Intel is transforming the future of high-performance computing (HPC) with new tools for innovation and discovery. At this year’s International Supercomputing Conference in Frankfurt, Intel is sharing updates to its HPC product portfolio that includes SDVis Appliance, a new turnkey solution for optimizing visualization, the upcoming Intel® Xeon® Scalable processor to enable new levels of performance and scalability, optimizations to the Intel® Omni-Path Architecture (Intel® OPA), an end-to-end fabric solution, and Intel’s upcoming extension to Intel® Xeon Phi™ with Knights Mill, the first CPU tool targeted for deep learning model training.

Videos

ISC Keynote, Dr. Rajeeb Hazra

Images

  • Intel ISC 17 – 6
  • Intel ISC 17 – 5
  • Stephan Gillich, Intel Germany’s Director of Technical Computing
  • Intel ISC 17 – 3
  • Intel ISC 17 – 2
  • Intel demonstrated how high-content imaging application harnesse

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