All News

Count the Work Done. Not Just the Cores.

For agentic AI, infrastructure should be measured by the work it reliably completes—per dollar, per watt and per rack.

Six in 10 Leaders Bet Big on Robots. Only Four in 10 Are Ready.

New Intel commissioned research finds robotics adoption accelerating—while gaps in strategy, skills, safety and infrastructure threaten organizations’ ability to scale.

Intel Corporation to Participate in Upcoming Investor Conference

Intel executives will participate in a fireside chat at the Deutsche Bank Conference.

Intel Announces Upsize and Pricing of $20 Billion Common Stock Offering

Intel today announced the pricing of its previously announced registered public offering of common stock. The offering is expected to close on August 12, 2026, subject to customary closing conditions.

Intel Gamer Days 2026 Kicking Off with AAA Gaming Bundle & Partnerships

Intel partnering with Fuse Games. & Crystal Dynamics on STAR WARS: Galactic Racer™ and Tomb Raider: Legacy of Atlantis for Intel platforms, including XeSS 3 support at launch

Intel Announces Proposed $15 Billion Common Stock Offering

Proceeds intended to support general corporate purposes, including capital expenditures and working capital.

Intel Announces Leadership Appointment to Strengthen Customer Engagement and Accelerate Growth

Creating Pathways to Semiconductor Careers: Intel Launches SEPP

Intel-funded initiative expands education-to-career pathways across key U.S. semiconductor regions

Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors

How Intel Foundry uses Foveros stacking, EMIB silicon bridges, and EMIB-T to scale chiplets, bypass the reticle limit, and power massive AI workloads.

Intel Completes RAMP-C Program, Accelerating Momentum for Secure Enclave

Program enabled validated prototypes, ecosystem readiness, and early customer engagement, creating a path to domestic leadership in high-volume manufacturing

Intel Secure Enclave: Securing High-Performance Computing at the Tactical Edge

Combining advanced process technology and secure manufacturing to strengthen mission performance and supply chain resilience

Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era

Collaboration combines Intel's advanced packaging expertise with Lens Technology's precision glass processing capabilities to deliver enhanced performance for future AI and datacenter workloads