Building upon Intel's leadership in radio frequency, the company announced a new solution called SMARTiTM UE2p that integrates 3G power amplifiers into radio frequency circuits. The new system-on-chip (SoC) solution enables a smaller footprint and reduces complexity for developers as well as the associated total cost of ownership. This solution is targeted at new mass market segments such as entry level 3G handsets and machine-to-machine modules. Samples are expected to be provided to select customers in the fourth quarter of 2012. More information is available in the press release.