Intel Accelerates ‘AI Everywhere’ at Computex 2024

June 4, 2024 Last Updated
June 3, 2024 Published
A person stands on stage next to a large screen displaying >500 AI Models Optimized for Core Ultra. Beside them, a wall of monitors shows various tech brand logos like Lenovo, HP, Acer, Samsung, and more, illuminated in vibrant colors.

At Computex Taiwan, Intel CEO Pat Gelsinger unveils a wall of AI PCs running on Intel technology. During the event in June 2024, Intel unveiled cutting-edge technologies and architectures poised to accelerate the artificial intelligence ecosystem. (Credit: Intel Corporation)

Intel supports vigorous AI adoption across the enterprise with solutions spanning the data center, cloud and network to the client and edge.

At Computex 2024, Intel CEO Pat Gelsinger unveiled the latest technologies marrying cutting-edge performance and power efficiency – across data centers, acceleration and the AI PC experience – with the goal of making AI cost-efficient and accessible for all. Intel is committed to empowering open ecosystems and accelerating AI opportunities for customers and partners. With more processing power, leading-edge power efficiency and low total cost of ownership, Intel continues to lead the industry into a sustainable and scalable future.

During the June 4-7 event in Taipei, Taiwan, Gelsinger presented a keynote at which he launched Intel® Xeon® 6 processors with Efficient-cores (E-cores), announced pricing for Intel® Gaudi® 2 and Intel® Gaudi® 3 AI accelerator kits, and unveiled the breakthrough Lunar Lake client processor architecture, a revolutionary design that further expands the AI PC category.

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Intel Keynote Images

Download all 11 images (ZIP, 104 MB)

Lunar Lake

Intel revealed architecture details for its upcoming Lunar Lake client computing processor, which was redesigned to set a new bar for x86 power efficiency and to deliver leading core and graphics performance with unmatched AI.

New Performance-cores (P-cores) and Efficient-cores (E-cores) deliver amazing performance at up to 40% lower system-on-chip power compared to the previous generation1. A new neural processing unit is up to 4x faster, enabling corresponding improvements in generative AI, versus the previous generation. And new Xe2 graphics processing unit cores improve gaming and graphics performance by 1.5x over the previous generation.

Lunar Lake will power more than 80 new AI PC designs from more than 20 partners beginning in 2024’s third quarter.

 

Lunar Lake Architecture: An Animation

Lunar Lake Architecture: An Animation

Animated video shows the layers of technologies that make up Lunar Lake. On June 4, 2024, at Computex in Taipei, Taiwan, Intel unveiled architecture details about Lunar Lake. The processor designed for thin-and-light PCs makes significant improvements to performance and efficiency across the neural processing unit, central processing unit and graphics processing unit when compared with the previous generation. (Credit: Intel Corporation)

Lunar Lake Images

Close-up image of a computer chip with two prominent square components at the top, featuring alphanumeric codes. The chip has a blue and gold outline with other electronic markings on a plain black background.
Illustration of a computer chip with a sleek, rectangular design. The chip features a prominent central section with intricate circuit patterns highlighted in blue, surrounded by a metallic frame.
Collage of features for Intels Lunar Lake chip: integrated Wi-Fi, NPU 4.0, Enhanced Intel Thread Director, Xe2 GPU, up to 32GB memory, 120 TOPS AI, Ecores, P-cores, new packaging, and power delivery. Intel logos present.
Close-up image of a computer chip with two prominent square components at the top, featuring alphanumeric codes. The chip has a blue and gold outline with other electronic markings on a plain black background.
Illustration of a computer chip with a sleek, rectangular design. The chip features a prominent central section with intricate circuit patterns highlighted in blue, surrounded by a metallic frame.
Collage of features for Intels Lunar Lake chip: integrated Wi-Fi, NPU 4.0, Enhanced Intel Thread Director, Xe2 GPU, up to 32GB memory, 120 TOPS AI, Ecores, P-cores, new packaging, and power delivery. Intel logos present.

Download all images (ZIP, 7 MB)

Lunar Lake Delivers a New Architecture for the AI PC

Lunar Lake Delivers a New Architecture for the AI PC

At Computex 2024, Intel revealed the architectural details of Lunar Lake – the flagship processor for the next generation of AI PCs. Lunar Lake offers a leap in graphics and AI processing power and a focus on power-efficient compute performance for the thin-and-light segment. (Credit: Intel Corporation)

Intel Xeon 6

Intel launched the Intel® Xeon® 6 family of processors, including both E-core and P-core options, to address a broad array of use cases and workloads, from AI and other high-performance compute needs to scalable cloud-native applications.

The first of the family debuting at Computex 2024 is the Intel® Xeon® 6 processor with Efficient-cores, code-named Sierra Forest. With its high core density and exceptional performance per watt, it enables rack-level consolidation of 3-to-1, and a rack-level performance gain of up to 4.2x and performance per watt gain of up to 2.6x when compared with 2nd Gen Intel® Xeon® processors on media transcode workloads.

