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Intel Newsroom

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Intel unveiled a new lab in France that will spearhead big data research initiatives for personalized healthcare, smart cities, and precision agriculture. The research initiatives aim to accelerate the deployment of big data solutions through the use of proof of concepts and real-world trials. The new lab is situated within the Teratec science and technology park which brings together more than 80 technology and industrial companies, laboratories, research centers and universities to collaborate on ways to use big data analysis to develop personalized healthcare, improve the efficiency of agriculture, and create more sustainable cities.  Read more about the new lab.

Announced at Computex yesterday, Intel® Unite™ offers businesses an easy and cost-effective way to transform existing conference rooms into modern and connected meeting spaces with enhanced security to help improve collaboration and productivity. With a select Intel® Core™ vPro™ processor-powered mini PC in the conference room and the Intel Unite application running on devices, meeting participants can present wirelessly using new or existing displays and projectors, and both on-site and remote attendees can view and interact with content real time. The Intel Unite solution includes capabilities that increase security within the collaboration session itself, including the use of a unique rotating PIN design and the hardware-enhanced security of an Intel Core vPro processor. To learn more about additional features of this new solution, read the Intel Unite blog post by Tom Garrison.


Interactive Photo Capsule:  Intel® Unite™

The Society for Information Display (SID) announced the winners of its 20th annual Display Industry Awards. Intel® RealSense™ technology was awarded the Silver award for display component of the year. Intel RealSense technology takes creativity and collaboration in a 3D world to a whole new level. It uses a camera, infrared sensing components and software to create a touch-free interface that responds to facial expressions as well as head and hand motions. Get more information about Intel RealSense technology.

Intel was once again included on DiversityMBA’s 50 Out Front Best Places for Women & Diverse Managers to Work list which recognizes the top 50 companies that are working to increase the advancement of women and people of color into leadership positions. DiversityMBA evaluated companies on recruitment and retention, representation, workplace inclusion, succession planning and accountability. Intel is dedicated to increasing the representation of women and under-represented minorities. Find out more about Intel’s diversity and inclusion goals.


Intel® Thunderbolt™ 3 Technology

Today at Computex in Taipei Intel unveiled Thunderbolt™ 3 – marking the biggest advancement since the technology's inception. Thunderbolt 3 brings Thunderbolt to USB-C at 40Gbps, creating one compact port that does it all – delivering the fastest and most versatile connection to any dock, display, or data device. For the first time, one computer port connects to Thunderbolt devices, every display, and billions of USB devices. A single cable now provides four times the data and twice the video bandwidth of any other PC cable, while also supplying power. Initial products with Thunderbolt 3 are expected to start shipping before the end of this year, and ramp in 2016. Read more in this blog post and visit the online press kit for more information.

Today at Computex 2015, Intel introduced the Intel® Xeon® processor E3-1200 v4 product family, now integrated with Intel's most powerful data center graphics, Intel® Iris™ Pro graphics P6300. The Intel Xeon E3v4 product family enables cloud service providers and content owners to meet cloud-based graphics demands like high-definition video streaming to help deliver better user experiences. Built on 14nm process technology, the latest generation Intel Xeon processors offer new levels of performance for graphically-intensive workloads such as video transcoding, graphics/media delivery and remote workstation applications. Read the New Data Center Graphics Powerhouse blog or visit the multimedia press kit to learn more.

Computing Innovation, New Experiences and Internet of Things Solutions to Create Smart and Connected World



5th Gen Intel® Core™ mobile processor ("Broadwell-H")


5th Gen Intel® Core™ desktop processor ("Broadwell-H")


Intel Unite enables smart and connected meeting spaces with enhanced security

COMPUTEX, Taipei, Taiwan, June 2, 2015 - Intel Corporation today announced products and solutions that will deliver new user experiences and support the computing ecosystem's expansion into new areas. During the opening keynote address at Computex 2015, Kirk Skaugen, senior vice president and general manager of Intel's Client Computing Group encouraged the Taiwan ecosystem to work together and capture the opportunity to shape the future of computing.


"The power of Moore's Law has enabled incredible computing innovation over the past 50 years and because of it, nearly everything in the future will have the ability to compute and connect," said Skaugen. "Our 30-year history of collaboration with Taiwan has delivered historic innovation to the world, from personal computing to the cloud and data centers. The next 30 years will see even greater innovation as we deliver new computing experiences and bring intelligence and connectivity to the Internet of Things together."


