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Intel Newsroom

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MasterCard* is now utilizing Intel® Identity Protection Technology (Intel® IPT) to provide a convenient, fast and more confident online shopping experience for consumers that use its MasterPass* digital service. Intel® IPT is a built-in security feature of Ultrabook™ devices and other Intel® Core™ processor-based devices which offers increased protection from the risk of identity theft and online account breaches. MasterPass is currently available in the United States, Canada and Australia, with availability in additional countries expected in the second half of 2013. Get more info on Intel IPT.

Today marks the opening for 2014 Intel Science Talent Search submissions! The Intel Science Talent Search is the nation's oldest and most prestigious pre-college science competition, which attracts the brightest and most innovative young scientists in the country. Past finalists' projects have included groundbreaking algae biofuel research, a less toxic breast cancer treatment and even research around two local species of invasive crayfish. What will this year's applicants aim to uncover through their research? Learn more here.

Intel wins CIO Magazine's 2013 CIO 100 award for innovative use of technology. Intel was recognized for its security business intelligence (SBI) platform that uses big data to improve threat detection, analysis, and response capabilities. SBI is a scalable platform that performs near real-time correlation of billions of events to detect security threats faster, boosting Intel's ability to intervene quickly and reduce its risk exposure. For more check out: Fast Threat Detection with Big Data Security Business Intelligence

They are all cast members of the new social film “The Power Inside.” This is the third year that Intel and Toshiba have partnered to produce a studio-quality film, and last year’s film picked up a Daytime Emmy. Directed by Will Speck and Josh Gordon of “Blades of Glory” fame, the film stars Harvey Keitel as well as Craig Roberts and Analeigh Tipton. Global viewers can visit the Facebook* page to watch the trailer and audition to be in the film by uploading photos or videos. The first episode will be available August 15. View the press release for more information.

SANTA CLARA, Calif., July 25, 2013 -- Intel Corporation's board of directors has declared a quarterly dividend of 22.5 cents per share (90 cents per share on an annual basis) on the company's common stock. The dividend will be payable on Sept. 1, 2013, to stockholders of record on Aug. 7, 2013.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Acclaimed Directors, Hollywood Stars Collaborate on Film and Provide Social Interaction for Viewers

 

NEWS HIGHLIGHTS

  • The film trailer will launch on July 25 along with a consumer casting call; visit www.thepowerinside.com.
  • The first episode of the social film will be available on August 15 and continue online over the next six weeks.
  • The film stars actors Harvey Keitel, Craig Roberts, Analeigh Tipton, Reid Ewing and Zack Pearlman and is directed by Will Speck and Josh Gordon.

 

 

SANTA CLARA and IRVINE, Calif., July 25, 2013 – Intel® Corporation and Toshiba's Digital Products Division (DPD), a division of Toshiba America Information Systems Inc.*, today announced a creative collaboration to deliver a social film titled "The Power Inside." Directed by Will Speck and Josh Gordon ("Blades of Glory" and "The Switch"), the movie stars Harvey Keitel ("Reservoir Dogs"), Craig Roberts ("Submarine"), Analeigh Tipton ("Crazy, Stupid, Love"), Reid Ewing ("Modern Family") and Zack Pearlman ("The Inbetweeners"). "The Power Inside" is a blockbuster-class experiment in social entertainment, brought to life by leading minds in Hollywood, technology and social media. This will be the third year that Intel and Toshiba have partnered with award-winning directors to produce a Hollywood-quality film. Last year's "The Beauty Inside" film won a 2013 Daytime Emmy award for Outstanding New Approach to Daytime Programming.

 

"The way that we make films and how viewers interact with entertainment content is evolving," said Will Speck of the film's directing team Speck and Gordon. He continued, "Social films give us the opportunity to tell stories in a new way by creating an immersive, participatory experience for the audience. Co-Director Josh Gordon added, "This project was also a chance to collaborate with talent from all fields of entertainment, technology and advertising, pushing the boundaries of filmmaking. It's exciting to work in this new model and to allow viewers to participate alongside the creation of the content."

