Announces Collaborations with Ericsson*, Samsung*, Others as Part of Broad Effort Spanning Silicon, Devices, Security and Networking Solutions
- Introduces the Intel® Atom™ x3 processor series, formerly code-named “SoFIA,” for low-cost smartphones, phablets and tablets with 20 customers committed to deliver designs.
- Introduces the Intel® Atom™ x5 and x7 processor series, formerly code-named “Cherry Trail,” for mainstream and premium tablets and small-screen 2 in 1s.
- Introduces the five-mode Intel® XMM™ 7360 LTE Advanced solution, with support for up to Category 10 and download speeds up to 450 Mbps.
- Brightstar Corp*, Deutsche Telekom*, LG Electronics*, Prestigio* and Samsung* select Intel Security technologies to help protect personal devices.
- Announces efforts with Alcatel-Lucent*, Ericsson* and Huawei* to address demand for new services, improve network efficiencies and accelerate the move toward a software-defined infrastructure using Intel® architecture.
Aicha Evans, Intel’s vice president and general manager of the Intel Communication and Devices Group, holds up the five-mode Intel® XMM 7360 LTE Advanced solution, which supports up to Category 10 and downlink speeds of up to 450 Mbps.
The Intel® Atom™ x3 processor, formerly code-named “SoFIA”, is Intel’s first integrated SoC featuring 3G or 4G (LTE) modems and Intel architecture application processors for entry and value tablets, phablets and smartphones.
MOBILE WORLD CONGRESS, Barcelona, Spain, March 2, 2015 – Intel Corporation CEO Brian Krzanich today announced a series of mobile platforms including the company’s new low-cost system-on-chip (SoC) for phones, phablets and tablets, a global LTE solution, innovative personal computing experiences, and a range of customers for mobile device and network infrastructure offerings. With technologies that span silicon, software and security, Krzanich said Intel was one of the few companies able to deliver solutions end-to-end, for devices, the network and the cloud.
The announcements include the Intel® Atom™ x3 processor series, Intel’s first integrated communications SoC solution for the growing value and entry device markets, and the five-mode Intel® XMM™ 7360 LTE Advanced solution, designed for performance and worldwide coverage. In addition, Krzanich highlighted joint efforts with Alcatel-Lucent, Ericsson and Huawei to address the demand for new telecommunications, cloud and data center services, improve network efficiencies, and accelerate the industry’s move toward a software-defined infrastructure.
Krzanich also reiterated that Samsung Galaxy S6* and S6 Edge* users will have the latest anti-malware solution from McAfee VirusScan Mobile™ technology built into and activated on their devices.
“The evolution of the mobile landscape and growth of smart, connected devices has led to increased demand for more connectivity and real-time, protected data on those devices,” said Krzanich. “All of these factors are driving a transformation of the network to accelerate the delivery of new personal computing experiences, services and capabilities in a safe and secure manner. Intel is one of the only companies in the world that can provide solutions end-to-end for the full spectrum of mobility.”
Mobile Communications Products
Intel introduced the Intel Atom x3 processor series (formerly code-named “SoFIA”), Intel’s first integrated communications platform for entry and value tablets, phablets and smartphones. Combining 64-bit multi-core Intel Atom processors together with 3G or 4G LTE connectivity, the integrated communications SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components in a single system chipset. This integration allows device manufacturers to deliver full-featured tablets, phablets and smartphones at affordable price points for the rapidly growing entry and value market segments.
Intel is bringing the benefits of integrated Intel architecture and wireless communications to customers, including the China technology ecosystem, with greater velocity. Twenty companies, including ASUS* and Jolla*, have committed to delivering Intel Atom x3 designs.
Rounding out its mobile portfolio that scales from the entry to performance segments, Intel also introduced its first 14nm Intel® Atom™ SoC, the Intel Atom x5 and x7 processor series (formally code-named “Cherry Trail”) for next-generation tablets and small-screen 2 in 1s. Offering 64-bit support for Windows* and Android*, Intel Gen 8 graphics, and an option to pair with next-generation LTE Advanced connectivity, the Intel Atom x5 and x7 processor series will power a range of mainstream to premium devices. The processors are also “conflict-free1,” meaning that these products do not contain minerals (tin, tantalum, tungsten and/or gold) that are inadvertently funding human rights violations in the Democratic Republic of the Congo.
