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Intel Core Processors with Intel Hybrid Technology, code-named “Lakefield,” are the industry’s first product with Intel’s Foveros 3D stacking and a hybrid computing architecture. Leveraging Intel’s 10nm process technology and Tremont cores, Lakefield achieves a dramatic reduction in package area over previous generations of technology, offering OEMs more flexibility for thin-and-light form factor PCs while delivering uncompromised Windows 10 experiences.

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  • Gregory Bryant, Intel senior vice president in the Client Comput
  • Intel’s mobile client platform, code-named “Lakefield,” intr
  • Intel’s mobile client platform, code-named “Lakefield,” intr
  • At CES 2019, Intel Corporation previews a new client platform co

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Videos

  • Co-EMIB, Intel’s EMIB and Foveros Tech Together, Delivers High Bandwidth at Low Power
  • 2019 CES: Intel Displays a World of Innovation (News Event Replay)
  • Intel Previews New Hybrid CPU Architecture with Foveros 3D Packaging

» Download video: “CES 2019: Intel Displays a World of Innovation (News Event Replay)”