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Join Luke Skywalker, Princess Leia and the whole rebel gang with Intel AppUp® center's Angry Birds Star Wars. Help your favorite feathery heroes defend the galaxy from Stormtroopers and Tusken Raider pigs with their unique and familiar capabilities. Take a trip with Han Solo, C-3PO and R2-D2 as they explore notable hotspots, including Mos Eisley, Hoth and the evil Pig Star. Even fight off Darth Vader, Dark Lord of the Pigs and become a Jedi Master! For a limited time only, download the app for $.99. May the 'birds' be with you...

As an extension of its sponsorship with Discovery Channel’s "Curiosity" series, Intel has created "Tangled Curiosity," a universal iOS puzzle game that integrates live streaming social data from players’ personal feeds and others. One of the first iOS games to use live data feeds as part of the play experience, Tangled Curiosity incorporates graphics, progressive touch mechanics and an innovative use of the social graph. Designed to be fun and visually stimulating, Tangled Curiosity challenges players to solve mind- and finger-bending puzzles while uncovering content from Intel iQ, Curiosity and affiliated social networks. As puzzles are solved, players unlock facts about science and technology, and can share their data trees and game progress with friends and followers. Tangled Curiosity is compatible with iPhone, iPod Touch and iPad, and requires iOS 6.0. Tangled Curiosity can be downloaded for free on iTunes. Review the Tangled Curiosity demo video on YouTube.

Combination of Intel® Xeon® Processors and Intel® Xeon Phi™ Coprocessors Promises to Drive High Performance Computing Innovation

 

NEWS HIGHLIGHTS

  • Intel® Xeon Phi™ coprocessors, when combined with the Intel® Xeon® processor E5 family, will deliver unprecedented parallel performance, increasing the productivity and efficiency of high- performance computing.
  • Efficient performance and a familiar programming model foster a thriving development community and extensive industry support from key OEMs, making high-performance computing easier to access for content creators, developers and scientists.
  • Optimizing applications with tools such as Intel Cluster Studio XE 2013 helps achieve industry's best performance per watt for high degrees of parallelism on Intel Xeon Phi coprocessors as well asa significant increase in productivity on Intel Xeon processors E5 product family.
  • Ninety-one percent of all newly listed systems on the recently announced Top500 list of the world's most powerful supercomputers are powered by Intel processors. Intel Xeon Phi coprocessors are already featured in 7 systems including the most power-efficient supercomputer on the list –"Beacon" delivering 2.44 GFlops/Watt.

 

 

SALT LAKE CITY, Utah, Nov. 12, 2012 – Marking a new era in high-performance computing, Intel Corporation introduced the Intel® Xeon Phi™ coprocessor, a culmination of years of research and collaboration, to bring unprecedented performance for innovative breakthroughs in manufacturing, life sciences, energy and other areas. The ability to quickly compute, simulate and make more informed decisions has propelled the growth of high performance computing (HPC) and analytics. This has been driven by global business and research priorities to more accurately predict weather patterns, create more efficient energy resources, and develop cures for diseases among many other pressing issues. With the breakthrough performance per watt and other new attributes of Intel Xeon Phi coprocessor, the industry will have even greater reliability in generating accurate answers, help proliferate high-performance computing beyond laboratories and universities and achieve maximum productivity.

 

"Intel Xeon Phi coprocessor represents an achievement in Intel innovation that will help propel us to new heights in research and discovery, and reaffirms our commitment to Exascale-level computing," said Diane Bryant, vice president and general manager of the Datacenter and Connected Systems Group. "The combination of the Intel Xeon processor family and the Intel Xeon Phi coprocessor will change the scope and scale of what highly parallel applications can accomplish, by delivering unprecedented performance, efficiency and programmability. With this technology as a new foundation for HPC, solving real-world challenges from accurately predicting weather patterns 21 days in advance, to developing new cures for diseases will become increasingly possible."

 

Based on the Intel® Many Integrated Core (Intel® MIC) architecture, Intel Xeon Phi coprocessors will complement the existing Intel® Xeon® processor E5-2600/4600 product families to deliver unprecedented performance for highly parallel applications. The Intel Xeon processor E5 family is a high-performance computing workhorse that has powered numerous Top500 systems to Petascale performance (1 quadrillion floating point operations per second). Now with Intel Xeon Phi products handling much of the "highly parallel" processing to help supercomputers produce answers for a wide range of scientific and technical disciplines such as genetic research, oil and gas exploration and climate modeling, Intel believes that this powerful combination will help blaze a path to Exascale computing, which would mark a thousand-fold increase in computational capabilities over Petascale.