Customers, including Acer*, ASUS, Dell*, HP*, Lenovo* and Toshiba*, have already committed to deliver devices on this platform. The first devices are expected to be in the market in the first half of this year.
Intel also announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450 Mbps. Its compact size and power efficiency enable the Intel XMM 7360 to accommodate a wide range of form factors, from smartphones and phablets to tablets and PCs. It also expands Intel’s portfolio of LTE solutions, giving device manufacturers a competitive option to quickly design and launch LTE devices in various market segments and geographies. At Mobile World Congress, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1 Gbps using Intel technology end-to-end.
Delivering New Experiences in Smarter, Safer Devices
With hardware and software products like Intel® RealSense™ depth sensing technology, wireless charging and True Key™ technology by Intel Security, among others, Intel continues to deliver new experiences that provide more natural, intuitive and immersive ways for people to interact with technology. Building on the success of the world’s thinnest tablet, the Dell Venue* 8, Krzanich showed a sneak peak of the Dell Venue* 10 tablet, featuring a detachable keyboard and Intel RealSense snapshot technology. Targeting consumer and business users, the tablet is expected to be available soon.
In addition to working with Samsung to help protect Galaxy S6 and S6 Edge devices, Krzanich said Intel Security is also collaborating with LG Electronics to help secure personal data. LG Electronics will make McAfee Mobile Security from Intel Security available on the LG Watch Urbane LTE*, delivering anti-theft capabilities that allow the owner to lock, locate and wipe the device, if needed. LG Android device users are already protected today with McAfee Mobile Security on their devices.
Krzanich announced new customers including Brightstar Corp, Deutsche Telekom and Prestigio for the company’s True Key technology, a cross-platform application to address the pain point of passwords by using personal factors like facial identification and fingerprints to make logging in easier and safer. Deutsche Telekom will preinstall the True Key product for its customers in Europe. Prestigio will be one of the first mobile device manufacturers to launch the True Key application in Russia and across Europe, making the application available across all of its Android tablets and smartphones by the end of this year.
Network Transformation – New Services, Greater Connectivity and Faster Data
Krzanich outlined how Intel is working with industry leaders to transform network infrastructure with standardized hardware and software, and helping to accelerate the industry’s move toward a flexible, agile software-defined infrastructure. This enables both telco and cloud service providers to improve network efficiencies and accelerate the delivery of new services and capabilities for consumers and businesses.
Alcatel-Lucent introduced its virtual radio access network (vRAN) solution, comprised of a virtualized baseband unit that uses general purpose servers with Intel® Xeon® processors to enable cost savings and increased network performance. The vRAN will be in customer trials this year and commercially available in 2016.
Ericsson announced a new generation of data center platforms for the Ericsson Cloud System that enable telecom and cloud service providers to lower their total cost of ownership (TCO) and realize more flexibility and efficiency in their data centers. The company is using Intel® Rack Scale Architecture, together with management and orchestration software, to optimize and scale cloud resources across private, public, enterprise and telco cloud domains, enabling improved services agility. Ericsson also announced it is working with Intel Security on mobile security for 4G networks.
Huawei and Intel are collaborating to deliver robust cloud solutions that will enable telecommunications service providers to transform their data centers. The companies will develop the next generation of Huawei’s FusionSphere* based on Intel architecture, and will use the Data Plane Development Kit and Open vSwitch to increase network virtualization performance of FusionSphere. These solutions aim to enhance performance that is optimized to minimize TCO for cloud workloads in a scalable and secure manner.
View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)
Intel, Intel Atom, Intel XMM, McAfee VirusScan Mobile, True Key, Intel RealSense, Intel Rackscale Architecture, Intel Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.
1 “Conflict free” and “conflict-free” means “DRC conflict free,” which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term “conflict-free” in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before Jan. 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.