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Intel Education and Intel Capital today announced the first eight member companies for the Intel Education Accelerator, a four-month program to help ed-tech startups transform education for student success. Beating out nearly 200 other global applicants, the selected startups will receive guidance from experts in tech, business and education; secure investments of up to $100,000 each from Intel Capital; and leverage Intel's global relationships with educators and governments in more than 100 countries. Check out the full list and descriptions of the eight startups for more information.

Intel Capital to Invest up to $100,000 Each in Eight Innovative Companies

 

SANTA CLARA, Calif., Aug. 3, 2015 – A company that can turn a park bench into a piano. A Copenhagen startup that lets children as young as age 3 create and share their own e-books. A woman-founded partnership that teaches teen girls to code through a social medium they love. These are just three of the first cohort of startups selected to take part in the Intel Education Accelerator.

 

Intel Capital, Intel Corporation's global investment organization, and Intel Education in April announced the formation of the accelerator, a specialized program to help ed-tech startups transform education for student success. After beating out nearly 200 other applicants – half of them from overseas – the selected startups on Monday will begin a rigorous and enriching four-month program that will provide them with working capital, veteran mentorship and dedicated workspace in the heart of Silicon Valley.

 

"We had a really strong global response during the application process, and we are extremely happy with the eight diverse companies that will be a part of our inaugural cohort," said Intel Vice President John Galvin, general manager of Intel Education. "These companies are eager to grow and make an impact on education, just as Intel has been committed to throughout our history. Together with our 50 mentors, we can't wait to work with these impressive startups."

 

The Intel Education Accelerator lets selected companies receive guidance from technology, business and education experts; secure investments of up to $100,000 each from Intel Capital; and leverage Intel's global relationships with educators and governments in more than 100 countries.

 

Participants in the accelerator – housed at GSVlabs of Redwood City, California – will receive access to weekly classes, coaching and opportunities to pilot their products in schools. Judges and mentors for the program include Tom Kalinske, former CEO of LeapFrog*, Sega* and Mattel*; Intel Capital President Arvind Sodhani; veteran Silicon Valley journalist and entrepreneur John Battelle; Ronald Chandler, former chief information officer for the Los Angeles Unified School District; Genevieve Bell, vice president of Intel Labs; and high-ranking officials from AT&T*, Coursera*, Goldman Sachs*, the International Society for Technology in Education* (ISTE), Silicon Valley Bank*, VICE Media* and the Walt Disney Co.*

 

The four-month program culminates in a Dec. 2 "pitch day" for the program's entrepreneurs in front of prospective funders.

 

The accelerator is open to both K-12 and higher-ed startups, with special consideration for companies focused on data analytics and adaptive learning. Members of the inaugural cohort are:

 

  • BeeLine* (Woodside, California), whose digital reading tools help students learn to read faster and help those with dyslexia and other learning differences read more fluently.
  • Echelon Creative* (New York City), which replaces normal words in text messages with advanced synonyms, teaching a user new vocabulary words in context.
  • GotIt!* (Menlo Park, California), an on-demand knowledge platform that lets students post photos of schoolwork problems and instantly connect with a study expert who can provide detailed explanations. The parallel ranking, bidding and matching engine was founded by Vietnam native Hung Tran, who previously led an international effort to build an open courseware program for millions of college students in his homeland.
  • Griti* (San Francisco), which produces fast, on-demand video help that supports college students using on-campus peer networks of subject experts.
  • Myriad Sensors* (Mountain View, California), maker of a wireless sensor called PocketLab* that connects to a smartphone, tablet or Chromebook and instantly streams measurement data similar to that of expensive lab equipment. PocketLab helps educators and students bring science, technology, engineering and math to real-world settings.
  • ToneTree* (Troy, New York), which combines a small hardware unit with intelligent software to transform nearly any surface into an interactive musical instrument for innovative audio/visual education.
  • Vidcode* (New York City), founded by software developers and educators Alexandra Diracles and Melissa Halfon to teach computer programming to teen girls by enabling them to upload their mobile videos to Instagram* and customize them with code.
  • WriteReader* (Copenhagen, Denmark), a literacy-based learning platform for children to create and share their own storybooks and improve their reading and writing skills through big data and adaptive learning.

