英特爾公布Panther Lake架構：首款採用18A製程打造的AI PC平台

新聞重點

• Intel® Core™ Ultra處理器（系列3）（代號Panther Lake）為首款採用Intel 18A製程的客戶端系統單晶片（SoC）。
• Panther Lake 已經開始生產，進度符合客戶交付承諾。該平台預計將成為業界最廣泛採用的個人電腦平台。
• 首次亮相的Intel® Xeon® 6+（代號 Clearwater Forest）是英特爾採用18A技術的新一代伺服器產品，將帶來顯著的能源效率與效能提升。
• Intel 18A 是目前在美國研發並製造的最先進半導體製程節點。
• 位於亞利桑那州的Fab 52廠已全面啟用，預計今年稍晚將以Intel 18A製程進入量產階段，強化美國在技術與製造的領導地位。

 2025年10月9日—英特爾今（9）日公布新一代客戶端Intel® Core™ Ultra處理器（系列3）（代號 Panther Lake）的架構細節，該產品預計將於今年稍晚開始出貨。Panther Lake是英特爾首款採用Intel 18A製程的產品，而Intel 18A是在美國研發與製造的最先進半導體製程技術。

英特爾同時預告首款基於Intel 18A的伺服器處理器Xeon 6+（代號Clearwater Forest），預計將於2026年上半年推出。Panther Lake、Clearwater Forest及多代採用Intel 18A的產品，都在亞利桑那州錢德勒市（Chandler）最先進的Fab 52晶圓廠進行生產。這象徵英特爾的關鍵里程碑，強化美國技術和製造領導地位，並打造具韌性的半導體供應鏈。

英特爾執行長陳立武表示：「我們正邁入一個令人興奮的運算新時代，這得益於半導體技術的重大躍進，它將深遠影響未來數十年的發展。我們的新一代運算平台結合領先的製程技術、製造和先進封裝能力，將成為推動公司創新的關鍵引擎，助力我們打造嶄新的英特爾。美國一直是英特爾最先進的研發、產品設計和製造重鎮；我們很自豪能夠延續這項傳承，持續擴大在美國的營運版圖，並將創新成果帶給市場。」

更多參考資料：Intel Technology Tour 2025

A photo from September 2025 at Intel’s new Fab 52 in Chandler, Arizona, shows manufacturing workstations where the first products on Intel 18A will pass through. (Credit: Intel Corporation)

An Intel manufacturing technician holds a Clearwater Forest chip inside the cleanroom of Intel’s new Fab 52 in Chandler, Arizona, in September 2025. Fab 52 is the U.S. home to Intel 18A, where Clearwater Forest, a data center processor, will be manufactured. (Credit: Intel Corporation)

An Intel manufacturing technician holds a Panther Lake chip inside the cleanroom of Intel’s new Fab 52 in Chandler, Arizona, in September 2025. Fab 52 is the U.S. home to Intel 18A, where Panther Lake, a consumer and client laptop processor, is being manufactured. (Credit: Intel Corporation)

Intel manufacturing technicians collaborate on production of Intel Core Ultra series 3 processors inside Intel’s new Fab 52 in Chandler, Arizona, in September 2025. (Credit: Intel Corporation)

An Intel manufacturing technician inside the new Fab 52 in Chandler, Arizona, in September 2025. (Credit: Intel Corporation).

An Intel manufacturing technician holds an Intel Core Ultra series 3 processor (code-named Panther Lake) built on Intel 18A, inside Intel’s new Fab 52 in Chandler, Arizona, in September 2025. (Credit: Intel Corporation).

A drone photo shows Intel’s new Fab 52 in Chandler, Arizona, in September 2025. Fab 52 is Intel’s fifth high-volume fab at its Ocotillo campus. This facility will produce the most advanced logic chips in the United States and is part of the $100 billion Intel is investing to expand its domestic operations. (Credit: Intel Corporation)

A drone photo shows Intel’s new Fab 52 in Chandler, Arizona, in September 2025. Fab 52 is Intel’s fifth high-volume fab at its Ocotillo campus. This facility will produce the most advanced logic chips in the United States and is part of the $100 billion Intel is investing to expand its domestic operations. (Credit: Intel Corporation)

A drone photo shows Intel’s new Fab 52 in Chandler, Arizona, in September 2025. Fab 52 is Intel’s fifth high-volume fab at its Ocotillo campus. This facility will produce the most advanced logic chips in the United States and is part of the more than $100 billion Intel is investing to expand its domestic operations. (Credit: Intel Corporation)