 

The film's plot follows an alien invasion by a race of extraterrestrial moustaches and unibrows who take over the upper lips and eyes of people around the world. The main character is Neil, who together with his friends and the help of technology discovers his inner strength to defeat the moustache and unibrow invaders called Uricks. Intel-inspired Ultrabook™ devices by Toshiba play an important role in Neil's journey of self-discovery.


Viewers from the around the world can visit www.thepowerinside.com  or www.Facebook.com/insidefilms to watch the trailer and audition to be in the film. To join the Urick team and potentially be featured in the film people are invited to upload a photo from their computer webcam to the Facebook Page*, and the facial recognition software will add a moustache or unibrow. Viewers can also upload videos of themselves removing a moustache to join the Guardian team. These photos and videos may be incorporated into the social film episodes. Neil's character will engage the audience through the "The Power Inside" Facebook Page. The global audience can watch the first episode online starting August 15.

 

"When we embarked on the first social film, the concept of branded entertainment was still in its infancy, yet consumers rewarded the newness and boldness with tens of millions of views and recently with a coveted Daytime Emmy," said Johan Jervoe, Intel's vice president partner marketing. "We continue to push the boundaries by partnering with acclaimed Hollywood talent and experimenting with new social tools to keep the experience fresh for our fans around the world."

 

"Toshiba's commitment to leading innovation is brought to life through the lens of the social film," said Carl Pinto, vice president marketing, Toshiba America Information Systems, Inc., Digital Products Division. "We strive to inspire consumers, foster creativity among the social film fans, and promote the new wave of computing among these communities."

 

Follow "The Power Inside" at www.thepowerinside.com. For more information on Intel-inspired Ultrabook devices, visit: http://www.intel.com/content/www/us/en/sponsors-of-tomorrow/ultrabook.html.

 

 

Directors_Speck_Gordon.jpg

Photographs of the cast, Harvey Keitel, Craig Roberts, Analeigh Tipton, Reid Ewing and Zack Pearlman, and directors Will Speck and Josh Gordon from "The Power Inside" set.

 

Press Materials

 

About Toshiba
Toshiba is a world-leading diversified manufacturer, solutions provider and marketer of advanced electronic and electrical products and systems. Toshiba Group brings innovation and imagination to a wide range of businesses: digital products, including LCD TVs, notebook PCs, retail solutions and MFPs; electronic devices, including semiconductors, storage products and materials; industrial and social infrastructure systems, including power generation systems, smart community solutions, medical systems and escalators & elevators; and home appliances. Toshiba was founded in 1875, and today operates a global network of more than 590 consolidated companies, with 206,000 employees worldwide and annual sales surpassing 5.8 trillion yen (US$61 billion). Visit Toshiba's web site at www.toshiba.co.jp/index.htm.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Ultrabook and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

Today, Intel launched a global application competition in conjunction with some of the largest developer communities worldwide. Co-sponsored by Lenovo*, the Intel App Innovation Contest (AIC) 2013 is open to application developers in 20 countries with the purpose of generating innovative Windows* 8 tablet and All-in-One desktop applications in six categories: Education, Entertainment, Finance, Games, Healthcare and Retail. Submissions will be accepted through four top developer communities: Code Project from the U.S., Habrahabr from Russia, ThinkDigit from India and CSDN from PRC. The competition begins with an idea submission phase that concludes on September 4, 2013 and 500 finalists will receive development systems and move on to the coding phase of the competition. Intel AIC 2013 winners will be announced by the end of the year.

Intel released a new version of Intel® Concurrent Collections for C++, a library that helps developers write and tune parallel software. Now with Version 0.9, computers powered by Intel® Xeon Phi™ co-processors are supported and can experience unified programming in the same seamless way that single Intel multi-core workstations and clusters of workstations have experienced with earlier versions. Additionally, its tuning layer was extended, giving developers even easier control over the execution of their application, offering greater potential for performance, scalability and productivity. Intel Concurrent Collections for C++ is available for Windows and Linux as a free download through the Intel Software Network.

