SANTA CLARA, Calif., Sept. 16, 2002 – Intel Corporation today announced plans to add communications capabilities to its industry-leading 90-nanometer (nm) manufacturing process. These capabilities include the use of high-speed silicon-germanium transistors and “mixed-signal” circuitry, aimed at bringing about a new wave of faster, more integrated, less-costly communications chips. Such chips could lead to single-chip, hand-held devices that offer cell-phone, wireless-data-network and the evolving “personal-area-network” services, as well as smaller, lower-cost network-infrastructure equipment.
Intel (NASDAQ: INTC), a leader in the semiconductor industry, is shaping the data-centric future with computing and communications technology that is the foundation of the world’s innovations. The company’s engineering expertise is helping address the world’s greatest challenges as well as helping secure, power and connect billions of devices and the infrastructure of the smart, connected world – from the cloud to the network to the edge and everything in between. Find more information about Intel at newsroom.intel.com and intel.com.
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