英特爾晶圓代工與客戶、合作夥伴齊聚，共同擘劃優先目標

【台北訊，2025年4月30日】英特爾今（30）日於「Intel Foundry Direct Connect 2025」活動中，分享多個世代核心製程與先進封裝技術的最新進展，並宣布全新生態系計畫與合作夥伴關係，邀請產業領袖共同探討系統級晶圓代工方法如何促進夥伴間的合作，進而協助客戶實現創新。

英特爾執行長陳立武為此次活動揭開序幕，說明英特爾晶圓代工邁向下一階段策略的最新進展與優先目標。英特爾技術與營運長暨英特爾代工技術與製造部門總經理Naga Chandrasekaran和英特爾晶圓代工服務總經理Kevin O’Buckley緊接著發表主題演講，分享製程及先進封裝的最新消息，並強調英特爾晶圓代工全球化的多元製造與供應鏈。

活動中英特爾執行長陳立武將與益華電腦、普迪飛半導體（PDF Solutions）、Siemens EDA以及新思科技等生態系合作夥伴齊聚舞台，強調彼此合作服務晶圓代工客戶的重要性。此外，在O’Buckley的主題演講中，聯發科、微軟以及高通的高階主管也將現身參與討論。

英特爾執行長陳立武表示：「英特爾致力打造世界級的晶圓代工廠，以滿足市場對於尖端製程技術、先進封裝和製造日益成長的需求。我們的首要任務是傾聽客戶需求，並創造出助力客戶成功的解決方案以贏得信任。我們正努力於英特爾內部推動工程優先的文化，同時加強與整體晶圓代工生態系夥伴之間的關係，這將有助於我們推進策略、提升執行力並在市場上取得長期的成功。」

英特爾晶圓代工Direct Connect 2025 新聞資料

Intel Foundry Direct Connect 2025發布的消息涵蓋核心製程與先進封裝、在美國發展製造的里程碑，以及贏得晶圓代工客戶信任所需的生態系支援。內容包括：

製程技術（Process Technology）

• 英特爾晶圓代工已開始與主要客戶針對其下一代製程技術「Intel 14A」展開合作，此技術為Intel 18A製程的接續技術。英特爾已向主要客戶發布Intel 14A製程設計套件（PDK）的早期版本。目前已有多家客戶表達有意願在新製程節點上生產測試晶片。
• Intel 14A將採用PowerDirect直接接觸供電技術（direct contact power delivery），此技術奠基於Intel 18A的PowerVia背部供電技術發展而成。
• Intel 18A已進入風險試產階段，預期今年將達到量產規模。英特爾晶圓代工生態系夥伴已準備好支援生產設計所需的電子設計自動化（EDA）、參考流程和矽智財（IP）。
• Intel 18A新衍生製程「Intel 18A-P」專為更廣泛的晶圓代工客戶提供更強化的效能，基於此製程的早期晶圓已準備就緒。而Intel 18A-P將與Intel 18A的設計規則相容，針對此製程，IP和EDA合作夥伴已開始更新相對應的產品與服務。
• 英特爾 18A-PT 是另一新的衍生製程，於英特爾 18A-P 的效能和功耗效率基礎上再進而提升。英特爾 18A-PT 透過 Foveros Direct 3D 混合鍵合技術連接頂部晶片，達成互連間距小於 5 微米（µm）。
• 英特爾晶圓代工首個16奈米製程流片（tape-out）已於晶圓廠進行試產，同時，英特爾正與主要客戶合作，針對先前與聯華電子共同開發的12奈米製程及其衍生產品進行研發。

欲了解更多關於英特爾晶圓代工製程技術，敬請造訪：https://www.intel.com/content/www/us/en/foundry/process.html

先進封裝（Advanced Packaging）

• 英特爾晶圓代工透過Foveros Direct（3D堆疊）和嵌入式多晶片互連橋接EMIB（5D橋接）技術，將Intel 14A製程與Intel 18A-PT進行連接，實現系統級整合。
• 全新先進封裝技術產品包括EMIB-T，可滿足未來高頻寬記憶體需求。此外，Foveros架構新增了兩項技術，分別為Foveros-R和Foveros-B，能為客戶提供更有效率和彈性的選擇。
• 透過與艾克爾國際科技股份有限公司（Amkor Technology, Inc.）合作，客戶可依據自身需求選擇合適的先進封裝技術。

欲了解更多關於英特爾晶圓代工先進封裝與測試技術，請造訪：https://www.intel.com/content/www/us/en/foundry/packaging.html

製造（Manufacturing）

• 英特爾位於美國亞利桑納州的Fab 52晶圓廠已成功營運，並完成首批晶圓製造，展現公司今年在美國建立先進Intel 18A晶圓製造方面取得進展。Intel 18A將於今年稍晚在奧勒岡州晶圓廠開始量產，而亞利桑那州晶圓廠將在今年稍晚逐步提升製造生產。Intel 18A、14A製程的研究、開發與晶圓生產都將在美國進行。

