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The Beauty Inside,” the second social film from Intel® and Toshiba, has won a 2013 Emmy from the Daytime Emmy’s for Outstanding New Approach to Daytime Programming. The social film was up against PBS’s "Chuck Vanderchuck" and "Design Squad Nation" as well as algebra media project “Get the Math.” The film provided a unique level of engagement between social media and blockbuster-style film and featured the innovative Toshiba Portégé* Ultrabook™. “The Beauty Inside” brought together top talent in entertainment, technology and social media, starring actor Topher Grace, actress Mary Elizabeth Winstead, and Sundance award-winning director Drake Doremus. Stay tuned for what’s next from Intel and Toshiba.

Today, the Top500 list of the most powerful supercomputers in the world, announced at the International Supercomputing Conference (ISC'13) in Germany, revealed a new leader: the "Milky Way 2" system powered by 32,000 Intel® Xeon® processors and 48,000 Intel® Xeon Phi™ coprocessors. Intel technology also powered more than 80 percent of all listed systems, including 98 percent of the newly added supercomputers. During the conference, Raj Hazra, Intel vice president and general manager of the Technical Computing Group, also announced the new Intel Xeon Phi coprocessors and disclosed the first details of the next generation of this technology, codenamed "Knights Landing", featuring Intel's leading 14nm process technology. Get more information about Intel at ISC'13.

NEWS HIGHLIGHTS

  • The new world's fastest supercomputer is powered by Intel® Xeon Phi™ coprocessors and Intel® Xeon® processors, delivering twice the speed of the previous leader.
  • Intel processors power more than 80 percent of all systems on Top500 list of world's most powerful supercomputers including 98 percent of new listed systems.
  • Intel expands the portfolio of current generation coprocessors with new Intel® Xeon Phi™ 3100 and 7100 product families, providing a variety of cost and performance options.
  • Intel also disclosed the next generation of Intel® Xeon Phi™ technology, codenamed "Knights Landing," promising to extend its supercomputing leadership.

 

 

INTERNATIONAL SUPERCOMPUTING CONFERENCE (ISC'13), Leipzig, Germany, June 17, 2013 – A system built with thousands of Intel® processors and co-processors was just named the most powerful supercomputer in the world in the 41st edition of the Top500 list of supercomputers.

 

The system, known as "Milky Way 2," includes 48,000 Intel® Xeon Phi™ coprocessors and 32,000 Intel® Xeon® processors and operates at a peak performance of 54.9 PFlops (54.9 quadrillion floating point operations per second) -- more than twice the performance of the top rated system from the last edition of the Top500 list in November 2012. This is the first exclusively Intel-based system to take the top spot on the list since 1997.

 

Intel also announced the expansion of the Intel Xeon Phi coprocessors portfolio and revealed details of the second generation of Intel Xeon Phi products code named "Knights Landing." The new products and technologies will continue to radically increase the energy efficiency and performance of supercomputers worldwide.

 

The worldwide high performance computing (HPC) server segment is expected to grow its annual revenue by 36 percent1 from $11 billion to $15 billion over the next four years. The dramatic increase and growth of supercomputers continues to be driven by the need to quickly compute, simulate and make more informed decisions across a range of industries. Supercomputers are used to increase the accuracy of weather predictions, help to explore more efficient energy resources, develop cures for diseases, sequence the human genome and analyze big data.

 

"Intel is helping to blaze a path toward new innovation, discovery and competitiveness with its supercomputing vision and products," said Raj Hazra, vice president and general manager of Technical Computing Group. "There is an insatiable demand for more computing power while also achieving new levels of power efficiency. With the current and future generations of Intel Xeon Phi coprocessors, Intel Xeon processors, Intel® TrueScale fabrics and software, Intel is uniquely equipped to deliver a comprehensive solution for our customers without compromise."

 

Since the introduction of Intel Xeon Phi six months ago, Intel Xeon processors and Intel Xeon Phi co-processors have become a powerful combination now powering many of the world's fastest supercomputers. Intel Xeon Phi coprocessors based on the Intel® Many Integrated Core (Intel MIC) architecture address the need for higher performing yet more energy efficient and user-friendly technology.

