Today at the Supercomputing Conference in Denver, Intel discussed form factors and memory configuration details of the next generation Intel® Xeon Phi™ processor (code named “Knights Landing”). The new revolutionary design will be based on the leading edge 14nm manufacturing technology and will be available as a host CPU with high-bandwidth memory on a processor package. This first-of-a-kind, highly integrated, many-core CPU will be more easily programmable for developers and improve performance by removing “off-loading” to PCIe devices, and increase cost effectiveness by reducing the number of components compared to current solutions. The company has also announced collaboration with the HPC community designed to deliver customized products to meet the diverse needs of customers, and introduced new Intel® HPC Distribution for Apache Hadoop* and Intel® Cloud Edition for Lustre* software tools to bring the benefits of Big Data analytics and HPC together. View the tech briefing.