Seok-Hee Lee is executive vice president of Intel Foundry at Intel Corporation. He leads advanced packaging, system integration, back-end technology development and back-end manufacturing, with a focus on strengthening Intel’s advanced packaging and system integration capabilities for foundry customers. 

Lee is a semiconductor industry veteran with deep experience leading complex, high-scale technology and manufacturing organizations. He previously served as president and CEO of SK On and as CEO of SK hynix, where he helped advance the company’s leadership in high-bandwidth memory for high-performance computing and artificial intelligence. He also led SK hynix’s acquisition of Intel’s NAND memory business and the formation of Solidigm. 

Earlier in his career, Lee spent 10 years at Intel in the Portland Technology Development group, working on process integration and yield for advanced logic technologies. He managed a team responsible for developing 32-nanometer logic process technology and helped deliver Intel’s high-k metal gate technology. 

Lee also served as an associate professor of electrical engineering at the Korea Advanced Institute of Science and Technology. He has authored or co-authored more than 60 research papers and received three Intel Achievement Awards. 

Lee earned bachelor’s and master’s degrees in materials science and engineering from Seoul National University and a doctorate in materials science and engineering from Stanford University.