 

"Milky Way 2" - the World's Fastest Supercomputer
Built for the National Supercomputing Center in Guangzhou China, the "Milky Way 2" system is powered by 32,000 of the upcoming 12-core Intel Xeon processors E5-2600 v2 based on Ivy Bridge architecture, and 48,000 Intel Xeon Phi coprocessors, with a total system power of 17.8 MW. Not only is it the fastest, but also one of the most power-efficient systems on the Top500 list. The system uses "neo-heterogeneous architecture," whereby the hardware architecture has multiple classes of compute capabilities that are accessed by a common programming model, streamlining development and optimization processes – an advantage not possible when using a combination of CPUs and GPU accelerators.

 

The system's leading performance and energy efficiency were achieved by using the upcoming Intel Xeon processor E5-2600 v2 product family based on Intel's leading 22nm manufacturing process. In addition to powering the "Milky Way 2", these processors also power two other systems on the Top500 list from Bull*, the 54th ranked system with 557 TFlops and the 329th with 139 TFlops, as part of an "early ship" program Intel uses to equip supercomputer customers. The products will be generally available next quarter, and will feature up to 12 cores and up to 2.7GHz clock speeds, delivering 259 GFlops per socket, a 56 percent increase over the previous generation.

 

More than 80 percent (403 systems) of the supercomputers on the 41st edition of the Top500 list are powered by Intel processors. Of those systems making their first appearance on the list, Intel-powered installations account for 98 percent. The June edition of the list had recorded 11 systems based on the Intel Xeon Phi coprocessor, including the Petaflops class systems like "Milky Way 2" at 54.9 PFlops and "Stampede" at 8.5 PFlops of peak performance.

 

The semi-annual TOP500 list of supercomputers is the work of Hans Meuer of the University of Mannheim, Erich Strohmaier and Horst Simon of the U.S. Department of Energy's National Energy Research Scientific Computing Center, and Jack Dongarra of the University of Tennessee. The complete report is available athttp://www.top500.org/

 

New Intel® Xeon Phi™ Coprocessor 3000 and 7000 Product Families

Intel also announced the expansion of its current generation Intel Xeon Phi coprocessors with the addition of five new products that feature various performance options, memory capacity, power efficiency and form factors that are available today. The Intel Xeon Phi coprocessor 7100 family is designed and optimized to provide the best performance and offer the highest level of features, including 61 cores clocked at 1.23GHz, 16 GB of memory capacity support (double the amount previously available in accelerators or coprocessors) and over 1.2 TFlops of double precision performance. The Intel Xeon Phi coprocessor 3100 family is designed for high performance per dollar value. The family features 57 cores clocked at 1.1 GHz and 1TFlops of double precision performance.

 

Lastly, Intel added another product to the Intel Xeon Phi coprocessor 5100 family announced last year. Named the Intel Xeon Phi coprocessor 5120D, it is optimized for high-density environments with the ability to allow sockets to attach directly to a mini-board for use in blade form factors.

 

"Knights Landing" – A Choice of Coprocessor or CPU
Intel revealed details of its second generation Intel Xeon Phi products aimed to further increase their supercomputing capabilities. Codenamed "Knights Landing," the next generation of Intel MIC Architecture-based products will be available as a coprocessor or a host processor (CPU) and manufactured using Intel's 14nm process technology featuring second generation 3-D tri-gate transistors.

 

As a PCIe card-based coprocessor, "Knights Landing" will handle offload workloads from the system's Intel Xeon processors and provide an upgrade path for users of current generation of coprocessors, much like it does today. However, as a host processor directly installed in the motherboard socket, it will function as a CPU and enable the next leap in compute density and performance per watt, handling all the duties of the primary processor and the specialized coprocessor at the same time. When used as a CPU, "Knights Landing" will also remove programming complexities of data transfer over PCIe, common in accelerators today.

 

To further boost the performance for HPC workloads, Intel will significantly increase the memory bandwidth for all "Knights Landing" products by introducing integrated on-package memory. This will allow customers to take full advantage of available compute capacity without encountering memory bandwidth bottlenecks experienced today.

