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Intel Newsroom

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Intel today announced it will hold its second Intel® Parallel Universe Computing Challenge at SC14, November 17-20, 2014 in New Orleans. The Intel Parallel Universe Computing Challenge is an educational and entertaining game show-style event where teams compete to win a grand prize of a $25,000 donation to a charitable organization. During the challenge, eight teams participate in a single elimination tournament designed to raise awareness of the importance of parallelization for improving the performance of technical computing applications. The event includes a live rapid-fire trivia competition and parallel code optimization where participants modify software. Learn more and submit your team for consideration.

Intel has been ranked #15 on Interbrand’s 2014 Best Global Green Brands list. Intel was selected based on its environmental performance and the market’s perception of the company’s efforts. Examples of such efforts include manufacturing the world’s first conflict-free microprocessors, being the largest purchaser of green power in the U.S. and saving 46 billion gallons of water over the past decade. Read more about Intel’s commitment to sustainability .

 

Note to Editors: Materials and multimedia available at Intel Education Solutions press kit.

 

WHAT:

Intel Education is more than technology – it's flexible, holistic solutions that transform learning and teaching. Based on more than a decade of on-the-ground experience working with educators, Intel's comprehensive approach addresses education needs at every level to promote student success. Join Intel at the International Society for Technology in Education (ISTE) 2014 Conference to find out what it really takes to transform learning in a classroom – from rich content solutions such as Kno, to active learning space concepts, to research-based guides on engaging students with technology. Below is an overview of Intel's presence at the conference and planned press activities. For general information, visit www.intel.com/iste.

WHEN:

June 28 – July 1, 2014

WHERE:

Georgia World Congress Center

285 Andrew Young International Blvd. NW

Atlanta, Georgia

Intel Booth: #1806

WHO:

Intel's John Galvin, vice president of the Sales and Marketing Group and general manager of Intel Education; Eileen Lento, director of Global Education Marketing and Advocacy, recently named one of the 10 most influential people in education technology by Tech & Learning magazine; and Paige Johnson, U.S. K-12 Education Strategist, will be available for comment and meetings at the event.

DETAILS:

Intel Booth

 

Ongoing

Booth #1806

 

Intel's booth at ISTE will feature interactive learning kiosks featuring Kno, designing active learning spaces, visionary strategies on personalized learning and transforming education, and a mobile device bar with a range of Intel's latest education products.

 

Attendees are encouraged to stop by the booth to pick up a free copy of "Transforming Education for the Next Generation, A Practical Guide for Learning and Teaching with Technology," a new guide for school leaders that includes expertise from industry visionaries from around the world and practical step-by-step actions to help schools create systemic change and transform education.

 

Intel will also give away codes for free digital downloads of "Personalized Learning: A Guide for Engaging Students with Technology," a book underwritten by Intel® Education and published by ISTE to help educators and administrators understand the concepts behind personalized learning and share with them strategies, policies, devices, services, techniques and resources to transform learning environments. Attendees can also buy a hardcover copy from ISTE.

 

Award-winning educators with real-world education technology experience will be hosting conversations in the booth, sharing their unique perspectives and discussing how technology has changed learning and teaching in their classrooms. One of these educators, Suzy Brooks, will be sharing her experience at ISTE via social media on Twitter and Pinterest.

 

Intel Education Overview

Sunday, June 29 from 10:30 – 11:30 a.m. ET

Intel Booth #1806

Invite Only

 

Join Intel's John Galvin and Eileen Lento to learn more about Intel's holistic approach to education technology – and for the announcement of Intel's newest education reference design. See how our solutions transform learning and teaching through the right devices, relevant software and content, teacher professional development and free planning resources. With over a decade of experience in technology implementation with schools and governments globally, they can answer questions on key elements that drive systemic change for student success.