 

Over the past decade, Intel Education has helped more than 300 million students and 15 million teachers in 100 countries obtain locally relevant solutions, hardware, software and tools for learning and creating a more vibrant, interactive learning environment. During that time, Intel and the Intel Foundation have invested more than US$1 billion in education programs and technology access efforts for youth around the globe.

 

To learn more about the Intel Education Accelerator, visit www.intel.com/content/www/us/en/education/accelerator/intel-education-accelerator.html.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

About Intel Capital
Intel Capital, Intel's global investment organization, makes equity investments in innovative technology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software, and services targeting enterprise, mobility, consumer Internet, digital media and semiconductor manufacturing. Since 1991, Intel Capital has invested nearly US$11.6 billion in over 1,440 companies in 57 countries. In that timeframe, 213 portfolio companies have gone public on various exchanges around the world and 373 were acquired or participated in a merger. For more information on what makes Intel Capital one of the world's most powerful venture capital firms, visit www.intelcapital.com or follow @Intelcapital.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

Intel Security today announced that leading research firm Gartner, Inc. has positioned the company in the leaders quadrant for its “Magic Quadrant for Security Information and Event Management” (SIEM) as published on July 20, 20151. According to the report, “Organizations are failing at early breach detection, with more than 92% of breaches undetected by the breached organization. The situation can be improved with stronger threat intelligence, the addition of behavior profiling and better analytics.” Additionally, the report highlights that “during 2014, the SIEM market grew from $1.5 billion to approximately $1.69 billion, achieving a growth rate of about 14%. The primary drivers that were in place at the start of 2014 remain in effect. Threat management is the primary driver, and compliance remains a secondary driver.” View a copy of the Gartner 2015 Magic Quadrant for SIEM report and learn more about McAfee SIEM solutions.

 

1 Gartner, Inc., Magic Quadrant for Security Information and Event Management, K. Kavanaugh, O. Rochford, July 20, 2015

In order to further optimize Intel® processors for Windows* 10, Intel today released new graphics drivers for 4th and 5th generation Intel® Core™ processors with Intel® HD Graphics, Intel® Iris™ Graphics and Iris™ Pro Graphics, N series Intel® Pentium® and Intel® Celeron® processors with Intel® HD graphics (formerly codenamed Braswell). The drivers also support several new features, including Microsoft DirectX* 12, Microsoft PlayReady* and Miracast*. Users can download the drivers from Intel’s website or check with their device’s manufacturer to get the latest drivers for their specific machine.

With the launch of Microsoft Windows* 10 today, the computing industry and people everywhere have a lot to celebrate. Intel collaborated with Microsoft to ensure people who have Intel-powered devices have a great Windows 10 experience. To learn more about how a new Intel-powered tablet, PC or 2 in 1 can help you take the fullest advantage of Windows 10 and in particular how PCs have transformed over the last few years, read this blog by Intel senior vice president Kirk Skaugen. Congratulations to Microsoft and cheers to a new era of amazing computing experiences.

Intel and Micron today unveiled 3D XPoint™ technology, the first new memory category in more than 25 years. 3D XPoint technology makes new innovations possible in applications that benefit from fast access to large sets of data, such as machine learning, real-time tracking of diseases and immersive 8K gaming. The technology uses unique material compounds and an innovation cross point architecture to deliver speeds up to 1000 times faster than NAND, and it is 10 times denser than conventional memory. Learn more about the announcement and watch the webcast.

 

Interactive Photo Capsule: 3D XPoint™ Technology

New Class of Memory Unleashes the Performance of PCs, Data Centers and More

 

NEWS HIGHLIGHTS

  • Intel and Micron begin production on new class of non-volatile memory, creating the first new memory category in more than 25 years.
  • New 3D XPoint™ technology brings non-volatile memory speeds up to 1,000 times faster1 than NAND, the most popular non-volatile memory in the marketplace today.
  • The companies invented unique material compounds and a cross point architecture for a memory technology that is 10 times denser than conventional memory2.
  • New technology makes new innovations possible in applications ranging from machine learning to real-time tracking of diseases and immersive 8K gaming.

