Intel Core Processors with Intel Hybrid Technology, code-named “Lakefield,” are the industry’s first product with Intel’s Foveros 3D stacking and a hybrid computing architecture. Leveraging Intel’s 10nm process technology and Tremont cores, Lakefield achieves a dramatic reduction in package area over previous generations of technology, offering OEMs more flexibility for thin-and-light form factor PCs while delivering uncompromised Windows 10 experiences.
News
- Intel Hybrid Processors: Uncompromised PC Experiences for Innovative Form Factors Like Foldables, Dual Screens
- Up Close with Lakefield – Intel’s Chip with Award-Winning Foveros 3D Tech
- Intel’s Project Athena, 10th Gen and Lakefield Drive ‘New Mobile Computing’ at Samsung Developer Conference
- Intel Introduces Tremont Microarchitecture
- Microsoft Unveils First Lakefield Device and New Surface Lineup with 10th Gen Intel Core
- At Hot Chips, Intel Pushes ‘AI Everywhere’
- 2019 Investor Meeting: Intel Previews Design Innovation; 10nm CPU Ships in June; 7nm Product in 2021
- 2019 CES: Intel Advances PC Experience with New Platforms, Technologies and Industry Collaboration
- Fact Sheet: New Intel Architectures and Technologies Target Expanded Market Opportunities
Press Materials
- Lakefield: Hybrid Cores in a 3D Package (Hot Chips 2019 presentation)
- “Innovations and the Compute Foundation” (Intel Press Conference, 2019 CES Presentation Slides)
Images
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Videos
» Download video: “CES 2019: Intel Displays a World of Innovation (News Event Replay)”