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Video: Co-EMIB, Intel’s EMIB and Foveros Tech Together, Delivers High Bandwidth at Low Power

Intel’s EMIB and Foveros technologies leverage high-density interconnects to enable high bandwidth at low power, with I/O density on par with or better than competitive approaches. The company’s new Co-EMIB technology enables the linkage of even more computing performance and capability together. Co-EMIB allows for the interconnection of two or more Foveros elements with essentially the performance of a single chip. And designers can also connect analog, memory and other tiles with very high bandwidth and at very low power. (Credit: Intel Corporation)

Learn more: Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox