Intel Foundation include the US$75,000 Gordon E. Moore Award, named for the Intel co-founder and fellow scientist. Two additional top winning projects will receive Intel Foundation Young Scientist Awards of US$50,000 each.
WHERE:

David L. Lawrence Convention Center

1000 Fort Duquesne Blvd.

Public Exhibition of Projects – DLCC Halls B and DE

Awards Ceremony – DLCC Hall A

QUOTES:

"The Intel International Science and Engineering Fair provides 1,700 brilliant teenagers with a unique opportunity to share cutting-edge ideas, exchange cultural perspectives and build lifelong friendships," said Wendy Hawkins, executive director of the Intel Foundation. "We're inspired by these young innovators and problem-solvers who are using science and technology to tackle our toughest global challenges and create a brighter future."

 

"Uniting students from around the world this year in Pittsburgh, the Intel International Science and Engineering Fair provides a unique opportunity for the world's top young innovators to compete for millions of dollars in awards while sharing their research and visions for the future with their peers," said Maya Ajmera, president and CEO of Society for Science & the Public. "We look forward with great anticipation to what these students will contribute individually and as a community to make our world a better place."

MORE INFO:

To get the latest Intel education news, visit www.intel.com/newsroom/education, and join the conversation on Facebook and Twitter.

 

To learn more about Society for Science & the Public, visit www.societyforscience.org, and follow the organization on Facebook and Twitter.

CONTACTS:

Gail Dundas, Intel

503-264-2154, gail.dundas@intel.com

 

Olivia Campbell, North of Nine Communications, for Intel

646-384-2095, olivia.campbell@nof9.com

 

Sarah Wood, Society for Science & the Public

202-872-5110, swood@societyforscience.org

Turning 50 this month, Moore’s Law is the cornerstone on which today’s innovation is built. IHS said today that Moore’s Law has generated a minimum of $3 trillion in incremental GDP and up to $11 trillion when including the indirect impact. At an event tonight, Gordon Moore is expected to highlight that without increasing funding for basic research and focus on STEM education advancements such as Moore’s Law may not happen in the future, potentially hobbling economic growth and increases in living standards.

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When Intel CEO Brian Krzanich showed 86-year-old Intel co-founder Dr. Gordon Moore the Intel® Edison-powered Spiderbot, Moore promptly pointed out that the robot does not have the correct number of legs -- spiders have eight.

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On the evening of May 11 in a rare opportunity, former and current Intel chairmen and CEOs gather at an event in San Francisco to celebrate the 50th anniversary of Moore's Law: Intel Co-Founder Dr. Gordon Moore, Intel Chairman Andy Bryant, retired Intel Chairman Arthur Rock and Intel CEO Brian Krzanich (left to right).  Credit: Intel, Walden Kirsch.

 

Gordon Moore: Thoughts on the 50th Anniversary of Moore’s Law

 

Infographic: Moore's Law Celebrating Five Decades of Innovation

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Intel today announced the winners of the $1 million Intel RealSense App Challenge, an international competition that highlights user experience innovation with Intel RealSense technology. Brazilian developer Alexandre Ribeiro da Silva of Anima Games won the $100,000 Grand Prize for the Ambassador track for its gaming app "Seed," while the $50,000 Grand Prize winner for the Pioneer track was awarded to Canadian developer David Schnare of Kinetisense for "OrthoSense," an app for medical professionals to remotely monitor patient rehabilitation. Over 7,000 developers across 37 countries participated in the challenge. The competition was announced last year at Computex by Intel President Renee James. For more on the potential of the Intel RealSense technology, read this blog by Doug Fisher, Intel's corporate senior vice president.

