SANTA CLARA, Calif., Feb. 18, 2003 — Intel Corporation today disclosed plans to convert Fab 12, a 200-mm wafer fabrication facility located in Chandler, Ariz. to a 300-mm wafer fab. The conversion project, estimated to cost $2 billion, will begin in the first half of 2004 with production scheduled to begin in late 2005. The converted fab will start up production on 65-nanometer process technology.
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