Skaugen offered predictions into the future of computing and showcased the products and platforms that will take us there. He also showed how these innovations will soon enable intelligence to be everywhere.


Internet of Things News:

  • Intel introduced the expansion of the Intel® IoT Gateway product family. The latest gateway reference design offers expanded choice in silicon and software with the addition of Intel® Core™ processor-based gateways and Wind River* Intelligent Device Platform XT 3 with flexible packaging options for applications that require a low cost of entry.
  • Intel also expanded the choice of operating systems for Intel® IoT Gateway reference designs with the availability of Ubuntu Snappy Core from Canonical*. This builds upon the current OS availability from Microsoft* and Wind River.
  • Specifically for IoT solutions, especially retail and medical environments, Intel announced the new Intel® Pentium®, Intel® Celeron® and Intel® Atom™ processors. With stunning graphics performance in a low thermal envelope, the processors are customized for IoT and offer seven year availability.


Computing Experiences and Platform News:

  • Intel® Unite™ was introduced as a new cost-effective business solution designed for easy and intuitive collaboration and improved meeting productivity. With a select Intel® Core™ vPro™ processor-based mini PC in the conference room and the Intel Unite application running on devices, existing conference rooms are modernized and transformed into smart and connected meeting spaces with enhanced security.
  • In the biggest advancement since its inception, Thunderbolt™ 3 delivers one computer port that connects to Thunderbolt devices, every display and billions of USB devices. For the first time, a single cable now provides four times the data and twice the video bandwidth of any other cable, while also supplying power. It's unrivaled for new uses, such as 4K video, single-cable docks with charging, external graphics and built-in 10 GbE networking. Initial products are expected to start shipping before the end of this year, with more expected in 2016.
  • The 5th generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris™ Pro graphics, Intel's most powerful client processor graphics and media engine. The lower 65-watt thermal design power (TDP) allows full PC performance in a broad range of form factors, including smaller and thinner mini PCs and all-in-one desktops, providing up to two times better 3-D graphics performance, 35 percent video conversion and 20 percent compute performance over the previous generation processors.1
  • Intel also introduced 5th generation Intel® Core™ mobile processors for mobile and IoT with integrated Intel® Iris™ Pro Graphics. Optimized for gamers and content creators on the go, Intel's fastest and most responsive mobile processors have Intel Iris Pro graphics 6200 and provide up to two times higher compute performance and two times better 3-D graphics performance compared to the current generation.2 These processors are also ideal for medical, public works and industrial IoT applications with the inclusion of critical features for powerful IoT designs, including ECC memory support, Intel® vPro™ technology and offer seven year availability.
  • Highlighting progress toward a future of a completely wireless computing experience, Intel announced it is working with Targus* to deliver Rezence standard-based wireless charging solutions. Intel also recently announced an agreement with China-based Haier* to bring wireless charging solutions to restaurants, hotels, cafés, and airports in China later this year. Additionally, Intel will work with A4WP members, Foxconn Interconnect*, Basecom* and original design manufacturers BYD* and Primax* to bring wireless charging solutions to market later this year.


Data Center News:

  • Intel introduced the Intel® Xeon® processor E3-1200 v4 product family, the first time the Xeon processor line has included integrated Intel® Iris™ Pro graphics P6300. Built on 14nm process technology and designed for visually intensive, cloud-based workloads such as high-definition (HD) video transcoding and remote workstation delivery, the product family delivers up to 1.4x the performance for video transcoding3 and up to 1.8x the 3-D graphics performance4 compared to the prior generation.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)


About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.


Intel, the Intel logo, Celeron, Intel Atom, Intel Core, Intel RealSense, Intel vPro, Iris, Pentium and Thunderbolt are trademarks of Intel Corporation in the United States and other countries.


*Other names and brands may be claimed as the property of others.

1 Intel® Core™ i7-5775C with Intel® Iris® Pro graphics 6200 compared to 65W Intel® Core™ i7-4790S with Intel® HD graphics 4600 using 3DMark11 – Graphics score performance preset, HDxPRT_2014 Convert Videos, SPECint_rate_base2006*.


2 Intel® Core™ i7-5950HQ with Intel® Iris® Pro graphics 6200 compared to i7-5600U with Intel HD Graphics 5500 using SPECint_rate_base2006, 3DMark11 – Graphics score performance preset.