Intel Xeon 6 processors with P-cores are expected to launch in 2024’s third quarter and will deliver greater performance for the most demanding workloads, including AI, high-performance computing, image processing and data analytics.

 

Xeon 6 Images

An overhead view of a silicon wafer with numerous glowing, grid-like patterns in orange and red hues, set against a white background. The wafer is circular and reflective, showcasing the intricate design of microchips.
An angled view of a silicon wafer, showing an array of rectangular microchips with a colorful reflective surface. The background is plain white.
A silver Intel Xeon 6 processor is shown against a blue background. The front side displays the Intel logo and model name, while the other side reveals the intricate circuitry pattern.
Image of a computer processor with a rectangular shape, featuring a central gold-colored section surrounded by a blue and green circuit board design, with various small components visible around the edges.
An Intel Xeon 6 processor chip with a silver metallic surface and the Intel Xeon logo in black. The chip is rectangular with connectors on the top and bottom edges, set against a white background.
Close-up image of a computer processor with a blue and silver design. Numerous small components and circuits are visible on its surface, set against a dark background.
A person wearing a brown hijab and white protective suit is seated at a workstation, inspecting electronic circuit boards. They are wearing blue gloves and surrounded by industrial equipment and metal racks.
A person wearing safety goggles, a mask, and blue gloves holds up a microchip in a cleanroom environment. The focus is on the microchip, with blurred background equipment and lighting visible.
An overhead view of a silicon wafer with numerous glowing, grid-like patterns in orange and red hues, set against a white background. The wafer is circular and reflective, showcasing the intricate design of microchips.
An angled view of a silicon wafer, showing an array of rectangular microchips with a colorful reflective surface. The background is plain white.
A silver Intel Xeon 6 processor is shown against a blue background. The front side displays the Intel logo and model name, while the other side reveals the intricate circuitry pattern.
Image of a computer processor with a rectangular shape, featuring a central gold-colored section surrounded by a blue and green circuit board design, with various small components visible around the edges.
An Intel Xeon 6 processor chip with a silver metallic surface and the Intel Xeon logo in black. The chip is rectangular with connectors on the top and bottom edges, set against a white background.
Close-up image of a computer processor with a blue and silver design. Numerous small components and circuits are visible on its surface, set against a dark background.
A person wearing a brown hijab and white protective suit is seated at a workstation, inspecting electronic circuit boards. They are wearing blue gloves and surrounded by industrial equipment and metal racks.
A person wearing safety goggles, a mask, and blue gloves holds up a microchip in a cleanroom environment. The focus is on the microchip, with blurred background equipment and lighting visible.

Download all images (ZIP, 18 MB)

Intel Xeon 6 Processors Explained in 60 Seconds

Intel Xeon 6 Processors Explained in 60 Seconds

Here’s a one-minute breakdown of three things to know about Intel® Xeon® 6 processors with Efficient-cores (E-cores). Code-named Sierra Forest, they were launched at Computex in Taipei, Taiwan, on June 4, 2024, and are built with E-cores to improve performance and power efficiency for high-density, scale-out workloads. This first member of the Intel Xeon 6 processor family will soon be followed by Intel Xeon 6 processors with Performance-cores (P-cores), code-named Granite Rapids. It will support more compute-intensive workloads such as AI and computer vision. (Credit: Intel Corporation)

Intel Manufacturing in Kulim, Malaysia, and San Jose, Costa Rica (B-Roll)

Intel Manufacturing in Kulim, Malaysia, and San Jose, Costa Rica (B-Roll)

B-roll footage from May 2024 shows the Intel Kulim Assembly Test (KuAT) facility in Kulim, Malaysia, and the Costa Rica Assembly Test (CRAT) facility in San Jose, Costa Rica. It includes Intel employees inside the facilities and video of Intel Xeon 6 processors with Efficient-cores (code-named Sierra Forest). (Credit: Intel Corporation)

Download video: “Intel Manufacturing in Kulim, Malaysia, and San Jose, Costa Rica (B-Roll)”

Intel Gaudi

The Intel Gaudi architecture gives customers the generative AI performance they seek with a price-performance advantage that provides choice and fast deployment time at lower total cost of operating.

At Computex, Intel announced that a standard AI kit including eight Intel Gaudi 2 accelerators with a universal baseboard (UBB) offered to system providers at $65,000 is estimated to be one-third the cost of comparable competitive platforms. A kit including eight Intel Gaudi 3 accelerators with a UBB will list at $125,000, estimated to be two-thirds the cost of comparable competitive platforms2.

Further, Intel announced six new system providers are expected to bring Intel Gaudi 3 systems to market. ASUS, Foxconn, Gigabyte, Inventec, Quanta and Wistron join Dell, Hewlett Packard Enterprise, Lenovo and Supermicro with plans to offer Intel Gaudi 3 systems.

