Intel Announces New Packaging and Test Technologies for Foundry Customers

New Technologies to Improve Time to Market and Reduce Costs

SANTA CLARA, Calif., Aug. 27, 2014 – Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.

Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed. Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost.

“The EMIB technology enables new on-package functionality that may have been too costly to pursue with previous solutions,” said Babak Sabi, Intel vice president and director, Assembly and Test Technology Development.

Intel also announced the availability of its revolutionary High Density Modular Test (HDMT) platform. HDMT, a combination of hardware and software modules, is Intel’s test technology platform that targets a range of products in diverse markets including server, client, system on chip, and Internet of Things. Until now, this capability was only available internally for Intel products. Today’s announcement makes HDMT available to customers of Intel Custom Foundry.

“We developed the HDMT platform to enable rapid test development and unit-level process control. This proven capability significantly reduces costs compared to traditional test platforms. HDMT reduces time to market and improves productivity as it uses a common platform from low-volume product debug up to high-volume production,” said Sabi.

EMIB is available to foundry customers for product sampling in 2015 and HDMT is available immediately.

About Intel

Intel (NASDAQ: INTC), a leader in the semiconductor industry, is shaping the data-centric future with computing and communications technology that is the foundation of the world’s innovations. The company’s engineering expertise is helping address the world’s greatest challenges as well as helping secure, power and connect billions of devices and the infrastructure of the smart, connected world – from the cloud to the network to the edge and everything in between. Find more information about Intel at newsroom.intel.com and intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.