Intel announced today the Intel® Solid-State Drive 530 Series, a new generation of solid-state drive (SSD) perfect for accelerating PC performance. It can easily handle intense multi-tasking needs and will blaze through the most demanding consumer client applications on a wide array of consumer platforms including Ultrabook™ devices, traditional desktops and laptops, as well as the latest tablets and small form factor desktops. The power efficient high-performance 530 Series offers users incredible read and write speeds, built in data protection and very low power usage for longer battery life. To meet a variety of PC applications the 530 Series is available in three form factors – M.2, mSATA and 2.5” – and in 80GB-480GB capacities. Get more information.

Less than a year after announcing its intention to deliver Intel Core processors operating at less than 10 watts and two months after delivering 4th generation Core processors operating at 6 watts scenario design power (SDP), Intel has confirmed a new 4th generation Core processor will be available operating at as low as 4.5 watts SDP, in addition to the 6 watt versions. These chips, to be available in the second half of 2013, will allow device manufacturers to produce the first fanless 2-in-1 and tablet designs based on the Core processor.

Intel is at Siggraph 2013 with a wide range of announcements about the latest high-fidelity visualization software advancements, including open source projects led by Intel. Highlights include the newest in high-fidelity ray-tracing from the upcoming 2.0 release of the Embree open source project. In UX design taking a cue from game development, the Rig project creates an advanced 3D UI tool for visual designers, harnessing more GPU capabilities, providing realistic device feedback, and more dynamic visuals. Come see the first demonstration of Autodesk* Opticore Professional Studio* on Intel® Xeon Phi™  co-processors. Technical sessions, paper presentations and demos on these and many other topics with schedules and locations are available here. Find Intel at booth #201.

Intel announced today that it acquired Xtremeinsights,Inc. to help drive adoption of the Intel Distribution for Apache Hadoop. The privately held big data analytics consulting company is focused on Hadoop deployments for advanced analytics and machine learning. The team, based in Schaumberg, Ill., joined Intel’s Datacenter Software Division led by vice president and general manager, Boyd Davis.

Is Intel interested in the future of graphics? At this week’s SIGGRAPH, almost a third of all presented papers are authored by researchers funded either partially or fully by the Intel Visual Computing Institute and the Intel Science and Technology Center for Visual Computing. This is up from 25 percent last year. More information can be found here and clicking on the “papers” tab. Stay tuned for more Chip Shots on Intel at SIGGRAPH 2013.

Intel today outlined its strategy to re-architect the datacenter infrastructure to enable companies and end-users to benefit from an increasingly services-oriented, mobile world. The company announced additional details about its next-generation Intel® Atom™ processor C2000 product family (codenamed “Avoton” and “Rangeley”), as well as disclosed its roadmap of next-generation 14nm products for 2014 and beyond. In a step towards reaching its Rack Scale Architecture vision, Intel also announced the first commercial rack scale implementation with Rackspace* Hosting. This robust pipeline of current and future products and technologies will allow Intel to expand into new segments of the datacenter that look to transition from proprietary designs to more open, standards-based compute models. More information is available in the press kit.

New Era of Services-Oriented Datacenters Gives Opportunities for Expansion

 

NEWS HIGHLIGHTS

  • Reveals new details of the forthcoming 22nm Intel® Atom™ processors C2000 product family, enabling the company to target a larger portion of the datacenter market.
  • Unveils future roadmap of 14nm datacenter products including a system-on-chip (SoC) that for the first time will incorporate Intel's next-generation Broadwell architecture to address an even broader range of workloads.
  • Rackspace Hosting* announces that it will deploy a new generation of rack designs as part of its hybrid cloud solutions aligned with Intel's Rack Scale Architecture vision.

