Postcard from MWC 2025: Seeing the Intel Xeon 6 SoC in Action

A woman and a man are standing together at a technology exhibition, surrounded by a crowd. They are observing open computer hardware on display. The event is busy, with various tech brand signs visible in the background.

Michelle Johnston Holthaus, interim co-CEO of Intel and CEO of Intel Products, tours the Hewlett Packard Enterprise booth with HPE executives at Mobile World Congress in Barcelona, Spain, on March 5, 2025. (Credit: Intel Corporation)

Intel customers and partners show the new system-on-chip for network and edge in action at booths across the telco-focused event.

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To: Our partners and customers across the world

From: Mobile World Congress 2025, Barcelona, Spain | March 5, 2025

First released in 1978, the x86 architecture remains the bedrock of today’s modern computing. The instruction set powers almost every high-tech product we interact with, from PCs to data centers and countless systems at the edge.

Many of these systems are created by Intel’s key partners like Hewlett Packard Enterprise, which is here at MWC 2025 with its latest servers designed and optimized specifically for the telco edge. HPE targets customers who need high-performance, power-efficient computing muscle that will also run forthcoming generations of AI workloads.

In a tour of Intel’s key partner booths in Barcelona, Michelle Johnston Holthaus, interim co-CEO of Intel and CEO of Intel Products, experienced firsthand how these systems integrate the new Intel® Xeon® 6 system-on-chip for network and edge into compact server form factors.

Intel is the market leader in CPUs for enterprise data center and network (telco) infrastructure workloads with significant ecosystem support spanning OEMs, enterprises and telco customers including Dell, Ericsson, Lenovo and HPE.

PS: Intel at MWC Barcelona 2025 (Press Kit) | MWC 2025: Intel Xeon 6 Proves Foundational to Network Infrastructure | Intel Xeon 6 Processors (Press Kit)