Image of an Intel Gaudi processor chip on a circuit board, featuring various electronic components, connectors, and intricate circuitry patterns, set against a plain white background.
An Intel Gaudi processor on a colorful printed circuit board. The processor is prominently labeled and surrounded by various electronic components and connectors.
A computer chip labeled Intel Gaudi is positioned on a gradient background. The image features blue and purple lighting, highlighting the intricate design and components on the circuit board.
Close-up of an Intel Gaudi processor chip on a circuit board, lit with a soft blue and orange light. The intricate design of the board and the reflective surface of the chip are highlighted.
Infographic showcasing the Intel Gaudi 3 AI chip features: 17x faster inference, 7.4x faster training than Nvidias H100, 128GB HBM2e, 3.7TB/s memory bandwidth, 180TB FLOPS, 24x 600GB/s fabric, extensive AI software stack support.
Image of an Intel Gaudi processor chip on a circuit board, featuring various electronic components, connectors, and intricate circuitry patterns, set against a plain white background.
An Intel Gaudi processor on a colorful printed circuit board. The processor is prominently labeled and surrounded by various electronic components and connectors.
A computer chip labeled Intel Gaudi is positioned on a gradient background. The image features blue and purple lighting, highlighting the intricate design and components on the circuit board.
Close-up of an Intel Gaudi processor chip on a circuit board, lit with a soft blue and orange light. The intricate design of the board and the reflective surface of the chip are highlighted.
Infographic showcasing the Intel Gaudi 3 AI chip features: 17x faster inference, 7.4x faster training than Nvidias H100, 128GB HBM2e, 3.7TB/s memory bandwidth, 180TB FLOPS, 24x 600GB/s fabric, extensive AI software stack support.

Download all images (ZIP, 27 MB)

Intel Tech Tour

Just days before Computex, Intel hosted its third-annual Technology Tour in Taiwan, where global media and analysts received an in-depth look at Lunar Lake architecture as well as sessions on Xeon 6 and Gaudi accelerators. The two-day event included technical deep dives and keynotes from business and technical leaders from across Intel who are charged with bringing next-generation technologies to life.

A person is presenting on stage with a large screen displaying Lunar Lake and various technology features. Graphics highlight an NPU, support for ray tracing, a media engine, power efficiency, and future advancements by Intel.
A large audience seated in a dimly lit conference room listens to a presentation. The stage is illuminated in blue light with Intel displayed on screens. A speaker stands on the right, engaging the audience.
Five people sit on stage for a Q&A session during the TECH tour.TW event. The backdrop has a geometric design and a large Q&A sign. The panelists are seated in a row, engaged in discussion.
Four men sit on stage in front of a screen displaying logos for Intel, Compal, Quanta Computer, and Wistron. They are seated in chairs, dressed casually, and appear to be participating in a panel discussion.
A group of six people standing on a stage in front of a backdrop featuring tech company logos such as Acer, ASUS, Dell, and Lenovo. The setting appears to be a technology event or conference.
A person in a suit is on stage holding a laptop with Tech Tour Live displayed on the screen. The large intel logo is visible on the backdrop, and several tech devices are showcased beside them.
A man in a blue checkered shirt holds a laptop with an Intel logo, speaking on stage against a backdrop of blue digital graphics, including charts and silhouettes.
A person is presenting on stage with a large screen displaying Lunar Lake and various technology features. Graphics highlight an NPU, support for ray tracing, a media engine, power efficiency, and future advancements by Intel.
A large audience seated in a dimly lit conference room listens to a presentation. The stage is illuminated in blue light with Intel displayed on screens. A speaker stands on the right, engaging the audience.
Five people sit on stage for a Q&A session during the TECH tour.TW event. The backdrop has a geometric design and a large Q&A sign. The panelists are seated in a row, engaged in discussion.
Four men sit on stage in front of a screen displaying logos for Intel, Compal, Quanta Computer, and Wistron. They are seated in chairs, dressed casually, and appear to be participating in a panel discussion.
A group of six people standing on a stage in front of a backdrop featuring tech company logos such as Acer, ASUS, Dell, and Lenovo. The setting appears to be a technology event or conference.
A person in a suit is on stage holding a laptop with Tech Tour Live displayed on the screen. The large intel logo is visible on the backdrop, and several tech devices are showcased beside them.
A man in a blue checkered shirt holds a laptop with an Intel logo, speaking on stage against a backdrop of blue digital graphics, including charts and silhouettes.

Download all images (ZIP, 57 MB)

1 Power measurements are based on Lunar Lake reference platform using YouTube 4K 30fps AV1. See backup for details. Results may vary.

2 Pricing guidance for cards and systems is for modeling purposes only. Please consult your original equipment manufacturer (OEM) of choice for final pricing. Results may vary based upon volumes and lead times.

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