3 Up to 1.4x transcoding performance with Intel® Xeon® E3-1285L v4 when compared with Intel® Xeon E3 v3 on Intel Media Server Studio 2015 R3 Essentials Edition. Number of real time threads transcoded simultaneously: 10 on E301286L v3, 14 on E3-1285L, using 1080p30 20Mbps streams. Baseline configuration: Intel Rainbow Pass SR1200V3RP Platform with Intel® Xeon® E3-1286Lv3 (65W, 4C, 3.4Ghz, Intel® Iris Pro Graphics P6300) or Intel® Xeon® Processor E3-1286L V3 (65W, 4C, 3.2Ghz, Intel® HD Graphics p4700), 32 GB (4x8GB DDR3-1600MHz UDIMM), 160GB 7200 SATA HDD, Turbo Boost Enabled, HT Enabled, Windows Server 2012 R2, Intel Media Server Studio 2015 R3 Essentials Edition, Multi Transcoding Sample Version, Intel graphics driver pGFX, BIOS S1200RP.86B.03.01.002. Source: Intel internal measurements as of May 2015


4 Up to 1.8x better performance on 3DMark11*. Baseline configuration: Intel® Hermosa Beach 2 CRB platform with Intel® Xeon® E3-1286v3, 32GB memory (4x 8GB DDR3-1333 UDIMM), 64GB SATA SSD, Turbo Boost Enabled, HT Enabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_17. 3DMark Score 1524, Source: Internal Intel® measurements as of April 2014. Intel® Xeon® workstation platform (Intel S1200RP Board) with one Intel Xeon processor E3-1285 v4 (quad-core, 3.5GHz, 6M cache) BIOS S1200RP.86B.03.01.0002.041520151123, Intel HT Technology best configuration, 32GB memory (4x8GB DDR3-1600 ECC UDIMM), Intel Iris Pro Graphics P6300 with driver, Intel SSDSC2BB300G4, Microsoft Windows 8.1*. 3DMark Score 2881, Source: Intel internal testing as of June 2015.


Intel® Core™ i7-4790S processor (up to 4.0GHz, 4C8T, 8M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920x1080, Intel HD Graphics 4600, Windows* 8.1
Intel® Core™ i7-5775C processor (up to 3.7GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920x1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5950HQ processor (up to 3.8GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920x1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5600U processor (up to 3.7GHz, 2C4T, 4M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920x1080, Intel HD Graphics 5500, Windows* 8.1


HDxPRT* 2014 – Convert Videos: High Definition Experience & Performance Ratings Test, is a benchmark from Principled Technologies* that measures Windows* media editing performance. It uses mainstream applications to test the performance of the system.


3DMark* 11:  3DMark* 11 is a benchmark from Futuremark* that measures DX 11 gaming performance. There are four DX 11 graphics tests with three quality presets: Entry, Performance, Extreme. Reported metrics: Graphics Score (GPU), Physics Score (CPU), Combined Score (GPU & CPU) and an overall 3DMark Score (higher is better for all Scores). OS support: Desktop Windows.


SPEC* CPU2006:  SPEC* CPU2006 is a benchmark from the SPEC consortium that measures device performance and throughput using compute intensive application subtests. SPECint*_base2006 measures how fast a device completes a single integer compute task. SPECint*_rate_base2006 measures throughput, or how many integer compute tasks a device can accomplish in a given amount of time. Reported metrics: TBD. Scaling efficiencies: TBD. OS support: Desktop Windows*.


Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.


Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.


Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.  For more complete information visit www.intel.com/performance.

Intel Senior Vice President Kirk Skaugen joined ASUS Chairman Jonney Shih on the eve of Computex 2015 to introduce the latest Intel-powered devices resulting from the ongoing collaboration between the two companies. Together, Shih and Skaugen unveiled a series of new devices based on Intel architecture, including the ZenPad 7.0, ZenPad S 8.0 and Zen AiO. The ZenPad 7.0 is a 7-inch tablet featuring the Intel® Atom x3 processor (SoFIA). The ZenPad S 8.0 is an 8-inch tablet powered by a 64-bit Intel® Atom™ Z3580 processor (Moorefield) and is the world’s first 8-inch mobile device with 4GB of RAM. The Zen AiO Series is a premium range of All-in-One PCs for the home that is powered by the next generation Intel® Core™ processors.