 

Saving Time and Resources with World's Most Popular Programing Model

The Intel Xeon Phi coprocessor takes advantage of familiar programming languages, parallelism models, techniques and developer tools available for the Intel® architecture. This helps ensure that software companies and IT departments are equipped with greater use of parallel code without retraining developers on proprietary and hardware specific programming models associated with accelerators. Intel is providing the software tools to help scientists and engineers optimize their code to take full advantage of Intel Xeon Phi coprocessors, including Intel Parallel Studio XE and Intel Cluster Studio XE. Available today, these tools enable code optimization and, through using the same programming languages and models shared by Intel Xeon Phi coprocessors and Intel Xeon processors E5 product family, help applications benefit both from tens of Intel Xeon Phi coprocessor cores and also from more efficient use of Intel Xeon processor threads.

 

Introducing Two New Intel Xeon Phi Product Families

Built with Intel's most advanced 22-nanometer, 3-D tri-gate transistors, Intel is introducing two new Intel Xeon Phi coprocessor families that provide optimal performance and performance-per-watt for highly parallel HPC workloads.

 

The Intel Xeon Phi coprocessor 3100 family will provide great value for those seeking to run compute-bound workloads such as life science applications and financial simulations. The Intel Xeon Phi 3100 family will offer more than 1000 Gigaflops (1 TFlops) double-precision performance, support for up to 6GB memory at 240GB/sec bandwidth, and a series of reliability features including memory error correction codes (ECC). The family will operate within a 300W thermal design point (TDP) envelope.

 

The Intel Xeon Phi coprocessor 5110P provides additional performance at a lower power envelope. It reaches 1,011 Gigaflops (1.01 TFlops) double-precision performance, and supports 8GB of GDDR5 memory at a higher 320 GB/sec memory bandwidth. With 225 watts TDP, the passively cooled Intel Xeon Phi coprocessor 5110P delivers power efficiency that is ideal for dense computing environments, and is aimed at capacity-bound workloads such as digital content creation and energy research. This processor has been delivered to early customers and featured in the 40th edition of the top500 list.

 

To provide early access to new Intel Xeon Phi coprocessor technology for customers such as Texas Advanced Computing Center (TACC), Intel has additionally offered customized products: Intel Xeon Phi coprocessor SE10X and Intel Xeon Phi coprocessor SE10P.These offer 1073 GFlops double precision performance at a 300W TDP with rest of the specification similar to Intel Xeon Phi coprocessor 5110P.

 

Broad Industry and Customers Adoption for Intel Xeon Phi coprocessor

More than 50 manufacturers are designing solutions based on the Intel Xeon Phi coprocessors, including Acer*, Appro*, Asus*, Bull*, Colfax*, Cray*, Dell*, Eurotech*, Fujitsu*, Hitachi*, HP*, IBM*, Inspur*, NEC*, Quanta*, SGI*, Supermicro* and Tyan*.

 

Professor Stephen Hawking and the Cosmos Lab at the University of Cambridge have been given early access to Intel Xeon Phi coprocessor technology for use in their SGI supercomputer. "I am delighted that our new COSMOS supercomputer from SGI contains the latest many-core technology from Intel, the Intel Xeon Phi coprocessors," said Hawking. "With our powerful and flexible SGI UV2000, we can continue to focus on discovery, leading worldwide efforts to advance the understanding of our universe."

 

Majority of TOP500 Supercomputers Chose Intel as the Compute Engine

More than 75 percent (379 systems) of the supercomputers on the 40th edition of the Top500 list are powered by Intel processors. Of those systems making their first appearance on the list, Intel-powered systems account for more than 91 percent. The November edition of the list had recorded seven systems based on Intel Xeon Phi coprocessors, including initial deployment of TACC's "Stampede" system (2.66 PFlops, #7 on the list); " Discover" system at NASA Center for Climate Simulation (417 TFlops, #52); Intel "Endeavour" system (379 TFlops, #57); "MVS-10P" supercomputer at the Joint Supercomputer Center of the Russian Academy of Sciences (375 TFlops, #58) "Maia" system at NASA Ames Research Center (212 TFlops, #117); "SUSU" system at The South Ural State University (146 TFlops, #170); and the "Beacon" supercomputerat The National Institute of Computational Sciences at the University of Tennessee (110 TFlops #253) that is also the most power efficient supercomputer on the list and delivers 2.44 GFlops per watt. The complete report is available at www.top500.org.

