14nm Package (codenamed ‘Broadwell’)
SANTA CLARA, Calif., Aug. 11, 2014 – Intel today disclosed details of its newest microarchitecture that is optimized with Intel’s industry-leading 14nm manufacturing process. Together these technologies will provide high-performance and low-power capabilities to serve a broad array of computing needs and products from the infrastructure of cloud computing and the Internet of Things to personal and mobile computing.
“Intel’s integrated model – the combination of our design expertise with the best manufacturing process – makes it possible to deliver better performance and lower power to our customers and to consumers,” said Rani Borkar, Intel vice president and general manager of product development. “This new microarchitecture is more than a remarkable technical achievement. It is a demonstration of the importance of our outside-in design philosophy that matches our design to customer requirements.”
“Intel’s 14 nanometer technology uses second-generation Tri-gate transistors to deliver industry-leading performance, power, density and cost per transistor,” said Mark Bohr, Intel senior fellow, Technology and Manufacturing Group, and director, Process Architecture and Integration. “Intel’s investments and commitment to Moore’s law is at the heart of what our teams have been able to accomplish with this new process.”
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