Computex 2026: An Intelligent World Built on Silicon

Computex 2026: An Intelligent World Built on Silicon

Live from Lip-Bu Tan's Keynote at Computex 2026

June 2, 2026

Intel Announces New AI Innovations at Computex

Chip to Rackscale AI Solutions Delivered to Customers with the Help of Strategic Industry Partners

June 1, 2026

Press Kit: Intel at Computex 2026

At Computex 2026 in Taiwan, Intel unveiled new solutions tailored to meet customers’ demands from chip- to system-level innovations.

June 1, 2026

Data Center

Intel Puts Agentic AI to Work with Xeon 6+, Networking, and AI Systems

Intel expands its AI ready platform across data center, network, and edge—showing why the CPU is at the heart of agentic AI orchestration, scale and data movement.

May 31, 2026

Client Computing

130+ Customers Choose Intel Series 3 Processors for Edge Devices

At Computex, Intel showcases edge AI and robotics ecosystem with Series 3 designs and debuts OpenVINO™ Physical AI framework to simplify robot deployment and scale

May 31, 2026

Meet the Intel Pioneer Behind EMIB Chip Packaging

Ravi Mahajan discusses the idea for a simple silicon bridge and why it is becoming a foundational technology for the AI era.

May 28, 2026

Client Computing

Intel Arc G-Series Processors Set a New Standard for Handheld PC Gaming

Intel® Arc™ G-Series processors combine leadership performance and power efficiency to deliver smooth, immersive gameplay with exceptional battery life

May 28, 2026

Corporate

Intel’s 2025 Outstanding Researcher Awards Honor 10 Academic Innovators

Recognizing breakthrough university research advancing the future of technology through deep academic collaboration.

May 21, 2026

Solving the Agentic AI Trilemma – Cost, Scale, and Data Security

Introducing SuperClaw - a Hybrid Agentic AI Solution Designed for AI PCs, Agent Computers, and Edge Devices

May 21, 2026

Intel Core Ultra Series 3: The New Standard for Edge AI Robotics Compute

By integrating a CPU, GPU, and NPU, Intel Core Ultra Series 3 delivers edge AI power across global use cases—from hospitality and manufacturing to healthcare and education.

May 20, 2026

Artificial Intelligence

Computex 2026: An Intelligent World Built on Silicon

Live from Lip-Bu Tan's Keynote at Computex 2026

June 2, 2026

Intel Announces New AI Innovations at Computex

Chip to Rackscale AI Solutions Delivered to Customers with the Help of Strategic Industry Partners

June 1, 2026

Intel Core Ultra Series 3: The New Standard for Edge AI Robotics Compute

By integrating a CPU, GPU, and NPU, Intel Core Ultra Series 3 delivers edge AI power across global use cases—from hospitality and manufacturing to healthcare and education.

May 20, 2026

Client Computing

Intel at Computex 2026: Advancing the Next Era of AI-Driven Computing

Intel outlines progress across the AI compute ecosystem—highlighting open platforms, partners and real world momentum from silicon to software to systems.

May 5, 2026

Tech 101

What is Artificial Intelligence?

Generative AI uses new approaches like transformers and diffusion models to produce human-like text, images and code.

April 7, 2025

Explaining Common Chip Terms

You know what a semiconductor is, but what’s a die? Wafer? Substrate? Learn the basics of all things chips.

March 9, 2026

Manufacturing

How Silicon Die Become Chip Packages

Intel assembly and test factories put semiconductor chips through brutal tests and finishing touches before they ship.

February 19, 2025

Manufacturing

How a Semiconductor Factory Works

Discover how semiconductors come to life in some of the largest, most complex factories in the world.

June 9, 2023

Intel Foundry

Meet the Intel Pioneer Behind EMIB Chip Packaging

Ravi Mahajan discusses the idea for a simple silicon bridge and why it is becoming a foundational technology for the AI era.

May 28, 2026

Corporate

Intel Announces 2026 EPIC Supplier Award Recipients

Annual program recognizes suppliers that exemplify Intel’s standard of excellence.

March 19, 2026

How the Science of Burning Buildings Paves the Way to Advances in AI

Behind the Builders: Rajiv Mongia and Intel’s thermal team are pushing boundaries to keep the heat off Moore’s Law and big AI chips that are getting bigger and more powerful.

May 27, 2025