Intel’s mobile client platform, code-named “Lakefield,” introduces the industry’s first product with 3D stacking and hybrid computing architecture. Leveraging Intel’s latest 10nm process and Foveros advanced packaging technology, Lakefield achieves a dramatic reduction in standby power, core area and package height over previous generations of technology, offering OEMs more flexibility for thin-and-light form factor PCs.

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  • Gregory Bryant, Intel senior vice president in the Client Comput
  • Intel’s mobile client platform, code-named “Lakefield,” intr
  • Intel’s mobile client platform, code-named “Lakefield,” intr
  • At CES 2019, Intel Corporation previews a new client platform co

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  • Co-EMIB, Intel’s EMIB and Foveros Tech Together, Delivers High Bandwidth at Low Power
  • 2019 CES: Intel Displays a World of Innovation (News Event Replay)
  • Intel Previews New Hybrid CPU Architecture with Foveros 3D Packaging

» Download video: “CES 2019: Intel Displays a World of Innovation (News Event Replay)”