Intel’s Ohio Groundbreaking Ceremony (Replay)

September 9, 2022 Published
Ohio political, education and local leaders join Intel CEO Pat Gelsinger and other Intel executives in a ceremonial groundbreaking to mark the start of construction on the company's newest U.S. manufacturing site on Friday, Sept. 9, 2022, in Licking County, Ohio. Intel is investing more than $20 billion in the new semiconductor manufacturing site to produce leading-edge chips. (Credit: Intel Corporation)

Ohio political, education and local leaders join Intel CEO Pat Gelsinger and other Intel executives in a ceremonial groundbreaking to mark the start of construction on the company's newest U.S. manufacturing site on Friday, Sept. 9, 2022, in Licking County, Ohio. Intel is investing more than $20 billion in the new semiconductor manufacturing site to produce leading-edge chips. (Credit: Intel Corporation)

Intel CEO Pat Gelsinger is joined by President Joe Biden, Ohio Gov. Mike DeWine and other government officials at Intel’s new Ohio manufacturing site.

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In a webcast on Friday, Sept. 9, President Joe Biden joined Intel CEO Pat Gelsinger in Licking County, Ohio, to celebrate breaking ground on Intel’s newest U.S. manufacturing site in 40 years. In January, Intel announced an investment of more than $20 billion in the new semiconductor manufacturing site to produce leading-edge chips.

President Biden delivered remarks on rebuilding American manufacturing through the CHIPS and Science Act and the Bipartisan Infrastructure Law. Ohio Gov. Mike DeWine and other federal, state and local officials also took part in the event.

More Details: Intel Invests in Ohio (Press Kit)

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