Intel Completes Next Generation, 32nm Process Development Phase

SANTA CLARA, Calif., Dec. 9, 2008 – Intel Corporation has completed the development phase of its next-generation manufacturing process that further shrinks chip circuitry to 32 nanometers (a billionth of a meter). The company is on track for production readiness of this future generation using even more energy-efficient, denser and higher performing transistors in the fourth quarter of 2009.

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