 

 

3D_XPoint_Die_1000.jpg

3D Xpoint™ technology is up to 1000x faster than NAND and an individual die can store 128Gb of data

3D XPoint Wafer Close-Up_1000.jpg

3D Xpoint™ technology wafers are currently running in production lines at Intel Micron Flash Technologies fab

SANTA CLARA, Calif., and BOISE, Idaho, July 28, 2015 – Intel Corporation and Micron Technology, Inc. today unveiled 3D XPoint™ technology, a non-volatile memory that has the potential to revolutionize any device, application or service that benefits from fast access to large sets of data. Now in production, 3D XPoint technology is a major breakthrough in memory process technology and the first new memory category since the introduction of NAND flash in 1989.

 

The explosion of connected devices and digital services is generating massive amounts of new data. To make this data useful, it must be stored and analyzed very quickly, creating challenges for service providers and system builders who must balance cost, power and performance trade-offs when they design memory and storage solutions. 3D XPoint technology combines the performance, density, power, non-volatility and cost advantages of all available memory technologies on the market today. The technology is up to 1,000 times faster and has up to 1,000 times greater endurance3 than NAND, and is 10 times denser than conventional memory.

 

"For decades, the industry has searched for ways to reduce the lag time between the processor and data to allow much faster analysis," said Rob Crooke, senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group. "This new class of non-volatile memory achieves this goal and brings game-changing performance to memory and storage solutions."

 

"One of the most significant hurdles in modern computing is the time it takes the processor to reach data on long-term storage," said Mark Adams, president of Micron. "This new class of non-volatile memory is a revolutionary technology that allows for quick access to enormous data sets and enables entirely new applications."

 

As the digital world quickly grows – from 4.4 zettabytes of digital data created in 2013 to an expected 44 zettabytes by 20204 – 3D XPoint technology can turn this immense amount of data into valuable information in nanoseconds. For example, retailers may use 3D XPoint technology to more quickly identify fraud detection patterns in financial transactions; healthcare researchers could process and analyze larger data sets in real time, accelerating complex tasks such as genetic analysis and disease tracking.

 

The performance benefits of 3D XPoint technology could also enhance the PC experience, allowing consumers to enjoy faster interactive social media and collaboration as well as more immersive gaming experiences. The non-volatile nature of the technology also makes it a great choice for a variety of low-latency storage applications since data is not erased when the device is powered off.

 

New Recipe, Architecture for Breakthrough Memory Technology

Following more than a decade of research and development, 3D XPoint technology was built from the ground up to address the need for non-volatile, high-performance, high-endurance and high-capacity storage and memory at an affordable cost. It ushers in a new class of non-volatile memory that significantly reduces latencies, allowing much more data to be stored close to the processor and accessed at speeds previously impossible for non-volatile storage.

 

The innovative, transistor-less cross point architecture creates a three-dimensional checkerboard where memory cells sit at the intersection of word lines and bit lines, allowing the cells to be addressed individually. As a result, data can be written and read in small sizes, leading to faster and more efficient read/write processes.

 

Interactive Photo Capsule: 3D XPoint™ Technology

 

3D XPoint technology will sample later this year with select customers, and Intel and Micron are developing individual products based on the technology.

 

Multimedia Elements

For additional information, visit:

Media Kit – Micron / Intel

 

Contribute to the memory technology conversations through Intel's social channels:

 

Take part in Micron's social conversations where we're talking all things storage and memory:

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.

 

Intel, 3D XPoint and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

*Other names and brands may be claimed as the property of others.

 

Micron Technology, Inc.
Micron Technology, Inc., is a global leader in advanced semiconductor systems. Micron's broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron's memory solutions enable the world's most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron's common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com

 

©2015 Micron Technology, Inc. All rights reserved. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.

 

This document contains forward looking statements. Forward looking statements are predictions, projections and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual results to differ materially from the forward-looking statements in this document. A detailed discussion of the factors that could affect Intel's results and plans is included in Intel's SEC filings, including the annual report on Form 10-K.