 

Pricing and Availability

The Intel Xeon Phi coprocessor 5110P is shipping today with general availability on Jan. 28 with recommended customer price of $2,649. The Intel Xeon Phi coprocessor 3100 product family will be available during the first half of 2013 with recommended customer price below $2,000. Additional information on availability and ordering Intel Xeon Phi coprocessor 5110P can be found at www.intel.com/xeonphi

 

Intel® Xeon Phi™ coprocessor Intel® Xeon Phi™ coprocessor

Marking a new era in high-performance computing, Intel Corporation introduced the Intel® Xeon Phi™ coprocessor, a culmination of years of the research and collaboration, to bring unprecedented performance for innovative breakthroughs in manufacturing, life sciences, energy and other areas.

 

View the Multimedia Press Kit
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About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Intel Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Available today, the latest Extreme Edition Core™ i7-3970X processor and the Extreme Series Intel® Desktop Board  DX79SR codenamed “Stormville” will unleash new PC performance for enthusiasts.  This is Intel’s highest performance Extreme Edition processor with 6 Cores, Intel® Hyper-Threading technology, 15 MB cache, and 4 Channels of DDR3 memory. The Intel Desktop Board DX79SR, “Stormville” is our highest performance Extreme Series Board designed for premium features such as 8 memory DIMMs, 64GB of memory, 3 PCI*Express 3.0 x16 graphics connectors to support NVIDIA SLI* and AMD CrossfireX* configurations, and full complement of controls targeted for performance tuning and overclocking. Unlock and Unleash with Extreme Confidence. Here’s more on the board and CPU.

Intel technology powers more than 75% of the world's most powerful supercomputers as revealed on just announced 40th edition of the Top500 list. Intel® Xeon® processors and Intel® Xeon Phi™ coprocessors have also been chosen for 91% of all newly listed systems compared to previous June edition including the most power efficient system on the list - "Beacon", the supercomputer at The National Institute of Computational Sciences at the University of Tennessee. "Beacon" is delivering 2.44GFlops per watt which is the record up to date in power efficiency.

Intel Foundation Awards $100,000 for Entrepreneurial Research

 

NEWS HIGHLIGHTS:

  • Team Greenway Grameen Infra of India won the 2012 Intel Global Challenge at UC Berkeley, receiving $50,000 from the Intel Foundation.
  • Greenway Grameen Infra invented an efficient, biomass-based stove that increases fuel efficiency.
  • Other top-placing teams were Nanoly Bioscience of the United States, which developed a protective shield that eliminates the need for vaccine refrigeration; Sustainable Agriculture Solutions of Colombia, which created sustainable farming solutions such as enhanced efficiency fertilizer; and Avetics of Singapore, which invented an autonomous mini-plane that takes high-resolution photographs for aerial maps.

 

 

BERKELEY, Calif., Nov. 9, 2012 – Greenway Grameen Infra, a team of student entrepreneurs from India, has won the 8thannual Intel Global Challenge at UC Berkeley, a global business plan competition that encourages student entrepreneurs to tackle some of the world's most pressing issues and rewards innovative ideas that could make a positive impact on society.

 

The winning team of entrepreneurs created efficient, biomass-based cooking solutions. In India and elsewhere around the globe, indoor open fires and traditional mud stoves are still used for cooking by nearly 3 billion people, leading to negative impacts on the environment and economy. The team's flagship product, the Greenway Smart Stove, incorporates a unique air-flow generator that saves fuel consumption by up to 65 percent and reduces smoke output by 70 percent. Since it commercially launched in December 2011, Greenway Grameen Infra has sold more than 12,000 units. The company plans to add two new stove designs and a waste heat-to-electricity converter to its product line.

 

"This year, we saw impressive innovations in fields including healthcare, mobile app development and energy conservation," said Shelly Esque, president of the Intel Foundation and global director of Intel's Corporate Affairs Group. "These student entrepreneurs from around the world have developed first-class business plans ranging from improved reliability for cancer diagnoses to the production of inexpensive, more efficient solar cells."