 

ISTE Authors Luncheon, sponsored by Intel® Education

Sunday, June 29 from 12 – 1:30 p.m. ET

ISTE Press Suite, B209

Invite Only

 

An opportunity to hear from the authors of the four new ISTE-published books launching at the 2014 conference. Dr. Peggy Grant, co-author of the Intel® Education-underwritten book "Personalized Learning: A Guide for Engaging Students with Technology," will discuss how personalized learning with technology can be used to meet the needs of all learners—from gifted students to students with disabilities—and how it can help achieve school goals.

 

Hewlett-Packard Media Reception

Sunday, June 29 from 5:30 – 6:30 p.m. ET

Atlanta Marriott Marquis – Room A601

Invite Only

 

Join Paige Johnson, U.S K-12 education strategist at Intel, HP and Microsoft to hear firsthand from Baltimore County Public Schools for insights on its digital learning strategy, implementation and the benefits of 1:1 learning.

CONTACTS:

Gail Dundas, Intel

503-264-2154, gail.dundas@intel.com

 

Olivia Campbell, North of Nine Communications, for Intel

646-384-2095, olivia.campbell@nof9.com

Today at the International Supercomputing Conference in Leipzig, Germany, Intel unveiled details on the next-generation Intel® Xeon Phi™ processor  codenamed Knights Landing, which includes the newly integrated Intel® Omni Scale Fabric, an end-to-end interconnect optimized for fast data transfers and better efficiency. Knights Landing will feature high-bandwidth on-package memory and deliver up to three times the performance of the prior generation while using less energy. Intel technology was also showcased throughout the conference with Intel® Xeon® processors powering 85% of systems in the newly published TOP500 list, underscoring their role as the fundamental building block for the world’s most powerful supercomputers. The press release, Dr. Rajeeb Hazra’s ISC keynote, videos and other information on this news is available here.

At the International Supercomputing Conference today, Intel announced the latest release of the Intel® Enterprise Edition for Lustre software that combines the performance and scalability of open-source Lustre software with new tools to help IT use Lustre storage for the most data-intensive applications. Building on the Lustre 2.5 foundation, the Intel Enterprise Edition for Lustre features new capabilities to monitor vast amounts of dynamic data to identify and overcome performance constraints as well as larger sized configurations to meet the need for faster and more productive storage solutions. Additionally, the latest version includes a new Lustre client for Intel® Xeon Phi™ coprocessors that delivers 10 times improved streaming I/O compared to network file systems. To learn more, visit lustre.intel.com.

Next-Generation Intel® Xeon Phi™ Processor with Integrated Intel® Omni Scale Fabric to Deliver Up to 3 Times the Performance of Previous Generation at Lower Power

 

NEWS HIGHLIGHTS

  • Announces new microarchitecture and memory details of the next-generation Intel® Xeon Phi™ processor (code-named Knights Landing), scheduled to power HPC systems in the second half of 2015.
  • Intel® Omni Scale Fabric– an end-to-end interconnect optimized for fast data transfers, reduced latencies and higher efficiency – initially available as discreet components in 2015, will also be integrated into next-generation Intel Xeon Phi processor (Knights Landing) and future 14nm Intel® Xeon® processors.
  • Intel continues to lead in HPC segment with 85 percent of all supercomputers on the latest TOP500* list powered by Intel Xeon processors.

 

 

 

INTERNATIONAL SUPERCOMPUTING CONFERENCE (ISC), Leipzig, Germany, June 23, 2014 – Intel Corporation today announced new details for its next-generation Intel® Xeon Phi™ processors, code-named Knights Landing, which promise to extend the benefits of code modernization investments being made for current generation products. These include a new high-speed fabric that will be integrated on-package and high-bandwidth, on-package memory that combined, promise to accelerate the rate of scientific discovery. Currently memory and fabrics are available as discrete components in servers limiting the performance and density of supercomputers.