Bay Area Maker Faire 2014

Intel CEO Brian Krzanich, left, is showing an interactive LED Matrix by Joey Hudy, 17, right, at the Intel booth during last year's Bay Area Maker Faire in San Mateo, Calif., Saturday, May 17, 2014. Ten Intel® Galileo development boards are used to power this matrix of 1,000 LEDs. Hudy was Intel's youngest intern

The weekend of May 15, the 10th annual Maker Faire will take place in San Mateo, Calif. Intel will be calling all makers, crafters and tinkers to have fun with our hands-on learning activities, interactive games and demonstrations of inventions made with Intel® Edison and Intel® Galileo. Come listen to DJ Thud Rumble*, play robot laser tag and enjoy carnival-style games by Two Bit Circus. View the media alert for event detail and watch highlights from the Maker Faire Bay Area 2014.

WHAT:

Maker Faire Bay Area

Intel is the presenting sponsor of the 10th annual Maker Faire. The Intel booth will feature hands-on learning activities, interactive games and demonstrations of inventions made with Intel® Edison and Intel® Galileo, including a DJ experience by Thud Rumble*, robot laser tag and carnival-style games by Two Bit Circus*, among other displays.

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Intel CEO Brian Krzanich, left, is showing an interactive LED Matrix by Joey Hudy, 17, right, at the Intel booth during last year's Bay Area Maker Faire in San Mateo, Calif., Saturday, May 17, 2014. Ten Intel® Galileo development boards are used to power this matrix of 1,000 LEDs. Hudy was Intel's youngest intern.

WHEN:

May 16-17

Saturday 10 a.m.-8 p.m. PT

Sunday 10 a.m.-6 p.m. PT

WHERE:

San Mateo Event Center

1346 Saratoga Drive, San Mateo, CA 94403

Intel booth to be located in the midway section

ALSO:

MakerCon

Sponsored by Intel, the business- and innovation-oriented MakerCon will feature maker workshops, startup pitches, informational sessions and keynotes, and a special track for educators on May 12-13 at the Palace of Fine Arts, San Francisco.

MORE INFO:

MakerFaire.com and MakerCon.com

CONTACTS:

Alison Wesley, Intel

alison.e.wesley@intel.com

Today Intel CEO Brian Krzanich announced that Intel is entering into a memorandum of understanding with the Oakland Unified School District and will invest $5 million over the next five years to implement a comprehensive, education transformation solution that will create a computer science and engineering pathway for more than 2,400 students with a graduating cohort of 600 students over the next five years. Krzanich also announced a goal of $1 billion spending over the next five years in diverse-owned businesses and said that Intel is on track to meet overall hiring goals for the year for women and under-represented minorities. The announcement was made during Krzanich’s keynote address at the Rainbow PUSH Tech 2020 Summit. Read more from Chief Diversity Officer Rosalind Hudnell.

In order to better help consumers protect their digital lives, Intel Security is leading an effort on World Password Day to help educate consumers globally on the importance of password safety. Beginning May 7, Passwordday.org, Intel Security’s dedicated destination for password education, encourages people to commit to changing and improving their passwords. Visit the Intel Security blog for tips on how to help protect your online persona and to learn more about World Password Day.

Intel’s SVP & GM of the Data Center Group Diane Bryant & Cloudera’s CEO Tom Reilly

Cloudera CEO Tom Reilly joined Diane Bryant, Intel Senior Vice President and General Manager of Intel’s Data Center Group, on stage at Intel’s May 5 Analytics Day to discuss the one-year anniversary of Intel’s investment in Cloudera.

View the replays of the Intel and Cloudera keynotes from Intel’s “Analytics Day” event yesterday in San Francisco. Intel’s Diane Bryant, senior vice president and general manager of the Data Center Group, discussed scale-up and scale-out data analytics solutions optimized on Intel® Xeon® processor-based platforms, including the introduction of the Intel® Xeon® processor E7 v3 family for real-time analytics and mission-critical computing. Celebrating the one year anniversary of the Intel and Cloudera partnership, Cloudera’s CEO Tom Reilly discussed how the companies are accelerating enterprise Hadoop adoption through new product enhancements and ecosystem collaborations. Visit the online press kit for event photos and additional information.

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