MediaTek and Intel have reached a milestone in the development and certification of 5G T700 modem solutions for next-generation PC experiences. As announced by MediaTek today, the project is on schedule and the team has conducted 5G calls with the chipset. Intel is also well under way developing platform optimizations for best-in-class 5G PC user experiences that include validation and system integration, and readying co-engineering support for further enablement of its OEM partners.
“A successful partnership is measured by execution, and we’re excited to see the rapid progress we are making with MediaTek on our 5G modem solution with customer sampling starting later this quarter. Building on Intel’s 4G/LTE leadership in PCs, 5G is poised to further transform the way we connect, compute and communicate. Intel is committed to enhancing those capabilities on the world’s best PCs,” said Chris Walker, corporate vice president and general manager of Mobile Client Platforms at Intel.
“Our partnership with Intel is a natural extension of our growing 5G mobile business and is an incredible market opportunity for MediaTek to move into the PC market,” said MediaTek President Joe Chen. “With Intel’s deep expertise in the PC space and our groundbreaking 5G modem technology, we will redefine the laptop experience and bring consumers the best 5G experiences.”
As previously announced, the two companies are working with Fibocom on the development of M.2 modules optimized for Intel client platforms. Fibocom will provide operator certification and regulatory support, as well as lead 5G M.2 module manufacturing, sales and distribution. The first PC products are expected to be available in early 2021.