Press Kit: Intel Foundry Direct Connect 2025

press kit: intel foundry direct connect 2025. may 1, 2025 last updated april 29, 2025 published intel foundry intel foundry direct connect on april 29, 2025, in san jose, calif., brings together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). intel foundry shares process technology roadmap, advanced packaging momentum and ecosystem partnerships. in this article: news. infographic. images. social highlights. third-party news. at direct connect on april 29, 2025, intel foundry is bringing together more than 1,000 customers and ecosystem partners from around the globe. during an opening keynote, intel ceo lip-bu tan outlines top priorities as the company drives the next phase of its foundry strategy. this year’s event includes presentations on intel foundry’s progress, with a sharp focus on delivering the core process and advanced packaging technology, manufacturing capacity, ecosystem support and customer-driven culture required to earn the trust of foundry customers. tan is joined on stage by industry leaders to discuss how a systems foundry approach enables enhanced collaboration with partners and unlocks innovation for customers. ecosystem partners cadence design systems, siemens eda and synopsys highlight their collaborations to serve foundry customers. naga chandrasekaran, intel foundry chief technology and operations officer, and kevin o’buckley, general manager of foundry services, also deliver keynotes, sharing process and advanced packaging news while highlighting intel foundry’s globally diverse manufacturing and supply chain. news. news: intel foundry gathers customers and partners, outlines priorities. event video: intel foundry direct connect keynote: earning customers’ trust (replay) | keynote in 30 minutes (highlights). tech 101: explaining common chip terms | all tech 101s. explainer video: intel 18a process technology simply explained. quote sheet: introducing the intel foundry chiplet alliance. postcard from ifdc: chip roams intel factories. postcard from ifdc: the ultimate factory tour. infographic. download infographic (pdf, 200kb). images. event images. lip-bu tan, intel ceo, speaks in a keynote presentation at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). lip-bu tan (left), intel ceo, speaks with sassine ghazi, president and ceo of synopsys, at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). sassine ghazi, president and ceo of synopsys, speaks at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). intel ceo lip-bu tan (left) speaks with anirudh devgan, president and ceo of cadence, at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). intel ceo lip-bu tan (left) speaks with anirudh devgan, president and ceo of cadence, at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). lip-bu tan, intel ceo, speaks in a keynote presentation at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). intel ceo lip-bu tan (left) speaks with mike ellow, ceo of siemens eda, at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). intel ceo lip-bu tan (left) speaks with john kibarian, ceo of pdf solutions, at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). naga chandrasekaran, intel foundry chief technology and operations officer, at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). naga chandrasekaran, intel foundry chief technology and operations officer, at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). jessica unwin (left), software integration engineer at intel, manages “chip,” a robot used at intel factories, during a keynote with naga chandrasekaran (center), intel foundry chief technology and operations officer, and joe robison, system software architect, at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). jessica unwin, software integration engineer at intel, manages “chip,” a robot used at global intel factories, during a keynote event at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). “chip,” a robot used at intel factories around the world, checks the heat of a tool during a keynote event at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). naga chandrasekaran, intel foundry chief technology and operations officer, displays a wafer made on the intel 14a process node during a keynote at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). kevin o’buckley, general manager of foundry services, speaks during a keynote at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). kevin o’buckley, general manager of foundry services, speaks during a keynote at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). kevin engel, chief operating officer of amkor, speaks during a keynote event at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). kevin o’buckley (left), general manager of foundry services, speaks with kevin engel, chief operating officer of amkor, during a keynote event at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). kevin o’buckley, general manager of foundry services, displays a next-generation test chip demonstrating intel foundry’s advanced packaging capabilities during a keynote at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). foundry images. an intel foundry engineer in clean room gear holds a silicon wafer at an intel manufacturing facility in chandler, arizona. (credit: intel foundry). a photo shows intel high-density modular test singulated die sort, or test platform, at an intel foundry manufacturing facility in hillsboro, oregon. (credit: intel foundry). intel 18a, intel foundry's leading-edge process node, is on track for production in 2025. with ribbonfet and powervia, foundry customers will unlock greater processor scale and efficiency to drive the future of ai computing. (credit: intel foundry). progress continues at intel’s ocotillo campus in chandler, arizona, where intel is investing more than $32 billion to build two new leading-edge chip factories and modernize an existing fab. a photo from october 2024 shows the site where intel will produce the world’s most advanced logic chips. the new factories will support the growing demand for intel’s products and provide committed capacity for intel foundry customers. (credit: intel corporation). show floor images. intel foundry guests, customers and ecosystem partners explore the show floor and experience demonstrations and deep-dive technical conversations at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). intel foundry guests, customers and ecosystem partners explore the show floor and experience demonstrations and deep-dive technical conversations at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). intel foundry guests, customers and ecosystem partners explore the show floor and experience demonstrations and deep-dive technical conversations at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). intel foundry guests, customers and ecosystem partners explore the show floor and experience demonstrations and deep-dive technical conversations at intel foundry direct connect on tuesday, april 29, 2025, in san jose, calif. the event brought together more than 1,000 customers and ecosystem partners to hear intel foundry leaders describe the company’s process technology roadmap, advanced packaging momentum and ecosystem partnerships. (credit: intel corporation). logos: download intel foundry logos (zip, 24mb). b-roll videos: all intel manufacturing, office and construction b-roll videos. social highlights. more on social: intel news on x | linkedin. how is intel tuning its technology roadmap for foundry customers with intel 18a-p and intel 14a? #directconnect. hear from foundry services general manager kevin o’buckley: pic.twitter.com/pvo0lxfa6r. — intel news (@intelnews) april 29, 2025. intel is undergoing a culture shift – and the priority is earning back customer trust. “we want to make sure customers are winning with us. we want to listen.”. more from intel foundry tech and manufacturing head naga chandrasekaran at intel foundry #directconnect 2025 pic.twitter.com/1dxjn4f5wc. — intel news (@intelnews) april 29, 2025. third-party news. ansys: ansys thermal and multiphysics solutions certified for intel 18a process and 3d-ic designs. arteris: arteris joins intel foundry accelerator ecosystem alliance program to support advanced semiconductor designs. cadence: cadence expands design ip portfolio optimized for intel 18a and intel 18a-p technologies, advancing ai, hpc and mobility applications. ic'alps: ic’alps joins intel foundry accelerator program as value chain alliance (vca) and design services alliance (dsa) partner. jariet technologies: jariet technologies joins intel foundry accelerator ip and usmag alliance programs. keysight technologies: keysight eda and intel foundry collaborate on emib-t silicon bridge technology for next-generation ai and data center solutions. siemens: siemens and intel foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2d and 3d ic. skyechip: skyechip joins intel foundry accelerator ip alliance. synopsys: synopsys and intel foundry propel angstrom-scale chip designs on intel 18a and intel 18a-p technologies.