欲了解更多關於英特爾晶圓代工製造相關資訊，請造訪：https://www.intel.com/content/www/us/en/foundry/manufacturing.html

生態系（Ecosystem）

• 英特爾晶圓代工加速聯盟推出多項新計畫，包括「英特爾晶圓代工小晶片聯盟（Intel Foundry Chiplet Alliance）」和「價值鏈聯盟（Value Chain Alliance）」，同時還有來自一流生態系夥伴的各項合作發布。

欲了解更多關於英特爾晶圓代工生態系聯盟，請造訪：https://www.intel.com/content/www/us/en/foundry/accelerator.html

為客戶提供可信賴的生態系工具和矽智財

英特爾晶圓代工藉由值得信賴且經驗證的生態系夥伴，提供完整的IP、EDA和設計服務解決方案產品組合，驅動先進發展，突破傳統製程節點的微縮技術。作為英特爾晶圓代工加速聯盟最新計畫，英特爾晶圓代工小晶片聯盟初期將聚焦於政府應用和關鍵商用市場，定義並推動先進技術的基礎架構。此聯盟將為客戶提供有保障且可規模化的路徑，協助客戶針對特定應用與市場，運用可互通且安全的小晶片解決方案進行布署設計。（夥伴證言：英特爾晶圓代工小晶片聯盟）

英特爾晶圓代工加速聯盟（Intel Foundry Accelerator Alliance）生態系包括矽智財（IP）、電子設計自動化（EDA）、設計服務、雲端以及美國軍事、航太與政府（USMAG）等聯盟。

^{Forward-Looking Statements}

^{This release contains forward-looking statements that involve a number of risks and uncertainties, including with respect to our business plans and strategy and anticipated benefits therefrom, our fabrication process technology roadmap, our advanced packaging roadmap, our manufacturing facilities, and our ecosystem alliances, tools and IP. Such statements involve many risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including those associated with:}

• ^{the high level of competition and rapid technological change in our industry;}
• ^{the significant long-term and inherently risky investments we are making in R&D and manufacturing facilities that may not realize a favorable return;}
• ^{the complexities and uncertainties in developing and implementing new semiconductor products and manufacturing process technologies;}
• ^{our ability to time and scale our capital investments appropriately and successfully secure favorable alternative financing arrangements and government grants;}
• ^{implementing new business strategies and investing in new businesses and technologies;}
• ^{changes in demand for our products;}
• ^{macroeconomic conditions and geopolitical tensions and conflicts, including geopolitical and trade tensions between the U.S. and China, the impacts of Russia's war on Ukraine, tensions and conflict affecting Israel and the Middle East, and rising tensions between mainland China and Taiwan;}
• ^{the evolving market for products with AI capabilities;}
• ^{our complex global supply chain, including from disruptions, delays, trade tensions and conflicts, or shortages;}
• ^{recently elevated geopolitical tensions, volatility and uncertainty with respect to international trade policies, including tariffs and export controls, impacting our business, the markets in which we compete and the world economy;}
• ^{product defects, errata and other product issues, particularly as we develop next-generation products and implement next-generation manufacturing process technologies;}
• ^{potential security vulnerabilities in our products;}
• ^{increasing and evolving cybersecurity threats and privacy risks;}
• ^{IP risks including related litigation and regulatory proceedings;}
• ^{the need to attract, retain and motivate key talent;}
• ^{strategic transactions and investments;}
• ^{sales-related risks, including customer concentration and the use of distributors and other third parties;}
• ^{our significantly reduced return of capital in recent years;}
• ^{our debt obligations and our ability to access sources of capital;}
• ^{complex and evolving laws and regulations across many jurisdictions;}
• ^{fluctuations in currency exchange rates;}
• ^{changes in our effective tax rate;}
• ^{catastrophic events;}
• ^{environmental, health, safety and product regulations;}
• ^{our initiatives and new legal requirements with respect to corporate responsibility matters; and}
• ^{other risks and uncertainties described in this release, our 2024 Form 10-K, our Q1 2025 Form 10-Q, and our other filings with the SEC.}

^{Given these risks and uncertainties, readers are cautioned not to place undue reliance on such forward-looking statements. Readers are urged to carefully review and consider the various disclosures made in this release and in other documents we file from time to time with the SEC that disclose risks and uncertainties that may affect our business.}

^{Unless specifically indicated otherwise, the forward-looking statements in this release do not reflect the potential impact of any divestitures, mergers, acquisitions, or other business combinations that have not been completed as of the date of this filing. In addition, the forward-looking statements in this release are based on management's expectations as of the date of this release, unless an earlier date is specified, including expectations based on third-party information and projections that management believes to be reputable. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law.}

關於英特爾晶圓代工

英特爾晶圓代工為提供全方位服務的系統級晶圓代工廠，致力於提供領先製程和先進封裝技術。我們擁有先進的業界技術、豐富的IP組合、世界級的設計生態系，以及具備營運韌性的全球製造供應鏈。欲了解更多資訊，請造訪www.intel.com/foundry。