Press Kit: Intel Technology Tour 2025

Intel introduced the Intel® Core™ Ultra series 3 processors (code-named Panther Lake) and gave a first look at Intel® Xeon® 6+ (code-named Clearwater Forest), both built on Intel 18A. Intel 18A is the most advanced semiconductor node developed and manufactured in the United States. Both Panther Lake and Clearwater Forest, as well as multiple generations of products built on Intel 18A, are being manufactured at Fab 52, Intel’s new, state-of-the-art factory in Chandler, Arizona

News

Press release: Intel Unveils Panther Lake Architecture: First AI PC Platform Built on 18A

Intel senior vice president and general manager of the Client Computing Group Jim Johnson delivers a keynote address at Intel Technology Tour 2025 in Arizona. Johnson explained the architecture highlights of the next generation of Intel Core Ultra, code-named Panther Lake. (Credit: Intel Corporation)

Tech media and industry analysts from around the world get their first look at an Intel Core Ultra series 3 wafer (code-named Panther Lake) during September’s Intel Technology Tour 2025 in Chandler, Arizona. (Credit: Intel Corporation)

Kevork Kechichian, Executive Vice President and GM of Intel’s Data Center Group, holds an Intel Xeon 6+ wafer, (code-named Clearwater Forest) on stage at Intel Technology Tour 2025 in September. Clearwater Forest is Intel's next generation Efficient-core (E-core) processor. It’s the most efficient server processor the company has ever created, and is built on Intel 18A. (Credit: Intel Corporation)

An Intel Xeon 6+ (code-named Clearwater Forest) wafer on display at September’s Intel Technology Tour 2025. Clearwater Forest is expected to launch in the first half of 2026. (Credit: Intel Corporation)

An Intel Xeon 6+ processor (code-named Clearwater Forest) built on Intel 18A process technology shown during the September 2025 Intel Technology Tour in Chandler, Arizona. (Credit: Intel Corporation). 

Tech media and industry analysts from around the world watch and listen as Intel technical marketing engineer Joe Broderick showcases how Panther Lake will up-level efficiency and performance from previous generations of Intel Core Ultra processors. (Credit: Intel Corporation)

A closer look at Fab 52

Intel Arizona's Fab 52 is Intel’s fifth high-volume fab at its Ocotillo campus. This facility will produce the most advanced logic chips in the United States and is part of the more than $100 billion Intel is investing to expand its domestic operations.

A photo from September 2025 at Intel’s new Fab 52 in Chandler, Arizona, shows manufacturing workstations where the first products on Intel 18A will pass through. (Credit: Intel Corporation)

An Intel manufacturing technician holds a Clearwater Forest chip inside the cleanroom of Intel’s new Fab 52 in Chandler, Arizona, in September 2025. Fab 52 is the U.S. home to Intel 18A, where Clearwater Forest, a data center processor, will be manufactured. (Credit: Intel Corporation)

An Intel manufacturing technician holds a Panther Lake chip inside the cleanroom of Intel’s new Fab 52 in Chandler, Arizona, in September 2025. Fab 52 is the U.S. home to Intel 18A, where Panther Lake, a consumer and client laptop processor, is being manufactured. (Credit: Intel Corporation)

Intel manufacturing technicians collaborate on production of Intel Core Ultra series 3 processors inside Intel’s new Fab 52 in Chandler, Arizona, in September 2025. (Credit: Intel Corporation)

An Intel manufacturing technician inside the new Fab 52 in Chandler, Arizona, in September 2025. (Credit: Intel Corporation).

An Intel manufacturing technician holds an Intel Core Ultra series 3 processor (code-named Panther Lake) built on Intel 18A, inside Intel’s new Fab 52 in Chandler, Arizona, in September 2025. (Credit: Intel Corporation).