A drone photo shows Intel’s new Fab 52 in Chandler, Arizona, in September 2025. Fab 52 is Intel’s fifth high-volume fab at its Ocotillo campus. This facility will produce the most advanced logic chips in the United States and is part of the $100 billion Intel is investing to expand its domestic operations. (Credit: Intel Corporation)

Panther Lake：以18A製程打造可擴展的AI PC效能

Intel® Core™ Ultra處理器（系列3）為首款採用Intel 18A製程的客戶端系統單晶片（SoC），將廣泛支持消費型與商用AI PC、遊戲裝置和邊緣運算解決方案。Panther Lake採用可擴展的多晶片（multi-chiplet）架構，為合作夥伴在不同的外型規格、應用領域與價格帶方面，提供前所未有的靈活性。

主要特色包括：

• 具備Lunar Lake等級的能源效率和Arrow Lake同級的效能表現¹。
• 配備高達16顆全新的效能核心（P-cores）和效率核心（E-cores），CPU效能比前一代提升超過50%以上²。
• 配備高達12個X^e核心的新Intel® Arc™ GPU，圖形效能比前一代提升超過50%以上³。
• 平衡的XPU設計可實現更高層級的AI加速，平台運算效能最高可達180 TOPS（每秒180兆次運算，trillions of operations per second）⁴。

除了個人電腦之外，Panther Lake也將延伸至邊緣運算應用，包括機器人技術。全新的Intel Robotics AI軟體套件與參考開發版，讓客戶能運用Panther Lake的運算與AI感知能力，快速開發具成本效益的機器人。

Panther Lake將於今年開始進入量產，第一款產品預計在年底前出貨，並於2026年1月進入市場。

Clearwater Forest：為現代資料中心帶來高效率和規模

Clearwater Forest是英特爾的新一代效率核心處理器，命名為Intel Xeon 6+，為英特爾迄今效率最高的伺服器處理器，採用Intel 18A製程。Xeon 6+預計於2026年上半年正式推出。

主要特色包括：

• 高達288個效率核心。
• 每周期指令數（Instructions Per Cycle，IPC）比前一代產品提升17%。
• 在密度、吞吐量和能耗效率方面均大幅提升。

Clearwater Forest專為超大規模資料中心、雲端服務供應商和電信業者量身打造，協助企業擴展工作負載、降低能源成本，並推動更智慧化的服務運作。

Intel 18A：為美國技術樹立新的產業標準

 Intel 18A是首個在美國研發和製造的2奈米等級製程節點。相較於Intel 3，其每瓦效能提升高達15%，晶片密度增加30%⁵。該製程節點在英特爾的俄勒岡州據點完成研發與製造驗證，並已投入早期生產，目前正於亞利桑那州邁入量產階段。

Intel 18A的關鍵創新包括：

• RibbonFET：英特爾十年多來推出的首款新電晶體架構，可實現更好的擴充和更高效率的切換，提升效能和能源效率。
• PowerVia：創新的晶片背部供電技術，提升電流傳輸和訊號傳遞。

此外，英特爾的先進封裝與3D晶片堆疊技術Foveros，可將多個晶片模組堆疊並整合在先進的單晶片（SoC）設計中，進而在系統層面提供更高的靈活性、可擴充性與效能。

Intel 18A將成為未來至少三個世代的英特爾客戶端與伺服器產品的技術基礎。

Fab 52：立基於英特爾在美國五十年的研發和製造投資

Fab 52為英特爾位於亞利桑那州錢德勒市Ocotillo園區的第五座大規模量產晶圓廠，生產美國最先進的邏輯晶片。此新廠是英特爾投資1,000億美元以拓展美國營運版圖的重要一環。

憑藉在俄勒岡州的先進研發與生產能力、亞利桑那州的大規模製造，以及新墨西哥州的封裝作業，英特爾擁有獨特優勢，可支持國家關鍵優先事項，為英特爾晶圓客戶提供策略性產能。Fab 52承襲英特爾在美國的56年來的研發與製造優勢，象徵在AI時代建立備受信賴的先進美國晶圓代工的重要里程碑。

更多內容：什麼是 x86 架構？現代運算基礎入門

^{For all claims, see intel.com/performanceindex for additional details.  Results may vary.}

 ^{1   As estimated by SPECrate®2017_int_base (n copies) for long-term expected steady state processor power consumption. As of September 2025. Results may vary. See intel.com/performanceindex for details.}

^{2 As estimated by SPECrate®2017_int_base (n copies). As of September 2025. Results may vary. See intel.com/performanceindex for details.}

