Today, at the annual Hot Chips Conference in Cupertino, California, Intel presented details about the company’s EMIB (Embedded Multi-die Interconnect Bridge) packaging technology. Developed by Intel, EMIB facilitates high-speed communication between multiple die in-package, and is a key component of Intel’s mix-and-match heterogeneous computing strategy. EMIB is used in Intel® Stratix® 10 FPGAs and 8th Gen Intel® Core™ processors with Radeon Graphics.
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.
© Intel Corporation. Intel, the Intel logo and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.