 

1 Performance difference based on comparison between 3D XPoint technology and other industry NAND

 

2 Density difference based on comparison between 3D XPoint technology and other industry DRAM 

 

3 Endurance difference based on comparison between 3D XPoint technology and other industry NAND 

 

4 www.emc.com/leadership/digital-universe/2014iview/executive-summary.htm

Includes Industry Investments and Collaborations to Unleash Tens of Thousands of New Clouds; Intel Announces Collaboration with Rackspace to Deliver Easy-to-Deploy Clouds

 

SANTA CLARA, Calif., July 23, 2015 – Intel Corporation today announced the Intel® Cloud for All initiative to accelerate cloud adoption by making public, private and hybrid cloud solutions easier to deploy. Through a series of investments and collaborations in the cloud software ecosystem, Intel believes the initiative will help businesses take advantage of the cloud benefits to deliver new capabilities and digital services, leading to tens of thousands of new cloud deployments.

 

While the Intel Cloud for All initiative is designed to benefit clouds of various sizes and types, enterprise cloud adoption has been particularly stifled by complexity, lack of scalability and gaps in open source enterprise-grade features. Removing these obstacles will enable companies to deploy more highly optimized and scalable cloud infrastructure that delivers new services more efficiently.

 

"The cloud has been critical to the digital services economy and has enabled tremendous innovation and business growth, but broad enterprise adoption is not happening fast enough," said Diane Bryant, senior vice president and general manager of Intel's Data Center Group. "We believe that through this initiative we will enable our customers to realize the benefits and innovations gained from the latest cloud computing technologies."

 

Unlocking the Next Wave of Cloud Deployments

Consumer services from major cloud service providers have driven the first wave of cloud adoption, accounting for 75 percent of current cloud usage. However, over the next five years, opportunities created from the Internet of Things and big data analytics solutions will be leading drivers for enterprise cloud growth. According to industry research firm IDC, organizations will spend an additional $142.8 billion on infrastructure for both public and private cloud environments in the next three years (2016-2018) to boost efficiency and business agility1.

 

The Intel Cloud for All initiative will focus on three primary areas to accelerate new cloud deployments and help businesses get the most from their cloud infrastructure:

  • Investing in the ecosystem to accelerate enterprise-ready, easy-to-deploy software defined infrastructure (SDI) solutions;
  • Optimizing SDI solutions to deliver highly efficient clouds across a range of workloads by taking full advantage of Intel platform capabilities; and
  • Aligning the industry and engaging the community through open industry standards, solutions and routes to market to accelerate cloud deployment.

 

New Collaboration with Rackspace*

As a key part of this initiative, Intel is announcing today a new collaboration with Rackspace*, the co-founder and leading operator of OpenStack*, the predominant open source cloud software platform. Intel and Rackspace will establish the OpenStack Innovation Center to focus on driving enterprise features and scale optimizations into the OpenStack source code.

 

The OpenStack Innovation Center will include the world's largest OpenStack developer cloud consisting of two 1,000-node clusters that will be available to the OpenStack community-at-large to support advanced, large-scale testing of OpenStack performance, code and new features. These testing clusters are expected to be available within the next six months.

 

The companies will also focus on the delivery of new enterprise features and optimizations that are aligned with the OpenStack Enterprise Working Group and community priorities. New modules of courseware will also be offered to onboard and increase the number of open source developers actively contributing to the success of the community.

 

Teleconference and Presentation

Intel will hold a teleconference today at 10:00 a.m. PT (1:00 p.m. ET) to discuss the Cloud for All initiative and the Rackspace collaboration. The live teleconference can be accessed in the United States at 1-888-339-2688 and outside the United States at +1-617-847-3007 with the passcode 83629340. View the slide presentation and view a replay of the teleconference.

 

Supporting Resources *available at 10:00 a.m. Pacific*

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

 

Intel technologies' features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at www.intel.com.

