Ruth A. Brain

Intel Fellow, Technology and Manufacturing Group
Director, Interconnect Technology and Integration

Ruth A. Brain is an Intel Fellow in the Technology and Manufacturing Group and the director of interconnect technology and integration at Intel Corporation. She leads the integration group responsible for defining key interconnect features of 7-nanometer (7nm) process technology, the high-performance Intel logic technology currently in research. Among her recent accomplishments, Brain delivered Intel’s 32nm device technology to production, a milestone that introduced self-aligned vias to high-volume manufacturing. She also led the team that developed Intel’s pioneering 22nm DRAM process.

A 20-year veteran of Intel logic technology development, Brain joined the company in 1995 as a thin-film engineer working on quarter-micron (0.25µm) process technology. She transitioned to process integration at the advent of the changeover from aluminum to copper interconnects for Intel’s 130nm process technology. In 2001, Brain began leading the interconnect process integration team for Intel’s 65nm technology development. Starting in 2005, she led the interconnect integration team for Intel’s 32nm technology development. Under her leadership, the group developed the self-aligned-via process that has become the industry norm for tight-pitch interconnects. Before assuming her current role in 2012, Brain spent two years as the process and project manager for 22nm embedded DRAM (e-DRAM). This work included enabling key new technology features to achieve a novel e-DRAM implementation with storage embedded in the interconnect system.

Brain holds a bachelor’s degree in physics and mathematics from Iowa State University and earned her master’s degree and Ph.D. in physics from the California Institute of Technology.

She has been issued more than 10 U.S. patents in the area of interconnect processes and integration, with additional patents pending, and has authored or co-authored more than a dozen papers in her field of expertise. She serves as the 2015-16 North American program chair for the International Interconnect Technology Conference. Brain was appointed an Intel Fellow in 2016.