 

More information on Intel news from ISC'13 including Raj Hazra's presentation are available on the Intel Newsroom.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Intel Xeon, Intel Xeon Phi, the Intel Xeon Phi logo, the Intel Xeon logo and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

INFORMATION IN THIS DOCUMENT IS PROVIDED "AS IS". NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO THIS INFORMATION INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

 

1 Source: IDC: Worldwide Technical Computing Server 2013–2017 Forecast

 

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

 

Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of record product roadmaps.

 

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel.

Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

Notice revision #20110804

 

All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.

 

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Go to: http://www.intel.com/products/processor_number

 

Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

 

Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.

In recent benchmark testing, ABI Research found that Intel’s latest smartphone processor outperformed the competition while consuming less power. ABI pitted the performance of the Intel® Atom™ processor Z2580 running inside the new Lenovo K900 Smartphone against the performance of several competing ARM-based, high-end smartphones. ABI found that Intel’s 2.0 GHz smartphone chip not only beat the competition in performance but it did so “with up to half the current drain.”  Read the ABI Research news release.

The new Pike Powers Laboratory & Center for Commercialization features nearly 80TB of high-speed computing systems based on Intel® Xeon® processors and the ability to do near real-time analytics using the Intel® Distribution for Apache Hadoop. Based in Austin, Texas, the new lab offers specialized capabilities for developing, testing and validating a wide range of smart grid, distributed energy and consumer electronics hardware and software. These capabilities provide companies of all sizes with a unique venue to simulate thousands of real world use cases (home or commercial down to the device level) of customer applications such as lighting, smart meters, solar panels and more. In addition to world-class hardware and computing assets, the lab provides companies with access to the largest database of disaggregated, detailed residential energy data ever recorded, as well as the research experts that designed and built the database. Get more information.

New Intel® Enterprise Edition for Lustre* Software Designed to Simplify Big Data Management, Storage

 

NEWS HIGHLIGHTS

  • Intel® Enterprise Edition for Lustre* software helps simplify configuration, monitoring, management and storage of high volumes of data.
  • With Intel® Manager for Lustre* software, Intel is able to extend the reach of Lustre into new markets such as financial services, data analytics, pharmaceuticals, and oil and gas.
  • When combined with the Intel® Distribution for Apache Hadoop* software, Hadoop users can access Lustre data files directly, saving time and resources.
  • New software offering furthers Intel's commitment to drive new levels of performance and features through continuing contributions the open source community.

 

 

SANTA CLARA, Calif., June. 12, 2013 – The amount of available data is growing at exponential rates and there is an ever-increasing need to move, process and store it to help solve the world's most important and demanding problems. Accelerating the implementation of big data solutions, Intel Corporation announced the Intel® Enterprise Edition for Lustre* software to make performance-based storage solutions easier to deploy and manage.

 

Businesses and organizations of all sizes are increasingly turning to high-performance computing (HPC) technologies to store and process big data workloads due to its performance and scalability advantages. Lustre is an open source parallel distributed file system and key storage technology that ties together data and enables extremely fast access. Lustre has become the popular choice for storage in HPC environments for its ability to support tens of thousands of client systems and tens of petabytes of storage with access speeds well over 1 terabyte per second. That is the equivalent to downloading all "Star Wars"* and all "Star Trek"* movies and television shows in Blu-Ray* format in one-quarter of a second.

 

"Enterprise users are looking for cost-effective and scalable tools to efficiently manage and quickly access large volumes of data to turn valuable information into actionable insight," said Boyd Davis, vice president and general manager of Intel's Datacenter Software Division. "The addition of the Intel Enterprise Edition for Lustre to our big data software portfolio will help make it easier and more affordable for businesses to move, store and process data quickly and efficiently."

 

The Intel Enterprise Edition for Lustre software is a validated and supported distribution of Lustre featuring management tools as well as a new adaptor for the Intel® Distribution for Apache Hadoop*. This new offering provides enterprise-class reliability and performance to take full advantage of storage environments with worldwide service, support, training and development provided experienced Lustre engineers at Intel.

 

The Intel® Manager for Lustre provides a consistent view of what is happening inside the storage system regardless of where the data is stored or what type of hardware is used. This tool enables IT administrators to easily manage tasks and reporting, provides real-time system monitoring as well as the ability to quickly troubleshoot. IT departments are also able to streamline management, shorten the learning curve and lower operational expenses resulting in time and resource savings, better risk mitigation and improved business decision-making.