 

1 IDC Worldwide Quarterly Cloud IT Infrastructure Tracker, market forecast, July 2015.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

SANTA CLARA, Calif., July 23, 2015 - Intel Corporation's board of directors has declared a quarterly dividend of 24 cents per share (96 cents per share on an annual basis) on the company's common stock. The dividend will be payable on September 1, 2015, to stockholders of record on August 7, 2015.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

ASUS ZenFone 2E

The ASUS ZenFone 2E powered by an Intel Atom processor and Intel LTE modem, is a budget-friendly option starting at US $119.

AT&T and ASUS announced the commercial availability of the ASUS ZenFone 2E, powered by a dual-core Intel® Atom™ processor and Intel® XMM™ 7160 LTE modem.  The Intel Atom processor enables efficient multitasking and performance in a sleek, five-inch HD phone.  The phone will be available for US$119 on an AT&T pre-paid GoPhone® plan at AT&T stores nationwide on July 24th, and other national retailers including Walmart*, Target* and Best Buy*.

WHEN:

Aug. 18-20, 2015

WHERE:

Moscone Center West, San Francisco

WHAT:
Intel CEO Brian Krzanich

Intel CEO Brian Krzanich

The 2015 Intel Developer Forum (IDF) will bring together the developers, technologists and makers who create the products, engineer the systems, render the movies and power the toys that deliver amazing experiences. At the annual conference, Intel will share its vision and latest innovations to spark new ideas, collaboration and conversation with its partners.

 

Intel CEO Brian Krzanich will kick off the event at 9 a.m. on Aug. 18 with a keynote focused on the evolution of technology and the increasing personalization of computing that is creating unprecedented opportunities for developers to drive new innovation with Intel technology. With the theme “Developed by You,” IDF 2015 will include “Mega Sessions” focused on the hottest topics in the technology industry including:

 

 

More than 160 technical sessions with industry and Intel experts will also be offered over the three-day event as well as a vast showcase featuring demonstrations of innovations by 180 leading technology companies.

 

IDF 2015 will also provide media and analysts opportunities to speak one-to-one with industry experts and Intel engineers whose work will impact the direction of future technologies. They will have full access to all of the general and technical sessions, including Technical Insights, lecture sessions and hands-on labs.

ATTENDANCE:

More than 5,000 attendees are expected from around the world.

INFORMATION:

www.intel.com/newsroom/idf

CONTACTS:

William Giles

+1-919-678-2858

william.e.giles@intel.com

Today at the Kubernetes 1.0 launch event co-located with OSCON, Intel announced several new industry collaborations to advance open source container solutions. This included the announcement of Intel as a founding member of the Cloud Native Computing Foundation (CNCF), a new industry organization chartered with driving container innovation and open standards so container-packaged applications can be moved between clouds. In conjunction with the launch of Google’s Kubernetes 1.0, an open source container orchestration system, Intel demonstrated three Kubernetes-based Software Defined Infrastructure stacks using CoreOS’ new Tectonic Preview, an OpenStack environment for running Kubernetes containers on a shared infrastructure layer featuring Mirantis and a Mesosphere platform. Check out Intel’s KuberCon, CNCF and Clear Container blogs for more info.

For kids, summer means endless sunny days of school-free fun. For busy mothers, it is code for schedules that need to be coordinated, activities that need to be planned, and days that are even more hectic than ever. Summer months can be some of the most challenging for active moms. Check out this illustration featuring Intel’s tips on how to combat summer challenges with the help of technology, and learn how a tablet can ease the stresses of the summertime blues.

The Intel Q2, 2015 earnings press release is available on our Investor Relations website: http://www.intc.com/results.cfm.

 

Q2 2015 Earnings Infographic

ITBTN_Earnings_Q2-2015_07152015.png

Today at ISC 2015, Intel unveiled new details for its future generation high performance computing (HPC) products, including the first public "powered-on" demonstration of the Intel® Omni-Path Architecture, a next-generation fabric technology optimized for HPC deployments. Intel also announced new industry collaborations designed to address the challenges of code modernization and the mainstream use of HPC technologies – including a collaboration with HP to develop purpose-built HP Apollo systems designed to expand the use of HPC solutions to enterprises of all sizes. Check out the Intel ISC 2015 fact sheet for more information.

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