Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors
How Intel Foundry uses Foveros stacking, EMIB silicon bridges, and EMIB-T to scale chiplets, bypass the reticle limit, and power massive AI workloads.
July 29, 2026
Intel Completes RAMP-C Program, Accelerating Momentum for Secure Enclave
Program enabled validated prototypes, ecosystem readiness, and early customer engagement, creating a path to domestic leadership in high-volume manufacturing
July 28, 2026
Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era
Collaboration combines Intel's advanced packaging expertise with Lens Technology's precision glass processing capabilities to deliver enhanced performance for future AI and datacenter workloads
July 24, 2026
Intel Reports Second-Quarter 2026 Financial Results
Intel’s second-quarter 2026 earnings news release and presentation are available on the company’s Investor Relations website.
July 23, 2026
Intel and Fortinet Collaborate to Advance Cybersecurity Innovation and Strengthen Global Supply Chain Resilience
Fortinet’s purpose-built ASIC expertise and Intel’s semiconductor design, packaging, and manufacturing capabilities will drive greater security, scale, performance, and resiliency for organizations
July 21, 2026
Intel-Powered Medical Exoskeleton Helps Patients Get Back on Their Feet
From muscle signals to movement: AI reimagines and speeds recovery.
July 17, 2026
Intel and Google Cloud Announce Collaboration to Accelerate Intel’s AI-Enabled Enterprise Transformation
Collaboration leverages Gemini Enterprise and Google Cloud to expand Intel’s AI workforce capabilities via scalable agentic workflows across core business functions
July 16, 2026
Intel Invests €5 Billion to Expand Manufacturing in Europe
Investment is expected to create permanent high-tech jobs and engage specialised tradespeople, while expanding leading-edge manufacturing capacity in Ireland.
July 13, 2026
Intel to Report Second-Quarter 2026 Financial Results
Intel will deliver its report after market close on July 23.
June 30, 2026
Three ways Intel and MSI co-engineered the world’s first Arc G3 handheld
Three generations across two years with one goal: bringing high-performance handheld gaming to life
June 30, 2026