With graduation season underway, Intel and Her Campus Media teamed up to survey more than 500 college women in an informal online poll to explore where technology ranks in their hearts. Technology devices (such as a laptop, tablet or smartphone) proved to be trusted companions, with nearly two-thirds (64 percent) of respondents stating that they are independent women and rely more on their tech than any best friend, boyfriend or super smart lab partner. Furthermore, 68 percent would rather forgo their daily dose of caffeine than accidentally leave their tech at home when heading to class. And one in five has new technology at the top of their graduation gift wish list, over a plane ticket or cash. Check out Intel’s Spring Product Guide for some of the best devices for the 2015 graduating class

Visible from Mission College Blvd. in the heart of Silicon Valley, Intel has installed one of the world's largest operating rooftop arrays of wind micro-turbines on the roof of Intel's worldwide headquarters in Santa Clara, California. Intel's micro-turbines are a proof-of-concept project, in which Intel hopes to collect data that will help the company better understand green power and identify ways to continue evolving its sustainability programs. This is just the latest milestone in Intel's longstanding commitment to innovation and environmental sustainability.


Press Materials



Rendering of the planned installation of 58 Wind Micro-Turbines on the rooftop of Intel's global headquarters building in Santa Clara, California. The installation is underway and will be complete in May 2015.  IMAGE SOURCE:  JLM Energy, Inc.


Located on the rooftop of Intel's headquarters Robert Noyce Building in Santa Clara, California, the company is installing a total of 58 micro turbines as part of a pilot wind power project.


Intel_Krzanich_RNB_Micro Turbines_2_1kpx.jpg Intel_Krzanich_RNB_Micro Turbines_1_1kpx.jpg

Intel CEO Brian Krzanich on the roof of Intel's headquarters Robert Noyce Building checking out the company's new wind microturbines. Intel is installing a total of 58 microturbines as part of a pilot wind power project. With Krzanich is Josh Beckwith, construction project manager with JLM Energy, the Rocklin California company that built and is installing the microturbines.

Doing the right things the right way – it’s who Intel is. Building on two decades of reporting, Intel released its 2014 Corporate Responsibility report, an assessment of its performance in areas including supply chain responsibility, environmental sustainability and more. From working to validate all of its products as conflict-free by 2016 to making a $300 million commitment to achieve a more diverse workforce, Intel remains committed to transparency, leadership in corporate responsibility and impacting the lives of people around the world. Read the new report.

Intel and the Food Network have teamed up to solve some of the messiest kitchen problems. By bringing Intel® RealSense™ technology to the mix, users can now create recipes with the help of voice and gesture control capabilities built into recipes on FoodNetwork.com which are optimized for the Intel RealSense 3D camera. Now cooks can simply take their Intel RealSense technology enabled-PC into the kitchen to prepare their favorite FoodNetwork.com recipes using voice or gesture with their hands in front of the camera — so it's OK if their hands are a mess. The top 100 Food Network recipes, including Perfect Roast Chicken and Super Sloppy Joes, are enabled with Intel RealSense technology. Check out the newly enabled recipes on the Food Network website. View a list of devices that support RealSense.

Intel has been recognized as a leader in conflict mineral reporting in a new report titled, Mining the Disclosures: An Investor Guide to Conflict Minerals Reporting. The report was released by Responsible Sourcing Network and Sustainalytics, and made note of Intel’s conflict-free efforts, specifically the company’s first commercially available conflict-free microprocessors in 2014. The report also referenced that Intel’s goal to establish all products as conflict-free starting in 2016. Learn more about Intel’s conflict-free efforts.

Today at the OpenStack Summit, Intel announced the availability of Intel Clear Containers, the latest feature coming from the Clear Linux Project for Intel Architecture. Intel Clear Containers bring a fast-booting, low-footprint Virtual Machine to the container usage model. Intel also announced Intel® Cloud Integrity Technology version 3.0, a root-of-trust based software solution for “remote attestation” delivering cloud workload transparency and control for OpenStack environments. Cloud Integrity Technology works with security features on Intel architecture based servers to help maintain security SLAs and regulations in the cloud. For more information, visit the Intel Clear Containers and Cloud Integrity Technology blogs.


Today, ASUS announced that the ZenFone 2 will be available on May 19, 2015 in North America. This is the first smartphone powered by an Intel® Atom™ processor (Moorefield) paired with the Intel® XMM™ 7260 LTE Advanced modem in North America. The Intel Atom processor and Intel XMM 7260 LTE Advanced modem allows for fast speeds and advanced graphics for a great music and video streaming experience, as well as live multiplayer gaming on the Zenfone 2. The phone will start at $199 USD, and will be available at Amazon.com, Groupon.com and NewEgg.com in the U.S., and NCIX.com, Canada Computer and Memory Express in Canada.

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