 

 

SAN FRANCISCO, Calif., July 22, 2013 – As the massive growth of information technology services places increasing demand on the datacenter, Intel Corporation today outlined its strategy to re-architect the underlying infrastructure, allowing companies and end-users to benefit from an increasingly services-oriented, mobile world.

 

The company also announced additional details about its next-generation Intel® Atom™ processor C2000 product family (codenamed "Avoton" and "Rangeley"), as well as outlined its roadmap of next-generation 14nm products for 2014 and beyond. This robust pipeline of current and future products and technologies will allow Intel to expand into new segments of the datacenter that look to transition from proprietary designs to more open, standards-based compute models.

 

"Datacenters are entering a new era of rapid service delivery," said Diane Bryant, senior vice president and general manager of the Datacenter and Connected Systems Group at Intel. "Across network, storage and servers we continue to see significant opportunities for growth. In many cases, it requires a new approach to deliver the scale and efficiency required, and today we are unveiling the near and long-term actions to enable this transformation."

 

As more mobile devices connect to the Internet, cloud-based software and applications get smarter by learning from the billions of people and machines using it, thus resulting in a new era of context-rich experiences and services. It also results in a massive amount of network connections and a continuous stream of real-time, unstructured data. New challenges for networks, computing and storage are emerging as the growing volume of data is transported, collected, aggregated and analyzed in datacenters. As a result, datacenters must be more agile and service-driven than ever before, and easier to manage and operate.

 

The role of information technology has evolved from being a way to reduce costs and increase corporate productivity to becoming the means to deliver new services to businesses and consumers. For example, Disney* recently started providing visitors with wirelessly connected-wristbands to enhance customers' in-park experience through real-time data analytics. Additionally, a smart traffic safety program from Bocom* in China seeks to identify traffic patterns in a city of ten million people and intelligently offers better routing options for vehicles on the road.

 

'Re-Architecting' Network, Storage and Servers
To help companies prepare for the next generation of datacenters, Intel revealed its plans to virtualize the network, enable smart storage solutions and invest in innovative rack optimized architectures.

 

Bryant highlighted Intel's Rack Scale Architecture (RSA), an advanced design that promises to dramatically increase the utilization and flexibility of the datacenter to deliver new services. Rackspace Hosting*, an open cloud company, today announced the deployment of new server racks that is a step toward reaching Intel's RSA vision, powered by Intel® Xeon® processors and Intel Ethernet controllers with storage accelerated by Intel Solid State Drives. The Rackspace design is the first commercial rack scale implementation.

 

The networking industry is on the verge of a transition similar to what the server segment experienced years ago. Equipping the network with open, general purpose processing capabilities provides a way to maximize network bandwidth, significantly reduce cost and provide the flexibility to offer new services. For example, with a virtualized software defined network, the time to provision a new service can be reduced to just minutes from two to three weeks with traditional networks. Intel introduced Open Network Platform reference designs to help OEMs build and deploy this new generation of networks.

 

Data growth is a challenge to all datacenters and transferring this large volume of data for processing within a traditional, rigid storage architecture is costly and time consuming. By implementing intelligent storage technologies and tools, Intel is helping to reduce the amount of data that needs to be stored, and is improving how data is used for new services.

 

Traditional servers are also evolving. To meet the diverse needs of datacenter operators who deploy everything from compute intensive database applications to consumer facing Web services that benefit from smaller, more energy-efficient processing, Intel outlined its plan to optimize workloads, including customized CPU and SoC configurations.

 

As part of its strategy, Intel revealed new details for the forthcoming Intel® Atom™ processors C2000 product family aimed for low-energy, high-density microservers and storage (codenamed "Avoton"), and network devices (codenamed "Rangeley"). This second generation of Intel's 64-bit SoCs is expected to become available later this year and will be based on the company's 22nm process technology and the innovative Silvermont microarchitecture. It will feature up to eight cores with integrated Ethernet and support for up to 64GB of memory.