 

The Intel Foundation awarded $100,000 total in cash prizes. The grand prize-winning team received $50,000, and the three best-of-category winning teams each received $15,000. In addition, two prizes of $2,500 were awarded to the winning teams of a social media challenge and an audience favorite contest. Besides cash prizes, winning teams received invaluable mentoring and feedback from Silicon Valley's leading venture capitalists.

 

Innovations from the three best-of-category winners included industries ranging from healthcare to agriculture. Nanoly Bioscience of the United States developed a protective shield that stabilizes vaccines and eliminates the need for refrigeration, allowing vaccines to be shipped virtually anywhere. Sustainable Agriculture Solutions of Colombia created sustainable farming solutions, including a fertilizer that increases efficiency by 40 percent over traditional alternatives. Avetics of Singapore invented an autonomous mini-plane with a computerized control board that takes high-resolution photographs for aerial maps.

 

The competition, held at the Haas School of Business at UC Berkeley, drew 25 teams from 16 countries. These finalist teams were selected from more than 150,000 students from more than 50 countries who competed in 14 affiliate competitions. Founded in 2005, the Intel Global Challenge at UC Berkeley is a joint project of Intel and the UC Berkeley Lester Center for Entrepreneurship. The project is designed to motivate young entrepreneurs to develop innovative technologies that solve real-world challenges, build viable business models and move that technology out of university labs and into the market.

 

Over the past decade alone, Intel has invested more than $1 billion, and its employees have donated close to 3 million hours toward improving education in more than 60 countries. To get the latest Intel education news, visit www.intel.com/newsroom/education, join the Facebook group at http://intel.ly/intel-edu and follow Twitter updates at http://twitter.com/Intelinvolved.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Today Intel announced the new Intel® Itanium® 9500 processor family delivering scalable and resilient performance to run IT’s mission-critical applications. Based on the new micro-architecture, new generation of Itanium, previously codenamed "Poulson", features twice the number of cores, provides up to 2.4 times more performance and 33 percent faster I/O speed over the previous generation. To provide a more sustainable path for Itanium development and greater design flexibility, Intel has also announced that the future generations of Itanium processors will adopt an innovative "Modular Development Model" that enables deeper commonality between Itanium and Xeon processors E7 family, from shared silicon design elements to full socket compatibility.

Intel® Puma™ 6 was selected as the Best New Product (Cable) by Light Reading's publication's staff. The Leading Light award is presented to a company that has "developed a potentially market-leading product that, through engineering and technical excellence, enables the deployment of profitable next-generation cable services." The Intel Puma family features the combination of specialized network processing capabilities including industry-leading DOCSIS (Data on Cable System Interface Specification) and an Intel® Atom™ core to target the emergence of data, voice, and video gateways deployed by service providers.

Based on New Microarchitecture, Intel® Itanium® Processor, Doubles Performance and Boosts Resiliency

 

NEWS HIGHLIGHTS

  • The Intel® Itanium® processor 9500 delivers unprecedented availability, error resiliency and performance increase over the previous generation.
  • With twice the number of cores on a new architecture, the Intel Itanium processor 9500 series will provide up to 2.4 times performance scaling1 and 33 percent faster I/O speed over the previous generation, with new capabilities such as the Intel® Instruction Replay Technology.
  • Future generations of Intel Itanium processors will adopt an innovative "Modular Development Model" that enables deeper commonality between Intel Itanium and the Intel® Xeon® processor E7 family, from shared silicon design elements to full-socket compatibility. This will provide a more sustainable path for Itanium development and greater design flexibility for Intel's partners.

 

 

SANTA CLARA, Calif., Nov. 8, 2012 – In an era of unprecedented growth in data usage, businesses require powerful computing solutions that can deliver scalable and resilient performance to run IT's mission-critical applications. The new Intel® Itanium® processor 9500 series is more than twice as powerful as the previous generation, making it ideal for today's most demanding workloads, including business analytics, database, and large-scale enterprise resource planning (ERP) applications. Systems based on Intel's Itanium processors run in more than three-quarters of the World's Global 100 companies across industries such as aerospace, energy, life sciences and telecommunications. With the Intel Itanium processor 9500 series, these industries will benefit from a leap in performance and an increase in world-class reliability, availability and serviceability (RAS) capabilities.

 

"In a world where businesses are increasingly dependent on IT for their competitive advantage, more and more business applications are rightfully called "mission critical"; they must be always available, highly responsive and extremely reliable. It's for precisely these computing workloads that we've developed the Intel Itanium 9500 processor," said Diane Bryant, vice president and general manager of Intel's Datacenter and Connected Systems Group. "Built on a new microarchitecture and providing breakthrough performance, the Intel Itanium 9500 processor family signals Intel's ongoing commitment to deliver unparalleled reliability, availability and scalability to meet the critical application demands across all industries."

