US CHIPS Act Funding for Intel

November 26, 2024 Last Updated
March 20, 2024 Published
Construction workers wearing helmets and safety gear are assembling a large metal structure at a construction site. A crane supports the structure, and other cranes are visible in the background against a clear blue sky.

In September 2023, ironworkers lower one of many rebar cages to create the main factory floor of one of Intel’s two new factories in Chandler, Arizona. Concrete will later be poured to surround the rebar. Building an Intel chip fab requires about 600,000 cubic meters of concrete. (Credit: Intel Corporation)

Award supports Intel’s plans to advance American semiconductor manufacturing and technology leadership.

On Nov. 26, 2024, Intel Corporation and the U.S. Department of Commerce announced an agreement to award the company $7.86 billion in direct funding for its commercial semiconductor manufacturing projects under the U.S. CHIPS and Science Act. This announcement follows the preliminary memorandum of terms agreement announced March 20, 2024.

CHIPS Act funding aims to increase U.S. semiconductor manufacturing and research and development capabilities, especially for leading-edge semiconductors.

Funding will help advance Intel’s critical semiconductor manufacturing and advanced packaging projects at its sites in Arizona, New Mexico, Ohio and Oregon – U.S. locations where the company produces some of the world’s most advanced chips and semiconductor packaging technologies.

Together, CHIPS Act funding and Intel’s previously announced plans to invest more than $100 billion in the U.S. constitutes one of the largest public-private investments in the U.S. semiconductor industry.

‘It’s Our Calling’: Intel, US Government Restoring Semiconductor Leadership

‘It’s Our Calling’: Intel, US Government Restoring Semiconductor Leadership

Watch sights and sounds from the CHIPS and Science Act event at Intel Arizona on March 20, 2024, attended by U.S. President Joe Biden, U.S. Secretary of Commerce Gina Raimondo, Intel CEO Pat Gelsinger, and other government and Intel leaders. The U.S. government granted Intel $8.5 billion in CHIPS Act funding. Gelsinger said restoring semiconductor leadership in the U.S. is “our calling.” (Credit: Intel Corporation)

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Event Photos

A woman signs a large wafer mounted on a plaque at a ceremony, while a man in a suit watches. Several people stand in the background, some taking photos. The setting appears to be a professional or corporate environment.
Two people smile while holding a framed memento featuring a large circle and signatures. They stand in a brightly lit room with a blue wall backdrop featuring a small Intel logo.
A group of people in formal attire stands in a high-tech facility with Intel in the background. They are gathered around tables displaying silicon wafers. Signs on the tables read Investing in America. The room is filled with advanced equipment.
Three men in suits stand in a technology facility, engaged in conversation. One in the center gestures with his hands. In front of them are several large, round silicon wafers. They appear to be discussing technology or manufacturing.
A person in a suit and yellow tie is seated outdoors at a construction site. A large crane is in the background, along with steel framework of a building under construction. The individual is smiling and there is a microphone stand nearby.
A man in a blue suit and sunglasses speaks at a podium with the presidential seal. An American flag is displayed in the background. Construction equipment is visible, suggesting a worksite setting.
A person in a suit speaks at a podium with the presidential seal. The backdrop includes construction equipment and an American flag. Signs reading Investing in are partially visible.
A man stands at a podium with the U.S. presidential seal, speaking into microphones. Behind him, a large American flag is displayed on a construction site with an excavator. Industrial structures are visible in the background.
A man in a suit and sunglasses speaks at a podium with the presidential seal. Two teleprompters stand nearby. Behind him, a large American flag and construction equipment are visible under a clear blue sky.
A woman signs a large wafer mounted on a plaque at a ceremony, while a man in a suit watches. Several people stand in the background, some taking photos. The setting appears to be a professional or corporate environment.
Two people smile while holding a framed memento featuring a large circle and signatures. They stand in a brightly lit room with a blue wall backdrop featuring a small Intel logo.
A group of people in formal attire stands in a high-tech facility with Intel in the background. They are gathered around tables displaying silicon wafers. Signs on the tables read Investing in America. The room is filled with advanced equipment.
Three men in suits stand in a technology facility, engaged in conversation. One in the center gestures with his hands. In front of them are several large, round silicon wafers. They appear to be discussing technology or manufacturing.
A person in a suit and yellow tie is seated outdoors at a construction site. A large crane is in the background, along with steel framework of a building under construction. The individual is smiling and there is a microphone stand nearby.
A man in a blue suit and sunglasses speaks at a podium with the presidential seal. An American flag is displayed in the background. Construction equipment is visible, suggesting a worksite setting.
A person in a suit speaks at a podium with the presidential seal. The backdrop includes construction equipment and an American flag. Signs reading Investing in are partially visible.
A man stands at a podium with the U.S. presidential seal, speaking into microphones. Behind him, a large American flag is displayed on a construction site with an excavator. Industrial structures are visible in the background.
A man in a suit and sunglasses speaks at a podium with the presidential seal. Two teleprompters stand nearby. Behind him, a large American flag and construction equipment are visible under a clear blue sky.

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Site Fact Sheets

B-Roll Videos

‘It’s Our Calling’: Intel Construction, Manufacturing and Advanced Assembly Test Manufacturing across the Unites States (B-Roll)

Intel Construction, Manufacturing and Advanced Assembly Test Manufacturing across the Unites States (B-Roll)

B-roll video includes footage of construction and production at Intel manufacturing facilities across the United States. It includes footage from Intel facilities in Hillsboro, Oregon; Chandler, Arizona; Rio Rancho, New Mexico; and Licking County, Ohio. Footage includes high-volume manufacturing in Intel’s D1D and D1X factories in Oregon; Fab 42 in Arizona; and Fab 9 and Fab 11X in New Mexico. It also includes video from Intel’s advanced packaging facilities in Arizona and Oregon. (Credit: Intel Corporation)

Download video: “Intel Construction, Manufacturing and Advanced Assembly Test Manufacturing across the Unites States (B-Roll)”

Photo Galleries

Intel Executive Leaders

  • David Zinsner, executive vice president and the chief financial officer
  • Kevin O’Buckley, senior vice president and general manager of Foundry Services
  • Naga Chandrasekaran, executive vice president, chief global operations officer and general manager of Intel Foundry Manufacturing and Supply Chain
  • April Miller Boise, executive vice president and chief legal officer
  • Christy Pambianchi, executive vice president and chief people officer
  • Dr. Ann B. Kelleher, executive vice president and general manager of Foundry Technology Development
  • Bruce Andrews, corporate vice president and chief government affairs officer
  • Al Thompson, vice president, U.S.-Canada Government Affairs

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