Intel, eASIC Collaborate on Customized Intel-Based Solutions for the Cloud

Companies Plan to Deliver Custom Intel® Xeon® Processors with eASIC Platforms to Speed Workloads like Security, Big Data, and Other Applications

SANTA CLARA, Calif., May 12, 2015 – Intel Corporation today announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the “cloud.” The new parts will enable acceleration of up to two times that of a field programmable gate array (FPGA) for workloads like security and big data analytics while also speeding the time to market for custom application specific integrated circuit (ASIC) development by as much as 50 percent1.

The tremendous growth of cloud computing has spurred greater demand for customized chips that make a particular application or workload run faster. To enable this, eASIC plans to integrate its eASIC platform technology with future Intel® Xeon® processors, providing cloud service providers a highly customized, integrated hardware solution for their particular workload.

eASIC’s technology can increase flexibility and fast-time-to-market when compared to traditional ASICs and increase performance and lower power consumption when compared to FPGAs. By integrating hardware accelerator solutions with the eASIC platform, Intel can deliver much faster and more flexible systems for cloud customers.

“Having the ability to highly customize our solutions for a given workload will not only make the specific application run faster, but also help accelerate the growth of exciting new applications like visual search,” said Diane Bryant, senior vice president and general manager of Intel’s Data Center Group. “This announcement helps broaden our portfolio of customized products to provide our customers with the flexibility and performance they need.”

This collaboration is part of Intel’s strategy to integrate reprogrammable technology with Intel Xeon processors to greatly improve performance, power and cost.

“We believe our eASIC technology has unique characteristics that will benefit cloud service providers to get the most from their applications,” said Ronnie Vasishta, president and chief executive office at eASIC. “The combination of eASIC and Intel technology will help bring break through cost and performance to our customers.”

About eASIC
eASIC is a semiconductor company offering a differentiated solution that enables us to rapidly and cost-effectively deliver custom integrated circuits (ICs), creating value for our customers’ hardware and software systems. Our eASIC solution consists of our eASIC platform which incorporates a versatile, pre-defined and reusable base array and customizable single-mask layer, our easicopy ASICs, our standard ASICs and our proprietary design tools. Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Crescendo Ventures, Seagate Technology, Kleiner Perkins Caufield and Byers (KPCB) and Evergreen Partners. For more information on eASIC please visit www.easic.com.

1 Source: eASIC website http://www.easic.com/products/28-nm-easic-nextreme-3/.

About Intel

Intel (NASDAQ: INTC), a leader in the semiconductor industry, is shaping the data-centric future with computing and communications technology that is the foundation of the world’s innovations. The company’s engineering expertise is helping address the world’s greatest challenges as well as helping secure, power and connect billions of devices and the infrastructure of the smart, connected world – from the cloud to the network to the edge and everything in between. Find more information about Intel at newsroom.intel.com and intel.com.

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