 

Enterprise Performance with World-Class Availability

Containing 3.1 billion transistors, the Intel Itanium processor 9500 series is Intel's most sophisticated general purpose processors to date. It supports up to twice as many cores (8 instead of 4) than the previous-generation processor, packs up to 54 MB of on-die memory, and enables up to 2 TB of low voltage DIMMs in a four-socket configuration. The speed of the processor increased 40 percent over the previous generation in lower power configurations. The new frequencies range from 1.73 GHz and a power level of 130 watts, to 2.53 GHz at a power level of 170 watts.

 

Delivering the highest levels of Intel Itanium performance, the new processors enable highly scalable deployments with world-class availability for data-intensive applications where downtime is not an option. These include ERP, supply chain management and customer relationship management (CRM) software.

 

Modular Development Model Provides More Flexibility

In 2010, Intel introduced its common platform strategy that allows Intel Itanium and Intel® Xeon® processors to utilize common platform ingredients including chipsets, interconnects and memory. This strategy gives Intel the ability to cascade the strength of Intel Itanium RAS features to benefit the Intel Xeon processor E7 family, and allows Intel Itanium to further extract the efficiencies and value of higher volume economics. For the next-generation Intel Itanium product family, code-named "Kittson," Intel will employ an innovative model for Intel Itanium and Intel Xeon development called "Modular Development Model." The model will extend the common platform strategy by sharing silicon-level design elements and socket compatibility. The result for Intel is an even more sustainable path to bring future Itanium processors to market. In addition, OEMs will be able to develop one single motherboard platform for both architectures.

 

Industry Support

Intel Itanium processors continue to maintain strong industry support among systems makers such as Bull*, Hitachi*, HP*, Inspur* and NEC*. Enterprise applications are widely available from multiple vendors, such as, Oracle*, SAP*, SAS*, Sybase* and Temenos*, among other vendors that underscore the ISV community's efforts to ensure the success of the Intel Itanium mission-critical ecosystem.

 

"A mission-critical IT infrastructure with resiliency, scalability and high availability is critical to the success of enterprises," said Ric Lewis, vice president and interim general manager, Business Critical Systems, HP. "The addition of the Intel® Itanium® processor 9500 series to our newly enhanced HP Integrity and HP-UX portfolio provides breakthrough performance, increased productivity and delivers on HP's commitment to provide our customers with investment protection."

 

"NEC has been working with Intel more than 15 years to build enterprise servers based on Intel Itanium processors," said Kazuaki Iwamoto, vice president and senior general manager of IT hardware operations unit, NEC Corporation. "We are pleased to provide our customers with the new enterprise servers based on Intel Itanium processor 9500 series for their highly scalable and mission critical systems."

 

Pricing and Availability

The Intel Itanium processor 9500 series is available now and is priced from $1,350 to $4,650 in quantities of 1,000 units.

 

 

Intel-Itanium-Processor-9500_11.jpg  Intel-Itanium-Processor-9500_10.jpg

Containing 3.1 billion transistors, the Intel® Itanium® processor 9500 series is Intel's most sophisticated general purpose processors to date. It supports up to twice as many cores (8 instead of 4) than the previous-generation processor, packs up to 54 MB of on-die memory, and enables up to 2 TB of low voltage DIMMs in a four-socket configuration.

 

Additional Images (ZIP 12.4MB)

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

1 Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

 

Configuration: Intel labs testing comparing Intel Itanium processor 9560 vs. Intel Itanium processor 9350, resulting in 2.44x performance scaling. For more information, go to http://www.intel.com/performance.

 

2 Intel® HT Technology available on select Intel® processors. Requires an Intel® HT Technology-enabled system. Consult your system manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visit http://www.intel.com/info/hyperthreading.

 

Relative performance is calculated by assigning a baseline value of 1.0 to one benchmark result, and then dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms, and assigning them a relative performance number that correlates with the performance improvements reported.

 

Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit Intel Performance Benchmark Limitations.

Intel today announced the availability of Intel® Cluster Studio XE 2013, an integrated suite that helps application developers create faster, more scalable and reliable applications targeted to run on MPI clusters. Improvements include increased MPI scalability, reduced MPI latency, support for next-generation processors including Intel® Xeon Phi™ coprocessors, and expanded support for C++ and Fortran. Learn more at www.intel.com/software/products.