 

When paired with the Intel® Distribution for Apache Hadoop, the Intel Enterprise Edition for Lustre software allows Hadoop to be run on top of Lustre, significantly improving speed in which data can be accessed and analyzed. This allows users to access data files directly from the global file system at faster rates and speeds up analytics time, providing more productive use of storage assets as well as simpler storage management.

 

As part of the company's commitment to drive innovation and enable the open source community, Intel will contribute development and support as well as community releases to the development of Lustre. With veteran Lustre engineers and developers working at Intel contributing to the code, Lustre will continue its growth in both high-performance computing and commercial environments and is poised to enter new enterprise markets including financial services, data analytics, pharmaceuticals, and oil and gas.

 

The Intel Enterprise Edition for Lustre will be available in early in the third quarter of this year.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

To meet the growing storage needs of the data center and cloud computing, Intel today announced the latest addition to its data center family of solid-state drives (SSD) at the Cloud Computing Expo in New York, the Intel® SSD DC S3500 Series. The DC S3500 Series is ideal for read-intensive applications such as Web hosting, cloud computing and data center virtualization. Data centers can save significant costs by replacing traditional hard disk drives (HDD) and moving toward an all-SSD storage model. Additional information about the Intel SSD DC S3500 Series is available here. Tune in Wednesday, June 12, 9 AM ET, for a livecast of Intel corporate VP Rob Crooke’s Cloud Computing Expo keynote address about the state of storage in cloud computing and data centers.

NEWS HIGHLIGHTS

  • Intel® Solid-State Drive Data Center S3500 Series delivers next-generation performance to meet the growing storage needs of cloud computing.
  • Deployment of Intel® SSDs in data centers increases multicore CPU utilization, reduces rack space, lowers power consumption and improves total cost of ownership.
  • Based on Intel's industry-leading 20nm NAND flash memory, the new SSD offers fast, consistent performance and stress-free protection in a cost- and power-efficient design.

 

 

Intel_SSD_S3500.jpg

Intel® Solid-State Drive Data Center S3500 Series

CLOUD COMPUTING EXPO, New York, June 11, 2013 -- Intel Corporation today announced the Intel® Solid-State Drive DC S3500 Series, its latest solid-state drive (SSD) for data centers and cloud computing. Designed for read-intensive applications such as Web hosting, cloud computing and data center virtualization, the Intel DC S3500 Series is an ideal replacement for traditional hard disk drives (HDD), allowing data centers to save significant costs by moving toward an all-SSD storage model.

 

Intel SSDs, including the Intel SSD DC S3500 Series, enable transformational improvements in cloud infrastructure, fostering new and enriching Web experiences. End customers experience quicker Web page loads and improved response times as a result of dramatically improved data access times and reduced latency. IT managers and cloud developers are rewarded with improved total cost of ownership as a result of reduced power consumption, more consistent performance and smaller space requirements. More than half of U.S. businesses now employ cloud computing applications, and IDC predicts that worldwide spending on cloud services will reach $44.2 billion this year1. Data centers powering these cloud applications need to quickly, efficiently and reliably scale to handle the tremendous growth of connected users and data traffic.

 

"The Intel SSD DC S3500 Series breaks through barriers – like the need for high throughput/low latency storage with a low total cost of ownership – to deliver the storage solution that meets the needs of the cloud, and its demand for storage, which has exploded in recent years," said Rob Crooke, Intel corporate vice president and general manager for the Non-Volatile Memory Solutions Group. "Intel's data center family of SSDs helps make cloud computing faster and more reliable, enabling more transactions and richer experiences."

 

In cloud computing and data center environments, fast and consistent performance, reduced power consumption, high multicore CPU utilization and stress-free data protection are important requirements. The Intel SSD DC S3500 Series offers enterprise IT and data center managers storage options that deliver increased IO performance, reliability and a lower total cost of ownership over traditional HDDs, ideal for cloud applications.

 

"Intel SSDs have enabled our chip designers to gain up to 27 percent performance throughput in our massive design distributed computing environment," said Kim Stevenson, chief information officer at Intel. "In fact, we are increasing our deployment of Intel SSDs in our data centers from 10,000 units to 40,000 by the end of this year to enable our global design team to help bring products to market faster."

