HILLSBORO, Ore., August. 13, 2002 — Intel Corporation today unveiled several technology breakthroughs that the company has integrated into its new 90-nanometer (nm) process, the most advanced semiconductor manufacturing process in the industry. Intel already has used this process to build record-breaking silicon structures and memory chips. Intel will put this process into volume manufacturing next year using 300 mm wafers.
Intel (NASDAQ: INTC), a leader in the semiconductor industry, is shaping the data-centric future with computing and communications technology that is the foundation of the world’s innovations. The company’s engineering expertise is helping address the world’s greatest challenges as well as helping secure, power and connect billions of devices and the infrastructure of the smart, connected world – from the cloud to the network to the edge and everything in between. Find more information about Intel at newsroom.intel.com and intel.com.
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