 

The new products are expected to deliver up to four times1,3 the energy efficiency and up to seven times1,2 more performance than the first generation Intel Atom processor-based server SoCs introduced in December last year. Intel has been sampling the new Intel Atom processor server product family to customers since April and has already more than doubled the number of system designs compared to the previous generation.

 

Roadmap for Expansion
The move to services-oriented datacenters presents considerable opportunities for Intel to expand into new segments. To help bolster the underlying technologies that power much of the next generation of datacenters, Intel outlined its roadmap of next-generation products based on its forthcoming 14nm process technology scheduled for 2014 and beyond. These products are aimed at microservers, storage and network devices and will offer an even broader set of low-power, high-density solutions for their Web-scale applications and services.

 

The future products include the next generation of Intel Xeon processors E3 family (codenamed "Broadwell") built for processor and graphic-centric workloads such as online gaming and media transcoding. It also includes the next generation of Intel Atom processor SoCs (codenamed "Denverton") that will enable even higher density deployments for datacenter operators. Intel also disclosed an addition to its future roadmap – a new SoC designed from the ground up for the datacenter based on Intel's next-generation Broadwell microarchitecture that follows today's industry leading Haswell microarchitecture. This SoC will offer higher levels of performance in high density, extreme energy efficient systems that datacenter operators will expect in this increasingly services-oriented, mobile world.

 

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel, Atom, Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

 

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.  Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions.  Any change to any of those factors may cause the results to vary.  You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
For more information go to www.intel.com/performance.

 

1 vs Intel® Atom™ S2100. Intel Atom C2000 pre-production silicon measurements. Intel internal measurements as of July 2013.

 

2 Dynamic Web Benchmark: Atom S1260 (8GB,SSD,1GbE), Estimated Score=1522.  Atom C2xxx (32GB, SSD,10GbE), Estimated Score=11109. Atom S1260:  DBC SDP w/Intel® Atom™ S1260 (2.0GHz, 2C), Hyper-Threading Enabled, 1x8GB DDR3-1333 MHz UDIMM ECC, BIOS version D134.4, Fedora* 17, Linux Kernel 3.3.4-5fc.x86_64, Apache 2.2.22, PHP 5.4.7, Boot Drive 1x 150GB SSD, Addl Drive 2x 150GB SSD, 2xGbE, Score: 1522
Atom C2xxx:  MPK SDP w/Intel® Atom™ C2xxx (8C), Turbo Disabled, 4x8GB DDR3-1600 MHz UDIMM ECC, BIOS version 18D05, Fedora* 17, Linux Kernel 3.3.4-5fc.x86_64, Apache 2.2.22, PHP 5.4.7, Boot Drive 1x150GB SSD, Addl Drive 1x 800GB SSD, 1x10GbE, Score: 11109

 

3 Results are estimated by Intel using the SPEC benchmark software cited and are provided for informational purposes only.  Any difference in system hardware or software design or configuration may affect actual performance.
Atom™ S1260:  FOR.INTEL.cpu2006.1.2.ic13.1.linux64.01june2013, Supermicro* 5017A-EF with one Intel® S1260 processor (2-core 2.0GHz), EIST Enabled, Hyper-Threading Enabled, 8GB memory (1x 8GB DDR3-1333 UDIMM ECC), 250GB SATA 7200RPM HDD, Red Hat Enterprise Linux 6.4 .  Score: Estimated SPECint*int_rate_base2006=18.7. Est. Node Power=20W
Atom™ C2xxx: FOR.INTEL.cpu2006.1.2.ic13.1.linux64.01june2013, Intel® Mohon Peak Alpha platform with one Intel® Avoton processor (8-core), Turbo Boost Disabled, 16GB memory (2x 8GB DDR3-1600 UDIMM ECC), 250GB SATA 7200RPM HDD, Red Hat Enterprise Linux 6.4.  Score: Estimated SPECint_rate_base2006=69, Est. Node Power=19W

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