 

The new interconnect technology, called Intel® Omni Scale Fabric, is designed to address the requirements of the next generations of high-performance computing (HPC). Intel Omni Scale Fabric will be integrated in the next generation of Intel Xeon Phi processors as well as future general-purpose Intel® Xeon® processors. This integration along with the fabric's HPC-optimized architecture is designed to address the performance, scalability, reliability, power and density requirements of future HPC deployments. It is designed to balance price and performance for entry-level through extreme-scale deployments.

 

"Intel is re-architecting the fundamental building block of HPC systems by integrating the Intel Omni Scale Fabric into Knights Landing, marking a significant inflection and milestone for the HPC industry," said Charles Wuischpard, vice president and general manager of Workstations and HPC at Intel. "Knights Landing will be the first true many-core processor to address today's memory and I/O performance challenges. It will allow programmers to leverage existing code and standard programming models to achieve significant performance gains on a wide set of applications. Its platform design, programming model and balanced performance makes it the first viable step towards exascale."

 

Knights Landing – Unmatched Integration
Knights Landing will be available as a standalone processor mounted directly on the motherboard socket in addition to the PCIe-based card option. The socketed option removes programming complexities and bandwidth bottlenecks of data transfer over PCIe, common in GPU and accelerator solutions. Knights Landing will include up to16GB high-bandwidth, on-package memory at launch – designed in partnership with Micron* – to deliver five times better bandwidth compared to DDR4 memory1, five times better energy efficiency2 and three times more density2 than current GDDR-based memory. When combined with integrated Intel Omni Scale Fabric, the new memory solution will allow Knights Landing to be installed as an independent compute building block, saving space and energy by reducing the number of components.

 

Powered by more than 60 HPC-enhanced Silvermont architecture-based cores, Knights Landing is expected to deliver more than 3 TFLOPS of double-precision performance3 and three times the single-threaded performance4 compared with the current generation. As a standalone server processor, Knights Landing will support DDR4 system memory comparable in capacity and bandwidth to Intel Xeon processor-based platforms, enabling applications that have a much larger memory footprint. Knights Landing will be binary-compatible with Intel Xeon processors5, making it easy for software developers to reuse the wealth of existing code.

 

For customers preferring discrete components and a fast upgrade path without needing to upgrade other system components, both Knights Landing and Intel Omni Scale Fabric controllers will be available as separate PCIe-based add-on cards. There is application compatibility between currently available Intel® True Scale Fabric and future Intel Omni Scale Fabric, so customers can transition to new fabric technology without change to their applications. For customers purchasing Intel True Scale Fabric today, Intel will offer a program to upgrade to Intel Omni Scale Fabric when it's available.

 

Knights Landing processors are scheduled to power HPC systems in the second half of 2015. For instance, in April the National Energy Research Scientific Computing Center (NERSC) announced an HPC installation planned for 2016, serving more than 5,000 users and over 700 extreme-scale science projects.

 

"We are excited about our partnership with Cray and Intel to develop NERSC's next supercomputer 'Cori,'" said Dr. Sudip Dosanjh, NERSC Director, Lawrence Berkeley National Laboratory. "Cori will consist of over 9,300 Intel Knights Landing processors and will serve as an on-ramp to exascale for our users through an accessible programming model. Our codes, which are often memory-bandwidth limited, will also greatly benefit from Knights Landing's high speed on package memory. We look forward to enabling new science that cannot be done on today's supercomputers."

 

New Fabric, New Speeds with Intel Omni Scale Fabric
Intel Omni Scale fabric is built upon a combination of enhanced acquired IP from Cray and QLogic, and Intel's own in-house innovations. It will include a full product line offering consisting of adapters, edge switches, director switch systems, and open-source fabric management and software tools. Additionally, traditional electrical transceivers in the director switches in today's fabrics will be replaced by Intel® Silicon Photonics-based solutions, enabling increased port density, simplified cabling and reduced costs6. Intel Silicon Photonics-based cabling and transceiver solutions may also be used with Intel Omni Scale-based processors, adapter cards and edge switches.

