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Intel Introduces Thunderbolt 5 Connectivity Standard

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Media Alert: Join Intel Innovation on Sept. 19-20

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Intel, Lenovo Open Co-Engineering Lab in Shanghai

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Intel and ASUS Help Doctors Detect Cancer with AI-Boosted Solution

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Intel Announces Major Brand Update Ahead of Upcoming Meteor Lake Launch

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IDC Analysis: Intel Expands Market Opportunities

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Intel Announces Intel Arc Pro A60 and Pro A60M GPUs

News Client ComputingA circular plate with a vibrant pattern of diagonal pink, purple, and orange stripes, resembling a woven design. The plate is set against a plain gray background.

With PowerVia, Intel Achieves a Chipmaking Breakthrough

Intel’s Ben Sell explains how the company developed and proved the world's first backside power solution, taking a major step forward in chipmaking.

News Client ComputingClose-up of a silicon wafer displaying intricate patterns of microchips in a grid layout. The wafer reflects various colors under the light, with a clear edge against a black background.

PowerVia Test Shows Industry-Leading Performance

Intel is first to implement backside power in a product-like chip, resulting in over 90% cell utilization and other gains.

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AI Coming to the PC at Scale

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