Microsoft Unveils First Lakefield Device and New Surface Lineup with 10th Gen Intel Core

  • On Oct. 2, 2019, in New York City, Microsoft previewed the Surfa
  • On Oct. 2, 2019, in New York City, Microsoft announced the Surfa
  • On Oct. 2, 2019, in New York City, Microsoft announced the Surfa

What’s New: Today, at a launch event in New York City, Microsoft previewed the Surface Neo, a category-defining device co-engineered with Intel. The dual-screen device will be powered by Intel’s unique processor, code-named “Lakefield,” that features an industry-first architecture combining a hybrid CPU with Intel’s Foveros 3D packaging technology. It offers device-makers more flexibility to innovate on design, form factor and experience.

“The innovation we’ve achieved with Lakefield gives our industry partners the ability to deliver on new experiences, and Microsoft’s Neo is trailblazing a new category of devices. Intel is committed to pushing the boundaries of computing by delivering key technology innovations for partners across the ecosystem.”
–Gregory Bryant, Intel executive vice president and general manager of the Client Computing Group

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Why It’s Important: Surface Neo is the culmination of deep engineering collaboration between Intel and Microsoft to drive innovation in new form factors, such as dual-screen devices. It exemplifies the companies’ shared vision of advancing the PC industry by delivering remarkable new usages and experiences without compromising on performance, design and the full Windows experience.

Leveraging Intel’s latest 10nm process and Foveros advanced packaging technology, Lakefield achieves a dramatic reduction in package area – a miniscule 12x12x1 mm – that is necessary for pushing the limits of form factor design. Its hybrid CPU architecture combines power efficient “Tremont” cores with a performance scalable “Sunny Cove” core to deliver computing performance and next-generation graphics at low power for long battery life. Lakefield is symbolic of the strategic shift in Intel’s design and engineering model that underpins the company’s future product roadmaps: enabling workload-optimized PC platforms through the right mix of leadership performance, architectures, manufacturing technologies and intellectual properties.

What Else is New: In addition, Microsoft announced new Surface devices based on 10th Gen Intel® Core™ processors: the Surface Pro 7 and the Surface Laptop 3. The new Surface devices bring the intelligent performance, rich and immersive Intel® Iris® Plus graphics experience and best-in-class connectivity1 of 10th Gen Intel Core to consumers and businesses in beautiful premium designs.

What They Offer: The new Surface devices are based on 10th Gen Intel Core processors code-named “Ice Lake” for improved performance and graphics over previous generation Surface devices. Available for pre-order today in select markets.

  • Surface Pro 7 is an ultralight 2 in 1 that offers laptop-to-tablet versatility with a 12.3″ touchscreen. 10th Gen Intel Core processors enable performance, connectivity and entertainment while remaining ultra-slim and light at just 1.70 pounds.
  • Surface Laptop 3 delivers style and speed in 13.5” and 15” touchscreen display options, as well as new colors and finishes. Breeze through professional-grade software and essential apps with 10th Gen Intel Core processors and up to 32GB RAM and 1TB of storage.

More Context: Lakefield Press Kit  |  10th Gen Intel Core Press Kit  |  Intel Architecture Day Fact Sheet

More Customer Stories: Intel Customer Spotlight on Intel.com | Customer Stories on Intel Newsroom

The Small Print:

1Best in Class Wi-Fi 6: Intel® Wi-Fi 6 (Gig+) products support optional 160 MHz channels, enabling the fastest possible theoretical maximum speeds (2402 Mbps) for typical 2×2 802.11 AX PC Wi-Fi products.   Premium Intel® Wi-Fi 6 (Gig+) products enable 2-4X faster maximum theoretical speeds compared standard 2×2 (1201 Mbps) or 1×1 (600 Mbps) 802.11 AX PC Wi-Fi products, which only support the mandatory requirement of 80 MHz channels.

About Intel

Intel (NASDAQ: INTC), a leader in the semiconductor industry, is shaping the data-centric future with computing and communications technology that is the foundation of the world’s innovations. The company’s engineering expertise is helping address the world’s greatest challenges as well as helping secure, power and connect billions of devices and the infrastructure of the smart, connected world – from the cloud to the network to the edge and everything in between. Find more information about Intel at newsroom.intel.com and intel.com.

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