 

Intel Supercomputing Momentum Continues
The current generation of Intel Xeon processors and Intel Xeon Phi coprocessors powers the top-rated system in the world – the 35 PFLOPS "Milky Way 2" in China. Intel Xeon Phi coprocessors are also available in more than 200 OEM designs worldwide.

 

Intel-based systems account for 85 percent of all supercomputers on the 43rd edition of the TOP500 list announced today and 97 percent of all new additions. Within 18 months after the introduction of Intel's first many-core architecture products, Intel Xeon Phi coprocessor-based systems already make up 18 percent of the aggregated performance of all TOP500 supercomputers. The complete TOP500 list is available at www.top500.org.

 

To help optimize applications for many-core processing, Intel has also established more than 30 Intel Parallel Computing Centers (IPCC) in cooperation with universities and research facilities around the world. Today's parallel optimization investment with the Intel Xeon Phi coprocessor will carry forward to Knights Landing, as optimizations using standards-based, common programming languages persist with a recompile. Incremental tuning gains will be available to take advantage of innovative new functionality.

 

Videos

 

 

Press Materials

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel, Xeon, Intel Xeon Phi, Intel Atom and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States or other countries.

 

*Other names and brands may be claimed as the property of others.

 

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.

 

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

 

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

 

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2®, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

 

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

 

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase"

 

1 Projected result based on internal Intel analysis of STREAM benchmark using a Knights Landing processor with 16GB of high-bandwidth versus DDR4 memory only with all channels populated

 

2 Projected results based on internal Intel analysis of Knights Landing's on-package memory MCDRAM vs Knights Corner's GDDR5 memory

 

3 Internal and preliminary projections of theoretical double-precision performance measured by Linpack. Based on current expectations of Knights Landing's cores, clock frequency and floating point operations per cycle.

 

4. Projected peak theoretical single-thread performance relative to 1st Generation Intel® Xeon Phi™ Coprocessor 7120P (formerly code-named Knights Corner)

 

5 Binary Compatible with Intel Xeon processors using Haswell Instruction Set (except TSX - Transactional Synchronization Extensions)

 

6 The TCO or other cost reduction scenarios described in this document are intended to enable you to get a better understanding of how the purchase of a given Intel product, combined with a number of situation-specific variables, might affect your future cost and savings. Circumstances will vary and there may be unaccounted-for costs related to the use and deployment of a given product. Nothing in this document should be interpreted as either a promise of or contract for a given level of costs."

NEWS HIGHLIGHTS

  • CEO of Workday, Inc., increases enterprise software and cloud computing expertise of Intel board

 

SANTA CLARA, Calif., June 23, 2014 –Intel Corporation announced that Aneel Bhusri, co-founder and chief executive officer of Workday, Inc. (NYSE: WDAY), has been elected to serve on the company's board of directors.

 

"We are very pleased to have Aneel Bhusri as an Intel director," said Andy Bryant, chairman of the board of Intel. "His more than 20 years' experience in enterprise software innovation and cloud computing will increase our board's depth in areas that are key to Intel's business and crucial in today's connected world."

 

Bhusri, 48, co-founded Workday, Inc., in 2005 and served as its co-chief executive officer from 2009 and chairman from 2012 until May of this year, when he was named chief executive officer. Workday is a leading provider of enterprise cloud applications for human resources and finance. In addition, Bhusri serves as a partner at Greylock Partners, a venture capital firm. Previously, he held a number of leadership positions at PeopleSoft, including senior vice president responsible for product strategy, business development and marketing, and vice chairman of the board.