 

By combining 20nm Intel® NAND Flash Memory technology with SATA 6 Gb/s interface support, the Intel SSD DC S3500 Series delivers sequential read speeds of up to 500 MB/s and sequential write speeds of up to 450 MB/s and a tight distribution of input/outputs per second with low maximum latencies. Random read performance can go up to 75,000 input-output operations per second.

 

The Intel SSD DC S3500 Series also includes data protection features to address IT and data center professional's concerns of data loss. Built-in capacitors provide a short period of backup power to the drive allowing it to finish operations in the event of power loss. The drives also use 256-bit AES encryption for data protection.

 

The new SSDs will be offered in capacities ranging from 80 gigabyte (GB) to 800GB and both 2.5 and 1.8 inch form factors. Available through Intel distributors and resellers, the Intel DC S3500 Series is offered at the suggested channel price of $115 for a 1.8-inch 80GB drive and $979 for a 2.5-inch 800GB drive. It is also accompanied by a 5-year warranty.

 

The new DC S3550 Series, as well as a previously released data center family (Intel SSD DC S3700 Series and 910 Series), are being showcased in Intel's booth (#519) at the Cloud Computing Expo. The event runs from June 10-13 at Jacob K. Javits Center in New York.

 

More information on Intel SSDs can be found at www.intel.com/go/ssd or by accessing the multimedia press kit at www.intel.com/newsroom/ssd. Follow Intel SSDs on Twitter: @intelssd, or communities.intel.com.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 "Neovise Report, Public, Private and Hybrid Clouds – When, Why and How They are Really Used."

Some of Intel’s top technologists are presenting details of technologies that enable 4th Generation Intel® Core™ processor technology to achieve dramatically improved graphics performance and how the company is improving energy efficiency of its products. The presentations are part of the 2013 IEEE Symposia on VLSI Technology and Circuits, June 11 to 14. Four of the eight Intel papers are highlighted by event organizers. Get details of the Intel papers.

Announced in 2012, Intel Puma 6 Now Shipping in Volume to Major Service Providers

 

NEWS HIGHLIGHTS

  • Intel® Puma™ 6 silicon powering Comcast's newest wireless gateway.
  • Fast gateway enables new TV experiences on all customer-owned and managed devices in the home.

 

 

THE CABLE SHOW, Washington, D.C., June 10, 2013 – Intel Corporation today announced that Intel® Puma™ 6 is the silicon powering Comcast's recently announced XFINITY Wireless Gateway. The Cisco-made XB3 device is a blazing-fast next-generation DOCSIS 3.0 wireless gateway that delivers data, voice, MoCA 2.0 wireline networking and dual-band wireless coverage in the home to power PCs, game consoles, tablets, smartphones and other customer owned Internet-connected devices. The Wireless Gateway (XB3) from XFINITY Internet is capable of up to 16 bonded downstream channels supporting speeds up to 640 Mbps.

 

Intel Puma 6 is the first DOCSIS silicon to reach up 1 Gbps downstream by bonding up to 24 DOCSIS channels and up to 240 Mbps upstream by bonding up to 8 DOCSIS return channels. Intel Puma 6 incorporates a powerful Intel® Atom™ core that can be used to support multiple services in the home including home automation, security, and energy management. Intel's hardware-based virtualization technology allows service providers to deploy a single gateway to support multiple services in a secure and stable environment, eliminating the need and cost of multiple, dedicated devices.

 

"Comcast and Cisco's selection of Puma 6 as the silicon powering this new generation of powerful wireless gateways illustrates the value of Intel to service providers," said Alan Crouch, Intel vice president and general manager, PCCG Service Provider Division. "The integration of these fast gateways and powerful new Intel-based Ultrabook™ and all-in-one PCs bridge the client and cloud to deliver exciting TV and broadband entertainment experiences to consumers."

 

Joe Chow, vice president and general manager of Cisco's Connected Devices Business Unit, said, "Cisco and Intel have a long-standing relationship as Intel is one of several strategic suppliers of silicon to Cisco. We look forward to the opportunities our combined technology offers, as we expand our collaboration to include CPE like the XB3 wireless gateway for Comcast."