^{3 As measured on Panther Lake reference validation platform measurement vs Lunar Lake and Arrow Lake-H reference validation platforms as measured by 3Dmark Solar Bay, Cyberpunk 2077 and Borderlands 3.}

^{4  Based on product specification. See ark.intel.com for more information.}

^{5 Based on Intel internal analysis comparing Intel 18A to Intel 3 as of February 2024. Results may vary. https://www.intel.com/content/www/us/en/foundry/process/18a.html}

^{Forward-Looking Statements}

^{This release contains forward-looking statements that involve a number of risks and uncertainties. Words such as "accelerate", "achieve", "aim", "ambitions", "anticipate", "believe", "committed", "continue", "could", "designed", "estimate", "expect", "forecast", "future", "goals", "grow", "guidance", "intend", "likely", "may", "might", "milestones", "next generation", "objective", "on track", "opportunity", "outlook", "pending", "plan", "position", "possible", "potential", "predict", "progress", "ramp", "roadmap", "seek", "should", "strive", "targets", "to be", "upcoming", "will", "would", and variations of such words and similar expressions are intended to identify such forward-looking statements, which may include statements regarding:}

• ^{Our Intel® Core™ Ultra processors series 3 (code-named Panther Lake) and Intel® Xeon® 6+ processors (code-named Clearwater Forest), including expected timing, industry adoption and applicability, architecture, specifications, power usage, efficiency, performance, and capabilities; and}
• ^{Our Intel 18A process node and high-volume production of such node at Arizona Fab 52, including expected timing, performance-per-watt, chip density, energy efficiency, process leadership, usage for future client and server products, and domestic manufacturing investments.}

^{Such statements involve many risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including those associated with:}

• ^{The high level of competition and rapid technological change in our industry;}
• ^{The significant long-term and inherently risky investments we are making in R&D and manufacturing facilities that may not realize a favorable return;}
• ^{The complexities and uncertainties in developing and implementing new semiconductor products and manufacturing process technologies;}
• ^{Our ability to time and scale our capital investments appropriately and successfully secure favorable alternative financing arrangements and government grants;}
• ^{Implementing new business strategies and investing in new businesses and technologies;}
• ^{Changes in demand for our products;}
• ^{Macroeconomic conditions and geopolitical tensions and conflicts, including geopolitical and trade tensions between the U.S. and China, the impacts of Russia's war on Ukraine, tensions and conflict affecting Israel and the Middle East, and rising tensions between mainland China and Taiwan;}
• ^{The evolving market for products with AI capabilities;}
• ^{Our complex global supply chain supporting our manufacturing facilities and incorporating external foundries, including from disruptions, delays, trade tensions and conflicts, or shortages;}
• ^{Recently elevated geopolitical tensions, volatility and uncertainty with respect to international trade policies, including tariffs and export controls, impacting our business, the markets in which we compete and the world economy;}
• ^{Product defects, errata and other product issues, particularly as we develop next-generation products and implement next-generation manufacturing process technologies;}
• ^{Potential security vulnerabilities in our products;}
• ^{Increasing and evolving cybersecurity threats and privacy risks;}
• ^{IP risks including related litigation and regulatory proceedings;}
• ^{The need to attract, retain, and motivate key talent;}
• ^{Strategic transactions and investments;}
• ^{Sales-related risks, including customer concentration and the use of distributors and other third parties;}
• ^{Our significantly reduced return of capital in recent years;}
• ^{Our debt obligations and our ability to access sources of capital;}
• ^{Complex and evolving laws and regulations across many jurisdictions;}
• ^{Fluctuations in currency exchange rates;}
• ^{Changes in our effective tax rate;}
• ^{Catastrophic events;}
• ^{Environmental, health, safety, and product regulations;}
• ^{Our initiatives and new legal requirements with respect to corporate responsibility matters; and}
• ^{Other risks and uncertainties described in this release, our 2024 Form 10-K, our Q1 2025 Form 10-Q, our Q2 2025 Form 10-Q, and our other filings with the SEC.}

^{Given these risks and uncertainties, readers are cautioned not to place undue reliance on such forward-looking statements. Readers are urged to carefully review and consider the various disclosures made in this release and in other documents we file from time to time with the SEC that disclose risks and uncertainties that may affect our business.}

 ^{The forward-looking statements in this release are based on management's expectations as of the date of this release, unless an earlier date is specified, including expectations based on third-party information and projections that management believes to be reputable. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law.}