 

Bhusri received an MBA from Stanford University and holds bachelor's degrees in electrical engineering and in economics from Brown University. He also is a Crown Fellow at the Aspen Institute.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Bolstering its commitment to Chrome OS, Intel launched Chrome Developer Zone, a new site that features videos, tutorials and sample code for application developers. The Chrome Developer Zone has a range of resources, including ones that teach developers how to create an X86/Intel® architecture based Chrome app and improve the efficiency and responsiveness their application or website, and information on the different Chrome device form factors available today. The very first Chromebook was based on Intel® architecture and, since then, Intel has launched five generations of Chromebooks and is the market leader. As one of the top software contributors to the Linux kernel and Chromium OS, Intel continually helps to shape the user experience and works to ensure the Chrome experience is delivered best on Intel architecture.  Visit software.intel.com/chrome to learn more, provide feedback and contribute to improving the Chrome experience.

Intel is creating a fun spin on communication with the launch of Pocket Avatars, a new over-the-top (OTT) mobile messaging app developed by Intel Labs technologists. With a standard smartphone camera, users are now able to create customized messages using 3D images of their favorite characters, including American Greetings Care Bears, Annoying Orange, Gumby and Pokey , LEGO characters, Mr. Bill and the San Diego Chicken. By leveraging sophisticated technology, Pocket Avatars captures a user’s facial expressions, head movements and voice, and then maps this data onto a 3D character. Messages can be shared through the app, on social media, or via text message and email. Pocket Avatars is free and available in the Apple App Store and the Google Play Store. View the blog post for more.

Intel Capital-backed portfolio companies MongoDB and Nexmo this week were named to CNBC’s Disruptor 50. Chosen from more than 500 companies, this annual list recognizes the top innovators revolutionizing the business landscape. MongoDB (derived from “humongous”) is living up to its name, disrupting the database market by processing humongous data sets at great speed. Nexmo, which lets businesses reach customers through phone messages, is shaking up the mobile, software and telecom industries with 5 billion users in 200 countries across a network of 700 mobile operators. MongoDB and Nexmo join other CNBC Disruptors including Airbnb, Kickstarter and Uber. See a complete list of disruptors.

At the Gigaom Structure conference in San Francisco today, Intel’s Diane Bryant announced that the company will now offer customizable chips for the data center based on industry leading Intel® Xeon® processors. For the first time, Intel server customers will be able to incorporate their own software and IP via a field-programmable gate array (FPGA) integrated into the same package, which can be programmed for specific functions and workloads, like search or video compression, particularly as the patterns change. This is an example of Intel leading a massive transformation at the silicon level of the data center to drive increased value to our customers.

To help independent software vendors create high-performance web communication services and accelerate product deployment, Intel today launched the Intel® Collaboration Service for WebRTC (Intel® CS for WebRTC). WebRTC (web real-time communication) technology aids browser-to-browser video/audio communication by enabling consumers to place calls and share files through the browser, across device platforms without the use of native applications. Intel CS for WebRTC includes a client SDK and server solution that is optimized for Intel® architecture and leverages the Intel® Iris™ Pro Graphics technology and Intel hardware codec acceleration (VP8 and H.264) to enable a better and cost-effective user experience. Get more information.

Intel is honoring Father's Day with an infographic pairing the latest technologies out there with their earlier-generation "dads" (for instance: the smartphone and the landline). The image also features the Intel 4004, Intel's first microprocessor, to show how far technology has come.

 

Honoring Father's Day

SANTA CLARA, Calif., June 12, 2014 - As a result of stronger than expected demand for business PCs, Intel Corporation now expects second-quarter revenue to be $13.7 billion, plus or minus $300 million, as compared to the previous range of $13.0 billion, plus or minus $500 million. The company is forecasting the mid-point of the gross margin range to increase by 1 point to 64 percent, plus or minus a couple of percentage points, driven mostly by higher PC unit volume. R&D plus MG&A spending is expected to be approximately $4.9 billion, $100 million higher than the prior expectation of approximately $4.8 billion, driven largely by revenue- and profit-dependent items. The tax rate for the second quarter is expected to be 28 percent as compared to the prior expectation of 27 percent due to higher profits in higher tax jurisdictions. The expectation for second-quarter depreciation remains unchanged.