 

MoCA-enabled wireless gateways will enable service providers such as Comcast to extend their video delivery into consumer devices over Wi-Fi. The combination of Comcast's X1set-top boxes, launched last year based on an Intel chipset, and the wireless gateway allows Comcast to stream live and On Demand content wirelessly to Intel-based devices in the home, all without the need of additional set-top boxes. That capability was previously only available on MoCA-connected set-top boxes. The same new graphically enhanced, cloud-based guide and user interface that you see on your TV will be available on subscribers' Ultrabooks and all-in-one PCs.

 

"Intel continues to be a great partner as we work to develop a platform that supports an in-home gateway and client architecture," said Steve Reynolds, senior vice president of Customer Premise Equipment for Comcast. "Intel's powerful silicon platforms have enabled us to quickly develop a flexible platform for the delivery of our cable video services that will give customers the ability to view them on a wide range of consumer devices in the home."

 

The Intel Puma family system architecture provides OEMs with flexibility to easily customize their products to fit a wide range of MSO-required and optional features such as high data rates, wireless communications, power down modes and telephone support. Intel was the first to deploy DOCSIS 3.0 technology with Intel® Puma™ 5, and over 40 million DOCSIS 3.0 systems have shipped.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Intel Puma, Intel Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

At the World Economic Forum (June 5-7,2013) taking place in Myanmar, Intel Capital announced three investments in e-commerce firms seeking to scale up and extend their businesses in Asia. The investments, totaling approximately US$16 million, are: India's Bright Lifecare, a premier distributor of nutrition, health and wellness products; Snapdeal.com, a leading consumer goods marketplace in India; and existing portfolio company Singapore's Reebonz.com, one of Asia's largest private luxury goods retailers. Please follow this link to learn more.

Today is World Environment Day, and Intel is celebrating by spreading the word about the company’s We Recycle program. We Recycle was launched earlier this year and aims to engage Intel employees in recycling 90 percent of the company’s solid waste – about 8,200 tons. Participating Intel sites now feature centralized areas for recycling to  better manage food waste, and Intel cafeterias now have reusable dishware to reduce waste from disposable utensils. Check out this blog post to learn more.

Available in new 4th generation Intel® Core™ processors, Intel® Iris™ Pro graphics 5200 and Intel® Iris™ graphics 5100 give consumers a better gaming experience with more stunning performance than ever before. One notable app that takes advantage of these new graphics to deliver a visually stunning racing experience is Codemasters GRID 2. In addition to great graphics, Ultrabook™ device users can enhance their experiences with touch, sensor and gesture input. Young racing fans will enjoy SEGA Sonic All Stars Racing with its touch and sensor controls. Aspiring composers can use Cakewalk Sonar’s multi-touch UI to make a musical masterpiece, while Magix Movie Edit Touch or Cyberlink Power Director let users express their video creativity. Inquiring minds can explore the night sky using Star Chart’s touch and sensor capabilities, and youngsters can use gestures to explore an animated virtual world with Compedia’s Pandu Park.

Intel Capital today announced an investment in Thalmic Labs, makers of MYO, an armband with the ability to control gadgets with simple hand gestures. Since announcing MYO, Thalmic Labs has seen rapid traction and global enthusiasm, receiving over 30,000 pre-orders across 138 countries in less than three months. The funding will help Thalmic Labs with product development and market expansion. As part of the investment from Intel Capital, Thalmic Labs will gain access to Intel’s manufacturing and technology expertise to help the company scale production and enhance next generation products. View the press release for more information.

Intel today announced it is the technology sponsor for polar explorer Ben Saunders’ attempt to replicate the Terra Nova expedition – a return trip from the coast of Antarctica to the South Pole that British Royal Navy Captain Robert Falcon Scott attempted in 1912 and that no person has completed since. Saunders will be equipped with a 4th Generation Intel® Core™ processor powered Sony VAIO* Pro Ultrabook™, which at just over 1.9 pounds is the lightest Ultrabook yet. This makes Saunders one of the first people to use the latest Intel® Core™ technology. He will connect to the Internet using an Intel NUC (Next Unit of Computing) device. The NUC will have a 24/7 data connection via satellite phone to a server in London and both it and the Ultrabook device will charge via solar panels attached to a specially designed sled. Saunders will be able to upload video, photos, data and blog content with minimal delay, enabling him to share his journey, as it happens, with the world.

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