A drone photo shows Intel’s new Fab 52 in Chandler, Arizona, in September 2025. Fab 52 is Intel’s fifth high-volume fab at its Ocotillo campus. This facility will produce the most advanced logic chips in the United States and is part of the $100 billion Intel is investing to expand its domestic operations. (Credit: Intel Corporation)

A drone photo shows Intel’s new Fab 52 in Chandler, Arizona, in September 2025. Fab 52 is Intel’s fifth high-volume fab at its Ocotillo campus. This facility will produce the most advanced logic chips in the United States and is part of the $100 billion Intel is investing to expand its domestic operations. (Credit: Intel Corporation)

A drone photo shows Intel’s new Fab 52 in Chandler, Arizona, in September 2025. Fab 52 is Intel’s fifth high-volume fab at its Ocotillo campus. This facility will produce the most advanced logic chips in the United States and is part of the more than $100 billion Intel is investing to expand its domestic operations. (Credit: Intel Corporation)

A drone photo shows Intel’s new Fab 52 in Chandler, Arizona, in September 2025. Fab 52 is Intel’s fifth high-volume fab at its Ocotillo campus. This facility will produce the most advanced logic chips in the United States and is part of the $100 billion Intel is investing to expand its domestic operations. (Credit: Intel Corporation)

On October 6, Intel CEO Lip-Bu Tan visited Fab 52 to meet with manufacturing leaders, including Zivit Katz-Tsameret, Vice President, Intel Foundry Manufacturing and Supply Chain, Factory Manager.

Intel CEO Lip-Bu Tan gowns up in a clean room bunny suit inside Fab 52 in Chandler, Arizona ahead of his October 2025 tour of the new factory building processors on Intel 18A. Joining him on the tour is Zivit Katz-Tsameret (right), Vice President, Intel Foundry Manufacturing and Supply Chain and Arizona Factory Manager. Anyone entering a semiconductor manufacturing environment must wear appropriate personal protective equipment (PPE), including what is popularly known as a "bunny suit," to protect the wafers and chips in production. (Credit: Intel Corporation)

Intel CEO Lip-Bu Tan (right) listens as manufacturing leaders lead a tour inside Fab 52 on the Intel Ocotillo campus in Chandler, Arizona in October 2025. Anyone entering a semiconductor manufacturing environment must wear appropriate personal protective equipment (PPE), including what is popularly known as a "bunny suit," to protect the wafers and chips in production. (Credit: Intel Corporation)

Intel CEO Lip-Bu Tan (center) stands with Jason Reid, Intel 18A Lithography Dept. Manager, (left) and Zivit Katz-Tsameret (right), Vice President, Intel Foundry Manufacturing and Supply Chain and Arizona Factory Manager, in front of an EUV lithography scanner used to print the next generation of Intel Core Ultra processors, code-named Panther Lake. Panther Lake is the first product to be manufactured on Intel 18A at Fab 52. Tan toured the Chandler, Arizona facility in October 2025. (Credit: Intel Corporation)

Intel manufacturing leaders, along with CEO Lip-Bu Tan (center) are gowned up in clean room bunny suits as they tour Fab 52 on the Intel Ocotillo campus in Chandler, Arizona in October 2025. Fab 52 is the U.S. home to Intel 18A, where Panther Lake, Intel’s next generation of consumer and client laptop processor, is being manufactured. (Credit: Intel Corporation)

Intel CEO Lip-Bu Tan holds a wafer of CPU tiles for the Intel Core Ultra series 3, code-named Panther Lake, at the Intel Ocotillo campus in Chandler, Arizona. Panther Lake is the first client system-on-chips (SoC) built on the Intel 18A process node. (Credit: Intel Corporation)

Zivit Katz-Tsameret, Vice President, Intel Foundry Manufacturing and Supply Chain, Factory Manager holds a Panther Lake chip outside Intel Arizona’s Ocotillo campus in September 2025. (Credit: Intel Corporation).

B-Roll Video

B-roll video captured during Intel Tech Tour shows the exterior and interior of Arizona's Fab 52, Intel's fifth high-volume fab near Chandler, Arizona.