 

Intel now expects some revenue growth for the year as compared to the previous outlook of approximately flat. The change in outlook is driven mostly by strong demand for business PCs. The company will provide additional commentary on all business segments when it reports second-quarter earnings on July 15. The full-year gross margin percentage is now expected to be in the upper half of the previous range of 61 percent, plus or minus a few percentage points, driven mostly by expected improvements in unit cost and volume. A new full-year gross margin range will be provided on July 15. Full-year R&D plus MG&A spending is expected to be $19.2 billion, plus or minus $200 million, higher than the prior expectation of $18.9 billion, plus or minus $200 million, driven mostly by revenue- and profit-dependent items. The tax rate for each of the remaining quarters of 2014 is expected to be 28 percent, as compared to the prior expectation of 27 percent due to higher profits in higher tax jurisdictions. The expectations for full-year depreciation and capital spending are unchanged. No other guidance from the April 15 earnings release remains in effect.

 

Business Outlook

Intel's second-quarter Business Outlook was originally published in the company's first-quarter 2014 earnings release, available at intc.com. The company is scheduled to report its second-quarter financial results on July 15.

 

Intel's updated Business Outlook does not include the potential impact of any business combinations, asset acquisitions, divestitures, strategic investments and other significant transactions that may be completed after June 12. Intel's updated Business Outlook is posted on intc.com and may be reiterated in public or private meetings with investors and others. The updated Business Outlook will be effective through the close of business on June 17, unless earlier updated. Intel's Quiet Period will start from the close of business on June 17 until publication of the company's second-quarter earnings release, scheduled for July 15. During the Quiet Period, all of the Business Outlook and other forward-looking statements disclosed in the company's news releases and filings with the SEC should be considered as historical, speaking as of prior to the Quiet Period only and not subject to an update by the company.

 

Risk Factors

The above statements and any others in this document that refer to plans and expectations for the second quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will," "should" and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel's actual results, and variances from Intel's current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be important factors that could cause actual results to differ materially from the company's expectations.

  • Intel's gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; and product manufacturing quality/yields. Variations in gross margin may also be caused by the timing of Intel product introductions and related expenses, including marketing expenses, and Intel's ability to respond quickly to technological developments and to introduce new products or incorporate new features into existing products, which may result in restructuring and asset impairment charges.
  • Demand for Intel's products is highly variable and, in recent years, Intel has experienced declining orders in the traditional PC market segment. Demand could be different from Intel's expectations due to factors including changes in business and economic conditions; consumer confidence or income levels; customer acceptance of Intel's and competitors' products; competitive and pricing pressures, including actions taken by competitors; supply constraints and other disruptions affecting customers; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers.
  • Intel operates in highly competitive industries and its operations have high costs that are either fixed or difficult to reduce in the short term.
  • The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets.
  • Gains or losses from equity securities and interest and other could vary from expectations depending on gains or losses on the sale, exchange, change in the fair value or impairments of debt and equity investments; interest rates; cash balances; and changes in fair value of derivative instruments.
  • Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates.
  • Intel's results could be affected by the timing of closing of acquisitions, divestitures and other significant transactions.
  • Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues, such as the litigation and regulatory matters described in Intel's SEC filings. An unfavorable ruling could include monetary damages or an injunction prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel's ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property.

 

A detailed discussion of these and other factors that could affect Intel's results is included in Intel's SEC filings, including the company's most recent reports on Form 10-K and Form 10-Q.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

 

Intel, Core and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

From supercomputers to the smallest wearable devices, the computing industry is searching for the most energy-efficient solutions while delivering optimal performance. At this week’s 2014 Symposia on VLSI Technology and Circuits, Intel presents five technical papers on energy efficiency. Read the Intel blog post on these papers and other Intel activities.

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