Intel To Add Communications Capabilities To Industry’s Most Advanced Chip-Manufacturing Process

SANTA CLARA, Calif., Sept. 16, 2002 – Intel Corporation today announced plans to add communications capabilities to its industry-leading 90-nanometer (nm) manufacturing process. These capabilities include the use of high-speed silicon-germanium transistors and “mixed-signal” circuitry, aimed at bringing about a new wave of faster, more integrated, less-costly communications chips. Such chips could lead to single-chip, hand-held devices that offer cell-phone, wireless-data-network and the evolving “personal-area-network” services, as well as smaller, lower-cost network-infrastructure equipment.

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