Intel® SSD DC S3700 Delivers Consistent Performance, Protection and High Endurance to Meet the Needs of HPC, Big Data, Cloud and Other Data Center Applications

 

NEWS HIGHLIGHTS

  • Intel® SSD DC S3700 Series offers next-generation storage performance to meet the needs of today's big data, HPC and cloud-computing apps.
  • Low latencies and consistent IOPS performance delivers 2x read and 15x write improvements over previous generation Intel® SSD 710 Series.
  • Offered in 100-/200-/400-/800GB capacities, new SSD delivers on all fronts: fast performance, strong data protection and high endurance.

 

 

SANTA CLARA, Calif., Nov. 5, 2012 – As big data, high-performance computing (HPC) and cloud-computing applications push the demand for real-time access of data into the zettabytes, Intel Corporation announced today its next-generation data center solid-state drive (SSD), the Intel® Solid-State Drive DC S3700 Series, designed to remove storage bottlenecks and maximize multi-core CPU performance. The Intel SSD DC S3700 Series delivers fast, consistent performance and low latencies along with strong data protection and high endurance to help IT personnel support today's most demanding data center applications.

 

"Today's data explosion creates unique storage challenges for data center professionals," said Rob Crooke, Intel vice president and general manager for the Intel Non-Volatile Memory (NVM) Solutions Group. "High latencies and slow storage I/O can cripple data centers' ability to deliver exciting big data or cloud-computing applications with fast, low latency data access. Intel's next-generation Intel SSD DC S3700 Series breaks through SSD limitations for the data center on all fronts – fast, consistent performance, strong data protection and high endurance -- so IT professionals can deliver on their most demanding technology initiatives."

 

The key to the Intel SSD DC S3700 Series superior and consistent fast performance is a tight distribution of Input/Outputs Per Second (IOPS) with low maximum latencies. The Intel SSD DC S3700 feeds I/O-starved applications with 4KB random read performance of up to 75,000 IOPS and 4KB write performance of up to 36,000 IOPS. With typical sequential write latency of 65 microseconds and high Quality of Service (QOS) of less than 500 microseconds 99.9 percent of the time, the Intel SSD DC S3700 ensures quick and consistent application response times.

 

This accelerated storage performance gives parallel multithreaded computing increased storage throughput to keep multicore CPUs more active. This reduces lapses in response time for end users for a smoother computing experience. For IT/data center professionals who must also worry about data protection and maximum security, the Intel SSD DC S3700 Series offers full end-to-end data protection and 256-bit Advanced Encryption Standard (AES) capability. To further improve reliability, the Intel SSD DC S3700 incorporates an array of surplus flash memory used for data redundancy to minimize potential data loss.

 

The drive incorporates Intel High Endurance Technology (HET) to deliver single-level cell SSD-like endurance in more cost-effective multi-level cell (MLC) technology. By combining SSD NAND management techniques with NAND silicon enhancements, HET enables the Intel SSD DC S37000 Series to achieve 10 full drive writes per day over the 5-year life of the drive. This is the equivalent of recording more than 186 years of HD video over the life of the highest capacity 800GB drive.

 

In addition, SSDs also improve overall power consumption. The Intel® SSD DC 3700 Series reduces typical active power consumption to 6 watts and idle 650 milliwatts, which reduces heat and therefore lowers both energy and cooling costs.

 

The Intel SSD DC S3700 Series is a 6 gigabit-per-second (Gbps) SATA drive with performance transfer rates of 500 megabyte per second (MB/s) reads and 460 MB/s writes. It delivers up to 2x read and 15x write performance over its previous generation Intel® SSD 710 Series. Samples of the product are now available for data center customers to begin quality and validation cycles. General production availability is expected to begin by the end of the year, with volume production in the first quarter of 2013.

 

The product comes in a 2.5-inch form factor for all capacities, 100, 200, 400 and 800 gigabytes (GB), and in a 1.8-inch form factor in 200GB and 400GB capacities. The recommended channel pricing (MSRP) for the 2.5-inch Intel SSD DC S3700 Series is as follows: $235 for 100 (GB) capacity; $470 for 200GB; $940 for 400GB and $1,880 for 800GB based on 1,000-unit quantities. The 1.8-inch drive MSRP pricing is $495 for the 200GB capacity and $965 for 400GB. Prices include a 5-year limited warranty.

 

For more information on Intel SSDs go to www.intel.com/go/ssd or follow Intel SSDs on Twitter (@intelssd), Facebook (www.intel.com/go/ssdfacebook or communities.intel.com).

 

Press Materials

 

Intel-SSD-DC-S3700_Straight.jpg

Intel® SSD DC S3700 Data Center SSD for Big Data, HPC and Cloud applications
As big data, high-performance computing (HPC) and cloud-computing applications push the demand for real-time access of data into the zettabytes, Intel Corporation announced its next-generation data center solid-state drive (SSD), the Intel® Solid-State Drive DC S3700 Series. It is designed to remove storage bottlenecks and maximize multi-core CPU performance.

Intel-SSD-DC-S3700_RightAngled.jpg

Intel® SSD DC S3700 Delivers Consistent Fast Performance
The key to the Intel® SSD DC S3700 Series superior and consistent fast performance is a tight distribution of Input/Outputs Per Second (IOPS) with low maximum latencies. The Intel SSD DC S3700 feeds I/O-starved applications with 4KB random read performance of up to 75,000 IOPS and 4KB write performance of up to 36,000 IOPS.


Intel-SSD-DC-S3700_Handshake.jpg

Intel® SSD DC S3700 Keeps Multicore CPUs More Active
With typical sequential write latency of 65 microseconds and high Quality of Service (QOS) of less than 500 microseconds 99.9 percent of the time, the Intel® SSD DC S3700 ensures quick and consistent application response times. This accelerated storage performance gives parallel multithreaded computing increased storage throughput to keep multicore CPUs more active.

Intel-SSD-DC-S3700_Handhold.jpg

Intel® SSD DC S37000 Series
The Intel® SSD DC S3700 Series delivers fast, consistent performance and low latencies along with strong data protection and high endurance to help IT personnel support today’s most demanding data center applications including big data, high-performance computing (HPC) and cloud applications.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Intel, in collaboration with Mashery, a leader in application programming interface (API) management, today announced the availability of the Intel® Expressway API Manager. Businesses are increasingly seeking ways to offer new apps and services more quickly. One of the best ways is to use legacy application services and data as APIs that are then consumable by customers, partners and developer communities. The Intel Expressway API Manager combines a cloud-based API sharing portal with on-premise gateway software to securely integrate backend infrastructure and quickly repurpose application assets for mobile consumption. To learn more, register for the webinar.

Celebrate Halloween all week long with the following apps found in the Intel AppUp® center. Become a world class juggler of bouncing pumpkins with Halloween Pumpkin Juggling. Play Vanessa Saint-Pierre Delacroix And Her Nightmare to embark on a sinister trail of puzzling mind games. Fight off the ‘Faceless Ones’ in Dark Strokes: Sins of the Fathers, as you search for clues in a deserted and haunted city. Download Panelfly Prime, a new digital comic book experience that lets you smoothly scroll from panel to panel, to read your favorite scary stories.

With the introduction of Windows 8, touch-enabled Ultrabook™ devices featuring 3rd Generation Intel® Core™ processors let users enjoy great new entertainment, creativity and productivity experiences. People can test their racing skills on real racetracks around the world with iRacing, set the direction of mankind with the newly touch-enabled Firaxis Civilization V strategy game, and explore and alter Cold War history with WarGame: European Escalation. With The Nest Family Organizer, users can manage their busy lifestyle at their fingertips. For creative types, unleash your artistic side with the popular, free and now touch-enabled Krita painting app. With the Windows 8 UI, quickly edit and share video, while seamlessly making video masterpieces in Windows 8 desktop mode using Cyberlink Director Suite.

Intel Capital portfolio company Crossing Automation announced today that it is being acquired by Brooks Automation (NASDAQ: BRKS) for $63 million. Intel Capital invested in Crossing in 2005 and provided financial support and strategic and operational planning guidance to the company, which manufactures fab and tool automation equipment for the semiconductor market, enabling Crossing to achieve significant revenue and operating income growth. The deal follows on the heels of FormFactor's (NASDAQ: FORM) $117 million acquisition of Intel Capital portfolio company MicroProbe, which provides advanced wafer test solutions to global semiconductor manufacturers.  These successful exits signal a revival of opportunities in the semiconductor investment sector where Intel Capital is well positioned to add value to these companies.

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